Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SKY65187-11: 2000-2230 MHz Variable Gain Amplifier
Applications
Description
• WCDMA base stations
• Femto cells
Skyworks SKY65187-11 is a high linearity, Variable Gain Amplifier
(VGA) module. The device includes an input Low-Noise Amplifier
(LNA), a variable voltage attenuator, and an output Power
Amplifier (PA). The two amplifiers and voltage attenuator are
optimized for superior ACLR performance with WCDMA signals.
Features
The high linearity (high OP1dB, OIP3, and ACLR) and high
efficiency of this device make it ideal for use at the final stage (or
close to the final stage) of a WCDMA transmit chain.
• Frequency range: 2000 to 2230 MHz
• High gain: >24 dB
• Attenuation range: > 30 dB
• OP1dB: >+28 dBm
• ACLR < –65 dBc for POUT = +12 dBm
• Single DC supply: +5 V
The output of the first PA (PA1) is matched to the input of the VCA.
The output of the VCA is matched to the input of the second PA
(PA2). The RF_IN and RF_OUT signals (pins 1 and 8, respectively)
are both internally matched, including DC blocking capacitors.
• Small MCM (12-pin, 8.385 x 8.385 mm) SMT package (MSL3,
260 °C per JEDEC J-STD-020)
The SKY65187-11 VGA uses low-cost Surface Mount Technology
(SMT) in the form of a compact, 8 x 8 mm 12-pin Multi-Chip
Module (MCM), which allows for a highly manufacturable low-cost
solution. A functional block diagram is shown in Figure 1. The pin
configuration and package are shown in Figure 2. Signal pin
assignments and functional pin descriptions are provided in
Table 1.
Figure 1. SKY65187-11 Block Diagram
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DATA SHEET • SKY65187-11 VGA
Figure 2. SKY65187-11 Pinout – 12-Pin MCM
(Top View)
Table 1. SKY65187-11 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
RF_IN
RF input
7
GND
Ground
2
GND
Ground
8
RF_OUT
RF output
3
VCTRL
Variable attenuator control voltage
9
GND
Ground
4
GND
Ground
10
VCC_AMP2
Voltage supply for PA2 (after the variable
voltage attenuator)
5
GND
Ground
11
VCC_AMP1
Voltage supply for PA1 (before the variable
voltage attenuator)
6
GND
Ground
12
GND
Ground
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY65187-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Table 4.
Typical performance characteristics of the SKY65187-11 are
illustrated in Figures 3 through 19.
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DATA SHEET • SKY65187-11 VGA
Table 2. SKY65187-11 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
Supply voltage
VCC_AMP1,
VCC_AMP2
5.5
V
Control voltage
VCTL
5.0
V
RF output power (CW)
POUT
+29
dBm
Thermal resistance
ΘJC
38.6
°C/W
Operating case temperature
TC
–40
+85
°C
Storage case temperature
TSTG
–55
Junction temperature
TJ
Note:
+125
°C
+150
°C
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65187-11 Recommended Operating Conditions
Parameter
Symbol
Frequency range
f
RF output power (CW)
POUT
Supply voltage, measured at terminals of
Evaluation Board
VCC_AMP1,
VCC_AMP2
Variable voltage attenuator control range
VCTRL
Ruggedness, load VSWR with no permanent
damage
PMAX_LOAD
Operating case temperature
TC
Minimum
Typical
Maximum
2110
4.75
5.00
0
–30
Units
2170
MHz
+25
dBm
5.25
V
4.5
V
10:1
–
+85
°C
Table 4. SKY65187-11 Electrical Specifications (Note 1)
(VCC_AMP1 = VCC_AMP2 = 5 V, VCTRL = 0 V, f = 2.14 GHz, TC = +25 °C, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
2110
Max
Units
2170
MHz
Frequency range
f
Small signal gain
|S21|
CW
24.0
25.5
dB
Gain control range
G_RANGE
CW
27
30
dB
Gain flatness
G_FLATNESS
CW
Output 1dB Compression Point
OP1dB
CW
+27
+28
dBm
3rd Order Output Intercept Point
OIP3
PTONE = +12 dBm,
Δf = 1 MHz
+40.0
+41.5
dBm
ACLR for POUT = +12 dBm
ACLR
WCDMA, test mode 1
Noise Figure
NF
At maximum gain
Input return loss
|S11|
10
20
dB
Output return loss
|S22|
8
10
dB
Quiescent current
IQ
No RF
288
330
mA
Operating current
IOP
POUT = +12 dBm
300
380
mA
Maximum VSWR for stable operation
VSWR_MAX
CW
0.8
dB
–66.5
–65.0
dBc
2.7
3.5
dB
8:1
–
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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DATA SHEET • SKY65187-11 VGA
Typical Performance Characteristics
(VCC_AMP1 = VCC_AMP2 = 5 V, VCTRL = 0 V, f = 2.14 GHz, TC = +25 °C, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
Figure 3. Quiescent Current vs VCC
Figure 4. Input Return Loss vs Frequency Over Temperature With
Minimum Attenuation
Figure 5. Input Return Loss vs Frequency Over Temperature With
Maximum Attenuation
Figure 6. Output Return Loss vs Frequency Over Temperature
With Minimum Attenuation
Figure 7. Output Return Loss vs Frequency Over Temperature
With Maximum Attenuation
Figure 8. Gain vs Frequency Over Control Voltage
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DATA SHEET • SKY65187-11 VGA
Figure 9. Gain vs Output Power Over Frequency
Figure 10. Gain vs Output Power Over Temperature
Figure 11. Current vs Output Power Over Voltage
Figure 12. Current vs Output Power Over Temperature
Figure 13. OIP3 vs Output Power Over Frequency
Figure 14. OIP3 vs Output Power Over Temperature
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DATA SHEET • SKY65187-11 VGA
Figure 15. OIP3 vs Output Power Over Voltage
Figure 16. ACLR vs Output Power Over Frequency
(WCDMA Test Model 1 With 64 DPCH)
Figure 17. ACLR vs Output Power Over Temperature
(WCDMA Test Model 1 With 64 DPCH)
Figure 18. Noise Figure vs Frequency Over Voltage
Figure 19. Noise Figure vs Frequency Over Temperature
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DATA SHEET • SKY65187-11 VGA
Evaluation Board Description
Testing Procedure
The Skyworks SKY65187-11 Evaluation Board is used to test the
performance of the SKY65187-11 VGA. An Evaluation Board
schematic diagram is provided in Figure 20. An assembly drawing
for the Evaluation Board is shown in Figure 21 and the layer detail
is provided in Figure 22. The layer detail physical characteristics
are noted in Figure 23.
Use the following procedure to set up the SKY65187-11
Evaluation Board for testing:
Capacitors C1, C2, and C3 provide DC bias decoupling and RF
bypass for VCC_AMP1 (pin 11). Capacitors C4, C5, and C6 provide
DC bias decoupling and RF bypass for VCC_AMP2 (pin 10).
Capacitor C7 provides decoupling for VCTRL (pin 3).
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of –20 dBm or less
to the Evaluation Board but do NOT enable the RF signal.
Pins 1 and 8 are the RF input and output signals, respectively.
Pins 2, 4, 5, 6, 7, 9, 12, and the package backside metal are
ground pins that provide the DC, RF, and thermal ground.
4. Enable the power supply.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Proper isolation must be provided between the VCC_AMP1
and VCC_AMP2 pins.
2. Paths to ground should be made as short as possible.
3. The ground pad of the SKY65187-11 VGA has special
electrical and thermal grounding requirements. This pad is the
main thermal conduit for heat dissipation. Since the circuit
board acts as the heat sink, it must shunt as much heat as
possible from the amplifier. As such, design the connection to
the ground pad to dissipate the maximum wattage produced
to the circuit board. Multiple vias to the grounding layer are
required. Filled or capped vias are recommended.
4. It is recommended that the layout for the VCC_AMP1 and
VCC_AMP2 signals follow what is shown in Figure 21. The
VCC_AMP1 and VCC_AMP2 traces can be tied together to
share the same power supply. The connecting node should
not be placed close to the package pins. The connecting node
should be connected closer to components C1 and C4 (see
Figure 20). This is to provide isolation between VCC_AMP1
and VCC_AMP2.
NOTE: Junction temperature (Tj) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
1. Connect a 5.0 V supply to the VCC_AMP1 and VCC_AMP2
pins. Connect the VCTRL signal to a power supply and set the
power supply to 0 V. If available, enable the current limiting
function of the power supply to 450 mA.
3. Connect a spectrum analyzer to the RF signal output port.
5. Enable the RF signal.
6. Take measurements.
CAUTION: If any of the output signals exceed the rated
maximum values, the SKY65187-11 Evaluation Board
can be permanently damaged.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY65187-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package Dimensions
The PDB footprint drawing for the SKY65187-11 is shown in
Figure 24. Package dimensions for the 12-pin MCM are shown in
Figure 25, and tape and reel dimensions are provided in
Figure 26.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SKY65187-11 VGA
J3
2
VCTRL VDD
1
VCC
4-Header
11
GND
12
J1
1
RF Input
RF_IN
10
VCC_AMP2
3
VCC_AMP1
4
C3
DNI
C2
1000 pF
C1
10 μF
C6
22 pF
C5
1000 pF
C4
10 μF
PA1 Voltage
Supply
PA2 Voltage
Supply
9
GND
J2
8
2
GND
3
7
GND
4
5
GND
VCTRL
GND
C7
1000 pF
GND
Variable Attenuator
Control Voltage
RF Output
RF_OUT
6
S2329
Figure 20. SKY65187-11 Evaluation Board Schematic
J3
J1
J2
S2330
Figure 21. SKY65187-11 Evaluation Board Assembly Drawing
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DATA SHEET • SKY65187-11 VGA
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S2331
Figure 22. SKY65187-11 Evaluation Board Layer Detail
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DATA SHEET • SKY65187-11 VGA
Cross Section
Name Thickness (mm) Material
εr
Pri
0.035
Cu-1 oz.
–
Die1
0.250
Rogers 4350
–
L2
0.035
Cu-1 oz.
–
Die2
0.200
FR4
4.0
L3
0.035
Cu-1 oz.
–
Die3
0.250
FR4
4.0
Sec
0.035
Cu-1 oz.
–
S2631
Figure 23. Layer Detail Physical Characteristics
Pin 12
Stencil aperture size of 80% to 100%
of the module/pkg solder mask openings
8.685
4X 1.65 Pitch
Pin 1 Indicator
0.20 X 0.20
12X 1.091
Pin 1
12X 0.81
25X 0.875
8.685
4X 1.91 Pitch
Exposed Center Pad
Component
Outline
0.125 Typ
25X 0.875
Stencil Aperture
Top View
8.685
Thermal Via Array,
∅0.3 mm on 0.6 mm pitch
will improve thermal performance.
NOTE: thermal vias should
be tented with solder mask,
30-35 mm Cu plating recommended.
Pin 12
Pin 12
8.785
1.65 Pitch
4X 1.65 Pitch
Pin 1 Indicator
0.20 X 0.20
12X 1.191
0.25 Typ.
Pin 1
Pin 1
12X 0.91
8.685
8.785
4X 1.91 Pitch
2X 2.4375
0.6 Pitch
5X 0.81
Component
Outline
Component
Outline
5X 1.091
Exposed Center Pad
Metallization
Top View
2X 2.4375
Solder Mask Opening
Top View
S2367
All dimensions are in millimeters
Figure 24. SKY65187-11 PCB Layout Footprint
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Opening size of
60% to 100% of
exposed center
opening shown
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B
Pin 1
Indicator
C
10X 2
8.385
6X 4.0925
DATA SHEET • SKY65187-11 VGA
Pin 1 Indicator
See Detail B
6X 4.0925
Pin 1
10X 2
10X 1
8.385
0
A
0.15 A B C
0.10
12x SMT Pad
0.1 M A B C
Side View
Top View
0.841 ± 0.1
10X 1
A
1.35 ± 0.1
(0.1)
0.875
0
4X 1.65
4X 1.91
24X Solder Mask Opening
See Detail C
0.2 A B C
Bottom View
0.875
0.2 x 0.2
Metal Pad Edge
0.81 ± 0.05
0.875
0.875
5X R0.05 Max
Soldermask Edges
Detail A
Pad
Scale: 2X
4X R0.05 Max
Soldermask Edges
Detail B
24X Detail C
Scale: 2X
Scale: 2X
1X This Rotation
24X This Rotation
3X This Rotation
3X Rotated 180°
3X Rotated 90° CW
3X Rotated 90° CCW
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Pads are metal defined.
All measurements are in millimeters
S2366
Figure 25. SKY65187-11 12-Pin MCM Package Dimensions
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DATA SHEET • SKY65187-11 VGA
Pin #1
∅1.50 ± 0.10
2.00 ± 0.10
12.00 ± 0.10
4.00 ± 0.10
0.318 ± 0.013 T
1.75 ± 0.10
B
A
A
7.50 ± 0.10
5° Max
8.88 ± 0.10 (Bo)
16.00 +0.30/–0.10
B
2.14 ± 0.10 (Ko)
∅1.50 ± 0.25
B
8° Max
8.89 ± 0.10 (Ao)
A
Notes:
1. Carrier tape material: black conductive polycarbonate
or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 13.3 mm width.
4. Typical ESD surface resistivity is ≤108 Ohms/square per EIA, JEDEC
tape and reel specification.
5. Tolerance: .XX = ±0.10 mm.
6. All measurements are in millimeters.
Figure 26. SKY65187-11 Tape and Reel Dimensions
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S2630
DATA SHEET • SKY65187-11 VGA
Ordering Information
Model Name
SKY65187-11 2000-2230 MHz Variable Gain Amplifier
Manufacturing Part Number
SKY65187-11
Evaluation Board Part Number
TW16-D590
Copyright © 2011, 2012 Skyworks Solutions, Inc. All Rights Reserved.
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
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