NEC PS7241E-1B-E3-A

DATA SHEET
Solid State Relay
OCMOS FET
PS7241E-1B
4-PIN SOP 400 V BREAK DOWN VOLTAGE
NORMALLY CLOSE TYPE
1-ch Optical Coupled MOS FET
−NEPOC Series−
DESCRIPTION
The PS7241E-1B is an optically coupled element that combines a GaAs infrared LED on the input side with a
normally close MOS FET on the output side to realize an excellent cost performance.
The small, thin package and high sensitivity of this element makes it ideal for battery-driven mobile devices, and its
small offset voltage at power-on and good linearity also make it suitable for controlling micro analog signals.
FEATURES
PIN CONNECTION
(Top View)
• Small and thin package (4-pin SOP, Height = 2.1 mm)
• 1 channel type (1 b output)
4
3
• Low LED operating current (IF = 3 mA)
• Designed for AC/DC switching line changer
1. LED Anode
2. LED Cathode
3. MOS FET
4. MOS FET
• Low offset voltage
• Ordering number of taping product: PS7241E-1B-E3, E4, F3, F4
• Pb-Free product
<R>
1
• Safety standards
2
• UL approved: File No. E72422
• BSI approved: File No. 8241/8242
APPLICATIONS
• Laptop PC, PDA
• Modem card
• Telephone, FAX
• Measurement equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10552EJ03V0DS (3rd edition)
Date Published June 2006 NS CP(K)
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2005, 2006
PS7241E-1B
PACKAGE DIMENSIONS (UNIT: mm)
4.0±0.5
0.05+0.08
–0.05
2.05+0.08
–0.05
0.15+0.10
–0.05
7.0±0.3
4.4
0.5±0.3
2.54
0.40+0.10
–0.05
0.25 M
MARKING EXAMPLE
41EB
N 603
No. 1 pin Mark
Initial of NEC
(Engraved mark)
Assembly Lot
N
*1
N
6 03
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
*1
2
Bar : Pb-Free
Data Sheet PN10552EJ03V0DS
PS7241E-1B
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Safety Standard
Application Part
Approval
Number
Specification
PS7241E-1B
PS7241E-1B-A
PS7241E-1B-E3
PS7241E-1B-E3-A
PS7241E-1B-E4
PS7241E-1B-E4-A
PS7241E-1B-F3
PS7241E-1B-F3-A
PS7241E-1B-F4
PS7241E-1B-F4-A
Pb-Free
Magazine case 100 pcs
Standard products
Embossed Tape 900 pcs/reel
(UL, BSI approved)
*1
PS7241E-1B
Embossed Tape 3 500 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
5.0
V
PD
50
mW
IFP
1
A
Break Down Voltage
VL
400
V
Continuous Load Current
IL
120
mA
Pulse Load Current
(AC/DC Connection)
ILP
240
mA
Power Dissipation
PD
300
mW
BV
1 500
Vr.m.s.
Total Power Dissipation
PT
350
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−40 to +100
°C
Diode
Power Dissipation
Peak Forward Current
MOS FET
*1
*2
Isolation Voltage
*3
*1 PW = 100 µs, Duty Cycle = 1%
*2 PW = 100 ms, 1 shot
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10552EJ03V0DS
3
PS7241E-1B
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
LED Operating Current
IF
3
10
20
mA
LED Off Voltage
VF
0
0.5
V
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
MOS FET
Coupled
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
5.0
µA
1.0
µA
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Off-state Leakage Current
ILoff
IF = 10 mA, VD = 400 V
0.03
Output Capacitance
Cout
IF = 10 mA, VD = 0 V, f = 1 MHz
206
LED Off-state Current
IFoff
IL = 120 mA
On-state Resistance
Ron1
IF = 0 mA, IL = 10 mA
pF
3.0
mA
22
35
Ω
Ron2
IF = 0 mA, IL = 120 mA, t ≤ 10 ms
17
24
*1, 2
ton
IF = 10 mA, VO = 5 V, RL = 500 Ω,
0.07
0.2
*1, 2
toff
PW ≥ 10 ms
1.0
3.0
Turn-on Time
Turn-off Time
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
10
ms
Ω
9
0.5
pF
*1 Test Circuit for Switching Time
IF
Pulse Input
VL
Input
50%
0
VO = 5 V
Input monitor
90%
VO monitor
Output
Rin
RL
10%
toff
<R>
ton
*2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms.
Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off
time will increase.
4
Data Sheet PN10552EJ03V0DS
PS7241E-1B
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
300
Maximum Load Current IL (mA)
Maximum Forward Current IF (mA)
100
80
60
40
20
0
–25
0
25
7585
50
200
100
0
–25
100
0
25
75 85
50
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
1.6
100
200
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1.2
1.0
1 mA
0.8
–25
0
25
50
75
Output Capacitance Cout (pF)
1.4
150
100
50
0
100
20
40
60
80
100
120
Ambient Temperature TA (˚C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs.
APPLIED VOLTAGE
LOAD CURRENT vs. LOAD VOLTAGE
10–5
200
IF = 10 mA
IF = 0 mA
TA = 85˚C
10–6
Load Current IL (mA)
Forward Voltage VF (V)
f = 1 MHz
Off-state Leakage Current ILoff (A)
<R>
10–7
25˚C
10–8
10–9
0
100
200
300
400
100
–4.0
500
–2.0
0
2.0
4.0
–100
–200
Load Voltage VL (V)
Applied Voltage VD (V)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10552EJ03V0DS
5
PS7241E-1B
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
ON-STATE RESISTANCE DISTRIBUTION
30
Normalized to 1.0
at TA = 25˚C,
IF = 0 mA,
IL = 10 mA
2.5
2.0
1.5
1.0
n = 50 pcs,
IF = 0 mA,
IL = 10 mA
25
Number (pcs)
Normalized On-state Resistance Ron
3.0
20
15
10
5
0.5
0.0
–25
0
25
50
75
0
100
21
22
23
24
Ambient Temperature TA (˚C)
On-state Resistance Ron (Ω)
TURN-ON TIME vs. FORWARD CURRENT
TURN-OFF TIME vs. FORWARD CURRENT
0.30
3.0
VO = 5 V
VO = 5 V
2.5
Turn-off Time toff (ms)
Turn-on Time ton (ms)
0.25
0.20
0.15
0.10
0
2.0
1.5
1.0
0.5
0.05
5
10
15
20
25
30
0
5
Forward Current IF (mA)
20
25
TURN-OFF TIME DISTRIBUTION
15
10
5
n = 50 pcs,
IF = 10 mA,
VO = 5 V
25
Number (pcs)
Number (pcs)
20
0
15
30
n = 50 pcs,
IF = 10 mA,
VO = 5 V
25
10
Forward Current IF (mA)
TURN-ON TIME DISTRIBUTION
30
20
15
10
5
0.04
0.06
0.08
0.10
0
0.12
Turn-on Time ton (ms)
0.8
1.0
1.2
1.4
Turn-off Time toff (ms)
Remark The graphs indicate nominal characteristics.
6
25
Data Sheet PN10552EJ03V0DS
1.6
30
PS7241E-1B
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
3.0
Normalized to 1.0
at TA = 25˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
Normalized Turn-off Time toff
Normalized Turn-on Time ton
3.0
Normalized to 1.0
at TA = 25˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10552EJ03V0DS
7
PS7241E-1B
TAPING SPECIFICATIONS (in millimeters)
1.55±0.1
2.9 MAX.
12.0±0.2
5.5±0.05
1.5+0.1
–0
7.4±0.1
2.0±0.05
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
2.4±0.1
4.6±0.1
0.3
8.0±0.1
Tape Direction
PS7241E-1B-E3
PS7241E-1B-E4
Outline and Dimensions (Reel)
2.0±0.5
φ 60 +1
–0
R 1.0
φ 180+0
–1.5
2.0±0.5
φ13.0±0.2
φ 21.0±0.8
13.5±1.0
17.5±1.0
Packing: 900 pcs/reel
8
Data Sheet PN10552EJ03V0DS
11.9 to 15.4
Outer edge of
flange
PS7241E-1B
1.55±0.1
2.9 MAX.
12.0±0.2
5.5±0.05
1.5+0.1
–0
7.4±0.1
2.0±0.05
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
2.4±0.1
4.6±0.1
0.3
8.0±0.1
Tape Direction
PS7241E-1B-F4
PS7241E-1B-F3
Outline and Dimensions (Reel)
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 13.0±0.2
2.0±0.5
φ13.0±0.2
φ 330±2.0
2.0±0.5
13.5±1.0
17.5±1.0
Packing: 3 500 pcs/reel
Data Sheet PN10552EJ03V0DS
11.9 to 15.4
Outer edge of
flange
9
PS7241E-1B
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
<R>
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
10
Data Sheet PN10552EJ03V0DS
PS7241E-1B
<R>
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10552EJ03V0DS
11
PS7241E-1B
• The information in this document is current as of June, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
12
Data Sheet PN10552EJ03V0DS
PS7241E-1B
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: [email protected]
Hong Kong Head Office TEL: +852-3107-7303
FAX: +852-3107-7309
Taipei Branch Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office
TEL: +82-2-558-2120
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH
http://www.eu.necel.com/
TEL: +49-211-6503-0
FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500
FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
0604