PULSECORE ASM3I2669AF-08TR

ASM3P2669A
January 2007
rev 1.7
Low Power Peak EMI Reducing Solution
Features
•
The ASM3P2669A uses the most efficient and optimized
Generates an EMI optimized clock signal at the
output.
•
Integrated loop filter components.
•
Operates with a 3.3V /2.5V supply.
•
Operating current less than 4mA.
•
Low power CMOS design.
•
Input frequency range : 6MHz to 12MHz for 2.5V
implemented by using a proprietary all digital method.
The ASM3P2669A modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of
: 6MHz to 13MHz for 3.3V
•
modulation profile approved by the FCC and is
Generates a 1X low EMI spread spectrum clock of
the input frequency.
its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced
by oscillators and most frequency generators. Lowering
EMI by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation’.
•
Frequency deviation: ±1% @ 10MHz
•
Available in 6-pin TSOT-23, 8-pin SOIC and 8-pin
TSSOP packages.
Applications
The ASM3P2669A is targeted towards all portable
Product Description
devices with very low power requirements like MP3
The ASM3P2669A is a versatile spread spectrum
frequency modulator designed specifically for a wide
range of clock frequencies. The ASM3P2669A reduces
electromagnetic interference (EMI) at the clock source,
allowing system wide reduction of EMI of
all clock
players and digital still cameras.
Key Specifications
Description
Specification
Supply voltages
VDD = 3.3V /2.5V
system cost savings by reducing the number of circuit
Cycle-to-Cycle Jitter
200pS ( Max)
board layers ferrite beads, shielding that are traditionally
Output Duty Cycle
45/55%
required to pass EMI regulations.
Modulation Rate Equation
FIN/256
Frequency Deviation
±1% @ 10MHz
dependent signals. The ASM3P2669A allows significant
Block Diagram
VDD
PD
PLL
Modulation
CLKIN
Frequency
Divider
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
ModOUT
VSS
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018
www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
ASM3P2669A
January 2007
rev 1.7
Pin Configuration (6-pin TSOT-23 Package)
PD 1
NC 2
ASM3P2669A
CLKIN 3
6
VSS
5
ModOUT
4
VDD
Pin Description
Pin#
1
Pin Name
PD
Type
Description
I
Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not
used.
2
NC
-
No connect.
3
CLKIN
I
External reference frequency input.
4
VDD
P
Power supply for the entire chip
5
ModOUT
O
Spread spectrum clock output.
6
VSS
P
Ground connection.
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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ASM3P2669A
January 2007
rev 1.7
Pin Configuration (8-pin SOIC and TSSOP Package)
CLKIN 1
8
VDD
7
NC
PD 3
6
ModOUT
NC 4
5
VSS
NC
2
ASM3P2669A
Pin Description
Pin#
Pin Name
Type
1
CLKIN
I
2
NC
-
No Connect.
I
Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not
used.
3
PD
Description
External reference frequency input.
4
NC
-
No connect.
5
VSS
P
Ground connection.
6
ModOUT
O
Spread spectrum clock output.
7
NC
-
No connect.
8
VDD
P
Power supply for the entire chip
Modulation Profile
Specifications
Description
Frequency Range
Specification
For 2.5V Supply
6MHz < CLKIN < 12MHz
For 3.3V Supply
6MHz < CLKIN < 13MHz
Modulation Equation
FIN/256
Frequency Deviation
±1% @ 10MHz
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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ASM3P2669A
January 2007
rev 1.7
Absolute Maximum Ratings
Symbol
Rating
Unit
Voltage on any pin with respect to Ground
-0.5 to +4.6
V
Storage temperature
-65 to +125
°C
TA
Operating temperature
-40 to +85
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
VDD, VIN
TSTG
Parameter
Static Discharge Voltage
TDV
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics for 2.5V Supply
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
Min
Typ
Max
Unit
VIL
Input low voltage
VSS - 0.3
-
0.8
V
VIH
Input high voltage
2.0
-
VDD + 0.3
V
IIL
Input low current
-
-
-35
µA
IIH
Parameter
Input high current
-
-
35
µA
IXOL
XOUT output low current (@0.5V, VDD=2.5V)
-
3
-
mA
IXOH
XOUT output high current (@1.8V, VDD=2.5V)
-
3
-
mA
VOL
Output low voltage (VDD = 2.5 V, IOL = 8 mA)
-
-
0.6
V
VOH
Output high voltage (VDD = 2.5 V, IOH = 8 mA)
1.8
-
-
V
IDD
Static supply current*
-
-
10
uA
ICC
Dynamic supply current (2.5V, 10MHz and no load)
-
2.0
-
mA
2.375
2.5
2.625
V
Power-up time (first locked cycle after power-up)**
-
-
5
mS
Output impedance
-
50
-
Ω
VDD
Operating voltage
tON
ZOUT
* XIN/CLKIN pin and PD pin are pulled low
** VDD and XIN/CLKIN input are stable, PD pin is made high from low.
AC Electrical Characteristics for 2.5V Supply
Symbol
CLKIN
ModOUT
fd
Parameter
Min
Typ
Max
Unit
Input frequency
6
-
12
MHz
Output frequency
6
-
12
MHz
Input Frequency = 6MHz
-
±1.5
-
Input Frequency = 12MHz
-
±0.8
-
Frequency Deviation
%
tLH*
Output rise time (measured from 0.7V to 1.7V)
0.8
1.5
1.7
nS
tHL*
Output fall time (measured from 1.7V to 0.7V)
0.5
1.0
1.2
nS
tJC
Jitter (cycle to cycle)
-
-
200
pS
tD
Output duty cycle
45
50
55
%
* tLH and tHL are measured into a capacitive load of 15pF
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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ASM3P2669A
January 2007
rev 1.7
DC Electrical Characteristics for 3.3V Supply
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
Min
Typ
Max
Unit
VIL
Input low voltage
Parameter
VSS - 0.3
-
0.8
V
VIH
Input high voltage
2.0
-
VDD + 0.3
V
IIL
Input low current
-
-
-35
µA
IIH
Input high current
-
-
35
µA
IXOL
XOUT output low current (@0.4V, VDD=3.3V)
-
3
-
mA
IXOH
XOUT output high current (@2.5V, VDD=3.3V)
-
3
-
mA
VOL
Output low voltage (VDD = 3.3 V, IOL = 8 mA)
-
-
0.4
V
VOH
Output high voltage (VDD = 3.3 V, IOH = 8 mA)
2.5
-
-
V
IDD
Static supply current*
-
-
10
uA
ICC
Dynamic supply current (3.3V, 10MHz and no load)
-
2.5
-
mA
2.7
3.3
3.6
V
Power-up time (first locked cycle after power-up)**
-
-
5
mS
Output impedance
-
45
-
Ω
VDD
tON
ZOUT
Operating voltage
* XIN/CLKIN pin and PD pin are pulled low
** VDD and XIN/CLKIN input are stable, PD pin is made high from low.
AC Electrical Characteristics for 3.3V Supply
Symbol
CLKIN
ModOUT
fd
Parameter
Min
Typ
Max
Unit
Input frequency
6
-
13
MHz
Output frequency
6
-
13
MHz
Input Frequency = 6MHz
-
±1.5
-
Input Frequency = 13MHz
-
±0.75
-
Frequency Deviation
%
tLH*
Output rise time (measured from 0.8 to 2.0V)
0.5
1.3
1.5
nS
tHL*
Output fall time (measured at 2.0V to 0.8V)
0.4
0.9
1.1
nS
tJC
Jitter (cycle to cycle)
-
-
200
pS
tD
Output duty cycle
45
50
55
%
*tLH and tHL are measured into a capacitive load of 15pF
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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ASM3P2669A
January 2007
rev 1.7
Package Information
6-pin TSOT-23 Package
Dimensions
Symbol
Inches
Min
A
Max
Millimeters
Min
Max
0.04
1.00
A1
0.00
0.004
0.00
0.10
A2
0.033
0.036
0.84
0.90
b
0.012
0.02
0.30
0.50
H
0.005 BSC
0.127 BSC
D
0.114 BSC
2.90 BSC
B
0.06 BSC
1.60 BSC
e
0.0374 BSC
0.950 BSC
C
0.11 BSC
2.80 BSC
L
0.0118
0.02
0.30
0.50
θ
0°
4°
0°
4°
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
6 of 11
ASM3P2669A
January 2007
rev 1.7
8-Pin SOIC Package
H
E
D
A2
A
C
A1
D
θ
e
L
B
Dimensions
Symbol
Inches
Millimeters
Min
Max
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.010
0.18
0.25
D
0.193 BSC
4.90 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
0.41
1.27
θ
0°
8°
0°
8°
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
7 of 11
ASM3P2669A
January 2007
rev 1.7
8-Pin TSSOP Package
H
E
D
A2
A
C
θ
e
A1
L
B
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.10
A1
0.002
0.006
0.05
0.15
A2
0.033
0.037
0.85
0.95
B
0.008
0.012
0.19
0.30
c
0.004
0.008
0.09
0.20
D
0.114
0.122
2.90
3.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.028
0.50
0.70
θ
0°
8°
0°
8°
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
8 of 11
ASM3P2669A
January 2007
rev 1.7
Ordering Information
Part Number
Marking
ASM3P2669AF-06OR
H4LL
ASM3P2669AF-08TT
ASM3P2669AF-08TR
Package Type
Temperature
6-Pin TSOT-23, TAPE & REEL, Pb Free
Commercial
3P2669AF
8-Pin TSSOP, TUBE, Pb Free
Commercial
3P2669AF
8-Pin TSSOP, TAPE & REEL, Pb Free
Commercial
ASM3P2669AF-08ST
3P2669AF
8-Pin SOIC, TUBE, Pb Free
Commercial
ASM3P2669AF-08SR
3P2669AF
8-Pin SOIC, TAPE & REEL, Pb Free
Commercial
ASM3P2669AG-06OR
H3LL
6-Pin TSOT-23, TAPE & REEL, Green
Commercial
ASM3P2669AG-08TT
3P2669AG
8-Pin TSSOP, TUBE, Green
Commercial
ASM3P2669AG-08TR
3P2669AG
8-Pin TSSOP, TAPE & REEL, Green
Commercial
ASM3P2669AG-08ST
3P2669AG
8-Pin SOIC, TUBE, Green
Commercial
ASM3P2669AG-08SR
3P2669AG
8-Pin SOIC, TAPE & REEL, Green
Commercial
ASM3I2669AF-06OR
H5LL
ASM3I2669AF-08TT
6-Pin TSOT-23, TAPE & REEL, Pb Free
Industrial
3I2669AF
8-Pin TSSOP, TUBE, Pb Free
Industrial
ASM3I2669AF-08TR
3I2669AF
8-Pin TSSOP, TAPE & REEL, Pb Free
Industrial
ASM3I2669AF-08ST
3I2669AF
8-Pin SOIC, TUBE, Pb Free
Industrial
ASM3I2669AF-08SR
3I2669AF
8-Pin SOIC, TAPE & REEL, Pb Free
Industrial
ASM3I2669AG-06OR
H6LL
6-Pin TSOT-23, TAPE & REEL, Green
Industrial
ASM3I2669AG-08TT
3I2669AG
8-Pin TSSOP, TUBE, Green
Industrial
ASM3I2669AG-08TR
3I2669AG
8-Pin TSSOP, TAPE & REEL, Green
Industrial
ASM3I2669AG-08ST
3I2669AG
8-Pin SOIC, TUBE, Green
Industrial
ASM3I2669AG-08SR
3I2669AG
8-Pin SOIC, TAPE & REEL, Green
Industrial
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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ASM3P2669A
January 2007
rev 1.7
Device Ordering Information
A S M 3 P 2 6 6 9 A F - 0 8 T R
R = Tape & Reel, T = Tube or Tray
O = SOT
S = SOIC
T = TSSOP
A = SSOP
V = TVSOP
B = BGA
Q = QFN
U = MSOP
E = TQFP
L = LQFP
U = MSOP
P = PDIP
D = QSOP
X = SC-70
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE, LEAD FREE, and RoHS
PART NUMBER
X= Automotive
I= Industrial
P or n/c = Commercial
(-40C to +125C) (-40C to +85C)
(0C to +70C)
1 = Reserved
2 = Non PLL based
3 = EMI Reduction
4 = DDR support products
5 = STD Zero Delay Buffer
6 = Power Management
7 = Power Management
8 = Power Management
9 = Hi Performance
0 = Reserved
PulseCore Semiconductor Mixed Signal Product
Licensed under U.S Patent Nos 5,488,627 and 5,631,921
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
10 of 11
ASM3P2669A
January 2007
rev 1.7
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200
Campbell, CA 95008
Tel: 408-879-9077
Fax: 408-879-9018
www.pulsecoresemi.com
Copyright © PulseCore Semiconductor
All Rights Reserved
Part Number: ASM3P2669A
Document Version: 1.7
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
© Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct
this data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from
PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.
The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Low Power Peak EMI Reducing Solution
Notice: The information in this document is subject to change without notice.
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