PIC16F716 Data Sheet 8-bit Flash-based Microcontroller with A/D Converter and Enhanced Capture/Compare/PWM © 2007 Microchip Technology Inc. DS41206B Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41206B-page ii © 2007 Microchip Technology Inc. PIC16F716 8-bit Flash-based Microcontroller with A/D Controller and Enhanced Capture/Compare PWM Microcontroller Core Features: Low-Power Features: • High-performance RISC CPU • Only 35 single-word instructions to learn - All single-cycle instructions except for program branches which are two-cycle • Operating speed: DC – 20 MHz clock input DC – 200 ns instruction cycle • Interrupt capability (up to 7 internal/external interrupt sources) • 8-level deep hardware stack • Direct, Indirect and Relative Addressing modes • Standby Current: - 100 nA @ 2.0V, typical • Operating Current: - 14 μA @ 32 kHz, 2.0V, typical - 120 μA @ 1 MHz, 2.0V, typical • Watchdog Timer Circuit: - 1 μA @ 2.0V, typical • Timer1 Oscillator Current: - 3.0 μA @ 32 kHz, 2.0V, typical Peripheral Features: Special Microcontroller Features: • Timer0: 8-bit timer/counter with 8-bit prescaler • Timer1: 16-bit timer/counter with prescaler can be incremented during Sleep via external crystal/clock • Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler • Enhanced Capture, Compare, PWM module: - Capture is 16-bit, max. resolution is 12.5 ns - Compare is 16-bit, max. resolution is 200 ns - PWM maximum resolution is 10-bit - Enhanced PWM: - Single, Half-Bridge and Full-Bridge modes - Digitally programmable dead-band delay - Auto-shutdown/restart • 8-bit multi-channel Analog-to-Digital Converter • 13 I/O pins with individual direction control • Programmable weak pull-ups on PORTB • Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation • Dual level Brown-out Reset circuitry - 2.5 VBOR (Typical) - 4.0 VBOR (Typical) • Programmable code protection • Power-Saving Sleep mode • Selectable oscillator options • Fully static design • In-Circuit Serial Programming™ (ICSP™) CMOS Technology: • Wide operating voltage range: - Industrial: 2.0V to 5.5V - Extended: 3.0V to 5.5V • High Sink/Source Current 25/25 mA • Wide temperature range: - Industrial: -40°C to 85°C - Extended: -40°C to 125°C Device PIC16F716 Memory Flash Data 2048 x 14 128 x 8 © 2007 Microchip Technology Inc. I/O 8-bit A/D (ch) Timers 8/16 PWM (outputs) VDD Range 13 4 2/1 1/2/4 2.0V-5.5V DS41206B-page 1 PIC16F716 18-Pin Diagram 18-pin PDIP, SOIC TABLE 1: 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 PIC16F716 RA2/AN2 RA3/AN3/VREF RA4/T0CKI MCLR/VPP VSS RB0/INT/ECCPAS2 RB1/T1OSO/T1CKI RB2/T1OSI RB3/CCP1/P1A RA1/AN1 RA0/AN0 OSC1/CLKIN OSC2/CLKOUT VDD RB7/P1D RB6/P1C RB5/P1B RB4/ECCPAS0 18-PIN PDIP, SOIC SUMMARY I/O Pin Analog ECCP Timer Interrupts Pull-ups Basic RA0 17 AN0 — — — — — RA1 18 AN1 — — — — — RA2 1 AN2 — — — — — RA3 2 AN3/VREF — — — — — RA4 3 — — T0CKI — — — RB0 6 — ECCPAS2 — INT Y — RB1 7 — — T1CKI — Y — RB2 8 — — T1OSI — Y — RB3 9 — CCP1/P1A — — Y — RB4 10 — ECCPAS0 — IOC Y — RB5 11 — P1B — IOC Y — RB6 12 — P1C — IOC Y ICSPCLK RB7 13 — P1D — IOC Y ICSPDAT — 14 — — — — — VDD — 5 — — — — — VSS — 4 — — — — — MCLR/VPP — 16 — — — — — OSC1/CLKIN — 15 — — — — — OSC2/CLKOUT DS41206B-page 2 © 2007 Microchip Technology Inc. PIC16F716 20-Pin Diagram 20-pin SSOP TABLE 2: I/O 20 19 18 17 16 15 14 13 12 11 PIC16F716 1 2 3 4 5 6 7 8 9 10 RA2/AN2 RA3/AN3/VREF RA4/T0CKI MCLR/VPP VSS VSS RB0/INT/ECCPAS2 RB1/T1OSO/T1CKI RB2/T1OSI RB3/CCP1/P1A RA1/AN1 RA0/AN0 OSC1/CLKIN OSC2/CLKOUT VDD VDD RB7/P1D RB6/P1C RB5/P1B RB4/ECCPAS0 20-PIN SSOP SUMMARY Pin Analog ECCP Timer Interrupts Pull-ups Basic RA0 19 AN0 — — — — — RA1 20 AN1 — — — — — RA2 — — — — 1 AN2 — RA3 2 AN3/VREF — — — — — RA4 3 — — T0CKI — — — RB0 7 — ECCPAS2 — INT Y — RB1 8 — — T1CKI — Y — RB2 9 — — T1OSI — Y — RB3 10 — CCP1/P1A — — Y — RB4 11 — ECCPAS0 — IOC Y — RB5 12 — P1B — IOC Y — RB6 13 — P1C — IOC Y ICSPCLK RB7 14 — P1D — IOC Y ICSPDAT — 15 — — — — — VDD — 16 — — — — — VDD — 5 — — — — — VSS — 6 — — — — — VSS — 4 — — — — — MCLR/VPP — 18 — — — — — OSC1/CLKIN — 17 — — — — — OSC2/CLKOUT © 2007 Microchip Technology Inc. DS41206B-page 3 PIC16F716 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 Memory Organization ................................................................................................................................................................... 7 3.0 I/O Ports ..................................................................................................................................................................................... 19 4.0 Timer0 Module ........................................................................................................................................................................... 27 5.0 Timer1 Module with Gate Control............................................................................................................................................... 29 6.0 Timer2 Module ........................................................................................................................................................................... 35 7.0 Analog-to-Digital Converter (ADC) Module ................................................................................................................................ 37 8.0 Enhanced Capture/Compare/PWM Module ............................................................................................................................... 47 9.0 Special Features of the CPU ...................................................................................................................................................... 61 10.0 Instruction Set Summary ............................................................................................................................................................ 77 11.0 Development Support................................................................................................................................................................. 87 12.0 Electrical Characteristics ............................................................................................................................................................ 91 13.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 107 14.0 Packaging Information.............................................................................................................................................................. 121 Appendix A: Revision History............................................................................................................................................................. 125 Appendix B: Conversion Considerations............................................................................................................................................ 125 Appendix C: Migration from Base-line to Mid-Range Devices ........................................................................................................... 126 The Microchip Web Site ..................................................................................................................................................................... 127 Customer Change Notification Service .............................................................................................................................................. 127 Customer Support .............................................................................................................................................................................. 127 Reader Response .............................................................................................................................................................................. 128 Index .................................................................................................................................................................................................. 129 Product Identification System............................................................................................................................................................. 133 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS41206B-page 4 © 2007 Microchip Technology Inc. PIC16F716 1.0 DEVICE OVERVIEW This document contains device specific information for the PIC16F716. Figure 1-1 is the block diagram for the PIC16F716 device. The pinouts are listed in Table 1-1. FIGURE 1-1: PIC16F716 BLOCK DIAGRAM 13 Flash 2K x 14 Program Memory Program Bus RAM Addr(1) RA0 RA11 RA2 RA3 RA4 PORTB 9 Addr MUX Instruction Reg Direct Addr 7 8 Indirect Addr FSR Reg STATUS Reg 8 Power-up Timer OSC1/CLKIN OSC2/CLKOUT Instruction Decode and Control Oscillator Start-up Timer Timing Generation Watchdog Timer Brown-out Reset Power-on Reset MCLR Timer0 1: 3 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RB7 MUX ALU 8 W Reg VDD, VSS Timer1 Enhanced CCP (ECCP) Note PORTA RAM 128 x 8 File Registers 8 Level Stack (13-bit) 14 8 Data Bus Program Counter Timer2 A/D Higher order bits are from the STATUS register. © 2007 Microchip Technology Inc. DS41206B-page 5 PIC16F716 TABLE 1-1: PIC16F716 PINOUT DESCRIPTION Name Function Input Type Output Type Description Master clear (Reset) input. This pin is an active-low Reset to the device. MCLR/VPP MCLR VPP P — Programming voltage input OSC1/CLKIN OSC1 XTAL — Oscillator crystal input CLKIN CMOS — External clock source input CLKIN ST — RC Oscillator mode OSC2 XTAL — Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. CLKOUT — CMOS In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate. OSC2/CLKOUT RA0/AN0 RA1/AN1 RA2/AN2 RA3/AN3/VREF RA4/T0CKI RB0/INT/ECCPAS2 RB1/T1OSO/T1CKI RB2/T1OSI RB3/CCP1/P1A RB4/ECCPAS0 ST — RA0 TTL CMOS AN0 AN — RA1 TTL CMOS AN1 AN — Bidirectional I/O Analog Channel 0 input Bidirectional I/O Analog Channel 1 input RA2 TTL CMOS AN2 AN — RA3 TTL CMOS AN3 AN — Analog Channel 3 input VREF AN — A/D reference voltage input RA4 ST OD Bidirectional I/O. Open drain when configured as output. T0CKI ST — RB0 TTL CMOS Bidirectional I/O Analog Channel 2 input Bidirectional I/O Timer0 external clock input Bidirectional I/O. Programmable weak pull-up. INT ST — External Interrupt ECCPAS2 ST — ECCP Auto-Shutdown pin RB1 TTL CMOS Bidirectional I/O. Programmable weak pull-up. T1OSO — XTAL Timer1 oscillator output. Connects to crystal in Oscillator mode. T1CKI ST — RB2 TTL CMOS Timer1 external clock input T1OSI XTAL — RB3 TTL CMOS CCP1 ST CMOS Capture1 input, Compare1 output, PWM1 output. P1A — CMOS PWM P1A output RB4 TTL CMOS Bidirectional I/O. Programmable weak pull-up. Interrupt-onchange. Bidirectional I/O. Programmable weak pull-up. Timer1 oscillator input. Connects to crystal in Oscillator mode. Bidirectional I/O. Programmable weak pull-up. ECCPAS0 ST — RB5/P1B RB5 TTL CMOS Bidirectional I/O. Programmable weak pull-up. Interrupt-onchange. P1B — CMOS PWM P1B output RB6/P1C RB6 TTL CMOS Bidirectional I/O. Programmable weak pull-up. Interrupt-onchange. ST input when used as ICSP programming clock. P1C — CMOS PWM P1C output RB7 TTL CMOS Bidirectional I/O. Programmable weak pull-up. Interrupt-onchange. ST input when used as ICSP programming data. PWM P1D output RB7/P1D ECCP Auto-Shutdown pin P1D — CMOS VSS VSS P — Ground reference for logic and I/O pins. VDD VDD P — Positive supply for logic and I/O pins. Legend: I = Input O = Output P = Power DS41206B-page 6 AN = Analog input or output TTL = TTL compatible input XTAL = Crystal OD = Open drain ST = Schmitt Trigger input with CMOS levels CMOS = CMOS compatible input or output © 2007 Microchip Technology Inc. PIC16F716 2.0 MEMORY ORGANIZATION There are two memory blocks in the PIC16F716 device. Each block (program memory and data memory) has its own bus so that concurrent access can occur. 2.1 Program Memory Organization The PIC16F716 has a 13-bit program counter capable of addressing an 8K x 14 program memory space. The PIC16F716 has 2K x 14 words of program memory. Accessing a location above the physically implemented address will cause a wrap-around. The Reset vector is at 0000h and the interrupt vector is at 0004h. FIGURE 2-1: PROGRAM MEMORY MAP AND STACK OF PIC16F716 PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 2.2 Data Memory Organization The data memory is partitioned into multiple banks which contain the General Purpose Registers (GPR) and the Special Function Registers (SFR). Bits RP1 and RP0 of the STATUS register are the bank select bits. RP<1:0>(1) (Status<6:5>) Bank 00 0 Note 1: 2: 01 1 10 2(2) 11 3(2) Maintain Status bit 6 clear to ensure upward compatibility with future products. Not implemented Each bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the Special Function Registers. Above the Special Function Registers are General Purpose Registers, implemented as static RAM. All implemented banks contain Special Function Registers. The upper 16 bytes of GPR space and some “high use” Special Function Registers in Bank 0 are mirrored in Bank 1 for code reduction and quicker access. User Memory Space Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-chip Program Memory 07FFh 0800h 1FFFh © 2007 Microchip Technology Inc. DS41206B-page 7 PIC16F716 2.2.1 GENERAL PURPOSE REGISTER FILE The register file can be accessed either directly or indirectly through the File Select Register FSR (Section 2.5 “Indirect Addressing, INDF and FSR Registers”). FIGURE 2-2: REGISTER FILE MAP File Address File Address 00h INDF(1) INDF(1) 01h TMR0 02h PCL PCL 82h 03h STATUS STATUS 83h 04h FSR FSR 84h 05h PORTA TRISA 85h 06h PORTB TRISB 86h 80h OPTION_REG 81h 07h 87h 08h 88h 89h 09h 0Ah PCLATH PCLATH 8Ah 0Bh INTCON INTCON 8Bh 0Ch PIR1 PIE1 8Ch 0Eh TMR1L PCON 8Eh 0Fh TMR1H 8Fh 10h T1CON 90h 11h TMR2 12h T2CON 8Dh 0Dh 91h PR2 92h 93h 13h 14h 94h 15h CCPR1L 95h 16h CCPR1H 96h 17h CCP1CON 97h 18h PWM1CON 98h 19h ECCPAS 99h 1Ah 9Ah 1Bh 9Bh 1Ch 9Ch 1Dh 9Dh 9Eh 1Eh ADRES 1Fh ADCON0 ADCON1 9Fh 20h General Purpose Registers General Purpose Registers 32 Bytes A0h 80 Bytes C0h 6Fh 70h 7Fh BFh EFh 16 Bytes Accesses 70-7Fh Bank 0 Bank 1 F0h FFh Unimplemented data memory locations, read as ‘0’. Note 1: DS41206B-page 8 Not a physical register. © 2007 Microchip Technology Inc. PIC16F716 2.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM. A list of these registers is give in Table 2-1. The Special Function Registers can be classified into two sets; core (CPU) and peripheral. Those registers associated with the core functions are described in detail in this section. Those related to the operation of the peripheral features are described in detail in that peripheral feature section. TABLE 2-1: Address SPECIAL FUNCTION REGISTER SUMMARY BANK 0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page 00h INDF(1) Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 18 01h TMR0 Timer0 module’s register xxxx xxxx 27 02h PCL(1) Program Counter’s (PC) Least Significant Byte 0000 0000 17 03h STATUS(1) 04h FSR(1) 05h PORTA(5,6) 06h (5,6) PORTB 07h-09h IRP(4) RP1(4) RP0 TO PD Z DC C Indirect Data Memory Address Pointer — 0Ah PCLATH(1,2) 0Bh INTCON(1) 0Ch PIR1 0001 1xxx 11 xxxx xxxx 18 — — —(7) RA4 RA3 RA2 RA1 RA0 ---x 0000 19 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 21 Unimplemented — — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 17 GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 13 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 15 0Dh — 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 29 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 29 10h T1CON --00 0000 32 11h TMR2 0000 0000 35 12h T2CON -000 0000 36 13h-14h — Unimplemented — — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON Timer2 Module’s Register — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 Unimplemented — 15h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx 48 16h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx 48 17h CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 48 18h PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 60 19h ECCPAS —(8) ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 00-0 0000 57 1Ah-1Dh 1Eh 1Fh ADCON0 Legend: Note — ADRES 1: 2: 3: 4: 5: 6: 7: 8: ECCPASE ECCPAS2 Unimplemented — A/D Result Register ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE —(7) ADON xxxx xxxx 37 0000 0000 41 x = unknown, u = unchanged, q = value depends on condition, – = unimplemented, read as ‘0’, Shaded locations are unimplemented, read as ‘0’. These registers can be addressed from either bank. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for PC<12:8> whose contents are transferred to the upper byte of the program counter. Other (non Power-up) Resets include: external Reset through MCLR and the Watchdog Timer Reset. The IRP and RP1 bits are reserved. Always maintain these bits clear. On any device Reset, these pins are configured as inputs. This is the value that will be in the PORT output latch. Reserved bits, do not use. ECCPAS1 bit is not used on PIC16F716. © 2007 Microchip Technology Inc. DS41206B-page 9 PIC16F716 TABLE 2-2: Address SPECIAL FUNCTION REGISTER SUMMARY BANK 1 Name 80h INDF(1) 81h OPTION_REG 82h PCL(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Addressing this location uses contents of FSR to address data memory (not a physical register) RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Program Counter’s (PC) Least Significant Byte 0000 0000 18 1111 1111 12 0000 0000 17 83h STATUS(1) FSR(1) 85h TRISA — — —(7) TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 ---1 1111 19 86h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 21 — 8Ah PCLATH(1,2) 8Bh INTCON(1) 8Ch PIE1 8Dh — 8Eh PCON 8Fh-91h 92h 9Fh Note 1: 2: 3: 4: 5: 6: 7: TO PD Z DC C Unimplemented — — GIE PEIE T0IE INTE RBIE T0IF INTF — ADIE — — — CCP1IE TMR2IE Write Buffer for the upper 5 bits of the Program Counter — — Unimplemented 17 RBIF 0000 000x 13 TMR1IE -0-- -000 14 — — — — — POR BOR — ---- --qq 16 — Timer2 Period Register — 11 18 ---0 0000 Unimplemented — 0001 1xxx xxxx xxxx — — Unimplemented ADCON1 Legend: RP0 Indirect Data Memory Address Pointer — PR2 93h-9Eh RP1(4) Page 84h 87h-89h IRP(4) Value on POR, BOR 1111 1111 35, 52 — — — — PCFG2 PCFG1 PCFG0 ---- -000 42 x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, Shaded locations are unimplemented, read as ‘0’. These registers can be addressed from either bank. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for PC<12:8> whose contents are transferred to the upper byte of the program counter. Other (non Power-up) Resets include: external Reset through MCLR and the Watchdog Timer Reset. The IRP and RP1 bits are reserved. Always maintain these bits clear. On any device Reset, these pins are configured as inputs. This is the value that will be in the PORT output latch. Reserved bits, do not use. DS41206B-page 10 © 2007 Microchip Technology Inc. PIC16F716 2.2.2.1 STATUS Register The STATUS register, shown in Register 2-1, contains the arithmetic status of the ALU, the Reset status and the bank select bits for data memory. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register because these instructions do not affect the Z, C or DC bits from the STATUS register. For other instructions, not affecting any Status bits, see the “Instruction Set Summary.” Note 1: The PIC16F716 does not use bits IRP and RP1 of the STATUS register. Maintain these bits clear to ensure upward compatibility with future products. 2: The C and DC bits operate as a borrow and digit borrow bit, respectively, in subtraction. For example, CLRF STATUS will clear the upper-three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). REGISTER 2-1: STATUS: STATUS REGISTER Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IRP: This bit is reserved and should be maintained as ‘0’ bit 6 RP1: This bit is reserved and should be maintained as ‘0’ bit 5 RP0: Register Bank Select bit (used for direct addressing) 1 = Bank 1 (80h-FFh) 0 = Bank 0 (00h-7Fh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is reversed. 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. © 2007 Microchip Technology Inc. DS41206B-page 11 PIC16F716 2.2.2.2 OPTION Register Note: The OPTION register is a readable and writable register, which contains various control bits to configure the TMR0 prescaler/WDT postscaler (single assignable register known also as the prescaler), the External INT Interrupt, TMR0 and the weak pull-ups on PORTB. REGISTER 2-2: To achieve a 1:1 prescaler assignment for the Timer0 register, assign the prescaler to the Watchdog Timer. OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 RBPU: PORTB Pull-up Enable bit 1 = PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual PORT latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RB0/INT pin 0 = Interrupt on falling edge of RB0/INT pin bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on RA4/T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on RA4/T0CKI pin 0 = Increment on low-to-high transition on RA4/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits DS41206B-page 12 Bit Value Timer0 Rate WDT Rate 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 x = Bit is unknown © 2007 Microchip Technology Inc. PIC16F716 2.2.2.3 INTCON Register Note: The INTCON Register is a readable and writable register which contains various enable and flag bits for the TMR0 register overflow, RB Port change and external RB0/INT pin interrupts. REGISTER 2-3: R/W-0 INTCON: INTERRUPT CONTROL REGISTER R/W-0 GIE Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PEIE R/W-0 T0IE R/W-0 R/W-0 R/W-0 INTE RBIE(1) (2) T0IF R/W-0 R/W-x INTF RBIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: RB0/INT External Interrupt Enable bit 1 = Enables the RB0/INT external interrupt 0 = Disables the RB0/INT external interrupt bit 3 RBIE: PORTB Change Interrupt Enable bit(1) 1 = Enables the PORTB change interrupt 0 = Disables the PORTB change interrupt bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: RB0/INT External Interrupt Flag bit 1 = The RB0/INT external interrupt occurred (must be cleared in software) 0 = The RB0/INT external interrupt did not occur bit 0 RBIF: PORTB Change Interrupt Flag bit 1 = When at least one of the PORTB general purpose I/O pins changed state (must be cleared in software) 0 = None of the PORTB general purpose I/O pins have changed state Note 1: 2: IOCB register must also be enabled. T0IF bit is set when Timer0 rolls over. Timer0 is unchanged on Reset and should be initialized before clearing T0IF bit. © 2007 Microchip Technology Inc. DS41206B-page 13 PIC16F716 2.2.2.4 PIE1 Register Note: This register contains the individual enable bits for the peripheral interrupts. REGISTER 2-4: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — ADIE — — — CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5-3 Unimplemented: Read as ‘0’ bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt DS41206B-page 14 x = Bit is unknown © 2007 Microchip Technology Inc. PIC16F716 2.2.2.5 PIR1 Register This register contains the individual flag bits for the peripheral interrupts. REGISTER 2-5: Note: Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 — ADIF — — — CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 ADIF: A/D Interrupt Flag bit 1 = A/D conversion complete 0 = A/D conversion has not completed or has not been started bit 5-3 Unimplemented: Read as ‘0’ bit 2 CCP1IF: CCP1 Interrupt Flag bit Capture Mode 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare Mode 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM Mode Unused in this mode bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag bit 1 = Timer2 to PR2 match occurred (must be cleared in software) 0 = Timer2 to PR2 match has not occurred bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Timer1 register overflowed (must be cleared in software) 0 = Timer1 has not overflowed © 2007 Microchip Technology Inc. DS41206B-page 15 PIC16F716 2.2.2.6 PCON Register Note: The Power Control (PCON) register contains a flag bit to allow differentiation between a Power-on Reset (POR) to an external MCLR Reset or WDT Reset. These devices contain an additional bit to differentiate a Brown-out Reset condition from a Power-on Reset condition. If the BOREN Configuration bit is set, BOR is ‘1’ on Power-on Reset and reset to ‘0’ when a Brown-out condition occurs. BOR must then be set by the user and checked on subsequent Resets to see if it is clear, indicating that another Brown-out has occurred. If the BOREN Configuration bit is clear, BOR is unknown on Power-on Reset. REGISTER 2-6: PCON: POWER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-x — — — — — — POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as ‘0’ bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) DS41206B-page 16 © 2007 Microchip Technology Inc. PIC16F716 2.3 PCL and PCLATH The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 2-3 shows the two situations for the loading of the PC. The upper example in Figure 2-3 shows how the PC is loaded on a write to PCL (PCLATH<4:0> → PCH). The lower example in Figure 2-3 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> → PCH). 2.3.1 A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). Care should be exercised when jumping into a look-up table or program branch table (computed GOTO) by modifying the PCL register. Assuming that PCLATH is set to the table start address, if the table length is greater than 255 instructions or if the lower 8 bits of the memory address rolls over from 0xFF to 0x00 in the middle of the table, then PCLATH must be incremented for each address rollover that occurs between the table beginning and the target location within the table. For more information refer to Application Note AN556, “Implementing a Table Read” (DS00556). LOADING OF PC IN DIFFERENT SITUATIONS PCH 8 7 12 PCL 8 PCLATH<4:0> 5 0 Instruction with PCL as Destination ALU PCLATH 12 PCL PCH 1110 0 8 7 GOTO, CALL PCLATH<4:3> MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<12:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper 5 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 13 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 2.3.2 FIGURE 2-3: 2 11 Opcode <10:0> PCLATH 2.4 Stack The stack allows a combination of up to 8 program calls and interrupts to occur. The stack contains the return address from this branch in program execution. Mid-range devices have an 8-level deep x 13-bit wide hardware stack. The stack space is not part of either program or data space, and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not modified when the stack is PUSHed or POPed. After the stack has been PUSHed 8 times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). PROGRAM MEMORY PAGING The CALL and GOTO instructions provide 11 bits of address to allow branching within any 2K program memory page. When doing a CALL or GOTO instruction, the upper bit of the address is provided by PCLATH<3>. When doing a CALL or GOTO instruction, the user must ensure that the page select bit is programmed so that the desired program memory page is addressed. If a RETURN from a CALL instruction (or interrupt) is executed, the entire 13-bit PC is pushed onto the stack. Therefore, manipulation of the PCLATH<3> bit is not required for the RETURN instructions (which POPs the address from the stack). © 2007 Microchip Technology Inc. DS41206B-page 17 PIC16F716 2.5 Indirect Addressing, INDF and FSR Registers EXAMPLE 2-2: The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing. EXAMPLE 2-1: MOVLW MOVWF CLRF INCF BTFSS GOTO NEXT INDIRECT ADDRESSING HOW TO CLEAR RAM USING INDIRECT ADDRESSING 0x20 FSR INDF FSR FSR,4 NEXT ;initialize pointer ;to RAM ;clear RAM & FSR ;inc pointer ;all done? ;no, clear next CONTINUE • • • • Register file 05 contains the value 10h Register file 06 contains the value 0Ah Load the value 05 into the FSR register A read of the INDF register will return the value of 10h • Increment the value of the FSR register by one (FSR = 06) • A read of the INDR register now will return the value of 0Ah. : ;yes, continue An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit of the STATUS register, as shown in Figure 2-4. However, IRP is not used in the PIC16F716. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although Status bits may be affected). A simple program to clear RAM locations 20h-2Fh using indirect addressing is shown in Example 2-2. FIGURE 2-4: DIRECT/INDIRECT ADDRESSING Direct Addressing RP1: RP0 6 Indirect Addressing from opcode 0 IRP (2) bank select bank select location select 00 00h 01 80h 10 FSR register 0 100h 7Fh Bank 0 FFh Bank 1 17Fh Bank 2 location select 11 180h (3) Data Memory(1) Note 1: 2: 3: 7 (2) (3) 1FFh Bank 3 For register file map detail see Figure 2-2. Maintain clear for upward compatibility with future products. Not implemented. DS41206B-page 18 © 2007 Microchip Technology Inc. PIC16F716 3.0 I/O PORTS Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. 3.1 PORTA and the TRISA Register PORTA is a 5-bit wide bidirectional port. The corresponding data direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., put the corresponding output driver in a High-impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., put the contents of the output latch on the selected pin). Reading the PORTA register reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, the value is modified and then written to the PORT data latch. Pin RA4 is multiplexed with the Timer0 module clock input to become the RA4/T0CKI pin. The RA4/T0CKI pin is a Schmitt Trigger input and an open drain output. All other RA port pins have TTL input levels and full CMOS output drivers. PORTA pins, RA<3:0>, are multiplexed with analog inputs and analog VREF input. The operation of each pin is selected by clearing/setting the control bits in the ADCON1 register (A/D Control Register 1). Note: EXAMPLE 3-1: INITIALIZING PORTA BCF CLRF STATUS, RP0 PORTA BSF MOVLW STATUS, RP0 0xEF MOVWF TRISA BCF STATUS, RP0 FIGURE 3-1: DATA BUS D ; ;Initialize PORTA by ;clearing output ;data latches ;Select Bank 1 ;Value used to ;initialize data ;direction ;Set RA<3:0> as inputs ;RA<4> as outputs ;Return to Bank 0 BLOCK DIAGRAM OF RA<3:0> Q VDD WR PORT CK Q P Data Latch D WR TRIS CK VSS Q VSS Analog Input mode RD TRIS Q The TRISA register controls the direction of the RA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. I/O pin N Q TRIS Latch On a Power-on Reset, these pins are configured as analog inputs and read as ‘0’. VDD TTL Input Buffer D EN RD PORT Note: Setting RA3:0 to output while in Analog mode will force pins to output contents of data latch. © 2007 Microchip Technology Inc. To A/D Converter DS41206B-page 19 PIC16F716 FIGURE 3-2: BLOCK DIAGRAM OF RA4/T0CKI PIN Data Latch DATA BUS Q D WR PORT CK RA4/T0CKI Q N TRIS Latch WR TRIS VSS Q D CK VSS Schmitt Trigger Input Buffer Q RD TRIS Q D ENEN RD PORT Timer0 Clock Input TABLE 3-1: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Value on all other Resets Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR PORTA — — — RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u uuuu TRISA — — — ADCON1 — — — Name TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 ---1 1111 ---1 1111 — — PCFG2 PCFG1 PCFG0 ---- -000 ---- -000 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. DS41206B-page 20 © 2007 Microchip Technology Inc. PIC16F716 3.2 PORTB and the TRISB Register PORTB is an 8-bit wide bidirectional port. The corresponding data direction register is TRISB. Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., put the contents of the output latch on the selected pin). EXAMPLE 3-2: INITIALIZING PORTB BCF CLRF STATUS, RP0 PORTB BSF MOVLW STATUS, RP0 0xCF MOVWF TRISB ;select Bank 0 ;Initialize PORTB by ;clearing output ;data latches ;Select Bank 1 ;Value used to ;initialize data ;direction ;Set RB<3:0> as inputs ;RB<5:4> as outputs ;RB<7:6> as inputs Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit RBPU of the OPTION register. The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. FIGURE 3-3: BLOCK DIAGRAM OF RB0/INT/ECCPAS2 PIN VDD VDD RBPU(1) weak P pull-up When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTB pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. Since the TRIS bit override is in effect while the peripheral is enabled, read-modifywrite instructions (such as BSF, BCF, XORWF) with TRISB as the destination should be avoided. The user should refer to the corresponding peripheral section for the correct TRIS bit settings. Four of PORTB’s pins, RB<7:4>, have an interrupt-onchange feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB<7:4> pin configured as an output is excluded from the interrupton-change comparison). The input pins, RB<7:4>, are compared with the old value latched on the last read of PORTB. The “mismatch” outputs of RB<7:4> are OR’ed together to generate the RB Port Change Interrupt with flag bit RBIF of the INTCON register. This interrupt can wake the device from Sleep. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: 1. 2. Perform a read of PORTB to end the mismatch condition. Clear flag bit RBIF. A mismatch condition will continue to set flag bit RBIF. Reading PORTB will end the mismatch condition and allow flag bit RBIF to be cleared. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. Data Latch D Q DATA BUS WR PORT RB0/ INT/ ECCPAS2 CK TRIS Latch D Q WR TRIS VSS CK TTL Input Buffer RD TRIS Q RD PORT RB0/INT D EN Schmitt Trigger Buffer RD PORT ECCPAS2: ECCP Auto-shutdown input Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION register). © 2007 Microchip Technology Inc. DS41206B-page 21 PIC16F716 FIGURE 3-4: BLOCK DIAGRAM OF RB1/T1OSO/T1CKI PIN VDD T1OSCEN RBPU(1) weak P pull-up VDD DATA BUS WR PORTB Data Latch D CK RB1/T1OSO/T1CKI Q Q TRIS Latch D WR TRISB CK VSS Q Q RD TRISB T1OSCEN TTL Buffer Q D EN RD PORTB T1OSI (From RB2) TMR1 oscillator To Timer1 clock input ST Buffer Note FIGURE 3-5: 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION register). BLOCK DIAGRAM OF RB2/T1OSI PIN T1OSCEN VDD RBPU(1) weak P pull-up VDD Data Latch DATA BUS D WR PORTB CK Q RB2/T1OSI Q TRIS Latch D WR TRISB CK Q VSS Q RD TRIS T1OSCEN TTL Buffer Q D EN RD PORTB T1OSO (To RB1) Note 1: TMR1 Oscillator To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION register). DS41206B-page 22 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 3-6: BLOCK DIAGRAM OF RB3/CCP1/P1A PIN VDD RBPU(1) [PWMA(P1A) / CCP1 Compare] Output Enable [PWMA(P1A) / CCP1 Compare] Output weak P pull-up VDD 1 RB3/CCP1/P1A 0 PWMA(P1A) Auto-shutdown tri-state VSS Data Latch DATA BUS D WR PORTB CK Q Q TRIS Latch D WR TRISB CK Q Q RD TRIS TTL Buffer Q D EN RD PORTB Schmitt Trigger Buffer CCP – Capture input Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION register). FIGURE 3-7: BLOCK DIAGRAM OF RB4/ECCPAS0 PIN VDD RBPU(1) DATA BUS WR PORTB weak P pull-up Data Latch D Q RB4/ECCPAS0 CK TRIS Latch D Q WR TRISB VDD VSS TTL Buffer CK RD TRIS Q Latch D EN RD PORT ST Buffer Q1 Set RBIF From other RB<7:4> pins Q D RD PORT EN ECCPAS0: ECCP Auto-Shutdown input © 2007 Microchip Technology Inc. Q3 Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit of the OPTION register. DS41206B-page 23 PIC16F716 FIGURE 3-8: BLOCK DIAGRAM OF RB5/P1B PIN VDD RBPU(1) PWMB(P1B) Enable PWMB(P1B) Data out PWMB(P1B) Auto-shutdown tri-state Data Latch DATA BUS D Q WR PORTB weak P pull-up VDD 1 RB5/P1B 0 CK TRIS Latch D Q WR TRISB CK VSS TTL Buffer Q RD TRISB Q Latch D EN RD PORTB Q1 Set RBIF Q From other RB<7:4> pins D RD PORTB Q3 EN Note FIGURE 3-9: 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION register). BLOCK DIAGRAM OF RB6/P1C PIN VDD RBPU(1) PWMC(P1C) Enable PWMC(P1C) Data out PWMC(P1C) Auto-shutdown tri-state Data Latch DATA BUS D Q WR PORTB weak P pull-up VDD 1 RB6/P1C 0 CK TRIS Latch D Q WR TRISB CK VSS Q ST Buffer RD TRISB Q Latch D EN RD PORTB TTL Buffer Q1 Set RBIF From other RB<7:4> pins Q D EN RD PORTB Q3 ICSPC – In-Circuit Serial Programming™ Clock Input Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION register). DS41206B-page 24 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 3-10: BLOCK DIAGRAM OF RB7/P1D PIN VDD RBPU(1) PWMD(P1D) Enable PWMD(P1D) Data out PWMD(P1D) Auto-shutdown tri-state Data Latch DATA BUS D Q WR PORTB weak P pull-up VDD 1 RB7/P1D 0 CK TRIS Latch D Q WR TRISB CK VSS Q TTL Buffer ST Buffer RD TRISB Q Latch D EN RD PORTB Q1 Set RBIF Q From other RB<7:4> pins D Note RD PORTB Q3 EN ICSPD – In-Circuit Serial Programming™ Data Input TABLE 3-2: 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit of the OPTION register. SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 Name OPTION_REG Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB. © 2007 Microchip Technology Inc. DS41206B-page 25 PIC16F716 NOTES: DS41206B-page 26 © 2007 Microchip Technology Inc. PIC16F716 4.0 TIMER0 MODULE 4.1 Timer0 Operation The Timer0 module is an 8-bit timer/counter with the following features: When used as a timer, the Timer0 module can be used as either an 8-bit timer or an 8-bit counter. • • • • • 4.1.1 8-bit timer/counter register (TMR0) 8-bit prescaler (shared with Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow 8-BIT TIMER MODE When used as a timer, the Timer0 module will increment every instruction cycle (without prescaler). Timer mode is selected by clearing the T0CS bit of the OPTION register to ‘0’. Figure 4-1 is a block diagram of the Timer0 module. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: 4.1.2 The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. 8-BIT COUNTER MODE When used as a counter, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit of the OPTION register. Counter mode is selected by setting the T0CS bit of the OPTION register to ‘1’. FIGURE 4-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER FOSC/4 Data Bus 0 8 1 Sync 2 TCY 1 T0CKI pin TMR0 0 T0CS T0SE 0 8-bit Prescaler Set Flag bit T0IF on Overflow PSA 1 PSA 8 WDTE PS<2:0> 1 WDT Time-out 0 31 kHz INTOSC Note Watchdog Timer 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register. 2: WDTE bit is in the Configuration Word register. © 2007 Microchip Technology Inc. PSA DS41206B-page 27 PIC16F716 4.1.3 SOFTWARE PROGRAMMABLE PRESCALER When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (see Example 4-2). A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the OPTION register. To assign the prescaler to Timer0, the PSA bit must be cleared to a ‘0’. EXAMPLE 4-2: CLRWDT ;Clear WDT and ;prescaler BANKSEL OPTION_REG ; MOVLW b’11110000’ ;Mask TMR0 select and ANDWF OPTION_REG,W ;prescaler bits IORLW b’00000011’ ;Set prescale to 1:16 MOVWF OPTION_REG ; There are 8 prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be assigned to the WDT module. 4.1.4 The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. Switching Prescaler Between Timer0 and WDT Modules Note: As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device Reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 4-1, must be executed. EXAMPLE 4-1: BANKSEL CLRWDT CLRF TMR0 BANKSEL BSF CLRWDT OPTION_REG OPTION_REG,PSA MOVLW ANDWF IORLW MOVWF b’11111000’ OPTION_REG,W b’00000101’ OPTION_REG TABLE 4-1: Bit 7 USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in the Section 12.0 “Electrical Characteristics”. ; ;Clear WDT ;Clear TMR0 and ;prescaler ; ;Select WDT ; ; ;Mask prescaler ;bits ;Set WDT prescaler ;to 1:32 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timer0 Module Register INTCON OPTION_REG TRISA Legend: The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Name TMR0 4.1.5 CHANGING PRESCALER (TIMER0 → WDT) TMR0 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit must be cleared in software. The Timer0 interrupt enable is the T0IE bit of the INTCON register. When the prescaler is assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. 4.1.3.1 CHANGING PRESCALER (WDT → TIMER0) Value on POR, BOR Value on all other Resets xxxx xxxx uuuu uuuu GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 — — — TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 ---1 1111 ---1 1111 0000 000u – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module. DS41206B-page 28 © 2007 Microchip Technology Inc. PIC16F716 5.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer/counter with the following features: • • • • • • • 16-bit timer/counter register pair (TMR1H:TMR1L) Programmable internal or external clock source 3-bit prescaler Optional LP oscillator Synchronous or asynchronous operation Interrupt on overflow Wake-up on overflow (external clock, Asynchronous mode only) • Time base for the Capture/Compare function • Special Event Trigger (with ECCP) 5.1 Timer1 Operation The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer. When used with an external clock source, the module can be used as either a timer or counter. 5.2 Clock Source Selection The TMR1CS bit of the T1CON register is used to select the clock source. When TMR1CS = 0, the clock source is FOSC/4. When TMR1CS = 1, the clock source is supplied externally. Figure 5-1 is a block diagram of the Timer1 module. FIGURE 5-1: TIMER1 BLOCK DIAGRAM Set flag bit TMR1IF on Overflow 0 TMR1(2) TMR1H Synchronized clock input TMR1L 1 TMR1ON on/off T1OSC RB1/T1OSO/T1CKI RB2/T1OSI Note 1: 2: 3: 5.2.1 T1SYNC 1 T1OSCEN FOSC/4 Enable Internal Oscillator(1) Clock Prescaler 1, 2, 4, 8 0 2 T1CKPS<1:0> Synchronize (3) det Sleep input ST Buffer is low power type when using LP oscillator, or high speed type when using T1CKI. Timer1 register increments on rising edge. Synchronize does not operate while in Sleep. INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of TCY as determined by the Timer1 prescaler. 5.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When counting, Timer1 is incremented on the rising edge of the external clock input T1CKI. In addition, the Counter mode clock can be synchronized to the microcontroller system clock or run asynchronously. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after one or more of the following conditions: • Timer1 is enabled after POR or BOR Reset • A write to TMR1H or TMR1L • T1CKI is high when Timer1 is disabled and when Timer1 is reenabled T1CKI is low. See Figure 5-2. © 2007 Microchip Technology Inc. DS41206B-page 29 PIC16F716 5.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 5.4 Timer1 Oscillator A low-power 32.768 kHz crystal oscillator is built-in between pins T1OSI (input) and T1OSO (output). The oscillator is enabled by setting the T1OSCEN control bit of the T1CON register. The oscillator will continue to run during Sleep. The Timer1 oscillator is shared with the system LP oscillator. Thus, Timer1 can use this mode only when the primary system clock is derived from the internal oscillator or when in LP oscillator mode. The user must provide a software time delay to ensure proper oscillator start-up. TRISB1 and TRISB2 bits are set when the Timer1 oscillator is enabled. RB1 and RB2 bits read as ‘0’ and TRISB1 and TRISB2 bits read as ‘1’. Note: 5.5 The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to enabling Timer1. 5.5.1 Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. 5.6 Note 1: When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment. Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • Timer1 interrupt enable bit of the PIE1 register • PEIE bit of the INTCON register • GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer continues to increment asynchronous to the internal phase clocks. The timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 5.5.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE 5.7 The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • TMR1ON bit of the T1CON register must be set • TMR1IE bit of the PIE1 register must be set • PEIE bit of the INTCON register must be set The device will wake-up on an overflow and execute the next instruction. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine (0004h). 2: In Asynchronous Counter mode, Timer1 can not be used as a time base for the Capture or Compare modes of the ECCP module. DS41206B-page 30 © 2007 Microchip Technology Inc. PIC16F716 5.8 ECCP Capture/Compare Time Base The ECCP module uses the TMR1H:TMR1L register pair as the time base when operating in Capture or Compare mode. In Capture mode, the value in the TMR1H:TMR1L register pair is copied into the CCPR1H:CCPR1L register pair on a configured event. In Compare mode, an event is triggered when the value CCPR1H:CCPR1L register pair matches the value in the TMR1H:TMR1L register pair. This event can be a Special Event Trigger. For more information, see Section 8.0 “Enhanced Capture/Compare/PWM Module”. 5.9 ECCP Special Event Trigger If a ECCP is configured to trigger a special event, the trigger will clear the TMR1H:TMR1L register pair. This special event does not cause a Timer1 interrupt. The ECCP module may still be configured to generate a ECCP interrupt. In this mode of operation, the CCPR1H:CCPR1L register pair effectively becomes the period register for Timer1. Timer1 should be synchronized to the FOSC to utilize the Special Event Trigger. Asynchronous operation of Timer1 can cause a Special Event Trigger to be missed. In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the ECCP, the write will take precedence. For more information, see Section 8.0 “Enhanced Capture/Compare/PWM Module”. FIGURE 5-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. © 2007 Microchip Technology Inc. DS41206B-page 31 PIC16F716 5.10 Timer1 Control Register The Timer1 Control register (T1CON), shown in Register 5-1, is used to control Timer1 and select the various features of the Timer1 module. REGISTER 5-1: T1CON: TIMER 1 CONTROL REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale Value 10 = 1:4 Prescale Value 01 = 1:2 Prescale Value 00 = 1:1 Prescale Value bit 3 T1OSCEN: Timer1 Oscillator Enable Control bit 1 = Timer1 oscillator is enabled 0 = Timer1 oscillator is disabled bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from T1CKI pin (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 DS41206B-page 32 x = Bit is unknown © 2007 Microchip Technology Inc. PIC16F716 TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Name Bit 7 INTCON Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets 0000 000x GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu --00 0000 --uu uuuu T1CON Legend: — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. © 2007 Microchip Technology Inc. DS41206B-page 33 PIC16F716 NOTES: DS41206B-page 34 © 2007 Microchip Technology Inc. PIC16F716 6.0 TIMER2 MODULE The Timer2 module is an 8-bit timer with the following features: • • • • • 8-bit timer register (TMR2) 8-bit period register (PR2) Interrupt on TMR2 match with PR2 Software programmable prescaler (1:1, 1:4, 1:16) Software programmable postscaler (1:1 to 1:16) Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a ‘1’. Timer2 is turned off by clearing the TMR2ON bit to a ‘0’. The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The Timer2 postscaler is controlled by the TOUTPS bits in the T2CON register. The prescaler and postscaler counters are cleared when: See Figure 6-1 for a block diagram of Timer2. 6.1 The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. Timer2 Operation The clock input to the Timer2 module is the system instruction clock (FOSC/4). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. • A write to TMR2 occurs. • A write to T2CON occurs. • Any device Reset occurs (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset). Note: The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, two things happen: TMR2 is not cleared when T2CON is written. • TMR2 is reset to 00h on the next increment cycle • The Timer2 postscaler is incremented The match output of the Timer2/PR2 comparator is then fed into the Timer2 postscaler. The postscaler has postscale options of 1:1 to 1:16 inclusive. The output of the Timer2 postscaler is used to set the TMR2IF interrupt flag bit in the PIR2 register. FIGURE 6-1: TIMER2 BLOCK DIAGRAM TMR2 Output FOSC/4 Prescaler 1:1, 1:4, 1:16 2 TMR2 Comparator Sets Flag bit TMR2IF Reset EQ Postscaler 1:1 to 1:16 T2CKPS<1:0> PR2 4 TOUTPS<3:0> © 2007 Microchip Technology Inc. DS41206B-page 35 PIC16F716 REGISTER 6-1: T2CON: TIMER 2 CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 TABLE 6-1: Name Bit 7 INTCON x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets 0000 000x GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 PR2 Timer2 Module Period Register 1111 1111 1111 1111 TMR2 Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000 -000 0000 -000 0000 T2CON — Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module. DS41206B-page 36 TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 © 2007 Microchip Technology Inc. PIC16F716 7.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The ADC voltage reference is software selectable to either VDD or a voltage applied to the external reference pins. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 8-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 8-bit binary result via successive approximation and stores the conversion result into the ADC result register (ADRES). FIGURE 7-1: The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. Figure 7-1 shows the block diagram of the ADC. ADC BLOCK DIAGRAM VDD PFCG<2:0> (ADCON1 register) VREF RA0/AN0 000 RA1/AN1 001 RA2/AN2 010 011 RA3/VREF/AN3 ADC 8 GO/DONE CHS ADRES ADON VSS © 2007 Microchip Technology Inc. DS41206B-page 37 PIC16F716 7.1 ADC Configuration 7.1.3 When configuring and using the ADC the following functions must be considered: • • • • • Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control 7.1.1 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. • • • • FOSC/2 FOSC/8 FOSC/32 FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 8-bit conversion requires 9.5 TAD periods. For correct conversion, the appropriate TAD specification must be met. See A/D conversion requirements in Section 12.0 “Electrical Characteristics” for more information. Table 7-1 gives examples of appropriate ADC clock selections. Note: When changing channels, a delay is required before starting the next conversion. Refer to Section 7.2 “ADC Operation” for more information. TABLE 7-1: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. TAD vs. DEVICE OPERATING FREQUENCIES AD Clock Source (TAD) Operation CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON0 register. There are four possible clock options: The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ADCON1 bits. See the corresponding Port section for more information. 7.1.2 The PCFG bits of the ADCON0 register provide independent control of the positive voltage reference. The positive voltage reference can be either VDD or an external voltage source. 7.1.4 PORT CONFIGURATION Note: ADC VOLTAGE REFERENCE ADCS<1:0> Device Frequency 20 MHz ns(2) 5 MHz ns(2) 1.25 MHz 333.33 kHz 2 TOSC 00 100 1.6 μs 6 μs 8 TOSC 01 400 ns(2) 1.6 μs 6.4 μs 24 μs(3) 32 TOSC 10 1.6 μs 6.4 μs 25.6 μs(3) 96 μs(3) RC Legend: Note 1: 2: 3: 4: 400 11 2-6 μs(1), (4) 2-6 μs(1), (4) 2-6 μs(1), (4) 2-6 μs(1) Shaded cells are outside of recommended range. The RC source has a typical TAD time of 4 μs. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for Sleep operation only. DS41206B-page 38 © 2007 Microchip Technology Inc. PIC16F716 7.1.5 INTERRUPTS The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC interrupt flag is the ADIF bit in the PIR1 register. The ADC interrupt enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the global interrupt must be disabled. If the global interrupt is enabled, execution will switch to the Interrupt Service Routine. Please see Section 7.1.5 “Interrupts” for more information. © 2007 Microchip Technology Inc. DS41206B-page 39 PIC16F716 7.2 7.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/ DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. Note: 7.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 7.2.6 “A/D Conversion Procedure”. COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF flag bit • Update the ADRES register with new conversion result 7.2.3 7.2.4 A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. Using the Special Event Trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. See Section 8.0 “Enhanced Capture/Compare/ PWM Module” for more information. 7.2.6 When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. DS41206B-page 40 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. SPECIAL EVENT TRIGGER The ECCP Special Event Trigger allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 counter resets to zero. TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRES register will not be updated with the partially complete Analog-to-Digital conversion sample. Instead, the ADRES register will retain the value of the previous conversion. Additionally, a 2 TAD delay is required before another acquisition can be initiated. Following this delay, an input acquisition is automatically started on the selected channel. Note: 7.2.5 7. 8. Configure Port: • Disable pin output driver (See TRIS register) • Configure pin as analog Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Select result format • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC Result Clear the ADC interrupt flag (required if interrupt is enabled). Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: See Section 7.3 Requirements”. “A/D Acquisition © 2007 Microchip Technology Inc. PIC16F716 7.2.7 ADC REGISTER DEFINITIONS The following registers are used to control the operation of the ADC. REGISTER 7-1: R/W-0 ADCON0: A/D CONTROL REGISTER 0 R/W-0 ADCS1 ADCS0 R/W-0 CHS2 R/W-0 CHS1 R/W-0 CHS0 R/W-0 U-0 R/W-0 GO/DONE — ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 ADCS<1:0>: A/D Conversion Clock Select bits 00 = FOSC/2 01 = FOSC/8 10 = FOSC/32 11 = FRC (Clock derived from the internal ADC RC oscillator) bit 5-3 CHS<2:0>: Analog Channel Select bits 000 = AN0 001 = AN1 010 = AN2 011 = AN3 100 = Reserved, do not use 101 = Reserved, do not use 110 = Reserved, do not use 111 = Reserved, do not use bit 2 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 1 Unimplemented: Read as ‘0’ bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current © 2007 Microchip Technology Inc. DS41206B-page 41 PIC16F716 REGISTER 7-2: ADCON1: A/D CONTROL REGISTER 1 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 PCFG<2:0>: A/D Port Configuration Control bits. The following table illustrates the effects of the various configurations: PCFG<2:0> AN2/ RA2 AN2/ RA1 AN0/ RA0 VREF 0x0 A A A A VDD 0x1 VREF A A A RA3 100 A D A A VDD 101 VREF D A A RA3 D D D D VDD 11x Legend: DS41206B-page 42 AN3/ RA3 A = Analog input, D = Digital I/O © 2007 Microchip Technology Inc. PIC16F716 7.3 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 7-2. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 7-2. The maximum recommended impedance for analog sources is 10 kΩ. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), EQUATION 7-1: an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 7-1 may be used. This equation assumes that 1/2 LSb error is used. The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50°C and external impedance of 10k Ω 5.0V V DD Assumptions: T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2μs + T C + [ ( Temperature - 25°C ) ( 0.05μs/°C ) ] The value for TC can be approximated with the following equations: 1 V AP PLIE D ⎛ 1 – ------------⎞ = V CHOLD ⎝ 2047⎠ ;[1] VCHOLD charged to within 1/2 lsb –TC ----------⎞ ⎛ RC V AP P LI ED ⎜ 1 – e ⎟ = V CHOLD ⎝ ⎠ ;[2] VCHOLD charge response to VAPPLIED – Tc ---------⎞ ⎛ 1 RC V AP P LIED ⎜ 1 – e ⎟ = V A P PLIE D ⎛ 1 – ------------⎞ ⎝ 2047⎠ ⎝ ⎠ ;combining [1] and [2] Solving for TC: T C = – C HOLD ( R IC + R SS + R S ) ln(1/2047) = – 10pF ( 1k Ω + 7k Ω + 10k Ω ) ln(0.0004885) = 1.37 μs Therefore: T ACQ = 2μ S + 1.37μ S + [ ( 50°C- 25°C ) ( 0.05μ S /°C ) ] = 4.67μ S Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin leakage specification. © 2007 Microchip Technology Inc. DS41206B-page 43 PIC16F716 FIGURE 7-2: ANALOG INPUT MODEL VDD Rs ANx CPIN 5 pF VA VT = 0.6V VT = 0.6V RIC ≤ 1k Sampling Switch SS Rss ILEAKAGE(1) CHOLD = 10 pF VSS Legend: CPIN = Input Capacitance = Threshold Voltage VT I LEAKAGE = Leakage current at the pin due to various junctions RIC = Interconnect Resistance SS = Sampling Switch CHOLD = Sample/Hold Capacitance Note 1: 6V 5V VDD 4V 3V 2V RSS 5 6 7 8 9 10 11 Sampling Switch (kΩ) See Section 12.0 “Electrical Characteristics”. FIGURE 7-3: ADC TRANSFER FUNCTION Full-Scale Range FFh FEh FDh ADC Output Code FCh 1 LSB ideal FBh Full-Scale Transition 04h 03h 02h 01h 00h Analog Input Voltage 1 LSB ideal VSS DS41206B-page 44 Zero-Scale Transition VDD/VREF+ © 2007 Microchip Technology Inc. PIC16F716 TABLE 7-2: Name ADCON0 ADCON1 ADRES SUMMARY OF ASSOCIATED ADC REGISTERS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — ADON 0000 0000 0000 0000 — — — — — PCFG2 PCFG1 PCFG0 ---- -000 ---- -000 xxxx xxxx uuuu uuuu A/D Result Register GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 PORTA — — — RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu — — — TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 INTCON TRISA Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for ADC module. © 2007 Microchip Technology Inc. DS41206B-page 45 PIC16F716 NOTES: DS41206B-page 46 © 2007 Microchip Technology Inc. PIC16F716 8.0 ENHANCED CAPTURE/ COMPARE/PWM MODULE Note: The Enhanced Capture/Compare/PWM module is a peripheral which allows the user to time and control different events. In Capture mode, the peripheral allows the timing of the duration of an event. The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. The PWM mode can generate a Pulse-Width Modulated signal of varying frequency and duty cycle. TABLE 8-1: ECCP MODE – TIMER RESOURCES REQUIRED ECCP Mode Timer Resource Capture Timer1 Compare Timer1 PWM Timer2 Table 8-1 shows the timer resources required by the ECCP module. REGISTER 8-1: CCPR1 and CCP1 throughout this document refer to CCPR1 or CCPR2 and CCP1 or CCP2, respectively. CCP1CON: ENHANCED CCP1 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 P1M<1:0>: PWM Output Configuration bits If CCP1M<3:2> = 00, 01, 10: xx = P1A assigned as Capture/Compare input; P1B, P1C, P1D assigned as port pins If CCP1M<3:2> = 11: 00 = Single output; P1A modulated; P1B, P1C, P1D assigned as port pins 01 = Full-Bridge output forward; P1D modulated; P1A active; P1B, P1C inactive 10 = Half-Bridge output; P1A, P1B modulated with dead-band control; P1C, P1D assigned as port pins 11 = Full-Bridge output reverse; P1B modulated; P1C active; P1A, P1D inactive bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L. bit 3-0 CCP1M<3:0>: ECCP Mode Select bits 0000 = Capture/Compare/PWM off (resets ECCP module) 0001 = Unused (reserved) 0010 = Compare mode, toggle output on match (CCP1IF bit is set) 0011 = Unused (reserved) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CCP1IF bit is set) 1001 = Compare mode, clear output on match (CCP1IF bit is set) 1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected) 1011 = Compare mode, Special Event Trigger (CCP1IF bit is set; CCP1 resets TMR1 or TMR2) 1100 = PWM mode; P1A, P1C active-high; P1B, P1D active-high 1101 = PWM mode; P1A, P1C active-high; P1B, P1D active-low 1110 = PWM mode; P1A, P1C active-low; P1B, P1D active-high 1111 = PWM mode; P1A, P1C active-low; P1B, P1D active-low © 2007 Microchip Technology Inc. DS41206B-page 47 PIC16F716 8.1 Capture Mode 8.1.2 In Capture mode, CCPR1H:CCPR1L captures the 16-bit value of the TMR1 register when an event occurs on pin CCP1. An event is defined as one of the following and is configured by the CCP1M<3:0> bits of the CCP1CON register: • • • • Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge When a capture is made, the Interrupt Request Flag bit CCP1IF of the PIR1 register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPR1H, CCPR1L register pair is read, the old captured value is overwritten by the new captured value (see Figure 8-1). 8.1.1 CCP1 PIN CONFIGURATION In Capture mode, the CCP1 pin should be configured as an input by setting the associated TRIS control bit. Note: If the CCP1 pin is configured as an output, a write to the port can cause a capture condition. FIGURE 8-1: Prescaler ÷ 1, 4, 16 CAPTURE MODE OPERATION BLOCK DIAGRAM CCPR1H and Edge Detect 8.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCP1IE interrupt enable bit of the PIE1 register clear to avoid false interrupts. Additionally, the user should clear the CCP1IF interrupt flag bit of the PIR1 register following any change in operating mode. 8.1.4 CCP PRESCALER There are four prescaler settings specified by the CCP1M<3:0> bits of the CCP1CON register. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCP1CON register before changing the prescaler (see Example 8-1). EXAMPLE 8-1: CLRF MOVLW CCPR1L Capture Enable TMR1H Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. CHANGING BETWEEN CAPTURE PRESCALERS BANKSEL CCP1CON Set Flag bit CCP1IF (PIR1 register) CCP1 pin TIMER1 MODE SELECTION MOVWF ;Set Bank bits to point ;to CCP1CON CCP1CON ;Turn CCP module off NEW_CAPT_PS ;Load the W reg with ; the new prescaler ; move value and CCP ON CCP1CON ;Load CCP1CON with this ; value TMR1L CCP1CON<3:0> System Clock (FOSC) DS41206B-page 48 © 2007 Microchip Technology Inc. PIC16F716 TABLE 8-2: Name REGISTERS ASSOCIATED WITH CAPTURE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx xxxx xxxx CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx xxxx xxxx CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000 GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 INTCON PR2 Timer2 Period Register 1111 1111 1111 1111 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR2 Timer2 module’s register 0000 0000 0000 0000 1111 1111 1111 1111 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Capture. © 2007 Microchip Technology Inc. DS41206B-page 49 PIC16F716 8.2 Compare Mode 8.2.2 In Compare mode, the 16-bit CCPR1 register value is constantly compared against the TMR1 register pair value. When a match occurs, the CCP1 module may: • • • • • Toggle the CCP1 output. Set the CCP1 output. Clear the CCP1 output. Generate a Special Event Trigger. Generate a Software Interrupt. All Compare modes can generate an interrupt. FIGURE 8-2: COMPARE MODE OPERATION BLOCK DIAGRAM CCP1CON<3:0> Mode Select Q S R Output Logic Match TRIS Output Enable Comparator TMR1H TMR1L Special Event Trigger Special Event Trigger will: • Clear TMR1H and TMR1L registers. • NOT set interrupt flag bit TMR1IF of the PIR1 register. • Set the GO/DONE bit to start the ADC conversion. 8.2.1 CCP1 PIN CONFIGURATION The user must configure the CCP1 pin as an output by clearing the associated TRIS bit. Note: Clearing the CCP1CON register will force the CCP1 compare output latch to the default low level. This is not the PORT I/O data latch. DS41206B-page 50 SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCP1M<3:0> = 1010), the CCP1 module does not assert control of the CCP1 pin (see the CCP1CON register). 8.2.4 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCP1M<3:0> = 1011), the CCP1 module does the following: • Resets Timer1 • Starts an ADC conversion if ADC is enabled The CCP1 module does not assert control of the CCP1 pin in this mode (see the CCP1CON register). Set CCP1IF Interrupt Flag (PIR1) 4 CCPR1H CCPR1L CCP1 Pin In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. 8.2.3 The action on the pin is based on the value of the CCP1M<3:0> control bits of the CCP1CON register. TIMER1 MODE SELECTION The Special Event Trigger output of the CCP occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCPR1H, CCPR1L register pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. This allows the CCPR1H, CCPR1L register pair to effectively provide a 16-bit programmable period register for Timer1. Note 1: The Special Event Trigger from the CCP module does not set interrupt flag bit TMRxIF of the PIR1 register. 2: Removing the match condition by changing the contents of the CCPR1H and CCPR1L register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring. © 2007 Microchip Technology Inc. PIC16F716 TABLE 8-3: Name REGISTERS ASSOCIATED WITH COMPARE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx xxxx xxxx CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx xxxx xxxx CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000 GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 INTCON PR2 Timer2 Period Register 1111 1111 1111 1111 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR2 Timer2 module’s register 0000 0000 0000 0000 1111 1111 1111 1111 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Compare. © 2007 Microchip Technology Inc. DS41206B-page 51 PIC16F716 8.3 PWM Mode The PWM mode generates a Pulse-Width Modulated signal on the CCP1 pin. The duty cycle, period and resolution are determined by the following registers: • • • • PR2 T2CON CCPR1L CCP1CON FIGURE 8-4: CCP PWM OUTPUT Period Pulse Width In Pulse-Width Modulation (PWM) mode, the CCP module produces up to a 10-bit resolution PWM output on the CCP1 pin. Since the CCP1 pin is multiplexed with the PORT data latch, the TRIS for that pin must be cleared to enable the CCP1 pin output driver. Note: The PWM output (Figure 8-4) has a time base (period) and a time that the output stays high (duty cycle). TMR2 = PR2 TMR2 = CCPR1L:CCP1CON<5:4> TMR2 = 0 Clearing the CCP1CON register will relinquish CCP1 control of the CCP1 pin. Figure 8-3 shows a simplified block diagram of PWM operation. Figure 8-4 shows a typical waveform of the PWM signal. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 8.3.7 “Setup for PWM Operation”. FIGURE 8-3: SIMPLIFIED PWM BLOCK DIAGRAM CCP1CON<5:4> Duty Cycle Registers CCPR1L CCPR1H(2) (Slave) CCP1 R Comparator TMR2 (1) Q S TRIS Comparator PR2 Note 1: 2: Clear Timer2, toggle CCP1 pin and latch duty cycle The 8-bit timer TMR2 register is concatenated with the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. In PWM mode, CCPR1H is a read-only register. DS41206B-page 52 © 2007 Microchip Technology Inc. PIC16F716 8.3.1 PWM PERIOD The PWM period is specified by the PR2 register of Timer2. The PWM period can be calculated using the formula of Equation 8-1. EQUATION 8-1: PWM PERIOD PWM Period = [ ( PR2 ) + 1 ] • 4 • T OSC • (TMR2 Prescale Value) When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set. (Exception: If the PWM duty cycle = 0%, the pin will not be set.) • The PWM duty cycle is latched from CCPR1L into CCPR1H. Note: The Timer2 postscaler (see Section 6.0 “Timer2 Module”) is not used in the determination of the PWM frequency. 8.3.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to multiple registers: CCPR1L register and DC1B<1:0> bits of the CCP1CON register. The CCPR1L contains the eight MSbs and the DC1B<1:0> bits of the CCP1CON register contain the two LSbs. CCPR1L and DC1B<1:0> bits of the CCP1CON register can be written to at any time. The duty cycle value is not latched into CCPR1H until after the period completes (i.e., a match between PR2 and TMR2 registers occurs). While using the PWM, the CCPR1H register is read-only. Equation 8-2 is used to calculate the PWM pulse width. Equation 8-3 is used to calculate the PWM duty cycle ratio. EQUATION 8-2: PULSE WIDTH Pulse Width = ( CCPR1L:CCP1CON<5:4> ) • T OSC • (TMR2 Prescale Value) EQUATION 8-3: DUTY CYCLE RATIO ( CCPR1L:CCP1CON<5:4> ) Duty Cycle Ratio = ----------------------------------------------------------------------4 ( PR2 + 1 ) The CCPR1H register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. The 8-bit timer TMR2 register is concatenated with either the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2 prescaler is set to 1:1. When the 10-bit time base matches the CCPR1H and 2bit latch, then the CCP1 pin is cleared (see Figure 8-3). © 2007 Microchip Technology Inc. DS41206B-page 53 PIC16F716 8.3.3 PWM RESOLUTION EQUATION 8-4: The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is 10 bits when PR2 is 255. The resolution is a function of the PR2 register value as shown by Equation 8-4. TABLE 8-4: Timer Prescale (1, 4, 16) PR2 Value Maximum Resolution (bits) Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz 16 4 1 1 1 1 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 10 10 10 8 7 6.6 EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency Timer Prescale (1, 4, 16) PR2 Value Maximum Resolution (bits) DS41206B-page 54 log [ 4 ( PR2 + 1 ) ] Resolution = ------------------------------------------ bits log ( 2 ) EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency TABLE 8-5: PWM RESOLUTION 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz 16 4 1 1 1 1 0x65 0x65 0x65 0x19 0x0C 0x09 8 8 8 6 5 5 © 2007 Microchip Technology Inc. PIC16F716 8.3.4 OPERATION IN SLEEP MODE In Sleep mode, the TMR2 register will not increment and the state of the module will not change. If the CCP1 pin is driving a value, it will continue to drive that value. When the device wakes up, TMR2 will continue from its previous state. 8.3.5 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. 8.3.6 8.3.7 The following steps should be taken when configuring the CCP module for PWM operation: 1. 2. 3. 4. 5. EFFECTS OF RESET Any Reset will force all ports to Input mode and the CCP registers to their Reset states. 6. © 2007 Microchip Technology Inc. SETUP FOR PWM OPERATION Disable the PWM pin (CCP1) output drivers by setting the associated TRIS bit. Set the PWM period by loading the PR2 register. Configure the CCP module for the PWM mode by loading the CCP1CON register with the appropriate values. Set the PWM duty cycle by loading the CCPR1L register and DC1B bits of the CCP1CON register. Configure and start Timer2: • Clear the TMR2IF interrupt flag bit of the PIR1 register. • Set the Timer2 prescale value by loading the T2CKPS bits of the T2CON register. • Enable Timer2 by setting the TMR2ON bit of the T2CON register. Enable PWM output after a new PWM cycle has started: • Wait until Timer2 overflows (TMR2IF bit of the PIR1 register is set). • Enable the CCP1 pin output driver by clearing the associated TRIS bit. DS41206B-page 55 PIC16F716 8.3.8 ENHANCED PWM AUTOSHUTDOWN MODE When a shutdown event occurs, two things happen: The ECCPASE bit is set to ‘1’. The ECCPASE will remain set until cleared in firmware or an auto-restart occurs (see Section 8.3.9 “Auto-Restart Mode”). The PWM mode supports an Auto-Shutdown mode that will disable the PWM outputs when an external shutdown event occurs. Auto-Shutdown mode places the PWM output pins into a predetermined state. This mode is used to help prevent the PWM from damaging the application. The enabled PWM pins are asynchronously placed in their shutdown states. The PWM output pins are grouped into pairs [P1A/P1C] and [P1B/P1D]. The state of each pin pair is determined by the PSSAC and PSSBD bits of the ECCPAS register. Each pin pair may be placed into one of three states: The auto-shutdown sources are selected using the ECCPASx bits of the ECCPAS register. A shutdown event may be generated by: • Drive logic ‘1’ • Drive logic ‘0’ • Tri-state (high-impedance) • A logic ‘0’ on the INT pin • Setting the ECCPASE bit in firmware A shutdown condition is indicated by the ECCPASE (Auto-Shutdown Event Status) bit of the ECCPAS register. If the bit is a ‘0’, the PWM pins are operating normally. If the bit is a ‘1’, the PWM outputs are in the shutdown state. Refer to Figure 8-5. FIGURE 8-5: AUTO-SHUTDOWN BLOCK DIAGRAM ECCPAS<2:0> PSSAC<0> P1A_DRV 111 1 0 110 PSSAC<1> 101 INT P1A TRISx 100 011 From Comparator C2 010 PSSBD<0> From Comparator C1 001 P1B_DRV 000 1 0 PRSEN PSSBD<1> From Data Bus Write to ECCPASE R S D Q P1B TRISx ECCPASE PSSAC<0> P1C_DRV 1 0 PSSAC<1> P1C TRISx PSSBD<0> P1D_DRV 1 0 PSSBD<1> TRISx DS41206B-page 56 P1D © 2007 Microchip Technology Inc. PIC16F716 REGISTER 8-2: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN CONTROL REGISTER R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ECCPASE ECCPAS2 — ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; ECCP outputs are in shutdown state 0 = ECCP outputs are operating bit 6 ECCPAS2: ECCP Auto-Shutdown bit 2 1 = RB0 (INT) pin low level (‘0’) causes shutdown 0 = RB0 (INT) pin has no effect on ECCP bit 5 Unimplemented: Read as ‘0’ bit 4 ECCPAS0: ECCP Auto-Shutdown bit ‘0’ 1 = RB4 pin low level (‘0’) causes shutdown 0 = RB4 pin has no effect on ECCP bit 3-2 PSSACn: Pins P1A and P1C Shutdown State Control bits 00 = Drive pins P1A and P1C to ‘0’ 01 = Drive pins P1A and P1C to ‘1’ 1x = Pins P1A and P1C tri-state bit 1-0 PSSBDn: Pins P1B and P1D Shutdown State Control bits 00 = Drive pins P1B and P1D to ‘0’ 01 = Drive pins P1B and P1D to ‘1’ 1x = Pins P1B and P1D tri-state Note 1: The auto-shutdown condition is a levelbased signal, not an edge-based signal. As long as the level is present, the autoshutdown will persist. 2: Writing to the ECCPASE bit is disabled while an auto-shutdown condition persists. 3: Once the auto-shutdown condition has been removed and the PWM restarted (either through firmware or auto-restart), the PWM signal will always restart at the beginning of the next PWM period. © 2007 Microchip Technology Inc. DS41206B-page 57 PIC16F716 FIGURE 8-6: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0) Shutdown Event ECCPASE bit PWM Activity PWM Period ECCPASE Cleared by Shutdown Shutdown Firmware PWM Event Occurs Event Clears Resumes Start of PWM Period 8.3.9 AUTO-RESTART MODE The Enhanced PWM can be configured to automatically restart the PWM signal once the auto-shutdown condition has been removed. Auto-restart is enabled by setting the PRSEN bit in the PWM1CON register. If auto-restart is enabled, the ECCPASE bit will remain set as long as the auto-shutdown condition is active. When the auto-shutdown condition is removed, the ECCPASE bit will be cleared via hardware and normal operation will resume. FIGURE 8-7: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1) Shutdown Event ECCPASE bit PWM Activity PWM Period Start of PWM Period DS41206B-page 58 Shutdown Shutdown Event Occurs Event Clears PWM Resumes © 2007 Microchip Technology Inc. PIC16F716 8.3.10 PROGRAMMABLE DEAD-BAND DELAY MODE FIGURE 8-8: In Half-Bridge applications where all power switches are modulated at the PWM frequency, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on, and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shootthrough current) will flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. Period Period Pulse Width P1A(2) td td P1B(2) (1) (1) (1) td = Dead-Band Delay Note 1: 2: In Half-Bridge mode, a digitally programmable deadband delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the non-active state to the active state. See Figure 8-8 for illustration. The lower seven bits of the associated PWM1CON register (Register 8-3) sets the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). FIGURE 8-9: EXAMPLE OF HALFBRIDGE PWM OUTPUT At this time, the TMR2 register is equal to the PR2 register. Output signals are shown as active-high. EXAMPLE OF HALF-BRIDGE APPLICATIONS V+ Standard Half-Bridge Circuit (“Push-Pull”) FET Driver + V - P1A Load FET Driver + V - P1B V- © 2007 Microchip Technology Inc. DS41206B-page 59 PIC16F716 REGISTER 8-3: PWM1CON: ENHANCED PWM CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM bit 6-0 PDC<6:0>: PWM Delay Count bits PDCn = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should transition active and the actual time it transitions active TABLE 8-6: Name REGISTERS ASSOCIATED WITH PWM Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx xxxx xxxx CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx xxxx xxxx 0000 0000 CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 ECCPAS ECCPASE ECCPAS2 — ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 00-0 0000 00-0 0000 INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- -000 1111 1111 1111 1111 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 0000 0000 PR2 PWM1CON Timer2 Period Register PRSEN PDC6 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR2 Timer2 Module’s Register 0000 0000 0000 0000 1111 1111 1111 1111 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM. DS41206B-page 60 © 2007 Microchip Technology Inc. PIC16F716 9.0 SPECIAL FEATURES OF THE CPU The PIC16F716 device has a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide power-saving operating modes and offer code protection. These are: • OSC Selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Sleep • Code protection • ID locations • In-Circuit Serial Programming™ (ICSP™) 9.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’) or left unprogrammed (read as ‘1’) to select various device configurations. These bits are mapped in program memory location 2007h. The user will note that address 2007h is beyond the user program memory space. In fact, it belongs to the special configuration memory space (2000h-3FFFh), which can be accessed only during programming. The PIC16F716 device has a Watchdog Timer, which can be shut off only through Configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay on power-up only and is designed to keep the part in Reset while the power supply stabilizes. With these two timers on-chip, most applications need no external Reset circuitry. Sleep mode is designed to offer a very low-current Power-Down mode. The user can wake-up from Sleep through external Reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost, while the LP crystal option saves power. A set of Configuration bits are used to select various options. © 2007 Microchip Technology Inc. DS41206B-page 61 PIC16F716 REGISTER 9-1: — CONFIG: CONFIGURATION WORD REGISTER — CP(2) — — — — — bit 15 bit 8 BOREN(1) BORV — — PWRTE WDTE FOSC1 FOSC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit P = Programmable’ U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘1’ bit 13 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 12-8 Unimplemented: Read as ‘1’ bit 7 BORV: Brown-out Reset Voltage bit 1 = VBOR set to 4.0V 0 = VBOR set to 2.5V bit 6 BOREN: Brown-out Reset Selection bits(1) 1 = BOR enabled 0 = BOR disabled bit 5-4 Unimplemented: Read as ‘1’ bit 3 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 2 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0 FOSC<2:0>: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator Note 1: 2: Enabling Brown-out Reset does not automatically enable Power-up Timer. The entire program memory will be erased when the code protection is turned off. DS41206B-page 62 © 2007 Microchip Technology Inc. PIC16F716 9.2 Oscillator Configurations 9.2.1 TABLE 9-1: Ranges Tested: OSCILLATOR TYPES The PIC16F716 can be operated in four different oscillator modes. The user can program two Configuration bits (FOSC1 and FOSC0) to select one of these four modes: • • • • LP – Low-power Crystal XT – Crystal/Resonator HS – High-speed Crystal/Resonator RC – Resistor/Capacitor 9.2.2 In XT, LP or HS modes, a crystal or ceramic resonator is connected to the OSC1/CLKIN and OSC2/CLKOUT pins to establish oscillation (Figure 9-1). The PIC16F716 oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1/CLKIN pin (Figure 9-2). CRYSTAL/CERAMIC RESONATOR OPERATION (HS, XT OR LP OSC CONFIGURATION) C1(1) OSC1 XTAL RF(3) OSC2 C2(1) Note 1: 2: 3: RS(2) Sleep To internal logic PIC16F716 See Table 9-1 and Table 9-2 for recommended values of C1 and C2. A series resistor (RS) may be required. RF varies with the crystal chosen. FIGURE 9-2: Mode XT HS Note 1: CRYSTAL OSCILLATOR/CERAMIC RESONATORS FIGURE 9-1: CERAMIC RESONATORS Freq LP XT HS Note 1: OSC2 (C2) 455 kHz 68-100 pF 68-100 pF 2.0 MHz 15-68 pF 15-68 pF 4.0 MHz 10-68 pF 10-68 pF 8.0 MHz 15-68 pF 15-68 pF 16.0 MHz 10-22 pF 10-22 pF These values are for design guidance only. See notes at bottom of page. TABLE 9-2: Osc Type OSC1 (C1) CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Crystal Freq Cap. Range C1 Cap. Range C2 15-33 pF 32 kHz 15-33 pF 200 kHz 5-10 pF 5-10 pF 200 kHz 47-68 pF 47-68 pF 1 MHz 15-33 pF 15-33 pF 4 MHz 15-33 pF 15-33 pF 4 MHz 15-33 pF 15-33 pF 8 MHz 15-33 pF 15-33 pF 20 MHz 15-33 pF 15-33 pF These values are for design guidance only. See notes at bottom of page. Note 1: Higher capacitance increases the stability of the oscillator, but also increases the start-up time. 2: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 3: RS may be required to avoid overdriving crystals with low drive level specification. 4: When using an external clock for the OSC1 input, loading of the OSC2 pin must be kept to a minimum by leaving the OSC2 pin unconnected. EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION) OSC1 Clock from ext. system PIC16F716 Open OSC2 © 2007 Microchip Technology Inc. DS41206B-page 63 PIC16F716 9.2.3 RC OSCILLATOR For timing insensitive applications, the “RC” device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. In addition to this, the oscillator frequency will vary from unit-to-unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 9-3 shows how the R/C combination is connected to the PIC16F716. FIGURE 9-3: RC OSCILLATOR MODE VDD REXT Internal clock OSC1 CEXT PIC16F716 VSS FOSC/4 A simplified block diagram of the On-chip Reset circuit is shown in Figure 9-5. The PIC® microcontrollers have an MCLR noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive the MCLR pin low. 9.4 Power-On Reset (POR) A Power-on Reset pulse is generated on-chip when VDD rise is detected. To take advantage of the POR, just tie the MCLR pin directly (or through a resistor) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified (parameter D004). For a slow rise time, see Figure 9-4. When the device starts normal operation (exits the Reset condition), device operating parameters (voltage, frequency, temperature,...) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. Brown-out Reset may be used to meet the start-up conditions. OSC2/CLKOUT FIGURE 9-4: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ (VDD ≥ 3.0V) 10 kΩ ≤ REXT ≤ 100 kΩ (VDD ≥ 3.0V) CEXT > 20 pF 9.3 VDD VDD R Reset R1 The PIC16F716 differentiates between various kinds of Reset: • • • • • • Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep WDT Reset (during normal operation) WDT Wake-up (during Sleep) Brown-out Reset (BOR) Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on Power-on Reset (POR), on the MCLR and WDT Reset, on MCLR Reset during Sleep and Brown-out Reset (BOR). They are not affected by a WDT Wake-up, which is viewed as the resumption of normal operation. The TO and PD bits are set or cleared differently in different Reset situations as indicated in Table 9-4. These bits are used in software to determine the nature of the Reset. See Table 9-6 for a full description of Reset states of all registers. DS41206B-page 64 C Note 1: 2: 3: MCLR PIC16F716 External Power-on Reset circuit is required only if VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. R < 40 kΩ is recommended to make sure that voltage drop across R does not violate the device’s electrical specification. R1 = 100Ω to 1 kΩ will limit any current flowing into MCLR from external capacitor C in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). © 2007 Microchip Technology Inc. PIC16F716 9.5 Power-up Timer (PWRT) The Power-up Timer provides a fixed nominal time-out, on power-up only, from the POR. The Power-up Timer operates on an internal RC oscillator. The chip is kept in Reset as long as the PWRT is active. The PWRT’s time delay allows VDD to rise to an acceptable level. The power-up timer enable Configuration bit, PWRTE, is provided to enable/disable the PWRT. The power-up time delay will vary from chip-to-chip due to VDD, temperature and process variation. See AC parameters for details. 9.6 Oscillator Start-up Timer (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. See AC parameters for details. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from Sleep. 9.7 Programmable Brown-Out Reset (PBOR) The PIC16F716 has on-chip Brown-out Reset circuitry. A Configuration bit, BOREN, can disable (if clear/programmed) or enable (if set) the Brown-out Reset circuitry. The BORV Configuration bit selects the programmable Brown-out Reset threshold voltage (VBOR). When BORV is 1, VBOR IS 4.0V. When BORV is 0, VBOR is 2.5V A Brown-out Reset occurs when VDD falls below VBOR for a time greater than parameter TBOR (see Table 12-4). A Brown-out Reset is not guaranteed to occur if VDD falls below VBOR for less than parameter TBOR. On any Reset (Power-on, Brown-out, Watchdog, etc.) the chip will remain in Reset until VDD rises above VBOR. The Power-up Timer will be invoked and will keep the chip in Reset an additional 72 ms only if the Power-up Timer enable bit in the Configuration register is set to 0 (PWRTE = 0). If the Power-up Timer is enabled and VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be re-initialized. Once VDD rises above VBOR, the Power-up Timer will execute a 72 ms Reset. See Figure 9-6. For operations where the desired brown-out voltage is other than 4.0V or 2.5V, an external brown-out circuit must be used. Figure 9-8, Figure 9-9 and Figure 9-10 show examples of external Brown-out Protection circuits. © 2007 Microchip Technology Inc. DS41206B-page 65 PIC16F716 FIGURE 9-5: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR WDT Module Sleep WDT Time-out Reset VDD rise detect Power-on Reset VDD Brown-out Reset S BOREN OST/PWRT OST Chip_Reset R 10-bit Ripple counter Q OSC1 (1) On-chip RC OSC PWRT 10-bit Ripple counter PWRTE See Table 9-3 for time-out situations. Enable OST Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin. BROWN-OUT SITUATIONS (PWRTE = 0) FIGURE 9-6: VDD Internal Reset VBOR 72 ms VDD Internal Reset VBOR <72 ms 72 ms VDD Internal Reset DS41206B-page 66 VBOR 72 ms © 2007 Microchip Technology Inc. PIC16F716 FIGURE 9-7: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 1 VDD FIGURE 9-9: VDD VDD 33k MCP809 Q1 10k MCLR 40k EXTERNAL BROWN-OUT PROTECTION CIRCUIT 3 Vss VDD VDD RST PIC16F716 bypass capacitor MCLR PIC16F716 Note 1: This circuit will activate Reset when VDD goes below (Vz + 0.7V) where Vz = Zener voltage. 2: Internal Brown-out Reset circuitry should be disabled when using this circuit. FIGURE 9-8: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 2 VDD Note 1: This brown-out protection circuit employs Microchip Technology’s MCP809 microcontroller supervisor. The MCP8XX and MCP1XX families of supervisors provide push-pull and open collector outputs with both high and low active Reset pins. There are 7 different trip point selections to accommodate 5V and 3V systems. VDD R1 Q1 MCLR R2 40k PIC16F716 Note 1: This brown-out circuit is less expensive, albeit less accurate. Transistor Q1 turns off when VDD is below a certain level such that: VDD x R1 R1 + R2 = 0.7 V 2: Internal Brown-out Reset should be disabled when using this circuit. 3: Resistors should be adjusted for the characteristics of the transistor. © 2007 Microchip Technology Inc. DS41206B-page 67 PIC16F716 9.8 Time-out Sequence 9.9 On power-up, the time-out sequence is as follows: First PWRT time-out is invoked after the POR time delay has expired. Then OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. For example, in RC mode with the PWRT disabled, there will be no time-out at all. Figure 9-10, Figure 9-11, and Figure 9-12 depict time-out sequences on power-up. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then bringing MCLR high will begin execution immediately (Figure 9-12). This is useful for testing purposes or to synchronize more than one PIC16F716 device operating in parallel. Table 9-5 shows the Reset conditions for some Special Function Registers, while Table 9-6 shows the Reset conditions for all the registers. TABLE 9-3: The Power Control/STATUS Register, PCON has two bits. Bit 0 is the Brown-out Reset Status bit, BOR. If the BOREN Configuration bit is set, BOR is ‘1’ on Power-on Reset and reset to ‘0’ when a Brown-out condition occurs. BOR must then be set by the user and checked on subsequent resets to see if it is clear, indicating that another Brown-out has occurred. If the BOREN Configuration bit is clear, BOR is unknown on Power-on Reset. Bit 1 is POR (Power-on Reset Status bit). It is cleared on a Power-on Reset and unaffected otherwise. The user must set this bit following a Power-on Reset. TIME-OUT IN VARIOUS SITUATIONS Power-up or Brown-out Oscillator Configuration XT, HS, LP Wake-up from Sleep PWRTE = 0 PWRTE = 1 72 ms + 1024 TOSC 1024 TOSC 1024 TOSC 72 ms — — RC TABLE 9-4: Power Control/STATUS Register (PCON) STATUS BITS AND THEIR SIGNIFICANCE POR BOR TO PD 0 x 1 1 Power-on Reset (BOREN = 0) 0 1 1 1 Power-on Reset (BOREN = 1) 0 x 0 x Illegal, TO is set on POR 0 x x 0 Illegal, PD is set on POR 1 0 1 1 Brown-out Reset 1 1 0 1 WDT Reset 1 1 0 0 WDT Wake-up 1 1 u u MCLR Reset during normal operation 1 1 1 0 MCLR Reset during Sleep or interrupt wake-up from Sleep DS41206B-page 68 © 2007 Microchip Technology Inc. PIC16F716 TABLE 9-5: RESET CONDITION FOR SPECIAL REGISTERS Program Counter STATUS Register PCON Register Power-on Reset (BOREN = 0) 000h 0001 1xxx ---- --0x Power-on Reset (BOREN = 1) 000h 0001 1xxx ---- --01 MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during Sleep 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 1uuu ---- --uu PC + 1 uuu0 0uuu ---- --uu Condition WDT Wake-up Brown-out Reset Interrupt wake-up from Sleep 000h 0001 1uuu ---- --u0 PC + 1(1) uuu1 0uuu ---- --uu Legend: u = unchanged, x = unknown, - = unimplemented bit read as ‘0’. Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). © 2007 Microchip Technology Inc. DS41206B-page 69 PIC16F716 TABLE 9-6: Register W INITIALIZATION CONDITIONS FOR ALL REGISTERS OF THE PIC16F716 Power-on Reset, Brown-out Reset MCLR Resets WDT Reset Wake-up via WDT or Interrupt xxxx xxxx uuuu uuuu uuuu uuuu INDF N/A N/A N/A TMR0 xxxx xxxx uuuu uuuu uuuu uuuu 0000h 0000h PC + 1(2) PCL (3) uuuq quuu(3) STATUS 0001 1xxx FSR xxxx xxxx uuuu uuuu uuuu uuuu PORTA(4), (5), (6) --xx 0000 --xx 0000 --uu uuuu PORTB(4), (5) xxxx xxxx uuuu uuuu uuuu uuuu PCLATH ---0 0000 ---0 0000 ---u uuuu INTCON 0000 -00x 0000 -00u uuuu -uuu(1) PIR1 -0-- -000 -0-- -000 -u-- -uuu(1) TMR1L xxxx xxxx uuuu uuuu uuuu uuuu TMR1H xxxx xxxx uuuu uuuu uuuu uuuu T1CON --00 0000 --uu uuuu --uu uuuu TMR2 0000 0000 0000 0000 uuuu uuuu T2CON -000 0000 -000 0000 -uuu uuuu CCPR1L xxxx xxxx uuuu uuuu uuuu uuuu CCPR1H xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 0000 0000 0000 0000 uuuu uuuu PWM1CON 0000 0000 0000 0000 uuuu uuuu ECCPAS 00-0 0000 00-0 0000 u-uu uuuu ADRES xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 0000 0000 0000 0000 uuuu uuuu OPTION_REG 1111 1111 1111 1111 uuuu uuuu TRISA --11 1111 --11 1111 --uu uuuu TRISB 1111 1111 1111 1111 uuuu uuuu PIE1 -0-- -000 -0-- -000 -u-- -uuu PCON ---- --qq ---- --uu ---- --uu PR2 1111 1111 1111 1111 uuuu uuuu ADCON1 ---- -000 ---- -000 ---- -uuu 000q quuu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition Note 1: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 3: See Table 9-5 for Reset value for specific condition. 4: On any device Reset, these pins are configured as inputs. 5: This is the value that will be in the port output latch. 6: Output latches are unknown or unchanged. Analog inputs default to analog and read ‘0’. DS41206B-page 70 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 9-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 9-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 9-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET © 2007 Microchip Technology Inc. DS41206B-page 71 PIC16F716 9.10 Interrupts The peripheral interrupt flags are contained in the Special Function Registers, PIR1 and PIR2. The corresponding interrupt enable bits are contained in Special Function Registers, PIE1 and PIE2, and the peripheral interrupt enable bit is contained in Special Function Register, INTCON. The PIC16F716 devices have up to 7 sources of interrupt. The Interrupt Control Register (INTCON) records individual interrupt requests in flag bits. It also has individual and global interrupt enable bits. Note: Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit. When an interrupt is responded to, the GIE bit is cleared to disable any further interrupt, the return address is pushed onto the stack and the PC is loaded with 0004h. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid recursive interrupts. A Global Interrupt Enable bit, GIE of the INTCON register enables all un-masked interrupts when set, or disables all interrupts when cleared. When bit GIE is enabled, and an interrupt’s flag bit and mask bit are set, the interrupt will vector immediately. Individual interrupts can be disabled through their corresponding enable bits in various registers. Individual interrupt bits are set, regardless of the status of the GIE bit. The GIE bit is cleared on Reset and when an interrupt vector occurs. For external interrupt events, such as the INT pin or PORTB change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends when the interrupt event occurs. The latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. The “return-from-interrupt” instruction, RETFIE, exits the interrupt routine, as well as sets the GIE bit, which re-enables interrupts. The RB0/INT pin interrupt, the RB port change interrupt and the TMR0 overflow interrupt flags are contained in the INTCON register. FIGURE 9-13: INTERRUPT LOGIC T0IF T0IE INTF INTE ADIF ADIE CCP1IF CCP1IE Wake-up (If in Sleep mode) Interrupt to CPU RBIF RBIE PEIE GIE TMR2IF TMR2IE TMR1IF TMR1IE DS41206B-page 72 © 2007 Microchip Technology Inc. PIC16F716 9.10.1 9.11 INT INTERRUPT External interrupt on RB0/INT pin is edge triggered, either rising if bit INTEDG of the OPTION register is set, or falling if the INTEDG bit is clear. When a valid edge appears on the RB0/INT pin, flag bit INTF of the INTCON register is set. This interrupt can be disabled by clearing enable bit INTE of the INTCON register. Flag bit INTF must be cleared in software in the Interrupt Service Routine before re-enabling this interrupt. The INT interrupt can wake-up the processor from Sleep, if bit INTE was set prior to going into Sleep. The status of global interrupt enable bit GIE decides whether or not the processor branches to the interrupt vector following wake-up. See Section 9.13 “Power-down Mode (Sleep)” for details on Sleep mode. 9.10.2 TMR0 INTERRUPT An overflow (FFh → 00h) in the TMR0 register will set flag bit T0IF of the INTCON register. The interrupt can be enabled/disabled by setting/clearing enable bit T0IE of the INTCON register. (Section 4.0 “Timer0 Module”). 9.10.3 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt, (i.e., W register and STATUS register). This will have to be implemented in firmware. Example 9-1 stores and restores the W, STATUS, PCLATH and FSR registers. Context storage registers, W_TEMP, STATUS_TEMP, PCLATH_TEMP and FSR_TEMP, must be defined in Common RAM which are those addresses between 70h-7Fh in Bank 0 and between F0h-FFh in Bank 1. The example: a) b) c) d) e) f) Stores the W register. Stores the STATUS register in Bank 0. Stores the PCLATH register. Stores the FSR register. Executes the Interrupt Service Routine code (User-generated). Restores all saved registers in reverse order from which they were stored. PORTB INTCON CHANGE An input change on PORTB<7:4> sets flag bit RBIF of the INTCON register. The interrupt can be enabled/disabled by setting/clearing enable bit RBIE of the INTCON register. (Section 3.2 “PORTB and the TRISB Register”). EXAMPLE 9-1: MOVWF SWAPF MOVWF MOVF MOVWF CLRF BCF MOVF MOVWF : :(ISR) : MOVF MOVWF MOVF MOVWF SWAPF MOVWF SWAPF SWAPF RETFIE SAVING STATUS, W, AND PCLATH REGISTERS IN RAM W_TEMP STATUS,W STATUS_TEMP PCLATH, W PCLATH_TEMP PCLATH STATUS, IRP FSR, W FSR_TEMP ;Copy W to TEMP register, could be bank one or zero ;Swap status to be saved into W ;Save status to bank zero STATUS_TEMP register ;Only required if using pages 1, 2 and/or 3 ;Save PCLATH into W ;Page zero, regardless of current page ;Return to Bank 0 ;Copy FSR to W ;Copy FSR from W to FSR_TEMP FSR_TEMP,W FSR PCLATH_TEMP, W PCLATH STATUS_TEMP,W STATUS W_TEMP,F W_TEMP,W ;Restore FSR ;Move W into FSR ;Restore PCLATH ;Move W into PCLATH ;Swap STATUS_TEMP register into W ;Move W into STATUS register ;Swap W_TEMP ;Swap W_TEMP into W ;Return from interrupt and enable GIE © 2007 Microchip Technology Inc. DS41206B-page 73 PIC16F716 9.12 Watchdog Timer (WDT) WDT time-out period values may be found in the Electrical Specifications section under TWDT (parameter #31). Values for the WDT prescaler (actually a postscaler, but shared with the Timer0 prescaler) may be assigned using the OPTION register. The Watchdog Timer is a free running, on-chip, RC oscillator which does not require any external components. This RC oscillator is separate from the RC oscillator of the OSC1/CLKIN pin. That means that the WDT will run, even if the clock on the OSC1/CLKIN and OSC2/CLKOUT pins of the device have been stopped, for example, by execution of a SLEEP instruction. During normal operation, a WDT time-out generates a device Reset (Watchdog Timer Reset). If the device is in Sleep mode, a WDT time-out causes the device to wake-up and continue with normal operation (Watchdog Timer Wake-up). The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. Note: The CLRWDT and SLEEP instructions clear the WDT and the postscaler, if assigned to the WDT, and prevent it from timing out and generating a device Reset condition. Note: When a CLRWDT instruction is executed and the prescaler is assigned to the WDT, the prescaler count will be cleared, but the prescaler assignment is not changed. . The WDT can be permanently disabled by clearing Configuration bit WDTE (Section 9.1 “Configuration Bits”). FIGURE 9-14: WATCHDOG TIMER BLOCK DIAGRAM From TMR0 Clock Source (Figure 4-1) 0 1 WDT Timer Postscaler M U X 8 8-to-1 MUX PS2:PS0 PSA WDT Enable Bit To TMR0 (Figure 4-1) 0 1 MUX PSA WDT Time-out Note: PSA and PS2:PS0 are bits in the OPTION register. TABLE 9-7: Name SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CONFIG1(1) BORV BOREN — — PWRTE WDTE FOSC1 FOSC0 — — OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 Legend: Note 1: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used the Watchdog Timer. See Configuration Word Register (Register 9-1) for operation of all register bits. DS41206B-page 74 © 2007 Microchip Technology Inc. PIC16F716 9.13 Power-down Mode (Sleep) Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the PD bit of the STATUS register is cleared, the TO of the STATUS register bit is set, and the oscillator driver is turned off. The I/O ports maintain the status they had, before the SLEEP instruction was executed (driving high, low or high-impedance). The following peripheral interrupts can wake the device from Sleep: 1. 2. 3. TMR1 interrupt. Timer1 must be operating as an asynchronous counter. ECCP capture mode interrupt. ADC running in ADRC mode. Other peripherals cannot generate interrupts, since during Sleep, no on-chip clocks are present. The MCLR pin must be at a logic high level (parameter D042). When the SLEEP instruction is being executed, the next instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction and then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. 9.13.1 9.13.2 For lowest current consumption in this mode, place all I/O pins at either VDD or VSS, ensure no external circuitry is drawing current from the I/O pin, power-down the A/D and the disable external clocks. Pull all I/O pins that are high-impedance inputs, high or low externally, to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on PORTB should be considered. WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. 2. 3. External Reset input on MCLR pin. Watchdog Timer Wake-up (if WDT was enabled). Interrupt from INT pin, RB port change or some peripheral interrupts. External MCLR Reset will cause a device Reset. All other events are considered a continuation of program execution and cause a “wake-up”. The TO and PD bits in the STATUS register can be used to determine the cause of device Reset. The PD bit, which is set on power-up, is cleared when Sleep is invoked. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction, the SLEEP instruction will complete as a NOP. Therefore, the WDT and WDT postscaler will not be cleared, the TO bit will not be set and PD bits will not be cleared. • If the interrupt occurs during or after the execution of a SLEEP instruction, the device will immediately wake-up from Sleep. The SLEEP instruction will be completely executed before the wake-up. Therefore, the WDT and WDT postscaler will be cleared, the TO bit will be set and the PD bit will be cleared. Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. To ensure that the WDT is cleared, a CLRWDT instruction should be executed before a SLEEP instruction. © 2007 Microchip Technology Inc. DS41206B-page 75 PIC16F716 FIGURE 9-15: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 TOST(2) CLKOUT(4) INT pin INTF flag (INTCON Reg.) Interrupt Latency (Note 3) GIE bit (INTCON Reg.) Processor in Sleep INSTRUCTION FLOW PC PC Instruction fetched Inst(PC) = Sleep Instruction executed Inst(PC - 1) Note 9.14 1: 2: 3: 4: PC+1 PC+2 Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Dummy cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) XT, HS or LP Oscillator mode assumed. TOST = 1024TOSC (drawing not to scale). This delay will not be there for RC Osc mode. GIE = 1 assumed. In this case after wake- up, the processor jumps to the interrupt routine. If GIE = 0, execution will continue in-line. CLKOUT is not available in these osc modes, but shown here for timing reference. Program Verification/Code Protection If the code protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. 9.15 PC+2 Inst(PC + 1) ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code-identification numbers. These locations are not accessible during normal execution, but are readable and writable during program/verify. It is recommended that only the 4 Least Significant bits of the ID location are used. DS41206B-page 76 9.16 In-Circuit Serial Programming™ PIC16F716 microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. For complete details on serial programming, please refer to the In-Circuit Serial Programming™ (ICSP™) Specification, (DS40245). © 2007 Microchip Technology Inc. PIC16F716 10.0 INSTRUCTION SET SUMMARY The PIC16F716 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 14-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 10-1, while the various opcode fields are summarized in Table 10-1. Table 10-2 lists the instructions recognized by the MPASMTM assembler. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator, which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution time of 1 μs. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. 10.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTA, clear all the data bits, then write the result back to PORTA. This example would have the unintended consequence of clearing the condition that set the RAIF flag. © 2007 Microchip Technology Inc. TABLE 10-1: OPCODE FIELD DESCRIPTIONS Field Description Register file address (0x00 to 0x7F) f W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-out bit Carry bit C DC Digit carry bit Zero bit Z PD Power-down bit FIGURE 10-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value DS41206B-page 77 PIC16F716 TABLE 10-2: PIC16F716 INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 C, DC, Z Z Z Z Z Z Z Z Z C C C, DC, Z Z 1, 2 1, 2 2 1, 2 1, 2 1, 2, 3 1, 2 1, 2, 3 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS 1 1 1 (2) 1 (2) 01 01 01 01 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW Note 1: 2: 3: k k k – k k k – k – – k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 C, DC, Z Z TO, PD Z TO, PD C, DC, Z Z When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS41206B-page 78 © 2007 Microchip Technology Inc. PIC16F716 10.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW BCF k Operands: 0 ≤ k ≤ 255 Operation: (W) + k → (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f Syntax: [ label ] ADDWF f,d Bit Clear f Syntax: [ label ] BCF Operands: 0 ≤ f ≤ 127 0≤b≤7 Operation: 0 → (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF 0 ≤ f ≤ 127 0≤b≤7 f,b f,b Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: Operation: (W) + (f) → (destination) Operation: 1 → (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: Bit ‘b’ in register ‘f’ is set. ANDLW AND literal with W BTFSC Syntax: [ label ] ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .AND. (k) → (W) Status Affected: Z Description: The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. ANDWF AND W with f Syntax: [ label ] ANDWF Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (W) .AND. (f) → (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. © 2007 Microchip Technology Inc. Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0 ≤ f ≤ 127 0≤b≤7 Operation: skip if (f<b>) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a two-cycle instruction. f,d DS41206B-page 79 PIC16F716 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0 ≤ f ≤ 127 0≤b<7 Operands: None Operation: Operation: skip if (f<b>) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. 00h → WDT 0 → WDT prescaler, 1 → TO 1 → PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. CALL Call Subroutine COMF Complement f Syntax: [ label ] CALL k Syntax: [ label ] COMF Operands: 0 ≤ k ≤ 2047 Operands: Operation: (PC)+ 1→ TOS, k → PC<10:0>, (PCLATH<4:3>) → PC<12:11> 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) → (destination) Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECF Decrement f Syntax: [ label ] DECF f,d f,d Status Affected: None Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF Operands: 0 ≤ f ≤ 127 Operands: Operation: 00h → (f) 1→Z 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) - 1 → (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h → (W) 1→Z f Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. DS41206B-page 80 © 2007 Microchip Technology Inc. PIC16F716 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) - 1 → (destination); skip if result = 0 Operation: (f) + 1 → (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a NOP is executed instead, making it a two-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, a NOP is executed instead, making it a two-cycle instruction. GOTO Unconditional Branch IORLW Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ k ≤ 2047 Operands: 0 ≤ k ≤ 255 Operation: k → PC<10:0> PCLATH<4:3> → PC<12:11> Operation: (W) .OR. k → (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) + 1 → (destination) Operation: (W) .OR. (f) → (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. GOTO k INCF f,d © 2007 Microchip Technology Inc. INCFSZ f,d Inclusive OR literal with W IORLW k IORWF f,d DS41206B-page 81 PIC16F716 MOVWF Move W to f Syntax: [ label ] MOVF Move f Syntax: [ label ] Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: 0 ≤ f ≤ 127 Operation: (W) → (f) Operation: (f) → (dest) Status Affected: None Status Affected: Z Description: Description: The contents of register f is moved to a destination dependent upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Move data from W register to register ‘f’. Words: 1 Cycles: 1 Words: 1 Cycles: 1 Example: MOVF f,d MOVF Example: MOVW F MOVWF OPTION Before Instruction OPTION = W = After Instruction OPTION = W = FSR, 0 f 0xFF 0x4F 0x4F 0x4F After Instruction W = value in FSR register Z = 1 MOVLW Move literal to W NOP No Operation Syntax: [ label ] Syntax: [ label ] Operands: 0 ≤ k ≤ 255 Operands: None Operation: k → (W) Operation: No operation Status Affected: None Status Affected: None Description: The eight-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as ‘0’s. Description: No operation. Words: 1 Cycles: 1 Words: 1 Cycles: 1 Example: MOVLW k Example: MOVLW NOP 0x5A After Instruction W = DS41206B-page 82 NOP 0x5A © 2007 Microchip Technology Inc. PIC16F716 RETFIE Return from Interrupt RETLW Return with literal in W Syntax: [ label ] Syntax: [ label ] RETFIE RETLW k Operands: None Operands: 0 ≤ k ≤ 255 Operation: TOS → PC, 1 → GIE Operation: k → (W); TOS → PC Status Affected: None Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Description: The W register is loaded with the eight bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Words: 1 Cycles: 2 Example: Example: RETFIE After Interrupt PC = GIE = TABLE TOS 1 CALL TABLE;W contains table ;offset value • ;W now has table value • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ; End of table Before Instruction W = 0x07 After Instruction W = value of k8 © 2007 Microchip Technology Inc. RETURN Return from Subroutine Syntax: [ label ] Operands: None Operation: TOS → PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. RETURN DS41206B-page 83 PIC16F716 RLF Rotate Left f through Carry SLEEP Enter Sleep mode Syntax: [ label ] Syntax: [ label ] SLEEP Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: None Operation: Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 00h → WDT, 0 → WDT prescaler, 1 → TO, 0 → PD RLF f,d C Words: 1 Cycles: 1 Example: Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Register f RLF REG1,0 Before Instruction REG1 C = = 1110 0110 0 = = = 1110 0110 1100 1100 1 After Instruction REG1 W C RRF Rotate Right f through Carry SUBLW Subtract W from literal Syntax: [ label ] Syntax: [ label ] SUBLW k Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: 0 ≤ k ≤ 255 Operation: k - (W) → (W) Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. RRF f,d C DS41206B-page 84 Register f The W register is subtracted (2’s complement method) from the eight-bit literal ‘k’. The result is placed in the W register. C=0 W>k C=1 W≤k DC = 0 W<3:0> > k<3:0> DC = 1 W<3:0> ≤ k<3:0> © 2007 Microchip Technology Inc. PIC16F716 SUBWF Subtract W from f XORLW Exclusive OR literal with W Syntax: [ label ] SUBWF f,d Syntax: [ label ] XORLW k Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: 0 ≤ k ≤ 255 Operation: (f) - (W) → (destination) Status Affected: C, DC, Z Description: SWAPF Operation: (W) .XOR. k → (W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f. C=0 W>f C=1 W≤f DC = 0 W<3:0> > f<3:0> DC = 1 W<3:0> ≤ f<3:0> Swap Nibbles in f XORWF Exclusive OR W with f Syntax: [ label ] SWAPF f,d Syntax: [ label ] XORWF Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f<3:0>) → (destination<7:4>), (f<7:4>) → (destination<3:0>) Operation: (W) .XOR. (f) → (destination) Status Affected: Z Status Affected: None Description: Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. © 2007 Microchip Technology Inc. f,d DS41206B-page 85 PIC16F716 NOTES: DS41206B-page 86 © 2007 Microchip Technology Inc. PIC16F716 11.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 11.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. © 2007 Microchip Technology Inc. DS41206B-page 87 PIC16F716 11.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 11.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 11.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. 11.5 MPLAB ASM30 Assembler, Linker and Librarian MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 11.6 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction DS41206B-page 88 © 2007 Microchip Technology Inc. PIC16F716 11.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 11.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC® and MCU devices. It debugs and programs PIC® and dsPIC® Flash microcontrollers with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high speed, noise tolerant, lowvoltage differential signal (LVDS) interconnection (CAT5). 11.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 11.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. © 2007 Microchip Technology Inc. DS41206B-page 89 PIC16F716 11.11 PICSTART Plus Development Programmer 11.13 Demonstration, Development and Evaluation Boards The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. 11.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. DS41206B-page 90 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart® battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) and the latest “Product Selector Guide” (DS00148) for the complete list of demonstration, development and evaluation kits. © 2007 Microchip Technology Inc. PIC16F716 12.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias......................................................................................................... .-55°C to +125°C Storage temperature ........................................................................................................................... -65°C to +150°C Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4) ....................................... -0.3V to (VDD +0.3V) Voltage on VDD with respect to VSS ...................................................................................................... -0.3V to +7.5V Voltage on MCLR with respect to VSS (Note 2) ...................................................................................... 0V to +13.25V Voltage on RA4 with respect to Vss ............................................................................................................ 0V to +8.5V Total power dissipation (Note 1) (PDIP and SOIC)................................................................................................ 1.0W Total power dissipation (Note 1) (SSOP) ............................................................................................................. 0.65W Maximum current out of VSS pin ........................................................................................................................ 300 mA Maximum current into VDD pin ........................................................................................................................... 250 mA Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ...........................................................................................................±20 mA Maximum output current sunk by any I/O pin....................................................................................................... 25 mA Maximum output current sourced by any I/O pin ................................................................................................. 25 mA Maximum current sunk by PORTA and PORTB (combined).............................................................................. 200 mA Maximum current sourced by PORTA and PORTB (combined) ........................................................................ 200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL) 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin rather than pulling this pin directly to VSS. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. © 2007 Microchip Technology Inc. DS41206B-page 91 PIC16F716 PIC16F716 VOLTAGE-FREQUENCY GRAPH, -40°C < TA < +85°C(1) FIGURE 12-1: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. PIC16F716 VOLTAGE-FREQUENCY GRAPH, 85°C < TA < +125°C(1) FIGURE 12-2: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. DS41206B-page 92 © 2007 Microchip Technology Inc. PIC16F716 12.1 DC Characteristics: PIC16F716 (Industrial, Extended) DC CHARACTERISTICS Param No. Sym VDD Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Min Typ† Max Units 2.0 3.0 — — 5.5 5.5 V V — 1.5* — V V Conditions Supply Voltage D001 D001A RAM Data Retention Voltage(1) Industrial Extended D002* VDR D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — Vss — D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — D005 VBOR Brown-out Reset voltage trip point 3.65 4.0 4.35 V BOREN bit set, BOR bit = ‘1’ 2.2 2.5 2.7 V BOREN bit set, BOR bit = ‘0’ See section on Power-on Reset for details V/ms PWRT enabled (PWRTE bit clear) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered without losing RAM data. © 2007 Microchip Technology Inc. DS41206B-page 93 PIC16F716 12.2 DC Characteristics: PIC16F716 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C DC CHARACTERISTICS Param No. Sym VDD Characteristic 2.0 — Max Units VDD Conditions 5.5 V — Supply Current D010 D011 D012 D013 IPD Typ† Supply Voltage D001 IDD Min — 14 17 μA 2.0 — 23 28 μA 3.0 — 45 63.7 μA 5.0 — 120 160 μA 2.0 — 180 250 μA 3.0 — 290 370 μA 5.0 — 220 300 μA 2.0 — 350 470 μA 3.0 — 600 780 μA 5.0 — 2.1 2.9 mA 4.5 — 2.5 3.3 mA 5.0 — 0.1 0.8 μA 2.0 — 0.1 0.85 μA 3.0 — 0.2 2.7 μA 5.0 — 1 2.0 μA 2.0 — 2 3.5 μA 3.0 — 9 13.5 μA 5.0 — 37 50 μA 3.0 — 40 55 μA 4.5 — 45 60 μA 5.0 — 1.8 6 μA 2.0 — 2.6 7.5 μA 3.0 — 3.0 9 μA 5.0 FOSC = 32 kHz LP Oscillator mode FOSC = 1 MHz XT Oscillator mode FOSC = 4 MHz XT Oscillator mode FOSC = 20 MHz HS Oscillator mode Power-down Base Current D020 WDT, BOR and T1OSC: disabled (1) Peripheral Module Current D021 D022 D025 WDT Current BOR Current T1OSC Current † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral “Δ” current can be determined by subtracting the base IDD or IPD current from this limit. DS41206B-page 94 © 2007 Microchip Technology Inc. PIC16F716 12.3 DC Characteristics: PIC16F716 (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C DC CHARACTERISTICS Param No. Sym VDD Characteristic Min 3.0 Conditions — 5.5 V — Supply Current D010E D011E D012E D013E IPD VDD Supply Voltage D001 IDD Typ† Max Units — 21 28 μA 3.0 — 38 63.7 μA 5.0 — 182 250 μA 3.0 — 293 370 μA 5.0 — 371 470 μA 3.0 — 668 780 μA 5.0 — 2.6 2.9 mA 4.5 — 3 3.3 mA 5.0 FOSC = 20 MHz HS Oscillator mode — 0.1 11 μA 3.0 WDT, BOR and T1OSC: disabled — 0.2 15 μA 5.0 — 2 19 μA 3.0 — 9 22 μA 5.0 — 37 60 μA 3.0 — 40 71 μA 4.5 — 45 76 μA 5.0 — 2.6 20 μA 3.0 — 3.0 25 μA 5.0 FOSC = 32 kHz LP Oscillator mode FOSC = 1 MHz XT Oscillator mode FOSC = 4 MHz XT Oscillator mode Power-down Base Current D020E (1) Peripheral Module Current D021E D022E D025E WDT Current BOR Current T1OSC Current † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral “Δ” current can be determined by subtracting the base IDD or IPD current from this limit. © 2007 Microchip Technology Inc. DS41206B-page 95 PIC16F716 12.4 DC Characteristics: PIC16F716 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Operating voltage VDD range as described in DC spec Section 12.1 “DC Characteristics: PIC16F716 (Industrial, Extended)” and Section 12.4 “DC Characteristics: PIC16F716 (Industrial, Extended)”. DC CHARACTERISTICS Param No. Sym VIL D030 D030A D031 D032 D033 VIH D040 D040A Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, OSC1 (in RC mode) OSC1 (in HS mode) OSC1 (in XT and LP modes) Input High Voltage I/O ports with TTL buffer Min Typ† Max Units VSS VSS VSS VSS VSS VSS — — — — — — 0.8 0.15 VDD 0.2 VDD 0.2 VDD 0.3 VDD 0.6 V V V V V V — — — VDD VDD V V 4.5V ≤ VDD ≤ 5.5V otherwise — — — — VDD VDD VDD VDD V V V V For entire VDD range D041 D042 D042A D043 with Schmitt Trigger buffer MCLR OSC1 (XT, HS and LP modes) OSC1 (in RC mode) 2.0 0.25 VDD + 0.8V 0.8 VDD 0.8 VDD 0.7 VDD 0.9 VDD D060 Input Leakage Current(2), (3) I/O ports — — ±1 μA — — ±500 nA MCLR, RA4/T0CKI OSC1/CLKIN — — — — ±5 ±5 μA μA PORTB weak pull-up current Output Low Voltage I/O ports 50 250 400 μA — — 0.6 V — — 0.6 V — — 0.6 V — — 0.6 V VDD-0.7 — — V VDD-0.7 — — V VDD-0.7 — — V VDD-0.7 — — V IIL D061 D063 D070 IPURB D080 VOL D083 OSC2/CLKOUT (RC Osc mode) Conditions 4.5V ≤ VDD ≤ 5.5V otherwise (Note1) (Note1) Vss ≤ VPIN ≤ VDD, Pin at high-impedance Vss ≤ VPIN ≤ VDD, Pin configured as analog input Vss ≤ VPIN ≤ VDD Vss ≤ VPIN ≤ VDD, XT, HS and LP osc modes VDD = 5V, VPIN = VSS IOL = 8.5 mA, VDD = 4.5V, -40°C to +85°C IOL = 7.0 mA, VDD = 4.5V, -40°C to +125°C IOL = 1.6 mA, VDD = 4.5V, -40°C to +85°C IOL = 1.2 mA, VDD = 4.5V, -40°C to +125°C Output High Voltage D090 VOH D092 I/O ports(3) OSC2/CLKOUT (RC Osc mode) D150* VOD — — 8.5 V D100 Capacitive Loading Specs on Output Pins COSC2 OSC2/CLKOUT pin — — 15 pF D101 Note Open-Drain High Voltage IOH = -3.0 mA, VDD = 4.5V, -40°C to +85°C IOH = -2.5 mA, VDD = 4.5V, -40°C to +125°C IOH = -1.3 mA, VDD = 4.5V, -40°C to +85°C IOH = -1.0 mA, VDD = 4.5V, -40°C to +125°C RA4 pin In XT, HS and LP modes when external clock is used to drive OSC1. CIO All I/O pins and OSC2 (in RC mode) — — 50 pF These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC Oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC® be driven with external clock in RC mode. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. * † 1: DS41206B-page 96 © 2007 Microchip Technology Inc. PIC16F716 12.5 12.5.1 AC (Timing) Characteristics TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created using one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low © 2007 Microchip Technology Inc. T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance DS41206B-page 97 PIC16F716 12.5.2 TIMING CONDITIONS The temperature and voltages specified in Table 12-1 apply to all timing specifications, unless otherwise noted. Figure 12-3 specifies the load conditions for the timing specifications. TABLE 12-1: TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC AC CHARACTERISTICS FIGURE 12-3: Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Operating voltage VDD range as described in DC spec Section 12.1 “DC Characteristics: PIC16F716 (Industrial, Extended)” and Section 12.4 “DC Characteristics: PIC16F716 (Industrial, Extended)”. LC parts operate for commercial/industrial temp’s only. LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load condition 2 Load condition 1 VDD/2 Rl Cl Pin VSS Cl Pin VSS Legend: RL = 464Ω CL = 50 pF for all pins except OSC2/CLKOUT 15 pF for OSC2 output 12.5.3 TIMING DIAGRAMS AND SPECIFICATIONS FIGURE 12-4: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 3 1 3 4 4 2 CLKOUT DS41206B-page 98 © 2007 Microchip Technology Inc. PIC16F716 TABLE 12-2: Param No. Sym EXTERNAL CLOCK TIMING REQUIREMENTS Characteristic Min Typ† Max Units Conditions Ext. Clock Input Frequency(1) DC — 4 MHz RC and XT Osc modes DC — 20 MHz HS Osc mode DC — 200 kHz LP Osc mode (1) Oscillator Frequency DC — 4 MHz RC Osc mode 0.1 — 4 MHz XT Osc mode 4 — 20 MHz HS Osc mode 5 — 200 kHz LP Osc mode 1 TOSC External CLKIN Period(1) 250 — — ns RC and XT Osc modes 50 — — ns HS Osc mode 5 — — μs LP Osc mode Oscillator Period(1) 250 — — ns RC Osc mode 250 — 10,000 ns XT Osc mode 50 — 250 ns HS Osc mode 5 — — μs LP Osc mode 2 Tcy Instruction Cycle Time(1) 200 — DC ns TCY = 4/FOSC 3* TosL, External Clock in (OSC1) High or 100 — — ns XT oscillator TosH Low Time 2.5 — — μs LP oscillator 15 — — ns HS oscillator 4* TosR, External Clock in (OSC1) Rise or — — 25 ns XT oscillator TosF Fall Time — — 50 ns LP oscillator — — 15 ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1/CLKIN pin. When an external clock input is used, the “Max” cycle time limit is “DC” (no clock) for all devices. 1A FOSC © 2007 Microchip Technology Inc. DS41206B-page 99 PIC16F716 FIGURE 12-5: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 CLKOUT 13 19 14 12 18 16 I/O Pin (input) 15 17 I/O Pin (output) new value old value 20, 21 Note 1: Refer to Figure 12-3 for load conditions. TABLE 12-3: Param No. CLKOUT AND I/O TIMING REQUIREMENTS Sym Characteristic Min Typ† Max Units Conditions 10* TOSH2CKL OSC1↑ to CLKOUT↓ — 75 200 ns (Note 1) 11* TOSH2CKH OSC1↑ to CLKOUT↑ — 75 200 ns (Note 1) 12* TCKR — 35 100 ns (Note 1) 13* TCKF CLKOUT fall time — 35 100 ns (Note 1) 14* TCKL2IOV CLKOUT ↓ to Port out valid — — 20 ns (Note 1) 15* TIOV2CKH Port input valid before CLKOUT ↑ TOSC + 200 — — ns (Note 1) (Note 1) CLKOUT rise time 16* TCKH2IOI Port input hold after CLKOUT ↑ 0 — — ns 17* TOSH2IOV OSC1↑ (Q1 cycle) to Port out valid — 50 150 ns 18* TOSH2IOI OSC1↑ (Q2 cycle) to Port Standard input invalid (I/O in hold Extended (LC) time) 18A* 100 — — ns 200 — — ns 19* TIOV2OSH Port input valid to OSC1↑ (I/O in setup time) 0 — — ns 20* TIOR Port output rise time Standard — 10 40 ns Extended (LC) — — 80 ns TIOF Port output fall time Standard — 10 40 ns — — 80 ns 22††* TINP INT pin high or low time Tcy — — ns 23††* TRBP RB<7:4> change INT high or low time Tcy — — ns 20A* 21* 21A* Extended (LC) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. †† These parameters are asynchronous events not related to any internal clock edge. Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. DS41206B-page 100 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 12-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING(1) VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal Reset Watchdog Timer Reset 31 34 34 I/O Pins Note 1: Refer to Figure 12-3 for load conditions. FIGURE 12-7: BROWN-OUT RESET TIMING BVDD VDD TABLE 12-4: Param No. Sym 35 RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT RESET REQUIREMENTS Characteristic Min Typ† Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 — — μs VDD = 5V, -40°C to +125°C 31* TWDT Watchdog Timer Time-out Period 7 18 33 ms VDD = 5V, -40°C to +85°C TBD TBD TBD ms VDD = 5V, +85°C to +125°C 32 TOST Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period 33* TPWRT Power-up Timer Period (No Prescaler) 34 35 TIOZ I/O high-impedance from MCLR Low or WDT Reset TBOR Brown-out Reset Pulse Width 28 72 132 ms VDD = 5V, -40°C to +85°C TBD TBD TBD ms VDD = 5V, +85°C to +125°C — — 2.1 μs 100 — — μs VDD ≤ BVDD (D005) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. © 2007 Microchip Technology Inc. DS41206B-page 101 PIC16F716 TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS(1) FIGURE 12-8: T0CKI 41 40 42 T1OSO/T1CKI 46 45 47 48 TMR0 or TMR1 Note 1: Refer to Figure 12-3 for load conditions. TABLE 12-5: Param No. TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Sym Characteristic 40* Tt0H T0CKI High Pulse Width 41* Tt0L T0CKI Low Pulse Width 42* Tt0P T0CKI Period No Prescaler With Prescaler No Prescaler With Prescaler No Prescaler With Prescaler Typ† Max Units Conditions 0.5TCY + 20 10 0.5TCY + 20 10 TCY + 40 Greater of: 20 or TCY + 40 N 0.5TCY + 20 15 — — — — — — — — — — — — ns ns ns ns ns ns — — — — ns ns N = prescale value (2, 4,..., 256) Must also meet parameter 47 30 0.5TCY + 20 15 — — — — — — ns ns ns Must also meet parameter 47 30 Greater of: 30 OR TCY + 40 N 60 32.768 — — — — ns ns Must also meet parameter 42 Must also meet parameter 42 45* Tt1H 46* Tt1L 47* Tt1P 48* Asynchronous Standard — — ns Timer1 oscillator input frequency range — 32.768 kHz (oscillator enabled by setting bit T1OSCEN) TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc — * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Ft1 DS41206B-page 102 T1CKI High Time Synchronous, Prescaler = 1 Synchronous, Standard Prescaler = 2,4,8 Asynchronous Standard T1CKI Low Time Synchronous, Prescaler = 1 Synchronous, Standard Prescaler = 2,4,8 Asynchronous Standard T1CKI input Synchronous Standard period Min N = prescale value (1, 2, 4, 8) © 2007 Microchip Technology Inc. PIC16F716 FIGURE 12-9: CAPTURE/COMPARE/PWM TIMINGS(1) CCP1 (Capture Mode) 50 51 52 CCP1 (Compare or PWM Mode) 53 Note 1: Refer to Figure 12-3 for load conditions. TABLE 12-6: CAPTURE/COMPARE/PWM REQUIREMENTS Param Sym No. 50* 51* TccL CCP1 input low time Characteristic Min — — ns 10 — — ns 0.5TCY + 20 — — ns 10 — — ns 3TCY + 40 N — — ns Standard — 10 40 ns Extended — — 80 ns Standard — 10 40 ns Extended — — 80 ns With Prescaler Standard TccH CCP1 input high No Prescaler time With Prescaler Standard TccP CCP1 input period 53* TccR CCP1 output rise time 53A* TccF CCP1 output fall time 54A* Typ† Max Units 0.5TCY + 20 No Prescaler 52* 54* 54 Conditions N = prescale value (1,4, or 16) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. © 2007 Microchip Technology Inc. DS41206B-page 103 PIC16F716 TABLE 12-7: A/D CONVERTER CHARACTERISTICS: PIC16F716 (INDUSTRIAL, EXTENDED) Param Sym No. Characteristic A00 VDD VDD Operation A01 NR A02 Resolution EABS Total Absolute error Min Typ† Max Units Conditions 2.5 — 5.5 V — — 8-bits bit — — <±1 LSb VREF = VDD = 5.12V, VSS ≤ VAIN ≤ VREF VREF = VDD = 5.12V, VSS ≤ VAIN ≤ VREF A03 EIL Integral linearity error — — <±1 LSb VREF = VDD = 5.12V, VSS ≤ VAIN ≤ VREF A04 EDL Differential linearity error — — <±1 LSb VREF = VDD = 5.12V, VSS ≤ VAIN ≤ VREF A05 EFS Full scale error — — <±1 LSb VREF = VDD= 5.12V, VSS ≤ VAIN ≤ VREF A06 EOFF Offset error — — <±1 LSb VREF = VDD = 5.12V, VSS ≤ VAIN ≤ VREF Monotonicity — guaranteed(3) — — A20 VREF Reference voltage 2.5V — VDD + 0.3 V A25 VAIN Analog input voltage VSS 0.3 — VREF + 0.3 V A30 ZAIN Recommended impedance of analog voltage source — — 10.0 kΩ A40 IAD — 180 — μA Average current consumption when A/D is on.(1) A50 IREF VREF input current(2) 10 — 1000 μA — — 10 μA During VAIN acquisition. Based on differential of VHOLD to VAIN to charge CHOLD, see Section 12.1 “DC Characteristics: PIC16F716 (Industrial, Extended)”. During A/D Conversion cycle A10 — A/D conversion current (VDD) Standard VSS ≤ VAIN ≤ VREF * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. 3: The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. DS41206B-page 104 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 12-10: A/D CONVERSION TIMING BSF ADCON0, GO 134 1 Tcy (TOSC/2)(1) 131 Q4 130 A/D CLK 132 7 A/D DATA 6 5 4 3 2 1 0 NEW_DATA OLD_DATA ADRES ADIF GO DONE SAMPLING STOPPED SAMPLE Note 1: TABLE 12-8: Param No. Sym 130 TAD If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. A/D CONVERSION REQUIREMENTS Characteristic A/D clock period Min Typ† Max Units Conditions Industrial 1.6 — — μs TOSC based, VREF ≥ 3.0V Industrial 1.6 4.0 6.0 μs A/D RC mode Extended 1.6 — — μs TOSC based, VREF ≥ 3.0V Extended 1.6 6.0 9.0 μs A/D RC mode 9.5 — 9.5 TAD (Note 2) 20 — μs 5* — — μs The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 20.0 mV @ 5.12V) from the last sampled voltage (as stated on CHOLD). — TOSC/2 ** — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1.5 ** — — TAD 131 TCNV Conversion time (not including S/H time)(1) 132 TACQ Acquisition time 134 TGO 135 TSWC Switching from convert → sample time Q4 to A/D clock start * These parameters are characterized but not tested. ** This specification ensured by design. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 12.1 “DC Characteristics: PIC16F716 (Industrial, Extended)” for min. conditions. © 2007 Microchip Technology Inc. DS41206B-page 105 PIC16F716 NOTES: DS41206B-page 106 © 2007 Microchip Technology Inc. PIC16F716 13.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean - 3σ) respectively, where σ is a standard deviation, over each temperature range. FIGURE 13-1: TYPICAL IDD vs. FOSC OVER VDD (EC MODE) 3.5 3.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 5.5V 5.0V IDD (mA) 2.5 2.0 4.0V 1.5 3.0V 1.0 2.0V 0.5 0.0 1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz FOSC © 2007 Microchip Technology Inc. DS41206B-page 107 PIC16F716 FIGURE 13-2: MAXIMUM IDD vs. FOSC OVER VDD (EC MODE) EC Mode 4.0 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 5.5V 5.0V 3.0 IDD (mA) 2.5 4.0V 2.0 3.0V 1.5 2.0V 1.0 0.5 0.0 1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz FOSC FIGURE 13-3: TYPICAL IDD vs. FOSC OVER VDD (HS MODE) Typical IDD vs. FOSC Over Vdd HS Mode 4.0 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 5.5V 3.0 5.0V IDD (mA) 2.5 4.5V 2.0 1.5 4.0V 3.5V 3.0V 1.0 0.5 0.0 4 MHz 10 MHz 16 MHz 20 MHz FOSC DS41206B-page 108 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 13-4: MAXIMUM IDD vs. FOSC OVER VDD (HS MODE) Maximum IDD vs. FOSC Over Vdd HS Mode 5.0 4.5 4.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 5.5V IDD (mA) 3.5 5.0V 3.0 4.5V 2.5 2.0 1.5 4.0V 3.5V 3.0V 1.0 0.5 0.0 4 MHz 10 MHz 16 MHz 20 MHz FOSC FIGURE 13-5: TYPICAL IDD vs. VDD OVER FOSC (XT MODE) XT Mode 900 800 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 700 IDD (μA) 600 500 4 MHz 400 300 1 MHz 200 100 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41206B-page 109 PIC16F716 FIGURE 13-6: MAXIMUM IDD vs. VDD OVER FOSC (XT MODE) XT Mode 1,400 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 1,200 IDD (μA) 1,000 800 4 MHz 600 400 1 MHz 200 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 5.0 5.5 VDD (V) FIGURE 13-7: TYPICAL IDD vs. VDD OVER FOSC (EXTRC MODE) EXTRC Mode 800 700 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 600 IDD (μA) 500 4 MHz 400 300 1 MHz 200 100 0 2.0 2.5 3.0 3.5 4.0 4.5 VDD (V) DS41206B-page 110 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 13-8: MAXIMUM IDD vs. VDD (EXTRC MODE) EXTRC Mode 1,400 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 1,200 1,000 4 MHz IDD (μA) 800 600 1 MHz 400 200 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4.5 5.0 5.5 VDD (V) FIGURE 13-9: IDD vs. VDD (LP MODE) 70 60 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) IDD (μA) 50 32 kHz Maximum 40 30 32 kHz Typical 20 10 0 2.0 2.5 3.0 3.5 4.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41206B-page 111 PIC16F716 FIGURE 13-10: TYPICAL IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) Typical (Sleep Mode all Peripherals Disabled) 0.45 0.40 0.35 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) IPD (μA) 0.30 0.25 0.20 0.15 0.10 0.05 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 13-11: MAXIMUM IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) Maximum (Sleep Mode all Peripherals Disabled) 18.0 16.0 Typical: Statistical Mean @25°C Maximum: Mean + 3σ Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 14.0 Max. 125°C IPD (μA) 12.0 10.0 8.0 6.0 4.0 Max. 85°C 2.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41206B-page 112 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 13-12: BOR IPD vs. VDD OVER TEMPERATURE 160 140 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 120 IPD (μA) 100 80 Maximum 60 40 Typical 20 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 13-13: TYPICAL WDT IPD vs. VDD OVER TEMPERATURE Typical 3.0 2.5 Typical: Statistical StatisticalMean Mean @25°C @25°C Typical: Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) IPD (μA) 2.0 1.5 1.0 0.5 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41206B-page 113 PIC16F716 FIGURE 13-14: MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE Maximum 25.0 20.0 IPD (μA) Max. 125°C 15.0 Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 10.0 Max. 85°C 5.0 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 13-15: WDT PERIOD vs. VDD OVER TEMPERATURE 30 28 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Max. (125°C) 26 Max. (85°C) 24 Time (ms) 22 20 Typical 18 16 14 Minimum 12 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41206B-page 114 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 13-16: WDT PERIOD vs. TEMPERATURE OVER VDD (5.0V) Vdd = 5V 30 28 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 26 Maximum 24 Time (ms) 22 20 Typical 18 16 Minimum 14 12 10 -40°C 25°C 85°C 125°C Temperature (°C) © 2007 Microchip Technology Inc. DS41206B-page 115 PIC16F716 FIGURE 13-17: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V) (VDD = 3V, -40×C TO 125×C) 0.8 0.7 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Max. 125°C 0.6 VOL (V) 0.5 Max. 85°C 0.4 Typical 25°C 0.3 0.2 Min. -40°C 0.1 0.0 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V) FIGURE 13-18: 0.45 Typical: Statistical Mean @25°C Typical: Statistical Mean Temp) @25×C+ 3σ Maximum: Mean (Worst-case Maximum: Means (-40×C + 3 to 125×C) (-40°C to 125°C) 0.40 Max. 125°C 0.35 Max. 85°C VOL (V) 0.30 0.25 Typ. 25°C 0.20 0.15 Min. -40°C 0.10 0.05 0.00 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) DS41206B-page 116 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 13-19: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V) 3.5 3.0 Max. -40°C Typ. 25°C 2.5 Min. 125°C VOH (V) 2.0 1.5 1.0 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 0.5 0.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 IOH (mA) FIGURE 13-20: (VDD = 5.0V) VOH vs. IOH OVER TEMPERATURE ( , ) 5.5 5.0 Max. -40°C Typ. 25°C VOH (V) 4.5 Min. 125°C 4.0 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 3.0 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 IOH (mA) © 2007 Microchip Technology Inc. DS41206B-page 117 PIC16F716 FIGURE 13-21: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE (TTL Input, -40×C TO 125×C) 1.7 1.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Max. -40°C VIN (V) 1.3 Typ. 25°C 1.1 Min. 125°C 0.9 0.7 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 13-22: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE (ST Input, -40×C TO 125×C) 4.0 VIH Max. 125°C 3.5 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) VIH Min. -40°C VIN (V) 3.0 2.5 2.0 VIL Max. -40°C 1.5 VIL Min. 125°C 1.0 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41206B-page 118 © 2007 Microchip Technology Inc. PIC16F716 FIGURE 13-23: T1OSC IPD vs. VDD OVER TEMPERATURE (32 kHz) 45.0 40.0 Typical: Statistical Mean @25°C Maximum: Mean Mean (Worst-case Temp) + 3σ Maximum: (-40×C + 3 to 125×C) (-40°C to 125°C) 35.0 Max. 125°C IPD (mA) 30.0 25.0 20.0 15.0 Max. 85°C 10.0 5.0 Typ. 25°C 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) ADC CLOCK PERIOD vs. VDD OVER TEMPERATURE FIGURE 13-24: 8 Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 125°C Time (μs) 6 4 85°C 25°C -40°C 2 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) © 2007 Microchip Technology Inc. DS41206B-page 119 PIC16F716 NOTES: DS41206B-page 120 © 2007 Microchip Technology Inc. PIC16F716 14.0 PACKAGING INFORMATION 14.1 Package Marking Information 18-Lead PDIP Example PIC16F716-04/P e3 XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 18-Lead SOIC (7.50 mm) XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX 0610017 Example PIC16F716-20 /SO e3 0610017 YYWWNNN 20-Lead SSOP Example XXXXXXXXXXX XXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: * PIC16F716 -20I/SS025 0610017 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability code. For PIC® device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. © 2007 Microchip Technology Inc. DS41206B-page 121 PIC16F716 14.2 Package Details The following sections give the technical details of the packages. 18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A2 A L c A1 b1 b e eB Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 18 Pitch e Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .300 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .880 .900 .920 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .014 b1 .045 .060 .070 b .014 .018 .022 eB – – Upper Lead Width Lower Lead Width Overall Row Spacing § .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-007B DS41206B-page 122 © 2007 Microchip Technology Inc. PIC16F716 18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 3 b e α h h c φ A2 A A1 β L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 18 Pitch e Overall Height A – 1.27 BSC – Molded Package Thickness A2 2.05 – – Standoff § A1 0.10 – 0.30 Overall Width E Molded Package Width E1 7.50 BSC Overall Length D 11.55 BSC 2.65 10.30 BSC Chamfer (optional) h 0.25 – 0.75 Foot Length L 0.40 – 1.27 Footprint L1 1.40 REF Foot Angle φ 0° – 8° Lead Thickness c 0.20 – 0.33 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-051B © 2007 Microchip Technology Inc. DS41206B-page 123 PIC16F716 20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A2 A φ A1 L1 Units Dimension Limits Number of Pins L MILLIMETERS MIN N NOM MAX 20 Pitch e Overall Height A – 0.65 BSC – 2.00 Molded Package Thickness A2 1.65 1.75 1.85 Standoff A1 0.05 – – Overall Width E 7.40 7.80 8.20 Molded Package Width E1 5.00 5.30 5.60 Overall Length D 6.90 7.20 7.50 Foot Length L 0.55 0.75 0.95 Footprint L1 1.25 REF Lead Thickness c 0.09 – Foot Angle φ 0° 4° 0.25 8° Lead Width b 0.22 – 0.38 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-072B DS41206B-page 124 © 2007 Microchip Technology Inc. PIC16F716 APPENDIX A: REVISION HISTORY Revision A (June 2003) Original data sheet. However, the device described in this data sheet are upgrades to PIC16C716. Revision B (February 2007) Updated with current formats and added Characterization Data. Replaced Package Drawings. © 2007 Microchip Technology Inc. APPENDIX B: CONVERSION CONSIDERATIONS This is a Flash program memory version of the PIC16C716 device. Refer to the migration document, DS40059, for more information about differences between the PIC16F716 and PIC16C716. DS41206B-page 125 PIC16F716 APPENDIX C: MIGRATION FROM BASE-LINE TO MID-RANGE DEVICES To convert code written for PIC16C5X to PIC16F716, the user should take the following steps: 1. This section discusses how to migrate from a baseline device (i.e., PIC16C5X) to a mid-range device (i.e., PIC16F716). 2. The following are the list of modifications over the PIC16C5X microcontroller family: 3. 1. 4. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. Instruction word length is increased to 14-bits. This allows larger page sizes both in program memory (2K now as opposed to 512 before) and register file (128 bytes now versus 32 bytes before). A PC high latch register (PCLATH) is added to handle program memory paging. Bits PA2, PA1, PA0 are removed from STATUS register. Data memory paging is redefined slightly. STATUS register is modified. Four new instructions have been added: RETURN, RETFIE, ADDLW, and SUBLW. Two instructions TRIS and OPTION are being phased out although they are kept for compatibility with PIC16C5X. OPTION_REG and TRIS registers are made addressable. Interrupt capability is added. Interrupt vector is at 0004h. Stack size is increased to 8 deep. Reset vector is changed to 0000h. Reset of all registers is revisited. Five different Reset (and wake-up) types are recognized. Registers are reset differently. Wake-up from Sleep through interrupt is added. Two separate timers, Oscillator Start-up Timer (OST) and Power-up Timer (PWRT) are included for more reliable power-up. These timers are invoked selectively to avoid unnecessary delays on power-up and wake-up. PORTB has weak pull-ups and interrupt-onchange feature. T0CKI pin is also a port pin (RA4) now. FSR is made a full eight-bit register. “In-circuit serial programming” is made possible. The user can program PIC16F716 devices using only five pins: VDD, VSS, MCLR/VPP, RB6 (clock) and RB7 (data in/out). PCON STATUS register is added with a Poweron Reset Status bit (POR). Brown-out protection circuitry has been added. Controlled by Configuration Word bits BOREN and BORV. Brown-out Reset ensures the device is placed in a Reset condition if VDD dips below a fixed setpoint. DS41206B-page 126 5. Remove any program memory page select operations (PA2, PA1, PA0 bits) for CALL, GOTO. Revisit any computed jump operations (write to PC or add to PC, etc.) to make sure page bits are set properly under the new scheme. Eliminate any data memory page switching. Redefine data variables to reallocate them. Verify all writes to STATUS, OPTION, and FSR registers since these have changed. Change Reset vector to 0000h . Note 1: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. 2: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the Oscillator mode may be required. © 2007 Microchip Technology Inc. PIC16F716 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. DS41206B-page 127 PIC16F716 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: PIC16F716 Y N Literature Number: DS41206B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41206B-page 128 © 2007 Microchip Technology Inc. PIC16F716 INDEX A C A/D C Compilers MPLAB C18................................................................ 88 MPLAB C30................................................................ 88 Capture Module. See Enhanced Capture/Compare/ PWM(ECCP) Capture/Compare/PWM (CCP) Associated registers w/ Capture................................. 49 Associated registers w/ Compare............................... 51 Associated registers w/ PWM..................................... 60 Capture Mode............................................................. 48 CCP1 Pin Configuration ............................................. 48 CCP1CON Register...................................................... 9 CCPR1H Register ........................................................ 9 CCPR1L Register ......................................................... 9 Compare Mode........................................................... 50 CCP1 Pin Configuration ..................................... 50 Software Interrupt Mode ............................... 48, 50 Special Event Trigger ......................................... 50 Timer1 Mode Selection................................. 48, 50 Flag (CCP1IF Bit) ....................................................... 15 Prescaler .................................................................... 48 PWM Mode................................................................. 52 Duty Cycle .......................................................... 53 Effects of Reset .................................................. 55 Example PWM Frequencies and Resolutions, 20 MHZ...................................................... 54 Example PWM Frequencies and Resolutions, 8 MHz ........................................................ 54 Operation in Sleep Mode.................................... 55 Setup for Operation ............................................ 55 System Clock Frequency Changes .................... 55 PWM Period ............................................................... 53 Setup for PWM Operation .......................................... 55 Timing Diagram ........................................................ 103 CCP1CON (Enhanced) Register ........................................ 47 Code Examples Assigning Prescaler to Timer0.................................... 28 Assigning Prescaler to WDT....................................... 28 Changing Between Capture Prescalers ..................... 48 How to Clear RAM Using Indirect Addressing............ 18 Initializing PORTA ...................................................... 19 Initializing PORTB ...................................................... 21 Code Protection ............................................................ 61, 76 Compare Module. See Enhanced Capture/ Compare/PWM (ECCP) CONFIG Register ............................................................... 62 Configuration Bits ............................................................... 61 Conversion Considerations............................................... 125 Customer Change Notification Service............................. 127 Customer Notification Service .......................................... 127 Customer Support............................................................. 127 ADCON0 Register......................................................... 9 ADCON1 Register....................................................... 10 ADRES Register ........................................................... 9 Converter Characteristics ......................................... 104 Timing Diagram......................................................... 105 Absolute Maximum Ratings ................................................ 91 ADC .................................................................................... 37 Acquisition Requirements ........................................... 43 Associated registers.................................................... 45 Block Diagram............................................................. 37 Calculating Acquisition Time....................................... 43 Channel Selection....................................................... 38 Configuration............................................................... 38 Configuring Interrupt ................................................... 40 Conversion Clock........................................................ 38 Conversion Procedure ................................................ 40 Internal Sampling Switch (RSS) IMPEDANCE ................ 43 Interrupts..................................................................... 39 Operation .................................................................... 40 Operation During Sleep .............................................. 40 Port Configuration ....................................................... 38 Reference Voltage (VREF)........................................... 38 Source Impedance...................................................... 43 Special Event Trigger.................................................. 40 ADCON0 Register........................................................... 9, 41 ADCON1 Register......................................................... 10, 42 ADRES Register ................................................................... 9 Analog-to-Digital Converter. See ADC Assembler MPASM Assembler..................................................... 88 B Banking, Data Memory ......................................................... 7 Block Diagrams (CCP) Capture Mode Operation ................................. 48 ADC ............................................................................ 37 ADC Transfer Function ............................................... 44 Analog Input Model ..................................................... 44 Auto-Shutdown ........................................................... 56 CCP PWM................................................................... 52 Compare ..................................................................... 50 Interrupt Sources ........................................................ 72 On-Chip Reset Circuit ................................................. 66 PIC16F716.................................................................... 5 PORTA.................................................................. 19, 20 PORTB........................................................................ 21 RB1/T1OSO/T1CKI..................................................... 22 RB2/T1OSI.................................................................. 22 RB3/CCP1/P1A........................................................... 23 RB4 ............................................................................. 23 RB5 ............................................................................. 24 RB6/P1C ..................................................................... 24 RB7/P1D ..................................................................... 25 Timer1......................................................................... 29 Timer2......................................................................... 35 TMR0/WDT Prescaler................................................. 27 Watchdog Timer (WDT) .............................................. 74 BOR. See Brown-out Reset Brown-out Reset (BOR) .............................. 61, 64, 65, 69, 70 Timing Diagram......................................................... 101 © 2007 Microchip Technology Inc. D Data Memory ........................................................................ 7 Bank Select (RP Bits) ................................................... 7 General Purpose Registers .......................................... 8 Register File Map ......................................................... 8 Special Function Registers........................................... 9 DC Characteristics............................................ 93, 94, 95, 96 Development Support ......................................................... 87 Direct Addressing ............................................................... 18 DS41206B-page 129 PIC16F716 E Firmware Instructions.......................................................... 77 Fuses. See Configuration Bits XORWF ...................................................................... 85 Summary Table .......................................................... 78 INT Interrupt (RB0/INT). See Interrupt Sources INTCON Register............................................................ 9, 13 Internal Sampling Switch (RSS) IMPEDANCE ........................ 43 Internet Address ............................................................... 127 Interrupt Sources .......................................................... 61, 72 Interrupt-on-Change (RB) ........................................... 21 RB0/INT Pin, External................................................. 73 TMR0 Overflow........................................................... 73 Interrupts ADC ............................................................................ 40 TMR1 .......................................................................... 30 Interrupts, Context Saving During....................................... 73 Interrupts, Enable Bits Global Interrupt Enable (GIE Bit) ................................ 72 Interrupt-on-Change (RB) Enable (RBIE Bit).............. 73 Interrupts, Flag Bits CCP1 Flag (CCP1IF Bit)............................................. 15 Interrupt-on-Change (RB) Flag (RBIF Bit) .................. 73 TMR0 Overflow Flag (T0IF Bit)................................... 73 I M I/O Ports .............................................................................. 19 ID Locations .................................................................. 61, 76 In-Circuit Serial Programming (ICSP) ........................... 61, 76 Indirect Addressing ............................................................. 18 FSR Register ...................................................... 8, 9, 18 INDF Register ............................................................... 9 Instruction Format ............................................................... 77 Instruction Set ..................................................................... 77 ADDLW ....................................................................... 79 ADDWF ....................................................................... 79 ANDLW ....................................................................... 79 ANDWF ....................................................................... 79 BCF ............................................................................. 79 BSF ............................................................................. 79 BTFSC ........................................................................ 79 BTFSS ........................................................................ 80 CALL ........................................................................... 80 CLRF........................................................................... 80 CLRW ......................................................................... 80 CLRWDT..................................................................... 80 COMF ......................................................................... 80 DECF .......................................................................... 80 DECFSZ...................................................................... 81 GOTO ......................................................................... 81 INCF............................................................................ 81 INCFSZ ....................................................................... 81 IORLW ........................................................................ 81 IORWF ........................................................................ 81 MOVF.......................................................................... 82 MOVLW ...................................................................... 82 MOVWF ...................................................................... 82 NOP ............................................................................ 82 RETFIE ....................................................................... 83 RETLW ....................................................................... 83 RETURN ..................................................................... 83 RLF ............................................................................. 84 RRF............................................................................. 84 SLEEP ........................................................................ 84 SUBLW ....................................................................... 84 SUBWF ....................................................................... 85 SWAPF ....................................................................... 85 XORLW ....................................................................... 85 Master Clear (MCLR) MCLR Reset, Normal Operation..................... 64, 69, 70 MCLR Reset, Sleep ........................................ 64, 69, 70 Memory Organization Data Memory ................................................................ 7 Program Memory .......................................................... 7 Microchip Internet Web Site.............................................. 127 Migration from Base-Line to Mid-Range Devices ............. 126 MPLAB ASM30 Assembler, Linker, Librarian ..................... 88 MPLAB ICD 2 In-Circuit Debugger ..................................... 89 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator ...................................................... 89 MPLAB Integrated Development Environment Software.... 87 MPLAB PM3 Device Programmer ...................................... 89 MPLAB REAL ICE In-Circuit Emulator System .................. 89 MPLINK Object Linker/MPLIB Object Librarian .................. 88 ECCP. See Enhanced Capture/Compare/PWM ECCPAS Register ............................................................... 57 Effects of Reset PWM mode ................................................................. 55 Electrical Characteristics..................................................... 91 Enhanced Capture/Compare/PWM..................................... 47 Enhanced Capture/Compare/PWM (ECCP) Enhanced PWM Mode Auto-Restart........................................................ 58 Auto-shutdown .................................................... 56 Half-Bridge Application Examples....................... 59 Programmable Dead Band Delay ....................... 59 Shoot-through Current ........................................ 59 Timer Resources......................................................... 47 Errata .................................................................................... 4 External Power-on Reset Circuit ......................................... 64 F DS41206B-page 130 O OPCODE Field Descriptions............................................... 77 OPTION Register................................................................ 12 OPTION_REG Register................................................ 10, 12 Oscillator Associated registers ................................................... 33 Oscillator Configuration ................................................ 61, 63 HS......................................................................... 63, 68 LP ......................................................................... 63, 68 RC .................................................................. 63, 64, 68 XT ......................................................................... 63, 68 Oscillator, WDT................................................................... 74 P Packaging ......................................................................... 121 PDIP Details ............................................................. 122 Paging, Program Memory............................................... 7, 17 PCON Register ............................................................. 16, 68 PICSTART Plus Development Programmer....................... 90 PIE1 Register................................................................ 10, 14 PIR1 Register ................................................................. 9, 15 CCP1IF Bit.................................................................. 15 Pointer, FSR ....................................................................... 18 POR. See Power-on Reset PORTA Associated Registers .................................................. 20 © 2007 Microchip Technology Inc. PIC16F716 PORTA Register ..................................................... 9, 19 TRISA Register ..................................................... 10, 19 PORTB Associated Registers .................................................. 25 PORTB Register ..................................................... 9, 21 RB Interrupt-on-Change.............................................. 73 RB Interrupt-on-Change Enable (RBIE Bit) ................ 73 RB0/INT Pin, External................................................. 73 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit)........... 73 TRISB Register ..................................................... 10, 21 Power-down Mode. See Sleep Power-on Reset (POR) ..................................... 61, 64, 69, 70 Oscillator Start-up Timer (OST) ............................ 61, 65 Power Control (PCON) Register ................................. 68 Power-down (PD Bit) .................................................. 64 Power-on Reset Circuit, External................................ 64 Power-up Timer (PWRT) ...................................... 61, 65 Time-out (TO Bit) ........................................................ 64 Time-out Sequence..................................................... 68 Time-out Sequence on Power-up ............................... 71 Timing Diagram......................................................... 101 Prescaler Shared WDT/Timer0 ................................................... 28 Switching Prescaler Assignment................................. 28 Program Counter PCL Register........................................................... 9, 17 PCLATH Register ............................................. 9, 17, 73 Reset Conditions......................................................... 69 Program Memory .................................................................. 7 Interrupt Vector ............................................................. 7 Paging..................................................................... 7, 17 Program Memory Map .................................................. 7 Reset Vector ................................................................. 7 Program Verification ........................................................... 76 Programming, Device Instructions ...................................... 77 PWM1CON Register ........................................................... 60 R RA<3 0> ................................................................................ 19 RA4/T0CKI Pin.................................................................... 20 RAM. See Data Memory. RB0 Pin ............................................................................... 21 Reader Response ............................................................. 128 Read-Modify-Write Operations ........................................... 77 Register File .......................................................................... 8 Register File Map .................................................................. 8 Registers ADCON0 (ADC Control 0) .......................................... 41 ADCON1 (ADC Control 1) .......................................... 42 CCP1CON (Enhanced CCP1 Control)........................ 47 CONFIG (Configuration Word).................................... 62 ECCPAS (Enhanced CCP Auto-shutdown Control) ... 57 INTCON (Interrupt Control)......................................... 13 INTCON Register RBIF.................................................................... 21 OPTION_REG (OPTION) ........................................... 12 PCON (Power Control Register) ................................. 16 PIE1 (Peripheral Interrupt Enable 1)........................... 14 PIR1 (Peripheral Interrupt Register 1) ........................ 15 PWM1CON (Enhanced PWM Control) ....................... 60 STATUS...................................................................... 11 T1CON........................................................................ 32 T2CON........................................................................ 36 Reset............................................................................. 61, 64 Brown-out Reset (BOR). See Brown-out Reset (BOR) © 2007 Microchip Technology Inc. MCLR Reset. See MCLR Power-on Reset (POR). See Power-on Reset (POR) Reset Conditions for PCON Register ......................... 69 Reset Conditions for Program Counter ...................... 69 Reset Conditions for STATUS Register ..................... 69 Timing Diagram ........................................................ 101 WDT Reset. See Watchdog Timer (WDT) Revision History................................................................ 125 S Shoot-through Current ........................................................ 59 Sleep ...................................................................... 61, 64, 75 Software Simulator (MPLAB SIM) ...................................... 88 Special Event Trigger ......................................................... 40 Special Features of the CPU .............................................. 61 Special Function Registers ................................................... 9 Speed, Operating ................................................................. 1 Stack................................................................................... 17 STATUS Register ............................................................... 11 STATUS Register ........................................................... 9, 73 PD Bit ......................................................................... 64 TO Bit ......................................................................... 64 T T1CON Register ............................................................. 9, 32 T2CON Register ............................................................. 9, 36 Timer0 ................................................................................ 27 Associated Registers.................................................. 28 External Clock ............................................................ 28 Operation.............................................................. 27, 29 Overflow Flag (T0IF Bit) ............................................. 73 Overflow Interrupt ....................................................... 73 T0CKI ......................................................................... 28 Timing Diagram ........................................................ 102 TMR0 Register ............................................................. 9 Timer1 ................................................................................ 29 Associated registers ................................................... 33 Asynchronous Counter Mode ..................................... 30 Reading and Writing ........................................... 30 Interrupt ...................................................................... 30 Modes of Operation .................................................... 29 Operation During Sleep .............................................. 30 Oscillator..................................................................... 30 Prescaler .................................................................... 30 T1CON Register ........................................................... 9 Timing Diagram ........................................................ 102 TMR1H Register..................................................... 9, 29 TMR1L Register ..................................................... 9, 29 Timer2 Associated registers ................................................... 36 PR2 Register .............................................................. 10 T2CON Register ........................................................... 9 TMR2 Register ............................................................. 9 Timers Timer1 T1CON ............................................................... 32 Timer2 T2CON ............................................................... 36 Timing Diagrams Half-Bridge PWM Output ............................................ 59 PWM Auto-shutdown Auto-restart Enabled........................................... 58 Firmware Restart ................................................ 58 Time-out Sequence on Power-up............................... 71 Timer1 Incrementing Edge ......................................... 31 Wake-up from Sleep via Interrupt............................... 76 DS41206B-page 131 PIC16F716 Timing Diagrams and Specifications................................... 98 A/D Conversion ......................................................... 105 Brown-out Reset (BOR) ............................................ 101 Capture/Compare/PWM (CCP)................................. 103 CLKOUT and I/O....................................................... 100 External Clock ............................................................. 98 Oscillator Start-up Timer (OST) ................................ 101 Power-up Timer (PWRT) .......................................... 101 Reset......................................................................... 101 Timer0 and Timer1.................................................... 102 Watchdog Timer (WDT) ............................................ 101 V VREF. SEE ADC Reference Voltage W W Register .......................................................................... 73 Wake-up from Sleep ..................................................... 61, 75 Interrupts ............................................................... 69, 70 MCLR Reset ............................................................... 70 Timing Diagram........................................................... 76 WDT Reset ................................................................. 70 Watchdog Timer (WDT) ................................................ 61, 74 Enable (WDTE Bit)...................................................... 74 Postscaler. See Postscaler, WDT Programming Considerations ..................................... 74 RC Oscillator ............................................................... 74 Time-out Period .......................................................... 74 Timing Diagram......................................................... 101 WDT Reset, Normal Operation ....................... 64, 69, 70 WDT Reset, Sleep .......................................... 64, 69, 70 WWW Address.................................................................. 127 WWW, On-Line Support........................................................ 4 DS41206B-page 132 © 2007 Microchip Technology Inc. PIC16F716 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) Device: PIC16F716(1), PIC16F716T(2); VDD range 2.0V to 5.5V Temperature Range: I E = -40°C to +85°C = -40°C to +125°C Package: SO P SS = = = Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise) PIC16F716 - I/L 301 = Industrial temp., PDIP package, QTP pattern #301. PIC16F716 - E/SO = Extended temp., SOIC package. (Industrial) (Extended) SOIC PDIP SSOP Note 1: 2: © 2007 Microchip Technology Inc. F = Standard Voltage Range LF = Wide Voltage Range T = in tape and reel SOIC and SSOP packages only. 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