ASM3P2183A March 2007 rev 1.7 EMI Reduction IC Features The ASM3P2183A reduces electromagnetic interference • FCC approved method of EMI attenuation. • Provides up to 15dB EMI reduction. • Generates a 1X low EMI spread spectrum clock of the input frequency. • Input frequency range: 6MHz to 90MHz. • Internal loop filter minimizes external components and board space. • Selectable spread options: Down and Center Spread • 2 spread frequency deviation selections: • -1.25% or ± 0.42% • Low inherent cycle-to-cycle jitter. • Supply Voltage: 3.3 V ± 0.3V. • Low power CMOS design. • Supports notebook VGA and other LCD timing controller applications. • Products are available for Industrial temperature range. • Available in 8-pin SOIC and TSSOP Packages. Product Description (EMI) at the clock source, allowing system wide reduction of EMI of down stream clock and data dependent signals. The ASM3P2183A allows significant system cost savings by reducing the number of circuit board layers ferrite beads, shielding and other passive components that are traditionally required to pass EMI regulations. The ASM3P2183A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method. The ASM3P2183A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’. Applications The ASM3P2183A is a versatile spread spectrum frequency modulators designed specifically for a wide range of input clock frequencies from 6MHz to 90MHz. (Refer Input Frequency and Modulation Rate Table). The ASM3P2183A can generate an EMI reduced clock from an OSC or a system generated clock. The ASM3P2183A The ASM3P2183A is targeted towards EMI management for memory and LVDS interfaces in mobile graphic chipsets and high-speed digital applications such as PC peripheral devices, consumer electronics, and embedded controller systems. offers a Down Spread clock with a percentage deviation of -1.25% and a Center Spread clock with a percentage deviation of ± 0.42%. PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM3P2183A March 2007 rev 1.7 Block Diagram FS0 FS1 VDD SS% PLL Modulation XIN /CLKIN Crystal Oscillator Frequency Divider XOUT Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT VSS Pin Configuration XIN / CLKIN 1 8 XOUT 2 FS1 7 FS0 ASM3P2183A VSS 3 6 SS% 4 5 VDD ModOUT Pin Description Pin# Pin Name Type Description 1 XIN /CLKIN I 2 XOUT I 3 VSS P Ground to entire chip. 4 SS% I Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Selection Table). This pin has an internal pull-up resistor. 5 ModOUT O Spread spectrum low EMI output. 6 VDD P Power supply for the entire chip. 7 FS0 I 8 FS1 I Crystal connection or external frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock. Crystal connection. Input connection for an external crystal. If using an external reference, this pin must be left unconnected. Frequency range select. Digital logic input used to select frequency range (Refer Input Frequency and Modulation Rate Table). This pin has an internal pull-up resistor. Frequency range select. Digital logic input used to select frequency range (Refer Input Frequency and Modulation Rate Table). This pin has an internal pull-up resistor. EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 8 ASM3P2183A March 2007 rev 1.7 Input Frequency and Modulation Rate Table FS1 (pin 8) FS0 (pin 7) Frequency Range 0 0 6MHz to 13MHz 0 1 12MHz to 25MHz 1 0 25MHz to 50MHz 1 1 50MHz to 90MHz Spread Deviation Selection Table SS% (pin 4) Spread Deviation (%) 0 - 1.25 1 ± 0.42 Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TSTG Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) 150 °C 2 KV TDV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Recommended Operating Conditions Symbol TA VDD Parameter Operating Temperature Core Voltage Min Typ 0 +3.0 +3.3 EMI Reduction IC Notice: The information in this document is subject to change without notice. Max Units +70 °C +3.6 V 3 of 8 ASM3P2183A March 2007 rev 1.7 DC Electrical Characteristics Symbol Parameter Min Typ Max Unit VIL Input low voltage VSS – 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - - -35 µA IIH - - 35 µA - 3 - mA - 3 - mA VOL Input high current XOUT Output low current (@ 0.4V, VDD = 3.3V) XOUT Output high current (@ 2.5V, VDD = 3.3V) Output low voltage (VDD = 3.3V, IOL = 20mA) - - 0.4 V VOH Output high voltage (VDD = 3.3V, IOH = 20mA) 2.5 - - V ICC Dynamic supply current Normal mode (3.3V,90MHz and 10pF loading) - 28 - mA IDD Static supply current * - 7.0 - mA VDD Operating voltage 3.0 3.3 3.6 V tON Power up time (first locked clock cycle after power up) - 0.18 - mS Clock out impedance - 50 - Ω IXOL IXOH ZOUT * XIN /CLKIN pin is pulled low AC Electrical Characteristics Symbol fIN ModOUT Parameter Input frequency Typ Max Unit 6 - 90 MHz 6 - 90 MHz Output rise time (measured at 0.8V to 2.0V) 0.3 0.9 1.1 nS tHL* Output fall time (measured at 2.0V to 0.8V) 0.5 1.0 1.2 nS tJC Jitter (cycle to cycle) - - 200 pS TD Output duty cycle 45 50 55 % tLH* Output frequency Min * tLH and tHL are measured with a capacitive load of 15pF at 27MHz EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 8 ASM3P2183A March 2007 rev 1.7 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 8 ASM3P2183A March 2007 rev 1.7 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 8 ASM3P2183A March 2007 rev 1.7 Ordering Information Part Number Marking Package Type Temperature ASM3P2183A-08ST 3P2183A 8-Pin SOIC, TUBE Commercial ASM3P2183A-08SR 3P2183A 8-Pin SOIC, TAPE & REEL Commercial ASM3P2183A-08TT 3P2183A 8-Pin TSSOP, TUBE Commercial ASM3P2183A-08TR 3P2183A 8-Pin TSSOP, TAPE & REEL Commercial ASM3P2183AF-08ST 3P2183AF 8-Pin SOIC, TUBE, Pb Free Commercial ASM3P2183AF-08SR 3P2183AF 8-Pin SOIC, TAPE & REEL, Pb Free Commercial ASM3P2183AF-08TT 3P2183AF 8-Pin TSSOP, TUBE, Pb Free Commercial ASM3P2183AF-08TR 3P2183AF 8-Pin TSSOP, TAPE & REEL, Pb Free Commercial ASM3P2183AG-08ST 3P2183AG 8-Pin SOIC, TUBE, Green Commercial ASM3P2183AG-08SR 3P2183AG 8-Pin SOIC, TAPE & REEL, Green Commercial ASM3P2183AG-08TT 3P2183AG 8-Pin TSSOP, TUBE, Green Commercial ASM3P2183AG-08TR 3P2183AG 8-Pin TSSOP, TAPE & REEL, Green Commercial Device Ordering Information A S M 3 P 2 1 8 3 A F - 0 8 T R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 8 ASM3P2183A March 2007 rev 1.7 Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P2183A Document Version: v1.7 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. EMI Reduction IC Notice: The information in this document is subject to change without notice. 8 of 8