February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM FEATURES GENERAL DESCRIPTION Access time : 55ns Low power consumption: Operation current : 15mA (TYP.), VCC = 3.0V Standby current : 1µ A (TYP.), VCC = 3.0V Wide range power supply : 2.7 ~ 5.5V Fully Compatible with all Competitors 5V product Fully Compatible with all Competitors 3.3V product Fully static operation Tri-state output Data retention voltage : 2.0V (MIN.) All products ROHS Compliant Package : 28-pin 600 mil PDIP 28-pin 330 mil SOP 28-pin 8mm x 13.4mm sTSOP FUNCTIONAL BLOCK DIAGRAM DECODER DQ0-DQ7 I/O DATA CIRCUIT CE# WE# OE# CONTROL CIRCUIT 02/FEB/07, v1.0 The AS6C62256 is well designed for low power application, and particularly well suited for battery back-up nonvolatile memory application. The AS6C62256 operates with wide range power supply 2.7 ~ 5.5V . PIN DESCRIPTION Vcc Vss A0-A14 The AS6C62256 is a 262,144-bit low power CMOS static random access memory organized as 32,768 words by 8 bits. It is fabricated using very high performance, high reliability CMOS technology. Its standby current is stable within the range of operating temperature. 32Kx8 MEMORY ARRAY SYMBOL DESCRIPTION A0 - A14 Address Inputs DQ0 – DQ7 Data Inputs/Outputs CE# Chip Enable Input WE# Write Enable Input OE# Output Enable Input VCC Power Supply VSS Ground COLUMN I/O Alliance Memory Inc. Page 1 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM PIN CONFIGURATION 1 28 Vcc A12 2 27 WE# A7 3 26 A13 A6 4 25 A8 A5 5 24 A9 A4 6 A3 7 A2 8 A1 9 AS6C62256 A14 23 A11 22 OE# 21 A10 20 CE# 19 DQ7 18 DQ6 A0 10 DQ0 11 DQ1 12 17 DQ5 DQ2 13 16 DQ4 Vss 14 15 DQ3 OE# A11 A9 A8 A13 WE# Vcc A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AS6C62256 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CE# DQ7 DQ6 DQ5 DQ4 DQ3 Vss DQ2 DQ1 DQ0 A0 A1 A2 sTSOP PDIP/SOP ABSOLUTE MAXIMUM RATINGS* PARAMETER Terminal Voltage with Respect to VSS SYMBOL VTERM Operating Temperature RATING -0.5 to 7.0 0 to 70(C grade) UNIT V -40 to 85(I grade) -65 to 150 1 50 260 ºC TA Storage Temperature Power Dissipation DC Output Current Soldering Temperature (under 10 sec) TSTG PD IOUT TSOLDER ºC W mA ºC *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability. TRUTH TABLE MODE Standby Output Disable Read Write Note: CE# H L L L OE# X H L X WE# X H H L I/O OPERATION High-Z High-Z DOUT DIN SUPPLY CURRENT ISB,ISB1 ICC,ICC1 ICC,ICC1 ICC,ICC1 H = VIH, L = VIL, X = Don't care. 02/FEB/07, v1.0 Alliance Memory Inc. Page 2 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM DC ELECTRICAL CHARACTERISTICS SYMBOL TEST CONDITION PARAMETER Supply Voltage VCC *1 Input High Voltage VIH *2 Input Low Voltage VIL Input Leakage Current ILI VCC ≧ VIN ≧ VSS Output Leakage VCC ≧ VOUT ≧ VSS, ILO Current Output Disabled Output High Voltage VOH IOH = -1mA Output Low Voltage VOL IOL = 2mA Average Operating Power supply Current ICC ICC1 Standby Power Supply Current ISB ISB1 Cycle time = Min. CE# = VIL , II/O = 0mA MIN. 2.7 0.7*Vcc - 0.5 -1 -55 Cycle time = 1µs CE#≦0.2V and II/O = 0mA other pins at 0.2V or VCC-0.2V CE# = VIH -C CE# ≧VCC - 0.2V -I TYP. 3.3 - *5 MAX. 5.5 VCC+0.5 0.6 1 UNIT V V V µA -1 - 1 µA 2.4 - 3.0 - 0.4 V V - 15 45 mA . - 3 10 mA - 1 1 1 3 *4 50 *4 80 mA µA µA Notes: C = Commercial Temperature I = Industrial Temperature 1. VIH(max) = VCC + 3.0V for pulse width less than 10ns. 2. VIL(min) = VSS - 3.0V for pulse width less than 10ns. 3. Over/Undershoot specifications are characterized, not 100% tested. 4. 10µA for special request 5. Typical values are included for reference only and are not guaranteed or tested. Typical valued are measured at V CC = VCC(TYP.) and TA = 25ºC CAPACITANCE (TA = 25℃, f = 1.0MHz) PARAMETER Input Capacitance Input/Output Capacitance SYMBOL CIN CI/O MIN. - MAX 6 8 UNIT pF pF Note : These parameters are guaranteed by device characterization, but not production tested. AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Levels Output Load 02/FEB/07, v1.0 0.2V to VCC - 0.2V 3ns 1.5V CL = 50pF + 1TTL, IOH/IOL = -1mA/2mA Alliance Memory Inc. Page 3 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM AC ELECTRICAL CHARACTERISTICS (1) READ CYCLE PARAMETER SYM Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Chip Enable to Output in Low-Z Output Enable to Output in Low-Z Chip Disable to Output in High-Z Output Disable to Output in High-Z Output Hold from Address Change tRC tAA tACE tOE tCLZ* tOLZ* tCHZ* tOHZ* tOH (2) WRITE CYCLE PARAMETER SYM Write Cycle Time Address Valid to End of Write Chip Enable to End of Write Address Set-up Time Write Pulse Width Write Recovery Time Data to Write Time Overlap Data Hold from End of Write Time Output Active from End of Write Write to Output in High-Z tWC tAW tCW tAS tWP tWR tDW tDH tOW* tWHZ* AS6C62256-55 MIN MAX. 55 55 55 30 10 5 20 20 10 - UNIT AS6C62256-55 MIN. MAX. 55 50 50 0 45 0 25 0 5 20 UNIT *These parameters are guaranteed by device characterization, but not production tested. 02/FEB/07, v1.0 Alliance Memory Inc. ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Page 4 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM TIMING WAVEFORMS READ CYCLE 1 (Address Controlled) (1,2) tRC Address tAA Dout tOH Previous Data Valid Data Valid READ CYCLE 2 (CE# and OE# Controlled) (1,3,4,5) tRC Address tAA CE# tACE OE# tCLZ Dout High-Z tOLZ tOE tOH tOHZ tCHZ Data Valid High-Z Notes : 1.WE# is high for read cycle. 2.Device is continuously selected OE# = low, CE# = low. 3.Address must be valid prior to or coincident with CE# = low ,; otherwise tAA is the limiting parameter. 4.tCLZ, tOLZ, tCHZ and tOHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state. 5.At any given temperature and voltage condition, t CHZ is less than tCLZ , tOHZ is less than tOLZ. 02/FEB/07, v1.0 Alliance Memory Inc. Page 5 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM WRITE CYCLE 1 (WE# Controlled) (1,2,3,5,6) tWC Address tAW CE# tCW tAS tWP tWR WE# tWHZ Dout TOW High-Z (4) tDW Din (4) tDH Data Valid WRITE CYCLE 2 (CE# Controlled) (1,2,5,6) tWC Address tAW CE# tAS tWR tCW tWP WE# tWHZ Dout (4) High-Z tDW Din tDH Data Valid Notes : 1.WE#, CE# must be high during all address transitions. 2.A write occurs during the overlap of a low CE#, low WE#. 3.During a WE# controlled write cycle with OE# low, tWP must be greater than tWHZ + tDW to allow the drivers to turn off and data to be placed on the bus. 4.During this period, I/O pins are in the output state, and input signals must not be applied. 5.If the CE# low transition occurs simultaneously with or after WE# low transition, the outputs remain in a high impedance state. 6.tOW and tWHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state. 02/FEB/07, v1.0 Alliance Memory Inc. Page 6 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM DATA RETENTION CHARACTERISTICS PARAMETER VCC for Data Retention Data Retention Current Chip Disable to Data Retention Time Recovery Time tRC* = Read Cycle Time SYMBOL TEST CONDITION VDR CE# ≧ VCC - 0.2V VCC = 2.0V IDR CE# ≧ VCC - 0.2V See Data Retention tCDR Waveforms (below) tR MIN. 2.0 TYP. - MAX. 5.5 UNIT V - 0.5 20 µA 0 - - ns tRC* - - ns DATA RETENTION WAVEFORM VDR ≧ 2.0V Vcc Vcc(min.) Vcc(min.) tCDR CE# 02/FEB/07, v1.0 VIH tR CE# ≧ Vcc-0.2V Alliance Memory Inc. VIH Page 7 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM PACKAGE OUTLINE DIMENSION 28 pin 600 mil PDIP Package Outline Dimension SYM. A1 A2 B B1 c D E E1 e eB L S Q1 Θ 02/FEB/07, v1.0 UNIT INCH.(BASE) 0.010 (MIN) 0.150±0.005 0.020 (MAX) 0.055 (MAX) 0.012 (MAX) 1.430 (MAX) 0.6 (TYP) 0.52 (MAX) 0.100 (TYP) 0.625 (MAX) 0.180(MAX) 0.06 (MAX) 0.08(MAX) o 15 (MAX) MM(REF) 0.254 (MIN) 3.810±0.127 0.508(MAX) 1.397(MAX) 0.304 (MAX) 36.322 (MAX) 15.24 (TYP) 13.208 (MAX) 2.540(TYP) 15.87 (MAX) 4.572(MAX) 1.524 (MAX) 2.032(MAX) o 15 (MAX) Alliance Memory Inc. Page 8 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM 28 pin 330 mil SOP Package Outline Dimension SYM. A A1 A2 b c D E E1 e L L1 S y Θ 02/FEB/07, v1.0 UNIT INCH(BASE) 0.120 (MAX) 0.002(MIN) 0.098±0.005 0.016 (TYP) 0.010 (TYP) 0.728 (MAX) 0.340 (MAX) 0.465±0.012 0.050 (TYP) 0.05 (MAX) 0.067±0.008 0.047 (MAX) 0.003(MAX) o o 0 ～10 MM(REF) 3.048 (MAX) 0.05(MIN) 2.489±0.127 0.406(TYP) 0.254(TYP) 18.491 (MAX) 8.636 (MAX) 11.811±0.305 1.270(TYP) 1.270 (MAX) 1.702 ±0.203 1.194 (MAX) 0.076(MAX) o o 0 ～10 Alliance Memory Inc. Page 9 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM 28 pin 8mm x 13.4mm sTSOP Package Outline Dimension SYM. A A1 A2 b c Db E e D L L1 y Θ UNIT INCH(BASE) MM(REF) 0.047 (MAX) 0.004±0.002 0.039±0.002 0.006 (TYP) 0.010 (TYP) 0.465±0.004 0.315±0.004 0.022 (TYP) 0.528±0.008 0.020±0.004 0.0315±0.004 0.08(MAX) o o 0 ～5 1.20 (MAX) 0.10±0.05 1.00±0.05 0.15(TYP) 0.254(TYP) 11.80±0.10 8.00±0.10 0.55(TYP) 13.40±0.20 0.50±0.10 0.80±0.10 0.003(MAX) o o 0 ～5 Note：E dimension is not including end flash. The total of both sides’ end flash is not above 0.3mm. 02/FEB/07, v1.0 Alliance Memory Inc. Page 10 of 12 February 2007 AS6C62256 ® 32K X 8 BIT LOW POWER CMOS SRAM ORDERING INFORMATION Ordering Codes Alliance Organization VCC range Operating Speed Temp ns Commercial ~ 0º C to 70º C 55 Commercial ~ 0º C to 70º C 55 Industrial ~ -40ºC to 85º C 55 Commercial ~ 0º C to 70º C 55 Industrial ~ -40ºC to 85º C 55 Package AS6C62256-55PCN 32k x 8 2.7-5.5V 28pin 600mil PDIP AS6C62256-55SCN 32k x 8 2.7-5.5V 28pin 330mil SOP AS6C62256-55SIN 32k x 8 2.7-5.5V 28pin 330mil SOP AS6C62256-55STCN 32k x 8 2.7-5.5V 28pin sTSOP (8 x 13.4 mm) AS6C62256-55STIN 32k x 8 2.7-5.5V 28pin sTSOP (8 x 13.4 mm) Part numbering system AS6C 62256 low Device power Number SRAM 62256 prefix - 55 X Package Options: P = 28 pin 600 mil P-DIP Access S = 28 pin 330 mil SOP Time ST = 28 pin sTSOP (8mm x 13.4 mm) 02/FEB/07, v1.0 Alliance Memory Inc. X N Temperature Range: C = Commercial N = Lead (0ºC to +70º C) Free ROHS I = Industrial Compliant (-40º to +85º C) Part Page 11 of 12 February 2007 AS6C62256 Rev 1 ® ® Alliance Memory, Inc. 1116 South Amphlett, #2, San Mateo, CA 94402 Tel: 650-525-3737 Fax: 650-525-0449 Copyright © Alliance Memory All Rights Reserved Part Number: AS6C62256 Document Version: v. 1.0 www.alliancememory.com © Copyright 2003 Alliance Memory, Inc. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. 02/FEB/07, v1.0 Alliance Memory Inc. Page 12 of 12