MARKTECH MT4PR100B-UR

3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337
Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
SPECIFICATION
PART NO. : MT4PR100B-UR
HIGH POWER AUTOMOTIVE LED
HIGH POWER
AUTOMATIVE LED
MT4PR100B-UR
Package Dimensions
7.62±0.5
+1
+4
+2
+3
1
4
2
3
7.62±0.5
3.0 ± 0.2
4.4±0.2
1.5
0.5
2.5
7.5±0.2
0.4±0.2
1.55±0.2
5.08±0.3
5.08±0.3
Notes:
1. All dimensions are in mm.
2. Tolerance is ±0.25mm unless otherwise noted
Description
LED Chip
Part
No.
MT4PR100B-UR
Material
Emitting Color
AlGaInP/GaP
Hyper Red
VER.: 01
Lens Color
Water Clear
Date: 2007/08/24 Page: 1/6
HIGH POWER
AUTOMATIVE LED
MT4PR100B-UR
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation 9
PD
224
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
70
mA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-40 to +100
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature (1.6mm from body)
Tsld.
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Dip Soldering: 260℃ for 5 sec.
Hand Soldering: 350℃ for 3 sec.
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Luminous Intensity
IV
If=70mA
1400
2480
Luminous Flux
Φv
If=70mA
3000
-
6100
mlm
Forward Voltage
Vf
If=70mA
2.4
-
3.2
V
Peak Wavelength
λp
If=70mA
Dominant Wavelength
λd
If=70mA
Reverse Current
Ir
Vr=5V
Viewing Angle
2θ1/2
If=70mA
100
deg
∆λ
If=70mA
20
nm
Spectrum Line Halfwidth
Max.
mcd
632
618
-
Unit
nm
630
nm
100
µA
Notes: 1.The datas tested by IS tester.
2. Customer’s special requirements are also welcome..
VER.: 01
Date: 2007/08/24 Page: 2/6
HIGH POWER
AUTOMATIVE LED
MT4PR100B-UR
Typical Electrical/Optical Characteristic Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
5000
Relative Luminous Intensity(mcd)
Forward Current IF(mA)
100
80
60
40
20
2.0
2.4
2.8
3.2
3.6
4000
3000
2000
1000
0
4.0
35.0
0.0
Applied Voltage (V)
70.0
105
Forward Current (mA)
Forward Current VS. Applied Voltage
Forward Current VS. Luminous Intensity
0°
10°
20°
Forward Current IF(mA)
100
30°
80
40°
60
1.0
0.9
0.8
RΘj-a=211℃/W
40
RΘj-pin=140℃/W
50°
60°
70°
20
0
20
40
60
80
100
80°
90°
0.7
0.5 0.3
0.1
0.2 0.4
0.6
Ambient Temperature Ta (℃)
(TjMax.=110℃)
Ambient Temperature VS. Forward Current
Radiation Diagram
VER.: 01
Date: 2007/08/24 Page: 3/6
MT4PR100B-UR
HIGH POWER
AUTOMATIVE LED
Specifications for Bin Grading:
Φv(mlm)
Bin
Min.
Max.
J
3000
4200
K
3500
4800
L
4000
6100
Specifications for Vf Group:
Vf(V)
Bin
Min.
Max.
V5
2.4
2.6
V6
2.6
2.8
V7
2.8
3.0
V8
3.0
3.2
VER.: 01
Date: 2007/08/24 Page: 4/6
HIGH POWER
AUTOMATIVE LED
MT4PR100B-UR
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Dip Soldering:
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.
(3)
Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2007/08/24 Page: 5/6