SANKEN SI

SI-8001FDL
DC-to-DC Step-Down Converter
Features and Benefits
Description
▪ 3.5 A output current supplied in a small, surface mount
power package
▪ High efficiency: 83% at VIN = 15 V, IO = 2.0 A,VO = 5 V
▪ Requires only six external components
▪ Oscillation circuit built-in (frequency 300 kHz typical)
▪ Constant-current mode overcurrent protection circuit and
overtemperature protection circuit built-in
▪ Output-on state at low level
▪ Low current consumption during output-off state
The SI-8001FDL DC voltage regulator is a DC-to-DC buck
convertor that attains an oscillation frequency of 300 kHz,
and has an integrated miniaturized choke coil, allowing it to
serve as a small, high efficiency power supply in a compact
TO263 package.
The internal switching regulator function provides high
efficiency switching regulation without any need for adjustment.
The device requires only six external support components.
Optional on/off control can be performed using a transistor.
The SI-8001FDL includes overcurrent and overtemperature
protection circuits.
Applications include:
▪ DVD recorder
▪ FPD TV
▪ Telecommunications equipment
▪ Office automation equipment, such as printers
▪ On-board local power supply
▪ Output voltage regulator for second stage of SMPS
(switched mode power supply)
Package: TO263-5
Not to scale
Functional Block Diagram
VIN
1 IN
SW
C1
PReg
On/Off
Latch and
Driver
C2
R1
Osc
Comparator
Overtemperature
Protection
Error
Amplifier
GND
3
ADJ
4
R2
Reference
Voltage
27469.064-I
VOUT
L1
Di
SPB-G56S
(Sanken)
Overcurrent
Protection
Reset
5 VC
2
SI-8001FDL
DC-to-DC Step-Down Converter
Selection Guide
Part Number
Output Voltage
Adjustable Range
(V)
Efficiency,
Typ.
(%)
Input Voltage,
Max.
(V)
Output Current,
Max.
(A)
Packing
SI-8001FDL-TL
0.8 to 24
83
40
3.5
800 pieces per reel
Absolute Maximum Ratings
Characteristic
Symbol
DC Input Voltage
VIN
VC Pin Control Voltage
VC
Remarks
Rating
Units
43
V
VIN
V
3
W
–40 to 150
°C
–40 to 150
°C
Power Dissipation
PD
Mounted on 40 mm × 40 mm exposed copper area on 40 mm
× 40 mm glass-epoxy PCB; limited by internal overtemperature
protection.
Junction Temperature
TJ
Internal overtemperature protection circuit may enable when TJ ≥
130°C. During product operation, recommended TJ ≤ 125°C.
Storage Temperature
Tstg
Thermal Resistance (junction-to-case)
RθJC
Mounted on 40 mm × 40 mm exposed copper area on 40 mm ×
40 mm glass-epoxy PCB.
3
°C/W
Thermal Resistance (junction-to-ambient air)
RθJA
Mounted on 40 mm × 40 mm exposed copper area on 40 mm ×
40 mm glass-epoxy PCB.
33.3
°C/W
Recommended Operating Conditions*
Characteristic
Symbol
DC Input Voltage Range
VIN
DC Output Voltage Range
VO
DC Output Current Range
IO
Operating Junction Temperature Range
TJOP
Operating Temperature Range
TOP
Remarks
VIN (min) is the greater of 4.5 V or VO+3 V.
VIN ≥ VO + 3 V; to be used within the allowable package
power dissipation characteristics (refer to Power Dissipation
chart).
To be used within the allowable package power dissipation
characteristics (refer to Power Dissipation chart).
Min.
Max.
Units
See
remarks
40
V
0.8
24
V
0
3.5
A
–30
100
°C
–30
85
°C
*Required for normal device functioning according to Electrical Characteristics table.
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
2
SI-8001FDL
DC-to-DC Step-Down Converter
ELECTRICAL CHARACTERISTICS1, valid at TA = 25°C, VO = 5 V (adjusted), R1 = 4.2 kΩ, R1 = 0.8 kΩ
Characteristic
Test Conditions1
Symbol
Reference Voltage
VADJ
Reference Voltage Temperature Coefficient
∆VADJ /∆T
VIN = 15 V, IO = 0.2 A
Min.
Typ.
Max.
0.784
0.800
0.816
V
–
±0.1
–
mV/°C
VIN = 15 V, IO = 0.2 A, TC = 0 to 100 °C
Units
Efficiency2
η
VIN = 15 V, IO = 2 A
–
83
–
%
Operating Frequency
fO
VIN = 15 V, IO = 2 A
270
300
330
kHz
Line Regulation
VLine
VIN = 10 to 30 V, IO = 2 A
–
–
80
mV
Load Regulation
VLoad
VIN = 15 V, IO = 0.2 to 3.5 A
–
–
50
mV
Overcurrent Protection Threshold Current
IS
VC Terminal Control Voltage (On)
VC(IH)
VC Terminal Control Voltage (Off)
VC(IL)
VC Terminal Control Current (On)
IC(IH)
VIN = 15 V
3.6
–
–
A
–
–
0.8
V
2
–
–
V
VC = 2 V
–
6
100
μA
Quiescent Current 1
Iq
VIN = 15 V, IO = 0 A
–
6
–
mA
Quiescent Current 2
Iq(off)
VIN = 15 V, VC = 0 V
–
30
200
μA
1Using
circuit shown in Typical Application Circuit diagram.
2Efficiency is calculated as: η(%) = ([V × I ] × [V × I ]) × 100.
O
O
IN
IN
1
2
3
4
5
Terminal List Table
Name
Number
IN
1
Function
Supply voltage
SW
2
Regulated supply output
GND
3
Ground terminal
ADJ
4
Terminal for resistor bridge feedback
VC
5
If the VC terminal is left open, output will be in the on state. Because the input level is
equivalent to LS-TTL, direct drive by LS-TTL is possible.
VC Pin Control
Input Current versus Input Voltage
IO = 0 A, TA = 25°C, R1 = 4.2 kΩ, R2 = 0.8 kΩ
40
30
IC (μA)
Pin-out Diagram
20
10
0
0
10
20
VC (V)
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
30
40
3
SI-8001FDL
DC-to-DC Step-Down Converter
Performance Characteristics
At TA = 25°C, VO = 5 V Adjusted, R1 = 4.2 kΩ, R2 = 0.8 kΩ
6.00
90
15 V
Efficiency versus
Output Current
VO= 3.3 V
η (%)
80
0.5 A
VIN
4.00
Low Voltage
Behavior:
Output Voltage
versus
Supply Voltage
20 V
75
30 V
70
40 V
VO (V)
8V
0
0.5
1.0
1.5
2.0
IO (A)
2.5
3.0
0
3.5
1
2
3
4
5
VIN (V)
5.08
15 V
85
VIN
6
7
8
VIN
5.06
5.04
20 V
75
Load Regulation:
5.02
Output Voltage
5.00
versus
Output Current
4.98
40 V
4.96
10 V
VO (V)
80
η (%)
0
5.10
8V
30 V
70
40 V
30 V
15 V
4.94
65
60
3.5 A
1.00
90
Efficiency versus
Output Current
VO= 5.0 V
1A
2A
3.00
2.00
65
60
0A
IO
5.00
85
8V
4.92
4.90
0
0.5
1.0
1.5
2.0
IO (A)
2.5
3.0
0
3.5
100
1
2
IO (A)
10
20
VIN (V)
3
10
95
20 V
15V
VIN
8
Quiescent Current
versus
Supply Voltage
IO = 0 A
VC = 0 V
85
30 V
80
Iq (mA)
Efficiency versus
Output Current
VO= 12.0 V
η (%)
90
40 V
0
70
0
0.5
1.0
1.5
2.0
IO (A)
2.5
3.0
3.5
50
0
30
40
6
5
40
8V
Overcurrent
Protection:
Output Voltage
versus
Output Current
30
20
4
VO (V)
IQ (μA)
4
2
75
Behavior at
Turn-Off:
Quiescent Current
versus
Input Voltage
IO = 0 A
VC = 2 V
6
VIN
15 V
3
30 V
2
10
40 V
1
0
0
0
10
20
VIN (V)
30
40
0
1
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
2
IO (A)
3
4
5
4
SI-8001FDL
DC-to-DC Step-Down Converter
Thermal Performance Characteristics
The application must be designed to ensure that the TJ(max)
of the device is not exceeded during operation. To do so, it is
necessary to determine values for maximum power dissipation,
PD(max), and ambient temperature, TA(max).
Power Dissipation versus Ambient Temperature
TJ(max) = 125°C; Mounted on glass-epoxy PCB (40 mm × 40 mm),
with varying exposed copper areas
3.5
Cu Area: 1600 mm2
RθJA = 33.3°C/W
The relationships of TJ, PD, TA, and case temperature, TC, are as
shown in the following formulas:
PD =
TJ – TC
RθJC
and
PD =
TJ – TA
RθJA
3.0
Cu Area: 800 mm2
RθJA = 37°C/W
.
2.5
PD can be calculated from input values:
⎞
⎟⎟
⎠
Cu Area: 400 mm2
RθJA = 44°C/W
2.0
PD (W)
⎛ 100 ⎞
⎛ V
− 1⎟⎟ − VF ⋅ I O ⎜⎜1 − O
PD = VO ⋅ I O ⎜⎜
⎝ Hx
⎠
⎝ VIN
Cu Area: 100 mm2
RθJA = 53°C/W
1.5
where:
VO is output voltage in V,
ηx is IC efficiency in percent (varies with VIN and IO; refer to
efficiency performance curves for value), and
VF is forward voltage for the input diode, Di. In these tests, the
Sanken SPB-G56S was used, at 0.4 V. For application design,
obtain thermal data from the datasheet for the diode.
PD is substantially affected by the heat conductance properties of
the application, in particular any exposed copper area on the PCB
where the device is mounted. The relationships of PD, TA, and
copper area is represented in the Power Dissipation chart.
RθJA for a given copper area can be determined form the Device
Thermal Resistance chart. This can be substituted into the formula
above to determine the TJ (max) allowable in the application.
Generally, more than 10% to 20% derating is required.
Because the heat dissipation capacity of the copper area depends
substantively on how it is used in the actual application, thermal
characteristics of the application must be confirmed by testing.
TC is determined by connecting a thermocouple to the device as
shown here:
Thermocouple mount
at tab center
0.5
0
–25
0
25
50
75
100
125
TA (°C)
Device Thermal Resistance versus Exposed Copper Area on PCB
Glass-epoxy PCB, 40 mm × 40 mm
55
50
45
40
35
30
0
200
400
600
800
1000
1200
1400
1600
1800
Copper Area (mm2)
6
OTP On
5
Overtemperature
Protection:
Output Voltage versus
Junction Temperature
4
VO (V)
IO is output current in A,
1.0
RθJA(°C/W)
VIN is input supply voltage in V,
VIN = 15 V, IO = 10 mA
3
2
1
And analyzing the results using the following formula:
TJ = PD × RθJC + TC ,
OTP Off
0
0
for this device, RθJC is 3 °C/W.
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
20
40
60
80 100
TJ (°C)
120
140
160
180
5
SI-8001FDL
DC-to-DC Step-Down Converter
Component Selection
Diode Di A Schottky-barrier diode must be used for Di. If other
diode types are used, such as fast recovery diodes, the IC may be
destroyed because of the reverse voltage applied by the recovery
voltage or ON voltage.
Choke Coil L1 If the winding resistance of the choke coil is too
high, the efficiency may be reduced below rating. Because the
overcurrent protection start current is approximately 4.2 A, attention must be paid to the heating of the choke coil by magnetic
saturation due to overload or short-circuited load.
Capacitors C1 and C2 Because for SMPS, large ripple currents flow across C1 and C2, capacitors with high frequency and
low impedance must be used. If the impedance of C2 is too high,
the switching waveform may not be normal at low temperatures.
Do not use either OS or tantalum types of capacitors for C2,
because the extremely low ESR causes an abnormal oscillation.
The device is stabilized, and for proper operation, C1 must be
located close to the device (see layout diagram, below).
Resistor Bridge R1 and R2 comprise the resistor bridge for the
output voltage, VO, and are calculated as follows:
(V − V ) (V − 0.8) (Ω) , and R2 = VADJ = 0.8 = 0.8 (k Ω )
R1 = O ADJ = O
−3
−3
1 × 10
IADJ
1 × 10
IADJ
IADJ should always be set to 1 mA. Note that R2 should always be
present to ensure stable operation, even if VO, is set to 0.8 V (that
is, even if there is no R1). VO should be at least VIN + 8%.
Typical Application Diagram
VIN
1
IN
SW
L1
2
SI-8001FDL
VC GND
3
5
C1
ADJ
VO
Component
R1
4
IADJ
Di
R2
Rating
C1
C2
Di
L1
470 μF
680 μF
SPB-G56S (Sanken)
47 μH
C2
GND
GND
Recommended PCB Layout
Recommended Solder Pad Layout
11±0.2
9±0.2
6.8±0.1
Vc
9±0.1
Di
3.7±0.05
R2
R1
4±0.1
1±0.05
All external components should be mounted as close as possible
to the SI-8001FDL. The ground of all components should be
connected at one point near GND pin (pin 3).
1.7±0.1
(mm)
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
6
SI-8001FDL
DC-to-DC Step-Down Converter
9.90 ±0.20
0.80 ±0.10
2.00 ±0.10
3º
(R0.30)
(0.50)
6º
0º
4×P1.70 ±0.25
2.40 ±0.20
2.54 ±0.30
0.88 ±0.10
0.10 ±0.15
3º
(0.75)
4.90 ±0.20
XXXXXXXX
+
(R0.45)
3XR0.30
15.30 ±0.30
XXXXXXXX
XXXXXXXX
Branding
(4.40)
+
3º
9.20 ±0.20
XXXXXXXX
(4.60)
Ø1.5 ±0.20
(0.40)
1.30 –0.05
(0.75)
+0.10
3XR0.30
15º
(8.00)
(6.80)
4.50 ±0.20
2.20 ±0.20
PACKAGE OUTLINE DRAWING
2XR0.30
3º
1
2
3
4
10.00 ±0.02
5
Dimensions do not include mold protrusion
Heastsink side flash: 0.8 mm maximum
Dimensions in millimeters
Branding codes (exact appearance at manufacturer discretion):
1st line:
SK
2nd line, lot:
YMW X
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
W is the week of the month (1 to 5)
X is the device subtype suffix number
3rd line, type: 8001FDL
RoHS directive compliant
Device pins lead (Pb) free
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
7
SI-8001FDL
DC-to-DC Step-Down Converter
2.0 ±0.10
11.5 ±0.05
B
A
Ø1.5 MIN
A
16.0
0.4 ±0.05
15.7
+0.1
–0.0
24.3 ±0.03
4.0 ±0.10
Ø1.5
1.75 ±0.10
TAPE AND REEL SPECIFICATION
3.9
B
4.9
10.6
View A-A
View B-B
Material: conductive polysterene
Material: Conductive polysterene
Camber
< 1mm
mmlength
over 100
length of tape
Camber < 1 mm
over 100
of tape
Pocketmeasured
inner widths
measured
0.3 mm
above floor of pocket
Pocket inner widths
0.3 mm
above floor
of cavity
Pocket position relative to sprocket hole measured to true position of pocket
10 sprocket hole pitch cumulative ±0.2 mm
Pocket center and pocket hole center ±0.3 mm
Surface resistivity < 107 Ω / cm2
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
8
SI-8001FDL
DC-to-DC Step-Down Converter
PACKING SPECIFICATION
Inner Carton
800 pieces per reel
2 reels per carton
341
65
344
Outer Carton
3 inner cartons per outer carton
450
230
Dimensions in mm
350
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
9
SI-8001FDL
DC-to-DC Step-Down Converter
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
Soldering
•
When manually soldering the products, please be sure to
minimize the working time, within the following limits:
Soldering Iron Temperature
(°C)
Time
(s)
380±10
3
(once only)
•
Reflow soldering can be performed a maximum of twice, using
the following recommended profile:
250°C Maximum
250
230
Temperature (°C)
Cautions for Use
•
Operation of the product in parallel to increase current is not
permitted.
•
Although the product has an internal overtemperature protection
circuit, that is intended only to protect the product from temporary
excess heating due to overloads. Long-term reliability cannot
be guaranteed when the product is operated under continuous
overload conditions.
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Electrostatic Discharge
•
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
180
30 ±10s
150
90 ±30s
Time
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
10
SI-8001FDL
DC-to-DC Step-Down Converter
Application and operation examples described in this document are quoted for the sole purpose of reference only, for the use of the products
herein, and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights
of Sanken or any third party which may result from its use.
When using the products herein, the applicability and suitability of such products for an intended purpose or object shall be reviewed at the
user’s responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design
of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment measuring equipment, etc.). Before placing an order, the user’s written
consent to the specifications is requested.
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control
systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken
sales representative to discuss and obtain written confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace
equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
Anti radioactive ray design is not considered for the products listed herein.
If there is any discrepancy between English and Japanese versions of this datasheet, the Japanese version should take precedence over the
English one.
Please accept in advance that the content of this datasheet is subject to change without notice for the purpose of such as improvement of the
product.
Copyright © 2007 Sanken Electric Co., Ltd.
This datasheet is based on Sanken datasheet SSJ-03151
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
11
DC-to-DC Step-Down Converter
SI-8001FDL
June, 2007
<Worldwide Contacts>
Asia Pacific
China
Sanken Electric Hong Kong Co., Ltd.
Suite 1026 Ocean Centre, Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: 852-2735-5262
Fax: 852-2735-5494
Sanken Electric (Shanghai) Co., Ltd.
Room3202, Maxdo Centre, Xingyi Road 8, Changning district, Shanghai, China
Tel: 86-21-5208-1177
Fax: 86-21-5208-1757
Taiwan Sanken Electric Co., Ltd.
Room 1801, 18th Floor, 88 Jung Shiau East Road, Sec. 2, Taipei 100, Taiwan R.O.C.
Tel: 886-2-2356-8161
Fax: 886-2-2356-8261
India
Saket Devices Pvt. Ltd.
Office No.13, First Floor, Bandal - Dhankude Plaza, Near PMT Depot, Paud Road, Kothrud, Pune - 411 038, India
Tel: 91-20-5621-2340
91-20-2528-5449
Fax: 91-20-2528-5459
Japan
Sanken Electric Co., Ltd. Overseas Sales Headquaters
Metropolitan Plaza Bldg. 1-11-1 Nishi-Ikebukuro, Toshima-ku, Tokyo 171-0021, Japan
Tel: 81-3-3986-6164
Fax: 81-3-3986-8637
Korea
Sanken Electric Korea Co., Ltd.
Mirae Asset Life Bldg. 6F, 168 Kongduk-dong, Mapo-ku, Seoul, 121-705, Korea
Tel: 82-2-714-3700
Fax: 82-2-3272-2145
Singapore
Sanken Electric Singapore Pte. Ltd.
150 Beach Road, #14-03 The Gateway West, Singapore 189720
Tel: 65-6291-4755
Fax: 65-6297-1744
Sanken Electric Co., Ltd.
I02-006EA-070628
DC-to-DC Step-Down Converter
SI-8001FDL
June, 2007
Europe
United Kingdom
Sanken Power Systems (UK) Limited
Pencoed Technology Park, Pencoed, Bridgend CF35 5HY. UK
Tel: 44-1656-869-100
Fax: 44-1656-869-162
North America
United States
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Worcester, Massachusetts 01606, U.S.A.
Tel: 1-508-853-5000
Fax: 1-508-853-3353
Allegro MicroSystems, Inc. (Southern California)
14 Hughes Street, Suite B105, Irvine, CA 92618
Tel: 1-949-460-2003
Fax: 1-949-460-7837
Sanken Electric Co., Ltd.
I02-006EA-070628