MICROCRYSTAL CX8V-T1A

CX8V-T1A
Tuning Fork Crystal 32.768 kHz
DIMENSIONS
Recommended Solder Pad:
Package:
0,8
2,0
0,7
0,8
0,55
max.0,60
1,5
1,2
0,55
100% leadfree, RoHS - compliant
Smallest SMT ceramic package
Ultra low profile: 0.60 mm height
SMD-package in Tape and Reel
Ind. and Ext. temperature ranges
High stability
Low aging
Low power consumption
High shock and vibration resistance
ELECTRICAL CHARACTERISTICS
AT 25oC:
All dimensions in mm typical
DESCRIPTION:
This SMD ceramic package has been specially designed for miniature
telecom and portable applications. The Ultra Miniature Tuning Fork
(UMTF) in this product is achieved by a special manufacturing process,
this technology leads to improved electrical characteristics.
For pick-and-place equipment, the parts are available in 8 mm tape:
7” (178 mm) reel with 1’000 crystals
7” (178 mm) reel with 3’000 crystals
Nominal Frequency
1)
FL
32.768
kHz
Load capacitance
2)
CL
7.0 / 9.0 / 12.5
pF
Frequency tolerance
3)
ΔF/F
+/-20
ppm
ΔF/F
+/-100
ppm
Series resistance max.
RS
90
kΩ
Motional capacitance typ.
C1
3.5
fF
Static capacitance typ.
C0
1.1
pF
Drive level max.
P
0.5
μW
Insulation resistance min.
Ri
500
MΩ
Aging first year max.
ΔF/F
+/-3
ppm
Turnover temperature
T0
Frequency vs. temperature
ΔF/F0 –0.035
25 +/-5
ppm
°C
2
/°C² (T - T0) +/-10%
ppm
1) Other frequencies on request.
2) Other load capacitances on request.
3) Tighter and wider frequency tolerances on request.
Version 1.0/10.2009
STANDARD FREQUENCIES:
Frequency
kHz
32.768
Other frequencies on request
ENVIRONMENTAL
Conditions
CHARACTERISTICS:
Storage temp. range
–55 to +125°C
Industrial operating temp. range
–40 to +85°C
Extended operating temp. range
TERMINATIONS AND
PROCESSING:
Max. Dev.
–55 to +125°C
Shock resistance
ΔF/F 5000 g, 0.3 ms, ½ sine
+/-5 ppm
Vibration resistance
ΔF/F
+/-5 ppm
20 g / 10–2000 Hz
Type
Termination
Processing
CX8V-T1A
For SMD mounting
Au flashed pads
Reflow soldering
260°C / 20 s max.
PART NUMBER/
ORDERING INFORMATION
EXAMPLE:
CX 8 V-T 1 A
32.768 kHz 9.0 pF +/-20 ppm
Frequency
tolerance
Crystal package
C = Crystal in ceramic
package
Frequency FL
Package lid
X = Glas lid
Package pad form
A = Pads on both ends
Package size
8 = 2.0 x 1.2 x 0.60 mm
Pad plating
1 = Au flashed pads
Blank
V = Tuning fork
Package type
T = For SMD mounting
Load capacitance CL
All specifications subject to change without notice.
Micro Crystal AG
Mühlestrasse 14
CH-2540 Grenchen
Switzerland
10.09
Tel.
+41 32 655 82 82
Fax
+41 32 655 82 83
[email protected]
www.microcrystal.com
Version 1.0/10.2009