TC3331 REV5_20060516 3.3 - 3.7 GHz 1W MMIC FEATURES • • • • • • PHOTO ENLARGEMENT P-1 dB: 30 dBm Small Signal Gain: 30 dB Power Added Efficiency: 25 % IP3: 39 dBm Match to 50 Ω operation Bias condition: 650 mA @ 7 V GND GND RF IN Vd1 Vd2 Vg1 Vg2 RF OUT GND GND DESCRIPTION The TC3331 is a 2-stage PHEMT MMIC power amplifier. It is designed for use in low cost and high volume 3.3-3.7 GHz band applications. The MMIC is matched to 50Ω operation. It provides a typical gain of 30 dB and P1dB power of 30 dBm. Typical bias condition is 7V at 650 mA. The MMIC is packaged in a copper based ceramic 10 pins power package. The copper based carrier of the package allows direct soldering of the device to the PCB. APPLICATIONS • Wireless Internet Access • Wireless Local Loop • Two way radio ELECTRICAL SPECIFICATIONS (Ta = 25 °C) SYMBOL DESCRIPTION MIN FREQ Frequency Range 3.3 28 TYP MAX UNITS 3.7 GHz SSG Small Signal Gain GOF Small Signal Gain Flatness P-1 dB Output Power at 1 dB Gain Compression 29 30 dBm P-3 dB Output Power at 3 dB Gain Compression 30 31 dBm Third Order Intercept Point 37 39 dBm IP3 VSWR, IN VDD Vg Input VSWR dB 2:1 Supply Voltage Gate Voltage 30 ±0.5 7 -0.6 -1.0 Volt -1.5 Volt IDD Current Supply Without RF 650 mA IDP-1 Current Supply @ Pout=P-1 dB 670 mA Power Added Efficiency 25 % ηa TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P1/3 TC3331 REV5_20060516 Absolute Maximum Ratings Symbol Vdd Idd Pin Pt Tch TSTG Parameter/Conditions Drain-Source Voltage Total Drain Current RF Input Power Power Dissipation Operating Channel Temperature Storage Temperature Min. -65 Max. 12 2200 7 9 175 175 Units Volts mA dBm W °C °C Note: 1.This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2.Specifications subject to change without notice. TEST CIRCUITS Evaluation Board Schematic EVALUATION BOARD PCB Material: RO4003 ER = 3.38 Thickness = 20 mil Unit: mil ! ! DXF file of the PCB can be downloaded from our web-site at www.transcominc.com.tw Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3331 filled with solder and have two screws installed on required heat sink plate besides TC3331 on the PCB area. TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P2/3 TC3331 REV5_20060516 Evaluation Board Parts List Part Type Capacitor Capacitor Capacitor Capacitor Capacitor Resistor Reference Designator C1, C2, C3, C4 C6, C7 C5 C8 C9 R1 1 GND Description 1000pF 0603 0.1 uF 0603 4.7uF Tantalum Cap. 2.5pF 0603 1.8pF 0603 200 ohm 0603 Manufacturer Murata Murata Part Number GRM39C0G102J50V GRM39Y5V104Z25V Murata Murata GRM39C0G2R5C50V GRM39C0G1R8C50V Pin # 1, 2, 6, 7 3 4, 5 9, 10 8 10 Vg GND RF IN 50 ohm LINE 2 9 3 8 4 7 GND 5 6 GND 50 ohm LINE RF OUT Vd Name GND RF IN Vd Vg RF OUT Description Ground RF input (internally DC blocked) MMIC drain bias MMIC gate bias RF output (internally DC blocked) CONNECTION DIAGRAM AND PIN DESCRIPTIONS PHYSICAL DIMENSIONS (Unit: inch) α J DIMENSION TC3331 B A 0.002M AX G D F E C I H A B C D E F G H I J α MINIMUM 0.054 0.007 0.017 0.267 0.047 0.247 0.267 0.007 0.020 0.073 0° NOMINAL 0.057 0.008 0.020 0.270 0.050 0.250 0.270 0.008 0.080 MAXIMUM 0.060 0.009 0.023 0.273 0.053 0.253 0.273 0.009 0.040 0.087 7° TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P3/3