ASM3P2111B February 2007 rev 0.2 Peak EMI Reducing Solution Features allows significant system cost savings by reducing the number of circuit board layers and shielding that are • Generates an EMI optimized clock at the output. required to pass EMI regulations. The ASM3P2111B • Input frequency: 25MHz. modulates the output of PLL in order to spread the • Frequency outputs: bandwidth of a synthesized clock, thereby decreasing the • 60MHz (unmodulated) peak amplitudes of its harmonics. This results in • 2 x 48MHz (unmodulated) significantly lower system EMI compared to the typical • 66.6MHz (modulated): -1.7% down spread narrow band signal produced by oscillators and most • Modulation rate: 30KHz. clock generators. Lowering EMI by increasing a signal’s • Supply voltage range: 3.3V ± 0.3V. bandwidth is called spread spectrum clock generation. • Available in 8-pin SOIC Package. • Commercial and Industrial Temperature range. • RoHS Compliant Applications ASM3P2111B is targeted towards EMI management for Product Description high speed digital applications such as PC peripheral devices, consumer electronics and embedded controller The ASM3P2111B is a versatile spread spectrum frequency modulator that reduces systems. electromagnetic interference (EMI) at the clock source. The ASM3P2111B Block Diagram VDD 60 MHz XIN /CLKIN Crystal Oscillator PLL1 48 MHz_1 XOUT 48 MHz_2 48 MHz_1 PLL2 66.6 MHz Modulated VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM3P2111B February 2007 rev 0.2 Pin Configuration XIN/ CLKIN 1 XOUT 2 8 VSS 7 66.6MHz ASM3P2111B VDD 3 6 48MHz_1 60MHz 4 5 48MHz_2 Pin Description Description Pin # Pin Name Type 1 XIN / CLKIN I Connection to crystal 2 XOUT O Connection to crystal 3 VDD P Power supply for the analog and digital blocks (+3.3V) 4 60MHz O Clock output-1 60MHz un-modulated 5 48MHz_2 O Clock output-2 48MHz_2 un-modulated 6 48MHz_1 O Clock output-3 48MHz_1 un-modulated 7 66.6MHz O Clock output-4 66.6MHz modulated 8 VSS P Ground to entire chip. Connect to System Ground Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 2 of 8 ASM3P2111B February 2007 rev 0.2 Absolute Maximum Ratings Symbol VDD, VIN Parameter Rating Unit Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) 150 °C 2 KV TSTG TDV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Symbol Parameter Condition / Description VDD Supply Voltage FXIN Crystal Resonator Frequency CL 3.3V ± 0.3V Output Driver Load Capacitance Min Typ Max Unit 3 3.3 3.6 V 25 - - MHz - - 15 pF Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 3 of 8 ASM3P2111B February 2007 rev 0.2 DC Electrical Characteristics Parameter Symbol Conditions / Description Min Typ Max Unit IDD VDD=3.3V, FCLK =25MHz, CL=15pF 41 48 62 mA IDDL VDD = 3.3V, Clock Input = 0 20 25 35 mA VIH VDD=3.3V 2.0 - VDD+0.3 V VIL VDD=3.3V VSS-0.3 - 0.8 V IIH -1 - 1 µA IIL -20 -36 -80 µA Overall Supply Current, Dynamic Supply Current, Static All input pins High-Level Input Voltage Low-Level Input Voltage High-Level Input Current Low-Level Input Current (pull-up) High-Level Output Source Current Low-Level Output Sink Current IxOH VDD=V (XIN) = 3.3V, VO=0.4V - 3 - mA IxOL VDD=3.3V, V (XIN)=VO=2.5V - 3 - mA IOH VO=2.5V - -20 - mA IOL VO=0.4V - 23 - mA ZOH VO=0.5 VDD; output driving high - 29 - ZOL Vo=0.5 VDD; output driving low - 27 - Ω Clock Outputs High-Level Output Source Current Low-Level Output Sink Current Output Impedance AC Electrical Characteristics Parameter Symbol Rise Time tr Fall Time tf Clock Duty Cycle Conditions/ Description VO = 0.8V to 2.0V; CL = 15pF VO = 2.0V to 0.8V; CL = 15pF Min Typ Max Unit 300 800 900 pS 360 800 900 pS 45 - 55 % Ratio of pulse width (as measured from rising edge to next falling edge at VDD /2) to one clock period * CL = 15 pF, Input clock frequency = 25MHz Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 4 of 8 ASM3P2111B February 2007 rev 0.2 Typical Crystal Oscillator Circuit Crystal R1 = 510Ω C1 =18 pF C2 = 18 pF Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 25MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -25°C to +85°C Storage temperature -40°C to +85°C Load capacitance 18pF Shunt capacitance 7pF maximum ESR 25Ω Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 5 of 8 ASM3P2111B February 2007 rev 0.2 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 6 of 8 ASM3P2111B February 2007 rev 0.2 Ordering Codes Part number Marking Package Configuration Temperature Range ASM3P2111BF-08ST 3P2111BF 8-pin SOIC TUBE, Pb Free Commercial ASM3P2111BF-08SR 3P2111BF 8-pin SOIC TAPE & REEL, Pb Free Commercial ASM3I2111BF-08ST 3I2111BF 8-pin SOIC TUBE, Pb Free Industrial ASM3I2111BF-08SR 3I2111BF 8-pin SOIC TAPE & REEL, Pb Free Industrial ASM3P2111BG-08ST 3P2111BG 8-pin SOIC TUBE, Green Commercial ASM3P2111BG-08SR 3P2111BG 8-pin SOIC TAPE & REEL, Green Commercial ASM3I2111BG-08ST 3I2111BG 8-pin SOIC TUBE, Green Industrial ASM3I2111BG-08SR 3I2111BG 8-pin SOIC TAPE & REEL, Green Industrial Ordering Information A S M 3 P 2 1 1 1 B F - 0 8 S R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 7 of 8 ASM3P2111B February 2007 rev 0.2 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P2111B Document Version: v0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 8 of 8