3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT4PR100B-UR HIGH POWER AUTOMOTIVE LED HIGH POWER AUTOMATIVE LED MT4PR100B-UR Package Dimensions 7.62±0.5 +1 +4 +2 +3 1 4 2 3 7.62±0.5 3.0 ± 0.2 4.4±0.2 1.5 0.5 2.5 7.5±0.2 0.4±0.2 1.55±0.2 5.08±0.3 5.08±0.3 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted Description LED Chip Part No. MT4PR100B-UR Material Emitting Color AlGaInP/GaP Hyper Red VER.: 01 Lens Color Water Clear Date: 2007/08/24 Page: 1/6 HIGH POWER AUTOMATIVE LED MT4PR100B-UR Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation 9 PD 224 mW Reverse Voltage VR 5 V D.C. Forward Current If 70 mA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +100 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature (1.6mm from body) Tsld. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering: 260℃ for 5 sec. Hand Soldering: 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=70mA 1400 2480 Luminous Flux Φv If=70mA 3000 - 6100 mlm Forward Voltage Vf If=70mA 2.4 - 3.2 V Peak Wavelength λp If=70mA Dominant Wavelength λd If=70mA Reverse Current Ir Vr=5V Viewing Angle 2θ1/2 If=70mA 100 deg ∆λ If=70mA 20 nm Spectrum Line Halfwidth Max. mcd 632 618 - Unit nm 630 nm 100 µA Notes: 1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome.. VER.: 01 Date: 2007/08/24 Page: 2/6 HIGH POWER AUTOMATIVE LED MT4PR100B-UR Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) 5000 Relative Luminous Intensity(mcd) Forward Current IF(mA) 100 80 60 40 20 2.0 2.4 2.8 3.2 3.6 4000 3000 2000 1000 0 4.0 35.0 0.0 Applied Voltage (V) 70.0 105 Forward Current (mA) Forward Current VS. Applied Voltage Forward Current VS. Luminous Intensity 0° 10° 20° Forward Current IF(mA) 100 30° 80 40° 60 1.0 0.9 0.8 RΘj-a=211℃/W 40 RΘj-pin=140℃/W 50° 60° 70° 20 0 20 40 60 80 100 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta (℃) (TjMax.=110℃) Ambient Temperature VS. Forward Current Radiation Diagram VER.: 01 Date: 2007/08/24 Page: 3/6 MT4PR100B-UR HIGH POWER AUTOMATIVE LED Specifications for Bin Grading: Φv(mlm) Bin Min. Max. J 3000 4200 K 3500 4800 L 4000 6100 Specifications for Vf Group: Vf(V) Bin Min. Max. V5 2.4 2.6 V6 2.6 2.8 V7 2.8 3.0 V8 3.0 3.2 VER.: 01 Date: 2007/08/24 Page: 4/6 HIGH POWER AUTOMATIVE LED MT4PR100B-UR Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/08/24 Page: 5/6