3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT1064S15-G-A 4.8mm ROUND LED LAMP WITH HOLDER ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 4.8mm ROUND LED LAMP WITH HOLDER MT1064S15-G-A Package Dimensions 11.3 1.0 4.0 861.0±5 3±1.5 0.7 2.45±0.5 1.5 4.8 RED WIRE ANODE BLACK WIRE CATHODE TIN PLATING 7.0 5.9 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted. Description LED Chip Part No. MT1064S15-G-A Material Emitting Color GaP/GaP Green VER.: 01 Lens Color Green Diffused Date: 2007/11/13 Page: 1/5 4.8mm ROUND LED LAMP WITH HOLDER MT1064S15-G-A Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation per lamp PD 240 mW Reverse Voltage per lamp VR 5 V D.C. Forward Current per lamp If 30 mA If(Peak) 100 mA Operating Temperature Range Topr. -25 to +85 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol Peak Current per lamp (1/10Duty duty,0.1ms Pulse Width.) Dip Soldering: 260℃ for 5sec. Hand Soldering: 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Luminous Intensity per lamp IV If=20mA 20 35 mcd Forward Voltage per lamp Vf If=20mA 18.1 V Peak Wavelength per lamp λp If=20mA 567 nm Dominant Wavelength per lamp λd If=20mA 572 nm Reverse Current per lamp Ir Vr=5V Viewing Angle per lamp 2θ1/2 If=20mA 38 deg Spectrum Line Halfwidth per lamp ∆λ If=20mA 30 nm 100 Unit µA Note:The datas come from the SPEC. of LT6421-81-R801-C01 VER.: 01 Date: 2007/11/13 Page: 2/5 4.8mm ROUND LED LAMP WITH HOLDER MT1064S15-G-A Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) 50 Relative Luminous Intensity Forward Current IF(mA) 50 40 30 20 10 12 16 20 24 28 Forward Voltage (V) 40 30 20 10 0 32 30.0 Forward Current (mA) FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 50 Forward Current IF(mA) 20.0 10.0 0.0 10° 20° 30° 40 40° 30 1.0 20 60° 0.8 10 0 50° 0.9 20 40 60 Temperature(。C) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE 70° 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 Radiation Pattern VER.: 01 Date: 2007/11/13 Page: 3/5 MT1064S15-G-A 4.8mm ROUND LED LAMP WITH HOLDER Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/11/13 Page: 4/5