ADVANCE DATA SHEET SKY77189 Power Amplifier Module for WCDMA / HSDPA Band VIII (880–915 MHz) Applications • WCDMA handsets • HSDPA Features • Low voltage positive bias supply 3.2 V to 4.2 V • Good linearity • High efficiency - 40% @ 28.75 dBm • Large dynamic range • 10-pad package - 3 x 3 x 0.85 mm • Power down control • InGaP • Supports low collector voltage operation • Digital Enable The SKY77189 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full 880–915 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained throughout the entire power range, the SKY77189 delivers unsurpassed talk-time advantages. The SKY77189 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA) data transmission with high power added efficiency. A directional coupler is integrated into the module thus eliminating the need for any external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance. The SKY77189 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77189 is supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. • No VREF required • CMOS compatible control signals • Integrated Directional Coupler Figure 1. Functional Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200887E • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • February 3, 2009 1 ADVANCE DATA SHEET SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) Electrical Specifications The following tables list the electrical characteristics of the SKY77189 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve WCDMA and HSDPA performance characteristics listed in Table 4. Table 3 presents a truth table for the power settings. Table 5 and Table 6 provide the standard test configurations for WCDMA (STC1) and HSDPA (STC2), respectively. Table 1. Absolute Maximum Ratings 1 Parameter Symbol Minimum Nominal Maximum Unit RF Input Power PIN — 0 10 dBm Supply Voltage VCC1, VCC2 — 3.4 6.0 Volts Enable Control Voltage VEN — 1.8 4.2 Volts Mode Control Voltage VMODE_0 — 1.8 4.2 Volts VMODE_1 — 1.8 4.2 Operating TCASE –30 25 +110 Storage TSTG –55 — +125 Minimum Nominal Maximum Unit dBm Case Temperature 2 °C 1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. 2 Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package. Table 2. Recommended Operating Conditions Parameter RF Output Power 1 Symbol WCDMA PO_MAX — — 28.75 HSDPA PO_MAX — — 27.75 FO 880.0 897.5 915.0 MHz VCC1, VCC2 3.2 2 Operating Frequency Supply Voltage Enable Control Voltage Mode Control Voltage 3.4 4.2 Volts Low VEN_L 0.0 0.0 0.5 Volts High VEN_H 1.35 1.8 3.1 Low VMODE_0 1.35 1.8 3.1 VMODE_1 1.35 1.8 3.1 Medium VMODE_0 1.35 1.8 3.1 VMODE_1 0.0 0.0 0.5 VMODE_0 0.0 0.0 0.5 VMODE_1 0.0 0.0 0.5 TCASE –20 +25 +85 High Case Operating Temperature Volts °C 1 For VCC < 3.4 V, output power back-off = 0.5 dB. 2 Recommended minimum VCC for maximum power output is indicated. VCC2 down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current. Table 3. Modes of Operation Power Setting Power Down Mode ENABLE VMODE_0 VMODE_1 VCC Low Low Low On Standby Mode Low — — On High Power Mode (17.0 dBm ≤ POUT ≤ 28.75 dBm High Low Low On Medium Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm) High High Low On Low Power Mode (POUT ≤ 7.0 dBm) High High High On Optional Lower VCC Mode (POUT ≤ 7.0 dBm) High Low Low 1.5 V Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 February 3, 2009 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200887E SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) ADVANCE DATA SHEET Table 4. Electrical Specifications for Nominal Operating Conditions 1 Characteristics Symbol Gain Rx Band Gain Condition Total Supply Current Quiescent Current Typical Maximum Unit dB GLOW PO = 7.0 dBm 8.0 12.0 16.0 GMID PO = 17.0 dBm 13.0 18.0 24.0 GHIGH PO = 28.75 dBm 24.5 27.0 29.5 RxG — — — –0.5 RxG_GPS — — –14.0 –3.0 –6.0 RxG_ISM Power Added Efficiency Minimum — –20.0 PAELOW PO = 7.0 dBm — — 9.0 — PAEMID PO = 17.0 dBm — 16.5 — — PAEHIGH PO = 28.75 dBm 40.0 — ICC_LOW PO = 7.0 dBm — 7.5 — ICC_MID PO = 17.0 dBm — 40.0 — ICC_HIGH PO = 28.75 dBm — — 550 IQ_LOW Low Power Mode — 2.5 — IQ_MED Medium Power Mode — 10.0 — dB % mA mA Enable Control Current IEN — — 0.01 0.1 mA Mode Control Current IMODE_0 — — 0.05 0.1 mA IMODE_1 — — 0.05 0.1 IPD VCC = 3.4 V VEN = Low VMODE_0 = Low VMODE_1 = Low — — 10 μA ACLR5 PO = 7.0 dBm — –42 –36 dBc PO = 17.0 dBm — –46 –36 PO = 28.75 dBm — –40 –36 Total Supply Current in Power Down Mode Adjacent Channel Leakage power Ratio 2 5 MHz offset 10 MHz offset Harmonic Suppression Tx Noise in Rx Bands ACLR10 Second f02 Third f03 Rx PO = 7.0 dBm — –65 –46 PO = 17.0 dBm — –60 –46 PO = 28.75 dBm — –55 –46 PO ≤ 28.75 dBm — –45 –35 — –50 –35 — –138 –136 925 MHz–960 MHz dBm/Hz GPS Rx 1574 MHz–1577 MHz — –142 –140 ISM Rx 2400 MHz–2483.5 MHz — –145 –143 — 1.5:1 1.8:1 — — — 3.35 % Input Voltage Standing Wave Ratio VSWR EVM EVM1 PO = PMAX EVM2 PO = PMAX – 3 Rise / Fall Time dBc DC RF — — — 2.50 TONDC — — — 20 TOFFDC — — — 20 TONRF — — — 6 TOFFRF — μs — — 6 Coupling Factor CPL PO = 28.75 dBm — –18 — dB Stability (Spurious output) S 5:1 VSWR All phases — — –70 dBc Ruggedness – no damage 3 Ru PO ≤ 28.75 dBm 10:1 — — VSWR 1 Per Table 2 over dynamic range up to 28.75 dBm output power, unless specified otherwise. 2 ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets. 3 All phases, time = 10 seconds. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200887E • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • February 3, 2009 3 ADVANCE DATA SHEET SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) Table 5. Standard Test Configuration – STC1 WCDMA Mode Parameter Level Spread Code Spread Factor βc I/Q βd βhs βec βed Relative Power (dB) DPCCH 15 kbps 0 256 Q 8/15 — — — — –6.547 DPDCH 60 kbps 16 64 I — 15/15 — — — –1.087 Table 6. Standard Test Configuration – STC2 HSDPA Mode Parameter Level Spread Code Spread Factor βc I/Q βd βhs βec βed Relative Power (dB) DPCCH 15 kbps 0 256 Q 12/15 — — — — –7.095 DPDCH 60 kbps 16 64 I — 15/15 — — — –5.157 HS-DPCCH 15 kbps 64 256 Q — — 24/15 — — –3.012 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 February 3, 2009 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200887E SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) ADVANCE DATA SHEET Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77189, the evaluation board schematic and assembly diagrams are included for preliminary analysis and design. Figure 2 shows the basic schematic of the board for the 880 MHz to 915MHz range. Figure 2. Evaluation Board Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200887E • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • February 3, 2009 5 ADVANCE DATA SHEET SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) Figure 3. Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 February 3, 2009 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200887E SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) ADVANCE DATA SHEET Package Dimensions The SKY77189 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pad layout for this package. Figure 5 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 4. Dimensional Diagram for 3 mm x 3 mm x 0.85 mm Package – SKY77189 Specific Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200887E • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • February 3, 2009 7 ADVANCE DATA SHEET SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (880–915 MHz) Figure 5. Phone PCB Layout Diagram – 3 mm x 3 mm, 10-Pad Package – SKY77189 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 February 3, 2009 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200887C SKY77189 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA BAND VIII (880–915 MHz) ADVANCE DATA SHEET Package Description Package Handling Information Figure 6 shows the pad functions and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Typical case markings are illustrated in Figure 7. Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77189 is capable of withstanding an MSL3/260 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should not exceed 260 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Figure 6. SKY77189 Pad Names and Configuration (Top View) Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information – RF Modules, Document Number 101568. Electrostatic Discharge Sensitivity (ESD) To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class 1 ESD handling precautions listed below. Figure 7. Typical Case Markings • Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges • Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors • Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 Ω to GND) • Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200887E • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • February 3, 2009 9 Ordering Information Model Number Manufacturing Part Number SKY77189 Product Revision Package Operating Temperature SKY77189 MCM 3 x 3 x 0.85 mm –20 °C to +85 °C Date Description Revision History Revision A April 4, 2008 Initial Release – Advance Information B April 23, 2008 Revise: Tables 1–4; Figures 1–3, 6; Tx freq. to 880–915; Rx freq. to 925–960 C May 20, 2008 Revise: Features list (p1); Tables 1, 2, 4, 5; Figures 2–5; Add: Skyworks Green tag (p1) D November 13, 2008 Revise: Features list (p1); Figure 3; Tables 1–4; ESD section Add: Tables 5, 6 E February 3, 2009 Revise: Order Information table, Package column References Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Skyworks Application Note: Tape and Reel Information – RF Modules, Document Number 101568 Standard SMT Reflow Profiles: JEDEC Standard J–STD–020 Copyright © 2008, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks’ Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks’ customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks®, the Skyworks logo®, and Breakthrough Simplicity®. Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.