SKYWORKS SKY65066

DATA SHEET
SKY65066-360LF: 2.3-2.7 GHz Low Noise Amplifier
Applications
InterStage
Match
x Wireless infrastructure: WLAN, Bluetooth, WiMAX, LTE, and
WCDMA
x Ultra-low noise applications
Figure 1. SKY65066-360LF Block Diagram
Features
x Ultra-low Noise Figure = 0.70 dB @ 2.5 GHz
x Excellent input and output return loss
x Adjustable gain = 16.5 to 20.5 dB @ 2.5 GHz
x High output OIP3 = +35.5 dBm @ 75 mA
x OP1dB = +18 dBm @ 2.5 GHz
x Single, positive DC supply voltage
x Adjustable supply current, 30 to 100 mA
x Integrated on-die source inductors and interstage matching
network
Description
x Small, QFN (8-pin, 2 x 2 mm) package (MSL1, 260 qC per
JEDEC J-STD-020)
A functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
The SKY65066-360LF is a high performance, two-stage ultra-Low
Noise Amplifier (LNA). The device is fabricated from Skyworks
advanced pHEMT process and is provided in a 2 x 2 mm, 8-pin
Quad Flat No-Lead (QFN) package.
The device features excellent input and output return loss, and an
integrated interstage matching network. The amplifier’s ultra-low
Noise Figure (NF), high gain, and excellent 3rd Order Intercept
point (IP3) allow it to be used in various receiver and transmitter
applications.
BIAS1
1
8
BIAS2
RFIN
2
7
RFOUT/VDD2
N/C
3
6
N/C
VDD1
4
5
FEEDBACK
Figure 2. SKY65066-360LF Pinout – 8-Pin QFN
(Top View)
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
Table 1. SKY65066-360LF Signal Descriptions
Pin #
Name
Description
st
Pin #
Name
Description
1
BIAS1
Source lead for 1 stage transistor
5
FEEDBACK
Connect to RFOUT/VDD2 to reduce gain of
2nd stage transistor
2
RFIN
RF input
6
N/C
No connection
3
N/C
No connection
7
RFOUT/VDD2
RF output. Requires a DC bias using an RF
choke inductor.
4
VDD1
1st stage DC power supply
8
BIAS2
Source lead for 2nd stage transistor
Functional Description
Source Inductance
The SKY65066-360LF is a two stage LNA with an integrated
interstage matching network and source inductors. The device
has a tested low NF of 0.7 dB and gain of 16.5 dB. The device
allows designers to adjust current and gain without degrading the
NF.
The source inductance required on pins 1 and 8 (BIAS1 and BIAS2
signals, respectively) has been integrated on the die. This
simplifies board layout and reduces build variations.
The external matching network largely dictates the RF
performance of the device. The matching network is required for
operation and special care should be taken when designing a
circuit board layout for the SKY65066-360LF. There are four
separate groups of external components: input, output, biasing,
and feedback.
The input band-pass matching network consists of four
components. Component C1 serves as the input DC blocking
capacitor, C2 provides high frequency stability and improved input
return loss, and L1 and L2 are responsible for the best noise
match looking into the gate of the first stage amplifier.
Biasing
To properly bias a depletion mode pHEMT, both the gate and
drain of the device must be biased properly. At VGS = 0 V and
VDS > 2 V, the amplifier stage is in its saturated state and draws
the maximum amount of current, IDSS. A VDS of 5 V is
recommended to ensure proper performance.
To eliminate the need for a negative DC supply, self-biasing
should be used when a resistor is placed between one of the
source leads and ground. A bypass capacitor should be placed in
parallel to this resistor to provide an RF ground and to ensure
performance remains unchanged at the operating frequency.
When current flows from drain to source and through the resistor,
the source voltage becomes biased above DC ground. The gate
pin of the device should be left unbiased at 0 V, which creates the
desired negative VGS value. This simplifies the design by
eliminating the need for a second DC supply. Values for resistor
components R1 and R2 can be changed to easily increase or
decrease the bias current to a desired level.
Input and Output RF Matching Network
Excess board trace should be eliminated at the input of the device
to minimize board losses. High-Q components should be used to
achieve the best NF of the amplifier. Murata GJM series
capacitors and Coilcraft HP or CS series inductors are
recommended. Any excess board or component loss on the input
of the device directly adds to the total measured NF.
The output matching network is band-pass network optimized for
output return loss.
The SKY65066-360LF Evaluation Board assembly diagram is
shown in Figure 13 and a circuit schematic is provided in
Figure 14.
Feedback
Feedback is implemented in the recommended circuit on the 2nd
stage transistor. Feedback improves the input and output return
loss and high frequency stability. The gain of the device can be
increased by increasing the value of R3, which reduces the
amount of feedback present (gain for multiple feedback resistor
values is shown in Figure 12).
The first stage is biased at 20 percent of IDSS to achieve the best
NF performance. The gain and current of the 2nd stage amplifier
can be adjusted without degrading the overall NF. More current in
the 2nd stage yields better IP3 performance.
Biasing components R1, R2, C1, and C2 should be placed as
close to the package pins as possible. See Figure 12 for the
recommended board layout.
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
Measuring NF
Electrical and Mechanical Specifications
Special care should be taken when making < 1 dB NF
measurements. Ideally, measurements should be made in an RF
shield room. An Agilent MXA N9020A spectrum analyzer with an
internal pre-amp paired with an N4001A smart noise source was
used for all noise measurements. The smart noise source has an
internal thermocouple that automatically sets the TCOLD setting on
the analyzer. If a smart noise source is unavailable, a standard
low Excess Noise Ratio (ENR) source should be used. Use an
external thermocouple to manually adjust the TCOLD setting to
ensure accurate results.
The absolute maximum ratings of the SKY65066-360LF are
provided in Table 2. The recommended operating conditions are
specified in Table 3 and electrical specifications are provided in
Table 4.
Performance characteristics for the SKY65066-360LF are
illustrated in Figures 3 through 12.
Table 2. SKY65066-360LF Absolute Maximum Ratings
Parameter
Supply voltage
Symbol
Minimum
Typical
Maximum
Units
VDD
5.5
V
Input power
PIN
+10
dBm
Supply current stage one
IDS1
50
mA
Supply current stage two
IDS2
100
mA
Power dissipation
PDIS
530
mW
Junction temperature
TJ
150
qC
Storage temperature
TSTG
–65
+125
qC
Operating temperature
TOP
–40
+85
qC
Thermal resistance
QJC
Note:
qC/W
47
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65066-360LF Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
2.7
GHz
Operating frequency
f
2.3
Supply voltage
VDD
4.75
5.00
5.25
V
Supply current
IDD
30
75
100
mA
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
Table 4. SKY65066-360LF Electrical Specifications (Note 1)
(TOP = +25 qC, Characteristic Impedance [ZO] = 50 Ω, VDD = 5 V, IDD = 75 mA, f = 2.5 GHz, Parameters Include Recommended 2.3 to
2.7 GHz Matching Network, Unless Otherwise Noted)
Parameter
Symbol
Noise Figure (Note 2)
NF
Gain
|S21|
Test Condition
Min
Typical
Max
0.7
0.9
15.0
16.5
Units
dB
dB
Input return loss
|S11|
–20
dB
Output return loss
|S22|
–14
dB
Reverse isolation
|S12|
–27
dB
rd
3 Order Output Intercept Point
OIP3
10 MHz spacing,
PIN = –18 dBm per tone
+35.5
dBm
3rd Order Input Intercept Point
IIP3
10 MHz spacing,
PIN = –18 dBm per tone
+19
dBm
1 dB Output Compression Point
OP1dB
+18
dBm
1 dB Input Compression Point
IP1dB
+2.5
dBm
>1
K
Stability
Unconditionally stable up
to 18 GHz
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Exceeding any of the conditions
listed here may result in permanent damage to the device. Operation at elevated temperatures may reduce reliability of the device.
Note 2: NF of device and matching network. Input RF connector and board loss de-embedded from measurement.
Typical Performance Characteristics
(TOP = +25 qC, Characteristic Impedance [ZO] = 50 Ω, VDD = 5 V, IDD = 75 mA, Parameters Include a Recommended
2.3 to 2.7 GHz Matching Network, Unless Otherwise Noted)
0
+85 oC
+25 oC
–40 oC
–5
20
Input Return Loss (dB)
Small Signal Gain (dB)
25
15
10
o
+85 C
+25 oC
–40 oC
5
–10
–15
–20
–25
–30
–35
0
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
Frequency (GHz)
Figure 3. Small Signal Gain vs Frequency Over Temperature,
(PIN = –20 dBm)
–40
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.9
3.0
Figure 4. Input Return Loss vs Frequency Over Temperature,
(PIN = –20 dBm)
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2.8
Frequency (GHz)
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
0
0
+85 oC
+25 oC
–40 oC
–10
–2
Output Return Loss (dB)
Reverse Isolation (dB)
–5
–15
–20
–25
–30
–35
–40
–45
–50
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
–6
–8
–10
–12
–14
–16
–18
–20
3.0
+85 oC
+25 oC
–40 oC
–4
2.0
2.1
2.2
2.3
Frequency (GHz)
2.4
2.5
2.6
2.7
2.8
Figure 5. Reverse Isolation vs Frequency Over Temperature,
(PIN = –20 dBm)
+40
1.2
+39
+85 oC
+25 oC
–40 oC
+37
OIP3 (dBm)
Noise Figure (dB)
+38
1.0
0.8
0.6
0.4
+85 oC
+25 oC
–40 oC
0.2
2.35
2.40
2.45
2.50
2.55
2.60
2.65
+36
+35
+34
+33
+32
+31
+30
2.35
2.70
2.40
2.45
Frequency (GHz)
2.65
2.70
2.75
+38
18
17
16
+36
OIP3 (dBm)
Gain (dB)
2.60
+40
19
15
14
10
–20
2.55
Figure 8. OIP3 vs Frequency Over Temperature,
(PIN = –20 dBm)
20
11
2.50
Frequency (GHz)
Figure 7. Noise Figure vs Frequency Over Temperature,
Input RF Connector and Board Trace De-Embedded From
Measurement
13
12
3.0
Figure 6. Output Return Loss vs Frequency Over Temperature,
(PIN = –20 dBm)
1.4
0
2.30
2.9
Frequency (GHz)
+34
+32
+30
2500 MHz +85 oC
2400 MHz +25 oC
2600 MHz –40 oC
–15
2400 MHz +85 oC
2700 MHz +25oC
2500 MHz –40 oC
–10
2700 MHz +85 oC
2600 MHz +25 oC
2400 MHz –40 oC
–5
0
2600 MHz +85 oC
2500 MHz +25 oC
2700 MHz –40 oC
+5
+28
+10
Input Power (dBm)
Figure 9. Gain vs Input Power Over Temperature and Frequency
+26
–16
2400 MHz +85 oC
2400 MHz +25 oC
2400 MHz –40 oC
–14
–12
–10
2700 MHz +85 oC
2700 MHz +25 oC
2700 MHz –40 oC
2600 MHz +85 oC
2600 MHz +25 oC
2600 MHz –40 oC
2500 MHz +85 oC
2500 MHz +25oC
2500 MHz –40 oC
–8
–6
–4
–2
0
Input Power Per Tone (dBm)
Figure 10. OIP3 vs Input Power Over Temperature and Frequency
(Tone Spacing = 5 MHz)
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
8
μ1 –40 oC
μ1 +25 oC
μ1 +85 oC
6
22
μ2 –40 oC
μ2 +25 oC
μ2 +85 oC
5
μ1, μ2
24
Small Signal Gain (dB)
7
4
3
2
1
20
18
16
10 Ω
50 Ω
100 Ω
200 Ω
500 Ω
Removed
14
12
0
0
2
4
6
8
10
12
14
16
18
10
2.30
2.35
2.40
2.45
Frequency (GHz)
Figure 11. Stability vs Frequency Over Temperature
(PIN = –20 dBm)
2.50
2.55
2.60
2.65
2.70
Frequency (GHz)
Figure 12. Small Signal Gain vs Frequency for Multiple Feedback
Resistor Values
Evaluation Board Description
Package Dimensions
The SKY65066-360LF Evaluation Board is used to test the
performance of the SKY65066-360LF low noise amplifier. An
assembly drawing for the Evaluation Board is shown in Figure 13.
The Evaluation Board schematic diagram is shown in Figure 14.
Table 5 provides the Bill of Materials (BOM) list for Evaluation
Board components.
The PCB layout footprint for the SKY65066-360LF is shown in
Figure 15. Typical case markings are shown in Figure 16.
Package dimensions for the 8-pin QFN are shown in Figure 17,
and tape and reel dimensions are provided in Figure 18.
Input and output trace lengths have been minimized to reduce
losses. All surface mount components are 0402-sized to reduce
component parasitics. The use of 0603 or larger components is
not recommended. Component spacing has also been minimized.
The board is provisioned with two RF connectors and a DC
launch. The RF connector and board loss up to component C1 is
approximately 1 dB at 2500 MHz.
It is very important to place multiple ground vias as close to shunt
components as possible. This ensures proper grounding and
circuit performance.
Board material is 10 mil thick VT47 FR4 with 1 oz. copper
cladding. RF input and output traces are 50 Ω.
Evaluation Board Test Procedure
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
THE SKY65066-360LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 qC. It can be used for lead or lead-free soldering.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation, document number 200083.
Step 1: Connect RF test equipment to amplifier input/output SMA
connectors.
Step 2: Connect DC ground.
Step 3: Connect VDD to a +5 V supply with a current limit of
100 mA. Verify that the board draws approximately
75 mA.
Step 4: Apply RF signal or noise source.
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PRELIMINARY DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
S1513
Figure 13. SKY65066-360LF Evaluation Board Assembly Diagram
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
C4
1
C1
L2
BIAS1
BIAS2
R2
8
C3
C9
2
RF Input
C14
C5
R1
RF Output
L1
C8
C7
C2
×
3
N/C
N/C
6
R3
C11
FEEDBACK 5
VDD1
C15
L4
×
C6
4
C16
RFOUT/VDD2 7
RFIN
C18
L3
L5
R5
C13
C10
C17
R4
C12
C19
VDD
Note: Some component labels may be different than the
corresponding component symbol shown here.
Component values, however, as noted in Table 5,
are accurate as of the date of this Data Sheet.
S1514
Figure 14. SKY65066-360LF Evaluation Board Schematic
Table 5. SKY65066-360LF (QFN Package) Evaluation Board Bill of Materials (1 of 2)
Component
Value
Size
Manufacturer/Part Series
C1
30 pF
0402
Murata GRM1555C
C2
7.5 nH
0402
Coilcraft CS
C3, C8, C10, C12, C14, C19
DNP
C4
30 pF
0402
Murata GRM1555C
C5
4700 pF
0402
Murata GRM1555C
C6
0.3 pF
0402
Murata GJM1555C
C7
51 Ω
0402
Panasonic ERJ2RKF
C9
2.4 pF
0402
Murata GJM1555C
C11
0.4 pF
0402
Murata GJM1555C
C13
1000 pF
0402
Murata GRM1555C
C15
0.1 pF
0402
Murata GJM1555C
C16
2.0 nH
0402
TDK MLG1005S
C17
6 pF
0402
Murata GJM1555C
C18
10 pF
0402
Murata GJM1555C
L1
0.1 pF
0402
Murata GJM1555C
L2
1.2 nH
0402
Coilcraft CS
L3
27 nH
0402
TDK MLG1005S
L4
5.6 nH
0402
TDK MLG1005S
L5
5.6 nH
0402
TDK MLG1005S
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
Table 5. SKY65066-360LF (QFN Package) Evaluation Board Bill of Materials (2 of 2)
Component
Value
Size
Manufacturer/Part Series
22 Ω
0402
Panasonic ERJ2RKF
R2
6.8 Ω
0402
Panasonic ERJ2GE
R3
DNP
R4
91 Ω
0402
Panasonic ERJ2RKF
R5
22 Ω
0402
Panasonic ERJ2RKF
R1
8X 0.70
8X 0.45
R0.20
Pin 1
8X 0.25
0.50 Pitch
2X 0.85
0.25
Exposed Solder Areas
(Typical)
2X 0.45
All dimensions are in millimeters
S1413
Figure 15. SKY65066-360LF PCB Layout Footprint
Pin 1
Indicator
S66
Skyworks Part #
Figure 16. Typical Case Markings
(Top View)
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
0.90 +0.10/–0.15
C
0.20 Ref
Seating Plane
A
2
B
0.45 +0.05/–0.07
Exposed Pad
Detail A
0.02 +0.03/–0.02
Pin 1
Indicator
-B-
2
0.15 C
2X
8X
3
Detail C
0.08 C
0.90 ± 0.10
0.15 C
2X
1.70 +0.10/–0.15
0.85 +0.05/–0.07
Detail B
2 Places
0.10 C
Top View
Side View
Bottom View
R0.12 Typ
0.25
0.30 ± 0.10
-A-
CL
R0.20
0.5
0.25 +0.05/–0.07 5
0.10 M C A B
0.05 M C
Detail C
Detail B
8 Places
Detail A
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Coplanarity applies to the exposed heat sink slug as well as the terminals..
Plating requirement per source control drawing (SCD) 2504.
Dimension applies to metalized terminal and is measured between 0.15 mm and 0.30 mm from terminal tip.
S1415
Figure 17. SKY65066-360LF 8-Pin QFN Package Dimensions
∅1.50+ P0.10/–0.00
0.30 ± 0.01 (T)
Pin #1
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
1.75 ± 0.10
B
A
B
8.00 +0.30/–0.10
A
3.50 ± 0.05
2.60 ± 0.10 (Bo)
R0.30 Max
∅1.00 Min.
1.20 ± 0.10 (Ko)
2.60 ± 0.10 (Ao)
B
R0.30 Max
A
Notes:
1. Carrier tape: black conductive polystyrene.
2. Cover tape material: transparent conductive HSA.
3. Cover tape size: 5.40 mm width.
4. All measurements are in millimeters.
S1480
Figure 18. SKY65066-360LF Tape and Reel Dimensions
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DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
Ordering Information
Model Name
SKY65066-360LF Low Noise Amplifier
Manufacturing Part Number
SKY65066-360LF (Pb-free and Green package)
Evaluation Kit Part Number
SKY65066-360LF (2.3-2.7 GHz)
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damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com,
are incorporated by reference.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
201090E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 12, 2009
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