ADVANCEDPHOTONIX SD380-23-21-251

Red Enhanced Quad Cell Silicon Photodiode
SD 380-23-21-251
PACKAGE
DIMENSIONS INCH [mm]
PACKAGE DIMENSIONS INCH [mm]
.195 [4.95]
.185 [4.70]
Ø1.005 [25.53]
Ø.995 [25.27]
.100 [2.54]
CHIP PERIMETER
6X Ø.018 [0.46]
2
1
3
45°
45°
Ø.700 [17.78]
Ø.690 [17.53]
120°
VIEWING
ANGLE
Ø.980 [24.89]
± .030 [0.76]
6X .750 [19.05]
Ø.970 [24.64]
45°
B
C
A
D
45°
4
6
5
CHIP DIMENSIONS INCH [mm]
.402 [10.21] SQUARE
2
CHIP DIMENSIONS
INCH [mm]
Ø.380 [9.65] ACTIVE AREA
C
B
D
A
A
6
B
1
C
5
.004 [0.10] GAP
Ø.730 [18.54]
PIN CIRCLE
3
D
4
TO-46
PACKAGE
TO-8 PACKAGE
SCHEMATIC
.004 [0.10] GAP
DESCRIPTION
APPLICATIONS
The SD 380-23-21-251 is a red enhanced quad-cell
silicon photodiode used for nulling, centering, or
measuring small positional changes packaged in a
TO-8 metal package.
• Emitter Alignment
• Position sensing
• Medical and Industrial
SPECTRAL RESPONSE
ABSOLUTE MAXIMUM RATING (TA)= 23°C UNLESS OTHERWISE NOTED
+125
+240
°C
0.50
0.40
0.30
0.20
0.10
Wavelength (nm)
ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED
SYMBOL
CHARACTERISTIC
TEST CONDITIONS
ID
RSH
Dark Current
Shunt Resistance
CJ
Junction Capacitance
lrange
Spectral Application Range
VR = 5 V
VR = 10 mV
VR = 0 V, f = 1 MHz
VR = 5 V, f = 1 MHz
Spot Scan
l= 633nm, VR = 0 V
l= 900nm, VR = 0 V
I = 10 μA
VR = 0V @ l=950nm
RL = 50 Ω,VR = 0 V
RL = 50 Ω,VR = 10 V
R
Responsivity
VBR
NEP
Breakdown Voltage
Noise Equivalent Power
tr
Response Time**
MIN
TYP
MAX
5.0
27.0
100
375
75
350
0.32
0.50
nA
MW
pF
1100
0.36
0.55
50
3.0x10-14
190
13
UNITS
nm
A/W
V
W/ √ Hz
nS
**Response time of 10% to 90% is specified at 660nm wavelength light.
Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are
subject to change without notice.
Advanced Photonix Inc. 1240 Avenida Acaso, Camarillo CA 93012 • Phone (805) 987-0146 • Fax (805) 484-9935 • www.advancedphotonix.com
1150
1100
1050
950
1000
250
900
0.00
* 1/16 inch from case for 3 seconds max.
850
Soldering Temperature*
-40
°C
°C
800
TS
+150
750
Operating Temperature
-55
0.60
700
TO
V
650
Storage Temperature
50
600
TSTG
0.70
UNITS
550
Reverse Voltage
MAX
500
VBR
MIN
300
PARAMETER
Responsivity (A/W)
SYMBOL
450
Low noise
Red enhanced
High shunt resistance
High response
400
•
•
•
•
350
FEATURES