NEC PS2561DL2-1Y-V-A

PRELIMINARY DATA SHEET
PHOTOCOUPLER
PS2561D-1,PS2561DL-1
PS2561DL1-1,PS2561DL2-1
DIP PHOTOCOUPLER
OPERATING AMBIENT TEMPERATURE 110°C
−NEPOC Series−
DESCRIPTION
The PS2561D-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor.
The PS2561D-1 is in a plastic DIP (Dual In-line Package) and the PS2561DL-1 is lead bending type (Gull-wing) for
surface mount.
The PS2561DL1-1 is lead bending type for long creepage distance.
The PS2561DL2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
• Operating ambient temperature: 110°C
PIN CONNECTION
(Top View)
• High Isolation voltage (BV = 5 000 Vr.m.s.)
• High collector to emitter voltage (VCEO = 80 V)
4
3
1. Anode
2. Cathode
3. Emitter
4. Collector
• High current transfer ratio (CTR = 160% TYP.)
• High-speed switching (tr = 3 μs TYP., tf = 5 μs TYP.)
• Ordering number of taping product: PS2561DL-1-F3 : 2 000 pcs/reel
1
2
: PS2561DL2-1-E3: 1 000 pcs/reel
• Pb-Free product
APPLICATIONS
• Power supply
• Telephone/FAX.
• FA/OA equipment
• Programmable logic controller
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10777EJ01V0DS (1st edition)
Date Published August 2009 NS
Printed in Japan
2009
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type
Long Creepage Distance
PS2561DL1-1
PS2561D-1
4.6±0.35
4.6±0.35
4
3
1
2
6.5±0.5
6.5±0.5
4 3
1 2
0 to 15° +0.1
0.25 –0.05
1.25±0.15
10.16
3.5
±0.3
3.15
3.85
±0.35 ±0.4
3.5±0.3
3.2±0.4 4.15±0.4
7.62
0.50±0.1
0.25 M
1.25±0.15
0.50±0.10
0.25 M
+0.1
0.25–0.05
2.54
0 to 15°
2.54
Lead Bending Type
Long Creepage Distance (Gull-Wing)
PS2561DL2-1
PS2561DL-1
4.6±0.35
4.6±0.35
3
1
2
4
3
1
2
0.25 M
PS2561D-1, PS2561DL-1
PS2561DL1-1, PS2561DL2-1
Air Distance (MIN.)
7 mm
8 mm
Outer Creepage Distance (MIN.)
7 mm
8 mm
Inner Creepage Distance (MIN.)
4 mm
4 mm
0.4 mm
0.4 mm
2
11.8–0.5
10.16
PHOTOCOUPLER CONSTRUCTION
Isolation Distance (MIN.)
+0.1
+0.2
2.54
2.54
Parameter
0.25–0.05
0.9±0.25
1.25±0.15
0.25 M
0.9±0.25
9.60±0.4
1.25±0.15
0.25±0.2
3.5±0.3
0.1 +0.1
–0.05
3.5±0.3
0.25 +0.1
–0.05
6.5±0.5
6.5±0.5
4
Preliminary Data Sheet PN10777EJ01V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
MARKING EXAMPLE
No. 1 pin
Mark
2561D
NY931
N
Y
Assembly Lot
9 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Package
Pb-Free and Halogen Free New PKG
Made in Taiwan
Y
Preliminary Data Sheet PN10777EJ01V0DS
3
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Specification
Magazine case 100 pcs
Safety Standard
Application
Approval
Part Number
*1
PS2561D-1
PS2561D-1Y-A
Special version
Standard products
PS2561D-1
PS2561DL-1
PS2561DL-1Y-A
(Pb-Free and
(UL, CSA, BSI,
PS2561DL-1
PS2561DL1-1
PS2561DL1-1Y-A
Halogen Free)
NEMKO, DEMKO,
PS2561DL1-1
PS2561DL2-1
PS2561DL2-1Y-A
SEMKO, FIMKO
PS2561DL2-1
PS2561DL-1-F3
PS2561DL-1Y-F3-A
Embossed Tape 2 000 pcs/reel awaiting approval)
PS2561DL-1
PS2561DL2-1-E3
PS2561DL2-1Y-E3-A
Embossed Tape 1 000 pcs/reel
PS2561DL2-1
PS2561D-1-V
PS2561D-1Y-V-A
Magazine case 100 pcs
PS2561DL-1-V
DIN EN60747-5-2
PS2561D-1
PS2561DL-1Y-V-A
(VDE0884 Part2)
PS2561DL-1
PS2561DL1-1-V
PS2561DL1-1Y-V-A
awaiting approval
PS2561DL1-1
PS2561DL2-1-V
PS2561DL2-1Y-V-A
(Option)
PS2561DL2-1
PS2561DL-1-V-F3
PS2561DL-1Y-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2561DL-1
PS2561DL2-1-V-E3
PS2561DL2-1Y-V-E3-A
Embossed Tape 1 000 pcs/reel
PS2561DL2-1
*1 For the application of the Safety Standard, following part number should be used.
4
Preliminary Data Sheet PN10777EJ01V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Reverse Voltage
VR
6
V
Forward Current (DC)
IF
40
mA
ΔPD/°C
1.5
mW/°C
PD
150
mW
IFP
1
A
Collector to Emitter Voltage
VCEO
80
V
Emitter to Collector Voltage
VECO
7
V
IC
50
mA
ΔPC/°C
1.5
mW/°C
PC
150
mW
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +110
°C
Storage Temperature
Tstg
–55 to +150
°C
Diode
Power Dissipation Derating
Power Dissipation
*1
Peak Forward Current
Transistor
Collector Current
Power Dissipation Derating
Power Dissipation
Isolation Voltage
*2
*1 PW = 100 μs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Preliminary Data Sheet PN10777EJ01V0DS
5
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Transistor
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
5
μA
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
ICEO
VCE = 48 V, IF = 0 mA
CTR
IF = 5 mA, VCE = 5 V
50
160
IF = 1 mA, VCE = 5 V
10
80
Collector to Emitter Dark
10
pF
100
nA
400
%
0.3
V
Current
Coupled
Current Transfer Ratio
*1
(IC/IF)
Collector Saturation
VCE (sat)
IF = 10 mA, IC = 2 mA
Voltage
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
Rise Time
*2
tr
*2
tf
Fall Time
10
Ω
11
VCC = 10 V, IC = 2 mA, RL = 100 Ω
0.5
pF
3
μs
5
*1 CTR rank
CTR Rank
CTR (%)
Conditions
80 to 160
IF = 5 mA, VCE = 5 V
16 and larger
IF = 1 mA, VCE = 5 V
100 to 200
IF = 5 mA, VCE = 5 V
20 and larger
IF = 1 mA, VCE = 5 V
130 to 260
IF = 5 mA, VCE = 5 V
26 and larger
IF = 1 mA, VCE = 5 V
200 to 400
IF = 5 mA, VCE = 5 V
40 and larger
IF = 1 mA, VCE = 5 V
50 to 400
IF = 5 mA, VCE = 5 V
10 and larger
IF = 1 mA, VCE = 5 V
H
Q
W
L
N
*2 Test circuit for switching time
Pulse Input
VCC
Input
PW = 100 μ s
Duty Cycle = 1/10
ton
IF
50 Ω
td
VOUT
RL = 100 Ω
toff
ts
90%
Output
10%
tr
6
Preliminary Data Sheet PN10777EJ01V0DS
tf
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
TAPING SPECIFICATIONS (UNIT : mm)
1.55±0.1
4.5 MAX.
10.3±0.1
7.5±0.1
1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2561DL-1-F3
Outline and Dimensions (Reel)
2.0±0.5
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 330±2.0
2.0±0.5
φ 13.0±0.2
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
Preliminary Data Sheet PN10777EJ01V0DS
15.9 to 19.4
Outer edge of
flange
7
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
2.05±0.1
4.4±0.2
12.35±0.15
11.5±0.1
1.55±0.1
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
6.6±0.2
0.38
12.0±0.1
Tape Direction
PS2561DL2-1-E3
Outline and Dimensions (Reel)
R 1.0
φ 21.0±0.8
φ 100±1.0
2.0±0.5
φ13.0±0.2
φ 330±2.0
2.0±0.5
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
8
Preliminary Data Sheet PN10777EJ01V0DS
23.9 to 27.4
Outer edge of
flange
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
A
B
C
D
PS2561DL
lead bending type (Gull-wing)
for long creepage distance (surface mount)
8.2
2.54
1.7
2.2
PS2561DL2
lead bending type (Gull-wing)
for surface mount
10.2
2.54
1.7
2.2
Preliminary Data Sheet PN10777EJ01V0DS
9
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
10
Preliminary Data Sheet PN10777EJ01V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
corrector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Preliminary Data Sheet PN10777EJ01V0DS
11
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
• The information in this document is current as of August, 2009. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate
sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in
order to avoid risks of the damages to property (including public or social property) or injury (including death) to
persons, as the result of defects of NEC Electronics products.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
12
Preliminary Data Sheet PN10777EJ01V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.