3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT1064S15-Y-A 4.8mm ROUND LAMP WITH HOLDER AND WIRE ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 4.8mm ROUND LAMP WITH HOLDER AND WIRE MT1064S15-Y-A Package Dimensions 11.3 1.0 140.0±2 3.5±0.5 RED WIRE ANODE 4.8 4.0 0.7 2.42±0.5 BLACK WIRE CATHODE TIN PLATING 7.0 6.0 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted 3. The color of holder: Black. 4.The specification of wire:#1015 28AWG Description LED Chip Part No. MT1064S15-Y-A Material Emitting Color GaAsP/GaP Yellow VER.: 01 Lens Color Yellow Diffused Date: 2007/10/08 Page: 1/6 4.8mm ROUND LAMP WITH HOLDER AND WIRE MT1064S15-Y-A Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 240 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +100 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature (1.6mm from body) Tsld. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering: 260℃ for 5 sec. Hand Soldering: 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 4.29 7.2 Forward Voltage Vf If=20mA 18.1 Peak Wavelength λp If=20mA 585 nm Dominant Wavelength λd If=20mA 590 nm Reverse Current Ir Vr=5V Viewing Angle 2θ1/2 If=20mA 38 deg ∆λ If=20mA 100 nm Spectrum Line Halfwidth Max. Unit mcd 18.6 100 V µA Note:The datas come from the SPEC. of LT6431-81-R801-C01 VER.: 01 Date: 2007/10/08 Page: 2/6 4.8mm ROUND LAMP WITH HOLDER AND WIRE MT1064S15-Y-A Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) 10.0 Relative Luminous Intensity Forward Current IF(mA) 50 40 30 20 10 12 16 20 24 28 Forward Voltage (V) 32 8.0 6.0 4.0 2.0 0 20.0 10.0 0.0 30.0 Forward Current (mA) FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY 0° Forward Current IF(mA) 50 10° 20° 30° 40 30 40° 1.0 20 50° 0.9 10 0 60° 0.8 20 40 60 Temperature(。C) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE 70° 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 Radiation Pattern VER.: 01 Date: 2007/10/08 Page: 3/6 MT1064S15-Y-A 4.8mm ROUND LAMP WITH HOLDER AND WIRE Specifications for Bin Grading: Φv(mcd) Bin Min. Max. A 3.5 5.0 B 5.0 7.0 C 7.0 9.8 D 9.8 13.7 Specifications for Vf Group: Vf(V) Bin Min. Max. VA 17.4 17.6 VB 17.6 17.8 VC 18.0 18.2 VD 18.4 18.6 Specifications for Wavelength Group: WLD(nm) Bin Min. Max. X1 581 584 X2 584 587 X3 587 590 X4 590 593 VER.: 01 Date: 2007/10/08 Page: 4/6 MT1064S15-Y-A 4.8mm ROUND LAMP WITH HOLDER AND WIRE Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/10/08 Page: 5/6