Solid State Relay OCMOS FET PS7341-1A,PS7341L-1A 6-PIN DIP, HIGH ISOLATION VOLTAGE 400 V BREAK DOWN VOLTAGE NORMALLY OPEN TYPE 1-ch Optical Coupled MOS FET −NEPOC Series− DESCRIPTION The PS7341-1A and PS7341L-1A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7341L-1A has a surface mount type lead. FEATURES • High isolation voltage (BV = 3 750 Vr.m.s.) • 1 channel type (1 a output) • Low LED Operating Current (IF = 2 mA) • Designed for AC/DC switching line changer • Small package (6-pin DIP) • Low offset voltage • Ordering number of taping product : PS7341L-1A-E3, E4: 1 000 pcs/reel <R> • Pb-Free product <R> • Safety standards • UL approved: File No. E72422 • BSI approved: No. 8252/8253 • CSA approved: No. CA 101391 • SEMKO approved: No. 606398 • DEMKO approved: No. 309836 • NEMKO approved: No. P00100964 • FIMKO approved: No. FI 15188 • DIN EN60747-5-2 (VDE0884 Part2) approved (Option) APPLICATIONS • Exchange equipment • Measurement equipment • FA/OA equipment Document No. PN10306EJ02V0DS (2nd edition) Date Published September 2006 NS CP(K) The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 1996, 2006 PS7341-1A,PS7341L-1A PACKAGE DIMENSIONS (in millimeters) PS7341-1A 9.25±0.5 TOP VIEW 6 5 4 1 2 3 1. LED Anode 2. LED Cathode 3. NC 4. MOS FET Drain 5. MOS FET Source 6. MOS FET Drain 7.62 3.5±0.3 3.3±0.3 4.15±0.3 6.5±0.5 0.5±0.1 1.34±0.1 0.25 M 0 to 15˚ 2.54 PS7341L-1A 9.25±0.5 TOP VIEW 6 5 4 1 2 3 1. LED Anode 2. LED Cathode 3. NC 4. MOS FET Drain 5. MOS FET Source 6. MOS FET Drain 3.5±0.3 0.10+0.10 –0.05 6.5±0.5 1.34±0.1 0.25 M 2 0.9±0.25 2.54 9.60±0.4 Data Sheet PN10306EJ02V0DS PS7341-1A,PS7341L-1A <R> MARKING EXAMPLE No. 1 pin Mark PS7341-1A NL601 Country Assembled Type Number Assembly Lot N L 6 01 Week Assembled Year Assembled (Last 1 Digit) In-house Code (L: Pb-Free) Rank Code Data Sheet PN10306EJ02V0DS 3 PS7341-1A,PS7341L-1A <R> ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Specification PS7341-1A PS7341-1A-A PS7341L-1A PS7341L-1A-A PS7341L-1A-E3 PS7341L-1A-E3-A PS7341L-1A-E4 PS7341L-1A-E4-A Pb-Free Magazine case 50 pcs Safety Standard Application Part Approval Number Standard products (UL, BSI, CSA, SEMKO, Embossed Tape 1 000 pcs/reel DEMKO, NEMKO, FIMKO approved) *1 For the application of the Safety Standard, following part number should be used. 4 Data Sheet PN10306EJ02V0DS *1 PS7341-1A PS7341-1A,PS7341L-1A ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Diode Parameter Symbol Ratings Unit Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V PD 50 mW IFP 1 A VL 400 V IL 150 mA Power Dissipation Peak Forward Current MOS FET *1 Break Down Voltage Continuous Connection A *2 Load Current Pulse Load Current Connection B 200 Connection C 300 *3 ILP 300 mA PD 560 mW BV 3 750 Vr.m.s. Total Power Dissipation PT 610 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +125 °C (AC/DC Connection) Power Dissipation Isolation Voltage *4 *1 PW = 100 µs, Duty Cycle = 1% *2 Conditions: IF ≥ 2 mA. The following types of load connections are available. Connection A Connection B Connection C 1 2 3 1 2 3 1 2 3 1 2 3 6 5 4 6 5 IL IL VL (AC/DC) L L + VL (DC) – 4 6 5 4 6 5 IL 4 IL IL L L IL + I L – + VL (DC) + VL (DC) – *3 PW = 100 ms, 1 shot *4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-3 shorted together, 4-6 shorted together. Data Sheet PN10306EJ02V0DS 5 PS7341-1A,PS7341L-1A RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 2 10 20 mA LED Off Voltage VF 0 0.5 V ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode MOS FET Coupled Symbol Conditions MIN. Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V Off-state Leakage Current ILoff VD = 400 V Output Capacitance Cout VD = 0 V, f = 1 MHz LED On-state Current IFon IL = 150 mA On-state Resistance Ron1 IF = 10 mA, IL = 10 mA Ron2 IF = 10 mA, IL = 150 mA, t ≤ 10 ms ton IF = 10 mA, VO = 5 V, RL = 2 kΩ, Turn-off Time *1, 2 toff PW ≥ 10 ms VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz Unit 1.2 1.4 V 5.0 µA 1.0 µA 65 Turn-on Time RI-O MAX. 0.03 *1, 2 Isolation Resistance TYP. 10 pF 2.0 mA 20 30 Ω 16 25 0.35 1.0 0.03 0.2 ms Ω 9 1.1 pF *1 Test Circuit for Switching Time IF Pulse Input VL 50 % Input 0 VO = 5 V Input monitor 90 % VO monitor Output Rin RL 10 % ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. <R> Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. 6 Data Sheet PN10306EJ02V0DS PS7341-1A,PS7341L-1A TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 300 Maximum Load Current IL (mA) Maximum Forward Current IF (mA) 100 80 60 40 20 0 –25 0 25 75 85 50 200 100 0 –25 100 0 25 75 85 50 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 1.8 100 200 1.6 1.4 Output Capacitance Cout (pF) Forward Voltage VF (V) f = 1 MHz IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA 1.2 1.0 0.8 –25 0 25 50 75 150 100 50 0 100 20 40 80 100 120 Ambient Temperature TA (˚C) Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE LOAD CURRENT vs. LOAD VOLTAGE 10–5 200 IF = 10 mA TA = 85 ˚C 10–6 Load Current IL (mA) Off-state Leakage Current ILoff (A) 60 10–7 25 ˚C 10–8 10–9 0 100 200 300 400 100 –4.0 500 –2.0 0 2.0 4.0 –100 –200 Load Voltage VL (V) Applied Voltage VD (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10306EJ02V0DS 7 PS7341-1A,PS7341L-1A NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 30 Normalized On-state Resistance Ron 3.0 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, IL = 10 mA 2.5 25 Number (pcs) 2.0 1.5 1.0 n = 50 pcs, IF = 10 mA, IL = 10 mA 20 15 10 5 0.5 0.0 –25 0 25 50 75 0 100 20 21 On-state Resistance Ron (Ω) Ambient Temperature TA (˚C) TURN-OFF TIME vs. FORWARD CURRENT TURN-ON TIME vs. FORWARD CURRENT 12 0.30 VO = 5 V VO = 5 V 0.25 Turn-off Time toff (ms) Turn-on Time ton (ms) 10 8 6 4 0.15 0.10 0.05 2 0 0.20 5 10 15 20 25 0 30 Forward Current IF (mA) 20 25 30 n = 50 pcs, IF = 10 mA, VO = 5 V 25 20 15 10 n = 50 pcs, IF = 10 mA, VO = 5 V 25 Number (pcs) Number (pcs) 15 TURN-OFF TIME DISTRIBUTION TURN-ON TIME DISTRIBUTION 20 15 10 5 5 0.3 0 0.4 Turn-on Time ton (ms) 0.03 0.05 Turn-off Time toff (ms) Remark The graphs indicate nominal characteristics. 8 10 Forward Current IF (mA) 30 0 5 Data Sheet PN10306EJ02V0DS 30 PS7341-1A,PS7341L-1A NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE 3.0 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V 2.5 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 100 Normalized Turn-off Time toff Normalized Turn-on Time ton 3.0 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V 2.5 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. Data Sheet PN10306EJ02V0DS 9 PS7341-1A,PS7341L-1A TAPING SPECIFICATIONS (in millimeters) 4.5 MAX. 10.3±0.1 7.5±0.1 1.5 +0.1 –0 16.0±0.3 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.0±0.1 10.4±0.1 1.55±0.1 12.0±0.1 0.3 Tape Direction PS7341L-1A-E3 PS7341L-1A-E4 Outline and Dimensions (Reel) 2.0±0.5 R 1.0 21.0±0.8 100±1.0 330±2.0 2.0±0.5 13.0±0.2 17.5±1.0 21.5±1.0 Packing: 1 000 pcs/reel 10 Data Sheet PN10306EJ02V0DS 15.9 to 19.4 Outer edge of flange PS7341-1A,PS7341L-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Two • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) <R> (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. Data Sheet PN10306EJ02V0DS 11 PS7341-1A,PS7341L-1A (4) Cautions <R> • To avoid quality degradation, assembling within 1 month after take this device out from covered pack is required. (Storage conditions 25°C, 65%RH MAX.) • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. <R> USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. 12 Data Sheet PN10306EJ02V0DS PS7341-1A,PS7341L-1A • The information in this document is current as of September, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. 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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PN10306EJ02V0DS 13 PS7341-1A,PS7341L-1A Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 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