NEC PS2703-1-V

DATA SHEET
PHOTOCOUPLER
PS2703-1,PS2703-2,PS2703-4
HIGH ISOLATION VOLTAGE
HIGH COLLECTOR TO EMITTER VOLTAGE TYPE
−NEPOC
SOP MULTI PHOTOCOUPLER
TM
Series−
DESCRIPTION
The PS2703-1, PS2703-2, PS2703-4 are optically coupled isolators containing a GaAs light emitting diode and an
NPN silicon phototransistor.
Each is mounted in a plastic SOP (Small Outline Package) for high density applications.
This package has shield effect to cut off ambient light.
FEATURES
• High isolation voltage (BV = 3 750 Vr.m.s.)
• High collector to emitter voltage (VCEO = 120 V)
• SOP (Small Outline Package) type
• Each isolated channel per package
• High-speed switching (tr, tf = 10 µs TYP.)
• Taping product number (Only-1 type): PS2703-1-E3, E4, F3, F4
• UL approved: File No. E72422 (S)
• VDE0884 approved (Option)
APPLICATIONS
• Hibrid IC
• Telephone/FAX
• FA/OA equipment
• Programmable logic controllers
• Power supply
ORDERING INFORMATION
Part Number
Package
Safety Standard Approval
PS2703-1
4-pin SOP
Standard specification products
PS2703-2
8-pin SOP
• UL approved
PS2703-4
16-pin SOP
PS2703-1-V
4-pin SOP
PS2703-2-V
8-pin SOP
PS2703-4-V
16-pin SOP
VDE0884 specification products (Option)
The information in this document is subject to change without notice.
Document No. P11308EJ6V0DS00 (6th edition)
Date Published December 1998 NS CP(K)
Printed in Japan
The mark • shows major revised points.
©
1988
PS2703-1,PS2703-2,PS2703-4
PACKAGE DIMENSIONS (in millimeters)
PS2703-1
4.5 MAX.
TOP VIEW
4
1
3
1. Anode
2. Cathode
3. Emitter
4. Collector
2
1.3
0.15 +0.10
–0.05
2.0
0.1±0.1
2.3 MAX.
7.0±0.3
4.4
2.54
1.2 MAX.
0.4 +0.10
–0.05
0.5±0.3
0.25 M
PS2703-2
9.3 MAX.
TOP VIEW
8
7
6
5
1. 3.
2. 4.
5. 7.
6. 8.
1
2
3
4
7.0±0.3
4.4
1.3
0.15 +0.10
–0.05
2.0
0.1±0.1
2.3 MAX.
Anode
Cathode
Emitter
Collector
2.54
0.4 +0.10
–0.05
1.2 MAX.
0.5±0.3
0.25 M
PS2703-4
19.46 MAX.
TOP VIEW
16
15
1
2
14
13
12
3
4
5
1. 3. 5. 7.
2. 4. 6. 8.
9. 11. 13. 15.
10. 12. 14. 16.
0.15 +0.10
–0.05
2.0
0.1±0.1
2.3 MAX.
2
0.25 M
2.54
1.2 MAX.
Data Sheet P11308EJ6V0DS00
0.5±0.3
10
9
6
7
8
Anode
Cathode
Emitter
Collector
7.0±0.3
4.4
0.4 +0.10
–0.05
11
1.3
PS2703-1,PS2703-2,PS2703-4
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Ratings
Parameter
Diode
Symbol
PS2703-2,
PS2703-4
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
6
V
∆PD/°C
0.8
mW/°C
PD
80
mW/ch
IFP
1
A
Collector to Emitter Voltage
VCEO
120
V
Emitter to Collector Voltage
VECO
6
V
IC
30
mA/ch
Power Dissipation Derating
Power Dissipation
Peak Forward Current
Transistor
PS2703-1
*1
Collector Current
Power Dissipation Derating
Power Dissipation
*2
∆PC/°C
1.5
1.2
mW/°C
PC
150
120
mW/ch
Isolation Voltage
BV
3 750
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +100
°C
Storage Temperature
Tstg
–55 to +150
°C
*1 PW = 100 µs, Duty Cycle = 1 %
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
Data Sheet P11308EJ6V0DS00
3
PS2703-1,PS2703-2,PS2703-4
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 5 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1 MHz
MIN.
TYP.
MAX.
Unit
1.1
1.4
V
5
µA
30
Transistor
Collector to Emitter
Current
ICEO
IF = 0 mA, VCE = 120 V
Coupled
Current Transfer Ratio
CTR
IF = 5 mA, VCE = 5 V
50
150
IF = 1 mA, VCE = 5 V
10
80
*1
(IC/IF)
100
nA
400
%
0.3
V
Collector Saturation
Voltage
VCE (sat)
Isolation Resistance
RI-O
VI-O = 1 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.4
pF
VCC = 5 V, IC = 2 mA, RL = 1 kΩ
10
µs
Rise Time
Fall Time
*2
tr
*2
IF = 10 mA, IC = 2 mA
tf
CTR rank
CTR (%)
Conditions
K
200 to 400
IF = 5 mA, VCE = 5 V
80 to
IF = 1 mA, VCE = 5 V
100 to 300
IF = 5 mA, VCE = 5 V
25 to
IF = 1 mA, VCE = 5 V
50 to 150
IF = 5 mA, VCE = 5 V
10 to
IF = 1 mA, VCE = 5 V
L
M
*2 Test circuit for switching time
Pulse Input
IF
VCC
PW = 100 µs
Duty Cycle = 1/10
In monitor
50 Ω
Ω
11
10
10
*1 CTR rank (only PS2703-1)
4
pF
VOUT
RL = 1 kΩ
Data Sheet P11308EJ6V0DS00
PS2703-1,PS2703-2,PS2703-4
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
100
75
50
25
25
0
50
75
100
200
150
PS2703-1
1.5 mW/˚C
100
PS2703-2,
PS2703-4
1.2 mW/˚C
50
25
0
50
75
100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
10
1
+25 ˚C
0 ˚C
–25 ˚C
–55 ˚C
0.1
0.01
0.6
0.8
1.0
1.2
1.4
1.6
10
8
4 mA
6
3 mA
4
2 mA
2
1 mA
0.5 mA
2
0
4
6
8
10
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
50 000
10
10 000
5 000
5
1 000
500
Collector Current IC (mA)
Collector to Emitter Dark Current ICEO (nA)
TA = +100 ˚C
+75 ˚C
+50 ˚C
IF =
10
Collector Current IC (mA)
Forward Current IF (mA)
mA
5 mA
VCE = 40 V
24 V
10 V
100
50
10
5
1
0.5
0.1
–60 –40
–20
0
20
40
60
Ambient Temperature TA (˚C)
80
100
IF = 25 mA
10 mA
5 mA
2.5 mA
2 mA
1.5 mA
1 mA
1
0.5
0.5 mA
0.1
0.0
0.2
0.4
0.6
0.8
1.0
Collector Saturation Voltage VCE (sat) (V)
Data Sheet P11308EJ6V0DS00
5
PS2703-1,PS2703-2,PS2703-4
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,
,,,,,,,,,,,,,,,,
300
1.2
1.0
0.8
0.6
0.4
Normalized to 1.0
at TA = 25 ˚C,
IF = 5 mA, VCE = 5 V
0.2
0.0
–55
–25
0
25
50
75
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
250
200
150
100
50
0
0.1
100
0.5
1
5
10
Ambient Temperature TA (˚C)
Forward Current IF (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
100
50
1.2
VCC = 5V,
IC = 2 mA
tf
1.0
tr
10
Normalized Gain GV
Switching Time t ( µ s)
VCE = 5 V
td
ts
1
RL = 1 kΩ
510 Ω
300 Ω
100 Ω
0.8
0.6
0.4
0.2
0.1
10
100
0.0
0.5
10 k
1k
50 100
SWITCHING TIME vs.
LOAD RESISTANCE
LONG TIME CTR DEGRADATION
500
1.2
CTR Dgradation (Relative Value)
Switching Time t ( µ s)
10
Frequency f (kHz)
IF = 5 mA, VCC = 5 V,
CTR = 90 %
tf
100
ts
10
tr
td
1
1
10
100
1.0
0.8
IF = 1 mA, TA = 25 ˚C
IF = 5 mA, TA = 25 ˚C
IF = 20 mA, TA = 25 ˚C
IF = 20 mA, TA = 60 ˚C
0.6
0.4
0.2
0.0
1
Load Resistance RL (kΩ)
Remark The graphs indicate nominal characteristics.
6
5
Load Resistance RL (Ω)
1 000
0.1
1
Data Sheet P11308EJ6V0DS00
102
103
104
Time (Hr)
105
106
PS2703-1,PS2703-2,PS2703-4
TAPING SPECIFICATIONS (in millimeters)
1.55±0.1
2.4±0.1
7.4±0.1
5.5±0.1
1.55±0.1
12.0±0.2
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.3
4.6±0.1
8.0±0.1
Taping Direction
PS2703-1-E4
PS2703-1-F4
PS2703-1-E3
PS2703-1-F3
Outline and Dimensions (Reel)
6
6.0±1
Packing: PS2703-1-E3, E4 900 pcs/reel
PS2703-1-F3, F4 3 500 pcs/reel
φ 13.0±0.5
1.5±0.5
φ 66
2.0±0.5
0˚
1.5±0.1
120
˚
PS2703-1-E3, E4: φ 178
PS2703-1-F3, F4: φ 330
φ 21.0±0.8
1.5±0.1
12.4 +2.0
–0.0
18.4 MAX.
Data Sheet P11308EJ6V0DS00
7
PS2703-1,PS2703-2,PS2703-4
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C (package surface temperature)
• Time of temperature higher than 210 °C
30 seconds or less
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
120 to 160 ˚C
60 to 90 s
(preheating)
Time (s)
Peak temperature 235 ˚C or below
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
8
Data Sheet P11308EJ6V0DS00
PS2703-1,PS2703-2,PS2703-4
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
Parameter
Symbol
Speck
Unit
Application classification (DIN VDE 0109)
for rated line voltages ≤ 300 Vr.m.s.
IV
for rated line voltages ≤ 600 Vr.m.s.
III
Climatic test class (DIN IEC 68 Teil 1/09.80)
55/100/21
Dielectric strength maximum operating isolation voltage.
Test voltage (partial discharge test procedure a for type test and random test)
UIORM
710
Vpeak
Upr = 1.2 × UIORM, Pd < 5 pC
Upr
850
Vpeak
Test voltage (partial discharge test procedure b for random test)
Upr = 1.6 × UIORM, Pd < 5 pC
Upr
1 140
Vpeak
Highest permissible overvoltage
UTR
6 000
Vpeak
Degree of pollution (DIN VDE 0109)
2
Clearance distance
>5
mm
Creepage distance
>5
mm
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)
CTI
Material group (DIN VDE 0109)
175
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–55 to +100
°C
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25 °C
VIO = 500 V dc at TA MAX. at least 100 °C
12
Ω
11
Ris MIN.
10
Ω
Package temperature
Tsi
150
°C
Current (input current IF, Psi = 0)
Isi
200
mA
Power (output or total power dissipation)
Psi
300
mW
Ris MIN.
10
Safety maximum ratings
(maximum permissible in case of fault, see thermal derating curve)
Isolation resistance
VIO = 500 V dc at TA = 175 °C (Tsi)
9
Ω
Data Sheet P11308EJ6V0DS00
9
PS2703-1,PS2703-2,PS2703-4
[MEMO]
10
Data Sheet P11308EJ6V0DS00
PS2703-1,PS2703-2,PS2703-4
[MEMO]
Data Sheet P11308EJ6V0DS00
11
PS2703-1,PS2703-2,PS2703-4
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
NEPOC is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5