TRANSCOM TC3141

TC3141
REV3_20040412
2.4 GHz 2W MMIC
FEATURES
PHOTO ENLARGEMENT
• P-1 dB: 33 dBm
Vg
GND
RF OUT
• Small Signal Gain: 29 dB
RF IN
• Power Added Efficiency: 31 %
RF IN
RF OUT
• IP3: 42 dBm
GND
Vd
• DC Bias: 800 mA @ 7 V
DESCRIPTION
The TC3141 is a 2 stage PHEMT MMIC power amplifier. It is designed for use in low cost and high volume
2.4-2.5 GHz ISM band applications. The MMIC provides a typical gain of 29 dB and saturation power of more
than 33 dBm. Typical bias condition is 7V at 800 mA. The MMIC is a packaged in a standard SO-8 power package.
The copper based carrier of the package allows direct soldering of the device to the PCB for proper heat sinking.
The input and output matching of the MMIC require external components.
ELECTRICAL SPECIFICATIONS (Ta = 25 °C)
SYMBOL
DESCRIPTION
FREQ
Frequency Range
SSG
MIN
TYP
2.4
MAX
UNITS
2.5
GHz
Small Signal Gain
28
29
dB
P-1 dB
Output Power at 1 dB Gain Compression
32
33
dBm
P-3 dB
Output Power at 3 dB Gain Compression
33
34
dBm
Third Order Intercept Point
40
42
dBm
2:1
-
IP3
VSWR, IN
VDD
Vg
IDD
IDP-1
ηa
Input VSWR
Supply Voltage
7
Gate Voltage
-0.6
-1.2
Volt
-2
Volt
Current Supply Without RF
800
mA
Current Supply @ Pout = P-1 dB
920
mA
Power Added Efficiency
31
%
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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TC3141
REV3_20040412
Absolute Maximum Ratings
Symbol
Parameter/Conditions
Vdd
Drain-Source Voltage
Idd
Total Drain Current
Pin
RF Input Power
Min.
Max.
Units
12
Volts
2000
mA
10
dBm
Pt
Power Dissipation
12
W
Tch
Operating Channel Temperature
175
°C
175
°C
TSTG
Storage Temperature
-65
Note:
1. This GaAs MMIC is susceptible to damage from
Electrostatic Discharge. Proper precautions should
be used when handling these devices.
2. Specifications subject to change without notice.
TEST CIRCUITS
Evaluation Board Schematic
EVALUATION BOARD
PCB Material: FR4
ER = 4.6
Thickness = 31 mil
Unit: mil
* DXF file of the PCB can be downloaded
from our web-site at
www.transcominc.com.tw
* Application Notes:
For better heat sinking and
grounding, it's recommended to have the
via holes beneath TC3141 filled with
solder and have two screws besides
TC3141 installed on the PCB area.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P2/2
TC3141
REV3_20040412
Evaluation Board Parts List
Part Type
Reference Designator
Description
Manufacturer
Part Number
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
C1
C2
C3
C4
C5
C6~8
C9~11
C12
3.3 pF 0603
2.5 pF 0603
1 pF 0603
0.75pF
1.5 pF 0603
1000 pF 0603
0.1 uF 0603
4.7uF 1206 Tantalum Cap
Murata
Murata
Murata
Murata
Murata
Murata
Murata
GRM39C0G3R3C50V
GRM39C0G2R5C50V
GRM39C0G010C50V
GRM39C0GR75C50V
GRM39C0G1R5C50V
GRM39C0G102J50V
GRM39Y5V104Z25V
CONNECTION DIAGRAM AND PIN DESCRIPTIONS
Pin #
2, 3
1, 5
4
Name
RF IN
GND
Vg
6, 7
RF OUT
8
Vd
Description
RF input (internally DC blocked)
Ground
FET gate bias
RF output and Vd2 External
matching circuit required
Input stage drain bias
Vg
RF IN
4
5
3
6
2
7
1
8
MATCH
MATCH
GND
GND
RF OUT
Vd
PHYSICAL DIMENSIONS (Unit: inch)
α
α
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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