MARKTECH MT1064S15-G-A

3Northway Lane North Latham,New York 12110.
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Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
SPECIFICATION
PART NO. : MT1064S15-G-A
4.8mm ROUND LED LAMP WITH HOLDER
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
4.8mm ROUND LED LAMP
WITH HOLDER
MT1064S15-G-A
Package Dimensions
11.3 1.0
4.0
861.0±5
3±1.5
0.7
2.45±0.5
1.5
4.8
RED WIRE
ANODE
BLACK WIRE
CATHODE
TIN PLATING
7.0
5.9
Notes:
1. All dimensions are in mm.
2. Tolerance is ±0.25mm unless otherwise noted.
Description
LED Chip
Part
No.
MT1064S15-G-A
Material
Emitting Color
GaP/GaP
Green
VER.: 01
Lens Color
Green Diffused
Date: 2007/11/13 Page: 1/5
4.8mm ROUND LED LAMP
WITH HOLDER
MT1064S15-G-A
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation per lamp
PD
240
mW
Reverse Voltage per lamp
VR
5
V
D.C. Forward Current per lamp
If
30
mA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-25 to +85
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature(1.6mm from body)
Tsol
Peak Current per lamp (1/10Duty duty,0.1ms Pulse
Width.)
Dip Soldering: 260℃ for 5sec.
Hand Soldering: 350℃ for 3 sec.
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Max.
Luminous Intensity per lamp
IV
If=20mA
20
35
mcd
Forward Voltage per lamp
Vf
If=20mA
18.1
V
Peak Wavelength per lamp
λp
If=20mA
567
nm
Dominant Wavelength per lamp
λd
If=20mA
572
nm
Reverse Current per lamp
Ir
Vr=5V
Viewing Angle per lamp
2θ1/2
If=20mA
38
deg
Spectrum Line Halfwidth per lamp
∆λ
If=20mA
30
nm
100
Unit
µA
Note:The datas come from the SPEC. of LT6421-81-R801-C01
VER.: 01
Date: 2007/11/13 Page: 2/5
4.8mm ROUND LED LAMP
WITH HOLDER
MT1064S15-G-A
Typical Electrical/Optical Characteristic Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
50
Relative Luminous Intensity
Forward Current IF(mA)
50
40
30
20
10
12
16
20
24
28
Forward Voltage (V)
40
30
20
10
0
32
30.0
Forward Current (mA)
FORWARD CURRENT VS.APPLIED VOLTAGE
FORWARD CURRENT VS. LUMINOUS INTENSITY
0°
50
Forward Current IF(mA)
20.0
10.0
0.0
10°
20°
30°
40
40°
30
1.0
20
60°
0.8
10
0
50°
0.9
20
40
60
Temperature(。C)
80
100
FORWARD CURRENT VS. AMBIENT TEMPERATURE
70°
80°
90°
0.7
0.5 0.3
0.1
0.2
0.4
0.6
Radiation Pattern
VER.: 01
Date: 2007/11/13 Page: 3/5
MT1064S15-G-A
4.8mm ROUND LED LAMP
WITH HOLDER
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Dip Soldering:
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.
(3)
Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2007/11/13 Page: 4/5