TC3141 REV3_20040412 2.4 GHz 2W MMIC FEATURES PHOTO ENLARGEMENT • P-1 dB: 33 dBm Vg GND RF OUT • Small Signal Gain: 29 dB RF IN • Power Added Efficiency: 31 % RF IN RF OUT • IP3: 42 dBm GND Vd • DC Bias: 800 mA @ 7 V DESCRIPTION The TC3141 is a 2 stage PHEMT MMIC power amplifier. It is designed for use in low cost and high volume 2.4-2.5 GHz ISM band applications. The MMIC provides a typical gain of 29 dB and saturation power of more than 33 dBm. Typical bias condition is 7V at 800 mA. The MMIC is a packaged in a standard SO-8 power package. The copper based carrier of the package allows direct soldering of the device to the PCB for proper heat sinking. The input and output matching of the MMIC require external components. ELECTRICAL SPECIFICATIONS (Ta = 25 °C) SYMBOL DESCRIPTION FREQ Frequency Range SSG MIN TYP 2.4 MAX UNITS 2.5 GHz Small Signal Gain 28 29 dB P-1 dB Output Power at 1 dB Gain Compression 32 33 dBm P-3 dB Output Power at 3 dB Gain Compression 33 34 dBm Third Order Intercept Point 40 42 dBm 2:1 - IP3 VSWR, IN VDD Vg IDD IDP-1 ηa Input VSWR Supply Voltage 7 Gate Voltage -0.6 -1.2 Volt -2 Volt Current Supply Without RF 800 mA Current Supply @ Pout = P-1 dB 920 mA Power Added Efficiency 31 % TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P1/3 TC3141 REV3_20040412 Absolute Maximum Ratings Symbol Parameter/Conditions Vdd Drain-Source Voltage Idd Total Drain Current Pin RF Input Power Min. Max. Units 12 Volts 2000 mA 10 dBm Pt Power Dissipation 12 W Tch Operating Channel Temperature 175 °C 175 °C TSTG Storage Temperature -65 Note: 1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2. Specifications subject to change without notice. TEST CIRCUITS Evaluation Board Schematic EVALUATION BOARD PCB Material: FR4 ER = 4.6 Thickness = 31 mil Unit: mil * DXF file of the PCB can be downloaded from our web-site at www.transcominc.com.tw * Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3141 filled with solder and have two screws besides TC3141 installed on the PCB area. TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P2/2 TC3141 REV3_20040412 Evaluation Board Parts List Part Type Reference Designator Description Manufacturer Part Number Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor C1 C2 C3 C4 C5 C6~8 C9~11 C12 3.3 pF 0603 2.5 pF 0603 1 pF 0603 0.75pF 1.5 pF 0603 1000 pF 0603 0.1 uF 0603 4.7uF 1206 Tantalum Cap Murata Murata Murata Murata Murata Murata Murata GRM39C0G3R3C50V GRM39C0G2R5C50V GRM39C0G010C50V GRM39C0GR75C50V GRM39C0G1R5C50V GRM39C0G102J50V GRM39Y5V104Z25V CONNECTION DIAGRAM AND PIN DESCRIPTIONS Pin # 2, 3 1, 5 4 Name RF IN GND Vg 6, 7 RF OUT 8 Vd Description RF input (internally DC blocked) Ground FET gate bias RF output and Vd2 External matching circuit required Input stage drain bias Vg RF IN 4 5 3 6 2 7 1 8 MATCH MATCH GND GND RF OUT Vd PHYSICAL DIMENSIONS (Unit: inch) α α TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P3/3