AMIS-30624 I2C Microstepping Motordriver Data Sheet 1.0 General Description The AMIS-30624 is a single-chip microstepping motordriver with a position controller and control/diagnostic interface. It is ready to build intelligent peripheral systems where up to 32 drivers can be connected to one I2C master. This significantly reduces system complexity. The chip receives positioning instructions through the bus and subsequently drives the stator coils so the two-phase stepper motor moves to the desired position. The on-chip position controller is configurable (OTP or RAM) for different motor types, positioning ranges and parameters for speed, acceleration and deceleration. Microstepping allows silent motor operation and increased positioning resolution. The advanced motion qualification mode enables verification of the complete mechanical system in function of the selected 2 2 motion parameters. The AMIS-30624 can easily be connected to an I C bus where the I C master can fetch specific status information like actual position, error flags, etc. from each individual slave node. An integrated sensorless step-loss detection prevents the positioner from loosing steps and stops the motor when running into stall. This enables silent, yet accurate position calibrations during a referencing run and allows semi-closed loop operation when approaching the mechanical end-stops. The chip is implemented in I2T100 technology, enabling both high voltage analog circuitry and digital functionality on the same chip. The AMIS-30624 is fully compatible with the automotive voltage requirements. 2.0 Product Features Motordriver • Microstepping technology • Sensorless step-loss detection • Peak current up to 800mA • Fixed frequency PWM current-control • Selectable PWM frequency • Automatic selection of fast and slow decay mode • No external fly-back diodes required • 14V/24V compliant • Motion qualification mode Controller with RAM and OTP memory • Position controller • Configurable speeds and acceleration • Input to connect optional motion switch I2C interface • Bi-directional 2-wire bus for Inter IC Control • Field programmable node addresses • Full diagnostics and status information Protection • Over-current protection • Under-voltage management • Open circuit detection • High-temp warning and management • Low-temp flag EMI compatibility • High voltage outputs with slope control • HV outputs with slope control AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 1 AMIS-30624 I2C Microstepping Motordriver Data Sheet 3.0 Applications The AMIS-30624 is ideally suited for small positioning applications. Target markets include: automotive (headlamp alignment, HVAC, idle control, cruise control), industrial equipment (lighting, fluid control, labeling, process control, XYZ tables, robots) and building automation (HVAC, surveillance, satellite dish, renewable energy systems). Suitable applications typically have multiple axes or require mechatronic solutions with the driver chip mounted directly on the motor. 4.0 Ordering Information Table 1: Ordering Information Part No. AMIS-30624 PGA AMIS-30624 PNA Package Peak Current Temp. Range SOIC-20 NQFP-32 (7 x 7 mm) 800mA 800mA -40°C…..125°C -40°C…..125°C Ordering Code Tubes 0C624-004-XTD 0C624-005-XTD Ordering Code Tapes 0C624-004-XTP 0C624-005-XTP 5.0 Quick Reference Data Table 2: Absolute Maximum Ratings Parameter Vbb Supply voltage (2) Min. Max. -0.3 +40 Unit (1) V Tamb Ambient temperature under bias -50 +150 Tst Storage temperature -55 +160 °C Electrostatic discharge voltage on pins -2 +2 kV Vesd (3) °C Notes: (1) For limited time <0.5s (2) The circuit functionality is not guaranteed. (3) Human body model (100pF via 1.5 kΩ, according to JEDEC EIA-JESD22-A114-B) Table 3: Operating Ranges Parameter Vbb Top Min. Supply voltage Operating temperature range AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com Max. Unit +8 +29 V Vbb ≤ 18V -40 +125 °C Vbb ≤ 29V -40 +85 °C 2 AMIS-30624 I2C Microstepping Motordriver Data Sheet 6.0 Table of Contents 1.0 General Description.............................................................................................................................................................................. 1 2.0 Product Features .................................................................................................................................................................................. 1 3.0 Applications .......................................................................................................................................................................................... 2 4.0 Ordering Information............................................................................................................................................................................. 2 5.0 Quick Reference Data .......................................................................................................................................................................... 2 6.0 Content................................................................................................................................................................................................. 3 7.0 Block Diagram ...................................................................................................................................................................................... 5 8.0 Pin-out .................................................................................................................................................................................................. 6 9.0 Package Thermal Resistance............................................................................................................................................................... 7 9.1 SOIC-20............................................................................................................................................................................................ 7 9.2 NQFP-32........................................................................................................................................................................................... 7 10.0 DC Parameters................................................................................................................................................................................... 8 11.0 AC Parameters ................................................................................................................................................................................. 10 12.0 Typical Application............................................................................................................................................................................ 12 13.0 Positioning Parameters .................................................................................................................................................................... 12 13.1 Stepping Modes ............................................................................................................................................................................ 12 13.2 Maximum Velocity......................................................................................................................................................................... 13 13.3 Minimum Velocity.......................................................................................................................................................................... 13 13.4 Acceleration and Deceleration ...................................................................................................................................................... 14 13.5 Positioning .................................................................................................................................................................................... 14 13.5.1. Position Ranges .................................................................................................................................................................... 15 13.5.2. Secure Position ..................................................................................................................................................................... 15 13.5.3. Shaft...................................................................................................................................................................................... 15 14.0 Structural Description ....................................................................................................................................................................... 16 14.1 Stepper Motordriver ...................................................................................................................................................................... 16 14.2 Control Logic (Position Controller and Main Control) .................................................................................................................... 16 14.3 Motion Detection ........................................................................................................................................................................... 16 14.4 Miscellaneous ............................................................................................................................................................................... 16 15.0 Functional Description ...................................................................................................................................................................... 17 15.1 Position Controller......................................................................................................................................................................... 17 15.1.1. Positioning and Motion Control.............................................................................................................................................. 17 15.1.2. Dual Positioning .................................................................................................................................................................... 19 15.1.3. Position Periodicity ................................................................................................................................................................ 19 15.1.4. Hardwired Address HW......................................................................................................................................................... 20 15.1.5. External Switch SWI.............................................................................................................................................................. 22 15.2 Main Control and Register, OTP Memory + ROM......................................................................................................................... 23 15.2.1. Power-up Phase.................................................................................................................................................................... 23 15.2.2. Reset State............................................................................................................................................................................ 23 15.2.3. Soft Stop ............................................................................................................................................................................... 23 15.2.4. Thermal Shutdown Mode ...................................................................................................................................................... 23 15.2.5. Temperature Management .................................................................................................................................................... 24 15.2.6. Battery Under-voltage Management...................................................................................................................................... 25 15.2.7. OTP register .......................................................................................................................................................................... 25 15.2.8. RAM Registers ...................................................................................................................................................................... 29 15.2.9. Flags Table............................................................................................................................................................................ 30 15.2.10. Priority Encoder................................................................................................................................................................... 31 15.3 Motordriver.................................................................................................................................................................................... 33 15.3.1. Current waveforms in the coils .............................................................................................................................................. 33 15.3.2. PWM Regulation ................................................................................................................................................................... 34 15.3.3. PWM Jitter............................................................................................................................................................................. 34 15.3.4. Motor Starting Phase............................................................................................................................................................. 34 15.3.5. Motor Stopping Phase........................................................................................................................................................... 34 15.3.6. Charge Pump Monitoring ...................................................................................................................................................... 35 15.3.7. Electrical Defect on Coils, Detection and Confirmation ......................................................................................................... 35 15.3.8. Motor Shutdown Mode .......................................................................................................................................................... 36 15.4 Motion Detection ........................................................................................................................................................................... 37 AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 3 AMIS-30624 I2C Microstepping Motordriver Data Sheet 16.0 I2C Bus Description .......................................................................................................................................................................... 39 16.1 General Description ...................................................................................................................................................................... 39 16.2 Concept ........................................................................................................................................................................................ 39 16.3 General Characteristics ................................................................................................................................................................ 40 16.4 Bit Transfer ................................................................................................................................................................................... 40 16.4.1. Data Validity .......................................................................................................................................................................... 40 16.4.2. START and STOP Conditions ............................................................................................................................................... 41 16.5 Transferring Data .......................................................................................................................................................................... 41 16.5.1. Byte Format........................................................................................................................................................................... 41 16.5.2. Acknowledge ......................................................................................................................................................................... 42 16.5.3. Clock Generation................................................................................................................................................................... 42 16.6 Data Formats with 7-bit Addresses ............................................................................................................................................... 42 16.6.1. Data Transfer Formats .......................................................................................................................................................... 43 16.7 7-bit Addressing ............................................................................................................................................................................ 44 16.7.1. Definition of Bits in the First Byte........................................................................................................................................... 44 16.7.2. General Call Address ............................................................................................................................................................ 44 17.0 I2C Application Commands............................................................................................................................................................... 45 17.1 Introduction ................................................................................................................................................................................... 45 17.2 Commands Table.......................................................................................................................................................................... 45 17.3 Application Commands ................................................................................................................................................................. 46 18.0 Resistance to Electrical and Electromagnetic Disturbances............................................................................................................. 52 18.1 Electrostatic Discharges ............................................................................................................................................................... 52 18.2 Electrical Transient Conduction Along Supply Lines..................................................................................................................... 52 18.3 EMC.............................................................................................................................................................................................. 52 18.4 Power Supply Micro-interruptions ................................................................................................................................................. 52 19.0 Package Outline ............................................................................................................................................................................... 53 20.0 Soldering .......................................................................................................................................................................................... 55 20.1 Introduction to Soldering Surface Mount Packages ...................................................................................................................... 55 20.2 Re-flow Soldering.......................................................................................................................................................................... 55 20.3 Wave Soldering............................................................................................................................................................................. 55 20.4 Manual Soldering .......................................................................................................................................................................... 55 21.0 Company or Product Inquiries .......................................................................................................................................................... 56 22.0 Document History ............................................................................................................................................................................. 56 AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 4 AMIS-30624 I2C Microstepping Motordriver Data Sheet 7.0 Block Diagram SDA SWI SCK AMIS-30624 I2C-bus Interface Position Controller HW PWM regulator X Controller TST1 TST2 MOTXP MOTXN I-sense Decoder Main Control Registers OTP - ROM Sinewave Table Stall detection DAC's 4 MHz Vref Voltage Regulator VBB VDD Temp sense Oscillator PWM regulator Y Charge Pump I-sense CPN CPP VCP GND Figure 1: Block Diagram AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com MOTYP MOTYN 5 PC20060925.1 AMIS-30624 I2C Microstepping Motordriver Data Sheet 8.0 Pin-out 3 18 MOTXP GND 4 17 GND TST1 5 16 MOTXN TST2 6 15 MOTYP GND 7 14 GND VBB CPP 10 11 VCP XP 1 24 XP 2 23 YN VBB 3 22 VBB VBB 4 21 VBB AMIS-30624 YN VBB VBB 5 20 SWI NC SDA 6 19 VCP 7 18 CPP 8 17 CPN Top view NQ32 9 10 11 12 13 14 15 16 NC 12 25 HW GND 9 26 TST2 CPN 27 TST1 MOTYN 28 GND 13 29 VDD 8 30 SCK HW 31 GND VDD 32 GND VBB YP 19 YP 2 XN SCK XN SWI GND 20 GND 1 AMIS-30624 SDA PC20050925.3 PC20060925.2 Figure 2: SOIC 20 and NQFP-32 Pin-out Table 4: Pin Description Pin Name Pin Description SOIC-20 NQFP-32 2 1 8 I C serial clock line 2 2 9 VDD Internal supply (needs external decoupling capacitor) 3 10 GND Ground, heat sink 4,7,14,17 11, 14, 25, 26, 31, 32 TST1 Test pin (to be tied to ground in normal operation) 5 12 TST2 Test pin (to be left open in normal operation: internally pulled up) 6 13 HW Hard wired address bit 8 15 CPN Negative connection of pump capacitor (charge pump) 9 17 CPP Positive connection of pump capacitor (charge pump) 10 18 VCP Charge-pump filter-capacitor 11 19 VBB Battery voltage supply 12,19 3, 4, 5, 20, 21, 22 MOTYN Negative end of phase Y coil 13 23, 24 MOTYP Positive end of phase Y coil 15 27, 28 MOTXN Negative end of phase X coil 16 29, 30 MOTXP Positive end of phase X coil 18 1, 2 SWI Switch input 20 NC Not connected (to be tied to ground) SDA I C serial data line SCK AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 6 7, 16 6 AMIS-30624 I2C Microstepping Motordriver Data Sheet 9.0 Package Thermal Resistance 9.1 SOIC-20 To lower the junction-to-ambient thermal resistance, it is recommended to connect the ground leads to a printed circuit board (PCB) ground plane layout as illustrated in Figure 3. The junction-to-case thermal resistance is dependent on the copper area, copper thickness, PCB thickness and number of copper layers. Calculating with a total area of 460 mm2, 35µm copper thickness, 1.6mm PCB thickness and 1 layer, the thermal resistance is 28°C/W; leading to a junction-ambient thermal resistance of 63°C/W. SOIC-20 PC20041128.1 Figure 3: PCB Ground Plane Layout Condition 9.2 NQFP-32 The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the package partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to conduct heat away from the package. A thermal grounded pad with thermal vias can achieve this. With a layout as shown in Figure 4, the thermal resistance junction – to – ambient can be brought down to a level of 25°C/W. NQFP-32 PC20041128.2 Figure 4: PCB Ground Plane Layout Condition AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 7 AMIS-30624 I2C Microstepping Motordriver Data Sheet 10.0 DC Parameters The DC parameters are given for Vbb and temperature in their operating ranges. Currents flowing in the circuit are defined as positive. Table 5: DC Parameters Symbol Pin(s) Parameter Test Conditions Min. Typ. Max. Unit Motordriver Max. current through motor coil in normal operation Max. RMS current through coil in normal operation Absolute error on coil current IMSmax,Peak IMSmax,RMS IMSabs IMSrel RDSon MOTXP MOTXN Error on current ratio Icoilx / Icoily MOTYP MOTYN On resistance for each motor pin (including bond wire) at IMSmax IMSL Pull down current 800 mA 570 mA -10 10 % -7 7 % Ω Vbb = 12V, Tj = 50 °C 0.50 1 Vbb = 8V, Tj = 50 °C 0.55 1 Ω Vbb = 12V, Tj = 150 °C 0.70 1 Ω Vbb = 8V, Tj = 150 °C 0.85 1 HiZ mode 2 Ω mA Thermal Warning & Shutdown Ttw Thermal warning (1) (2) Ttsd Tlow (2) 138 145 152 °C Thermal shutdown Ttw + 10 °C Low temperature warning Ttw - 155 °C Supply and Voltage Regulator Vbb Nominal operating supply range VbbOTP Supply voltage for OTP zapping Ibat VBB Tamb ≤ 125 °C 6.5 18 V Tamb ≤ 85 °C 6.5 29 V 9.0 10.0 V 3.50 10.0 mA µA (3) Total current consumption Unloaded outputs Ibat_s Sleep mode current consumption 50 100 UV1 Stop voltage high threshold 7.8 8.4 8.9 V UV2 Stop voltage low threshold 7.1 7.5 8.0 V Vdd Internal regulated output 4.75 5 5.50 IddStop VddReset VDD (4) 8V < Vbb < 29V Digital current consumption Vbb < UV2 Digital supply reset level @ power down 2 (5) Current limitation IddLim Pin shorted to ground V mA 4.5 V 42 mA 2 kΩ 29 V Switch Input and Hardwire Address Input Rt_OFF Switch OFF resistance Rt_ON Vbb_sw (6) (6) SWI HW Switch ON resistance Vbb range for guaranteed operation of SWI and HW Switch to Gnd or Vbat, 10 kΩ 6 Vmax_sw Maximum voltage T < 1s 40V Ilim_sw Current limitation Short to Gnd or Vbat 30 V mA 2 I C Serial Interface (7) VIL Input level low VIH Input level high Noise margin at the LOW level for each connected device (including hysteresis) Noise margin at the HIGH level for each connected device (including hysteresis) VnL (8) SDA SCK VnH AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com - 0.5 0.3 * Vdd V 0.7 * Vdd Vdd + 0.5 V 0.1 * Vdd 0.2 * Vdd 8 V AMIS-30624 I2C Microstepping Motordriver Data Sheet Table 5: DC Parameters (cont.) Charge Pump Vcp VCP Output voltage Vbb > 15V 8V < Vbb < 15V Vbb+10 Vbb+12.5 Vbb+15 2 * Vbb – 5 2 * Vbb – 2.5 2 * Vbb V V Cbuffer External buffer capacitor 220 470 nF Cpump CPP CPN External pump capacitor 220 470 nF Motion Qualification Mode Output VOUT Output voltage swing ROUT Output impedance SWI Av Gain = VSWI / VBEMF Notes: (1) (2) (3) (4) (5) (6) (7) (8) 2 TestBemf I C command 2 Service mode I C command 2 Service mode I C command 0 - 4,85 2 0,50 No more than 100 cumulated hours in life time above Ttsd. Thermal shutdown and a low temperature warning are derived from thermal warning. A 10µF buffer capacitor of between VBB and GND is the minimum needed. Short connections to the power supply are recommended. Pin VDD must not be used for any external supply The RAM content will not be altered above this voltage. External resistance value seen from pin SWI or HW, including 1kΩ series resistor. If input voltages < - 0.3V, than a resistor between 22Ω to 100Ω needs to be put in series If the I2C-bus is operated in Fast Mode VIHmin = 0.7 * Vdd AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 9 V kΩ AMIS-30624 I2C Microstepping Motordriver Data Sheet 11.0 AC Parameters The AC parameters are given for Vbb and temperature in their operating ranges. All timing values of the I2C transceiver are referred to VIHman and VILmax levels (see Figure 5). Table 6: AC Parameters Symbol Pin(s) Parameter Test Conditions Min. Typ. Max. Unit 10 ms 4.4 MHz Power-up Tpu Power-up time Guaranteed by design Internal Oscillator fosc Frequency of internal oscillator 3.6 4.0 2 I C Transceiver (Generic) CB CI Capacitive load of each bus line SDA SCK Capacitance of SDA / SCK pin Pulse width of spikes which must be tSP suppressed by the input filter 2 I C Transceiver (Standard Mode) fSCL tLOW tHIGH tSU,START tHD,DATA 10 SDA SCK tSU,DATA pF pF 50 SCL clock frequency Hold time (repeated) START condition. After this period the first clock pulse is generated. LOW period of the SCK clock tHD,START (1) 400 ns 100 4.0 kHz µs 4.7 µs 4.0 µs HIGH period of the SCK clock Set-up time for a repeated START condition 2 Data hold time for I C bus devices 0 Data set-up time 250 4.7 (2) µs (3) 3.45 µs ns tR Rise time of SDA and SCK signals 1.0 µs tF Fall time of SDA and SCK signals 0.3 µs tSU,STOP Set-up time for STOP condition Bus free time between STOP and tBUF START condition 2 I C Transceiver (Fast Mode) fSCL SCL clock frequency Hold time (repeated) START condition. After this period the first clock pulse is generated. LOW period of the SCK clock tHD,START tLOW tHIGH tSU,START tHD,DATA tSU,DATA SDA SCK 4.0 µs 4.7 µs 360 0.6 HIGH period of the SCK clock Set-up time for a repeated START condition 2 Data hold time for I C bus devices µs 1.3 µs 0.6 µs 0.6 0 Data set-up time (2) 100 µs 0.9 (3) (4) Rise time of SDA and SCK signals 20 + 0.1CB 300 tF Fall time of SDA and SCK signals 20 + 0.1CB 300 tBUF Set-up time for STOP condition Bus free time between STOP and START condition AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 10 µs ns tR tSU,STOP kHz ns ns 0.6 µs 1.3 µs AMIS-30624 I2C Microstepping Motordriver Data Sheet Table 6: AC Parameters (cont.) Switch Input and Hardwire Address Input Tsw Scan pulse period SWI HW Tsw_on (5) Scan pulse duration 1024 µs 128 µs Motordriver Fpwm PWM frequency Fjit_depth PWM jitter modulation depth MOTxx Tbrise (5) Turn-on transient time PWMfreq = 0 (6) 20.6 22.8 25.0 kHz PWMfreq = 1 (6) 41,2 45,6 50,0 kHz PWMJen = 1 (6) Between 10% and 90% Tbfall Turn-off transient time Tstab Run current stabilization time 10 % 170 ns 140 29 ns 32 35 ms Charge Pump CPN CPP fCP Notes: (1) (2) (3) (4) (5) (6) Charge pump frequency (5) 250 kHz The maximum number of connected I2C devices is dependent on the number of available addresses and the maximum bus capacitance to still guarantee the rise and fall times of the bus signals. An I2C device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. The maximum tHD,DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal. A Fast-mode I2C-bus device can be used in a standard-mode I2C bus system, but the requirement tSU,DATA ≥ 250ns must than be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU,DATA = 1000 + 250 = 1250ns (according to the standard-mode I2C-bus specification) before the SCL line is released. Derived from internal oscillator. See SetMotorParam and PWM regulator. START SDA REPEATED START STOP START VIHmin VILmax tF SCK tSU,DATA tR tHD,START tHD,DATA tLOW tBUF tSU,START tSP tSU,STOP tHIGH PC20060925.8 Figure 5: I2C Timing Diagrams AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 11 AMIS-30624 I2C Microstepping Motordriver Data Sheet C1 220 nF 100 µF C3 CPN VDD 1 µF 9 220 nF VBAT C4 CPP 10 C5 VBB VCP 11 100 nF 12.0 Typical Application 12 3 20 AMIS-30624 HW 8 1 kΩ 18 MOTXP 16 MOTXN 13 6 5 TST1 TST2 4 7 14 MOTYN 17 GND All resistors are ± 5%, ¼ W. Depending on the application, the ESR value and working voltage of C1 must be carefully chosen. C2 must be a ceramic capacitor to assure low ESR. C3 and C4 must be as close as possible to pins CPN, CPP, VCP, and VBB to reduce EMC radiation. C5 and C6 must be close to pins VBB and GND. 13.0 Positioning Parameters 13.1 Stepping Modes One of four possible stepping modes can be programmed: • • • • Half stepping 1/4 microstepping 1/8 microstepping 1/16 microstepping AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com Connect to VBAT or GND 12 M MOTYP Figure 6: Typical Application Diagram Notes: (1) (2) (3) (4) (5) R2 1 kΩ SCK 2 R1 SWI C2 15 Connect to VBAT or GND 100 nF VBB 19 SDA 1 I2 C bus C6 PC20060925.5 AMIS-30624 I2C Microstepping Motordriver Data Sheet 13.2 Maximum Velocity For each stepping mode, the maximum velocity Vmax can be programmed to 16 possible values given in Table 7. The accuracy of Vmax is derived from the internal oscillator. Under special circumstances it is possible to change the Vmax parameter while a motion is ongoing. All 16 entries for the Vmax parameter are divided into four groups. When changing Vmax during a motion the application must take care that the new Vmax parameter stays within the same group, otherwise steps might be lost. Table 7: Maximum Velocity Selection Table Vmax Index Vmax Group (Full-step/s) Hex Dec 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 99 136 167 197 213 228 243 273 303 334 364 395 456 546 729 973 Stepping Mode th th 1/4 1/8 Microstepping Microstepping (Micro-step/s) (Micro-step/s) 395 790 546 1091 668 1335 790 1579 851 1701 912 1823 973 1945 1091 2182 1213 2426 1335 2670 1457 2914 1579 3159 1823 3647 2182 4364 2914 5829 3891 7782 Half stepping (Half-step/s) A 197 273 334 395 425 456 486 546 607 668 729 790 912 1091 1457 1945 B C D th 1/16 Microstepping (Micro-step/s) 1579 2182 2670 3159 3403 3647 3891 4364 4852 5341 5829 6317 7294 8728 11658 15564 13.3 Minimum Velocity Once the maximum velocity is chosen, 16 possible values can be programmed for the minimum velocity Vmin. Table 8 provides the obtainable values in full-step/s. The accuracy of Vmin is derived from the internal oscillator. Table 8: Obtainable Values in Full-step/s for the Minimum Velocity Vmin Index Hex 0 1 2 3 4 5 6 7 8 9 A B C D E F Notes: (1) (2) Dec 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Vmax Factor 1 1/32 2/32 3/32 4/32 5/32 6/32 7/32 8/32 9/32 10/32 11/32 12/32 13/32 14/32 15/32 Vmax (Full-step/s) A 99 99 3 6 9 12 15 18 21 24 28 31 34 37 40 43 46 B 136 136 4 8 12 16 21 25 30 33 38 42 47 51 55 59 64 167 167 5 10 15 20 26 31 36 41 47 51 57 62 68 72 78 197 197 6 11 18 24 31 36 43 49 55 61 68 73 80 86 93 C 213 213 6 12 19 26 32 39 46 52 59 66 72 79 86 93 99 228 228 7 13 21 28 35 42 50 56 64 71 78 85 93 99 107 243 243 7 14 22 30 37 45 52 60 68 75 83 91 98 106 113 273 273 8 15 25 32 42 50 59 67 76 84 93 101 111 118 128 303 303 8 17 27 36 46 55 65 74 84 93 103 113 122 132 141 334 334 10 19 31 40 51 61 72 82 93 103 114 124 135 145 156 364 364 10 21 32 44 55 67 78 90 101 113 124 135 147 158 170 395 395 11 23 36 48 61 72 86 97 111 122 135 147 160 172 185 456 456 13 27 42 55 71 84 99 113 128 141 156 170 185 198 214 546 546 15 31 50 65 84 99 118 134 153 168 187 202 221 237 256 D 729 729 19 42 65 88 111 134 156 179 202 225 248 271 294 317 340 973 973 27 57 88 118 149 179 210 240 271 301 332 362 393 423 454 The Vmax factor is an approximation. In case of motion without acceleration (AccShape = 1) the length of the steps = 1/Vmin. In case of accelerated motion (AccShape = 0) the length of the first step is shorter than 1/Vmin depending of Vmin, Vmax and Acc. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 13 AMIS-30624 I2C Microstepping Motordriver Data Sheet 13.4 Acceleration and Deceleration Sixteen possible values can be programmed for Acc (acceleration and deceleration between Vmin and Vmax). Table 9 provides the obtainable values in full-step/s². One observes restrictions for some combination of acceleration index and maximum speed (gray cells). The accuracy of Acc is derived from the internal oscillator. 167 197 213 228 243 273 303 334 364 395 456 546 729 973 Acceleration (Full-step/s²) 49 106 14785 Table 9: Acceleration and Deceleration Selection Table 99 136 Vmax (FS/s) → ↓ Acc Index Hex Dec 0 0 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 A 10 B 11 C 12 D 13 E 14 F 15 29570 218 1004 3609 6228 8848 11409 13970 16531 19092 21886 24447 27008 29570 34925 40047 473 735 The formula to compute the number of equivalent full-step during acceleration phase is: Nstep = Vmax 2 − Vmin 2 2 × Acc 13.5 Positioning The position is programmed in the command SetPosition and is given as a number of (micro)steps. According to the chosen stepping mode, the position words must be aligned as described in Table 10. When using command GotoSecurePosition, data is automatically aligned. Table 10: Position Word Alignment Stepping Mode th 1/16 S B14 th 1/8 S B13 th 1/4 S B12 Half-stepping S B11 SecurePosition S B9 Notes: (1) (2) B13 B12 B11 B10 B8 B12 B11 B10 B9 B7 B11 B10 B9 B8 B6 Position Word: Pos[15:0] B10 B9 B8 B7 B6 B5 B9 B8 B7 B6 B5 B4 B8 B7 B6 B5 B4 B3 B7 B6 B5 B4 B3 B2 B5 B4 B3 B2 B1 LSB LSB: Least significant bit S: Sign bit AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 14 B4 B3 B2 B1 0 B3 B2 B1 LSB B2 B1 LSB 0 B1 LSB 0 0 LSB 0 0 0 0 0 0 0 Shift No shift 1-bit left ⇔ ×2 2-bit left ⇔ ×4 3-bit left ⇔ ×8 No shift AMIS-30624 I2C Microstepping Motordriver Data Sheet 13.5.1. Position Ranges A position is coded by using the binary two’s complement format. According to the positioning commands used and to the chosen stepping mode, the position range will be as shown in Table 11. Table 11: Position Range Command SetPosition Stepping Mode Half stepping th 1/4 microstepping th 1/8 microstepping th 1/16 microstepping Position Range -4096 to +4095 -8192 to +8191 -16384 to +16383 -32768 to +32767 Full Range Excursion 8192 half-steps 16384 micro-steps 32768 micro-steps 65536 micro-steps Number of Bits 13 14 15 16 When using the command SetPosition, although coded on 16 bits, the position word will have to be shifted to the left by a certain number of bits, according to the stepping mode. 13.5.2. Secure Position A secure position can be programmed. It is coded in 11-bits, thus having a lower resolution than normal positions, as shown in Table 12. See also the command GotoSecurePosition. Table 12: Secure Position Stepping Mode Half-stepping th 1/4 microstepping th 1/8 microstepping th 1/16 microstepping Secure Position Resolution 4 half-steps th 8 micro-steps (1/4 ) th 16 micro-steps (1/8 ) th 32 micro-steps (1/16 ) Important Notes: (1) The secure position is disabled in case the programmed value is the reserved code “10000000000” (0x400 or most negative position). (2) The resolution of the secure position is limited to 9 bit at start-up. The OTP register is copied in RAM as illustrated below. SecPos1 and SecPos0 = 0. SecPos10 SecPos9 SecPos8 SecPos2 SecPos10 SecPos9 SecPos8 SecPos2 SecPos1 SecPos0 RAM OTP 13.5.3. Shaft A shaft bit which can be programmed in OTP or with command SetMotorParam, defines whether a positive motion is a clockwise or counter-clockwise rotation (an outer or an inner motion for linear actuators): • Shaft = 0 ⇒ MOTXP is used as positive pin of the X coil, while MOTXN is the negative one • Shaft = 1 ⇒ opposite situation. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 15 AMIS-30624 I2C Microstepping Motordriver Data Sheet 14.0 Structural Description See also the Block Diagram in Figure 1. 14.1 Stepper Motordriver The motordriver receives the control signals from the control logic. The main features are: • Two H-bridges designed to drive a stepper motor with two separated coils. Each coil (X and Y) is driven by one H-bridge and the driver controls the currents flowing through the coils. The rotational position of the rotor, in unloaded condition, is defined by the ratio of current flowing in X and Y. The torque of the stepper motor when unloaded is controlled by the magnitude of the currents in X and Y. • The control block for the H-bridges including the PWM control, the synchronous rectification and the internal current sensing circuitry • The charge pump to allow driving of the H-bridges’ high side transistors • Two pre-scale 4-bit DACs to set the maximum magnitude of the current through X and Y • Two DACs to set the correct current ratio through X and Y Battery voltage monitoring is also performed by this block, which provides information to the control logic part. The same applies for the detection and reporting of an electrical problem that could occur on the coils or the charge pump. 14.2 Control Logic (Position Controller and Main Control) The control logic block stores the information provided by the I2C interface (in a RAM or an OTP memory) and digitally controls the positioning of the stepper motor in terms of speed and acceleration, by feeding the right signals to the motordriver state machine. It will take into account the successive positioning commands to properly initiate or stop the stepper motor in order to reach the set point in a minimum time. It also receives feedback from the motordriver part in order to manage possible problems and decide on internal actions and reporting to the I2C interface. 14.3 Motion Detection Motion detection is based on the back emf, generated internally in the running motor. When the motor is blocked, for example when it hits the end-position, the velocity and as a result also the generated back emf, is disturbed. The AMIS-30624 senses the back emf, calculates a moving average and compares the value with two independent threshold levels. If the back emf disturbance is bigger than the set threshold, the running motor is stopped. 14.4 Miscellaneous The AMIS-30624 also contains the following: • • • • An internal oscillator needed for the control logic and the PWM control of the motor driver An internal trimmed voltage source for precise referencing A protection block featuring a thermal shutdown and a power-on-reset circuit A 5V regulator (from the battery supply) to supply the internal logic circuitry AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 16 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.0 Functional Description This chapter describes the following functional blocks in more detail: • Position controller • Main control and register, OTP memory + ROM • Motordriver The motion detection and I2C control are discussed in separate chapters. 15.1 Position Controller 15.1.1. Positioning and Motion Control A positioning command will produce a motion as illustrated in Figure 7. A motion starts with an acceleration phase from minimum velocity (Vmin) to maximum velocity (Vmax), and ends with a symmetrical deceleration. This is defined by the control logic according to the position required by the application and the parameters programmed by the application during configuration phase. The current in the coils is also programmable. Velocity Acceleration range Zero speed Hold current Deceleration range Zero speed Hold current Vmax Vmin Position P=0 Pstart Pmin Pstop Optional zero switch Pmax Figure 7: Positioning and Motion Control Table 13: Position Related Parameters Parameter Pmax – Pmin Zero speed hold current Maximum current Acceleration and deceleration Vmin Vmax AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com Reference See Positioning See Ihold See Irun See Acceleration and deceleration See Minimum velocity See Maximum velocity 17 AMIS-30624 I2C Microstepping Motordriver Data Sheet Different positioning examples are shown in Table 14. Table 14: Positioning Examples Positioning Examples Velocity Short motion time Velocity New positioning command in same direction, shorter or longer, while a motion is running at maximum velocity. time Velocity New positioning command in same direction while in deceleration phase Note: there is no wait time between the deceleration phase and the new acceleration phase. time Velocity New positioning command in reverse direction while motion is running at maximum velocity. time Velocity New positioning command in reverse direction while in deceleration phase. time Velocity New velocity programming while motion is Running. time AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 18 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.1.2. Dual Positioning A SetDualPosition command allows the user to perform positioning using two different velocities. The first motion is done with the specified Vmin and Vmax velocities in the SetDualPosition command, with the acceleration (deceleration) parameter already in RAM, to a position Pos1[15:0] also specified in SetDualPosition . Velocity Reset ActPos Pos1[15:0] Pos1[15:0] + Pos2[15:0] A second relative motion to a position Pos1[15:0] + Pos2[15:0] is done at the specified Vmin velocity in the SetDualPosition command (no acceleration). Once the second motion is achieved, the ActPos register is reset to zero, whereas TagPos register is not changed. Vmax Vmin First motion Second motion t 27 ms 27 ms PC20070221.1 Figure 8:Dual Positioning Remark: This operation cannot be interrupted or influenced by any further command unless the conditions exist to cause a motor shutdown or by a HardStop command. Sending a SetDualPosition command while a motion is already ongoing is not recommended. Notes: (0) (1) (2) (3) (4) (5) (6) (7) (8) The priority encoder describes the management of states and commands. All notes below are to be considered illustrative. The last SetPosition command issued during a DualPosition sequence will be kept in memory and executed afterwards. This also applies to the commands SetMotorParam and GotoSecurePosition. Commands such as GetFullStatus1 or GetFullStatus2 will be executed while a Dual Positioning is running. A DualPosition sequence starts by setting TagPos register to SecPos value, provided secure position is enabled otherwise TagPos is reset to zero. The acceleration/deceleration value applied during a DualPosition sequence is the one stored in RAM before the SetDualPosition command is sent. The same applies for Shaft bit, but not for Irun, Ihold and StepMode, which can be changed during the Dual Positioning sequence. The Pos1, Pos2, Vmax and Vmin values programmed in a SetDualPosition command apply only for this sequence. All further positioning will use the parameters stored in RAM (programmed for instance by a former SetMotorParam command). Commands ResetPosition, SetDualPosition, and SoftStop will be ignored while a DualPosition sequence is ongoing, and will not be executed afterwards. A SetMotorParam command should not be sent during a SetDualPosition sequence. If for some reason ActPos equals Pos1[15:0] at the moment the SetDualPosition command is issued, the circuit will enter in deadlock state. Therefore, the application should check the actual position by a GetFullStatus2 command prior to send the SetDualPosition command. 15.1.3. Position Periodicity th Depending on the stepping mode the position can range from –4096 to +4095 in half-step to –32768 to +32767 in 1/16 microstepping mode. One can project all these positions lying on a circle. When executing the command SetPosition, the position controller will set the movement direction in such a way that the traveled distance is at a minimum. Figure 9 illustrates that the moving direction going from ActPos = +30000 to TagPos = –30000 is clockwise. If a counter clockwise motion is required in this example, several consecutive SetPosition commands can be used. For larger movements, one could also use the command RunVelocity. +10000 +20000 ActPos = +30000 Motion direction 0 TagPos = -30000 -10000 -20000 Figure 9: Motion Direction is Function on Difference Between ActPos and TagPos AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 19 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.1.4. Hardwired Address HW In Figure 10 a simplified schematic diagram is shown of the HW comparator circuit. The HW pin is sensed via two switches STOP and SBOT. The DriveHS and DriveLS control lines are alternatively closing STOP and SBOT , connecting HW pin with a current to resistor converter. Closing STOP (DriveHS = 1) will sense a current to GND. In that case the top IÆ R converter output is low, via the closed passing switch SPASS_T this signal is fed to the “R” comparator which output HW_Cmp is high. Closing bottom switch SBOT (DriveLS = 1) will sense a current to VBAT. The corresponding IÆ R converter output is low and via SPASS_B fed to the comparator. The output HW_Cmp will be high. SPASS_T IÎ R State HW STOP DriveHS High Low LOGIC SBOT 1 = R2GND 2 = R2VBAT 64 ms Debouncer DriveLS Float "R"-Comp 3 = OPEN IÎ R SPASS_B COMP Rth 32 µs Debouncer HW_Cmp PC20060926.1 Figure 10: Simplified Schematic Diagram of the HW Comparator Three cases can be distinguished (see also Figure 10): HW is connected to ground: R2GND or Drawing 1 HW is connected to VBAT: R2VBAT or Drawing 2 HW is floating: OPEN or Drawing 3 Table 15: State Diagram of the HW Comparator Previous State DriveLS DriveHS HW_Cmp Float 1 0 0 Float 1 0 1 Float 0 1 0 Float 0 1 1 Low 1 0 0 Low 1 0 1 Low 0 1 0 Low 0 1 1 High 1 0 0 High 1 0 1 High 0 1 0 High 0 1 1 New State Float High Float Low Low High Float Low Float High High Low Condition R2GND or OPEN R2VBAT R2VBAT or OPEN R2GND R2GND or OPEN R2VBAT R2VBAT or OPEN R2GND R2GND or OPEN R2VBAT R2VBAT or OPEN R2GND Drawing 1 or 3 2 2 or 3 1 1 or 3 2 2 or 3 1 1 or 3 2 2 or 3 1 The logic is controlling the correct sequence in closing the switches and in interpreting the 32µs de-bounced HW_Cmp output accordingly. The output of this small state-machine is corresponding to: High or address = 1 Low or address = 0 Floating AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 20 AMIS-30624 I2C Microstepping Motordriver Data Sheet As illustrated in Table 15, the state is depending on the previous state, the condition of the two switch controls (DriveLS and DriveHS) and the output of HW_Cmp. Figure 11 shows an example of a practical case where a connection to VBAT is interrupted. Condition OPEN R2VBAT R2VBAT R2GND t Tsw = 1024 µs DriveHS t DriveLS Tsw_on = 128 µs t "R"-Comp Rth t HW_Cmp t PC20060926.2 Low Low Low High High Float Float Float High High High High High High Float State t Figure 11: Timing Diagram Showing the Change in States for HW Comparator R2VBAT A resistor is connected between VBAT and HW. Every 1024µs SBOT is closed for a period of 128µs and a current is sensed. The output of the I Æ R converter is low and the HW_Cmp output is high. Assuming the previous state was floating, the internal LOGIC will interpret this as a change of state and the new state will be High (see also Table 15). The next time SBOT is closed the same condition is observed. The previous state was high, so based on Table 15 the new state remains unchanged. This high state will be interpreted as HW address = 1. OPEN In case the HW connection is lost (broken wire, bad contact in connector) the next time SBOT is closed this will be sensed. There will be no current, the output of the corresponding I Æ R converter is high and the HW_Cmp will be low. The previous state was High. Based on Table 15 one can see that the state changes to float. This will trigger a motion to secure position after a debounce time of 64 ms. This prevents false triggering in case of micro interruptions of the power supply. See also Electrical Transient Conduction Along Supply Lines. R2GND If a resistor is connected between HW and the GND, a current is sensed every 1024µs when STOP is closed. The output of the top I Æ R converter is low and as a result the HW_Cmp output switches to high. Again based on the stated diagram in Table 15 one can see that the state will change to low. This low state will be interpreted as HW address = 0. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 21 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.1.5. External Switch SWI As illustrated in Figure 12, the SWI comparator is almost identical to HW. The major difference is in the limited number of states. Only open or closed is recognised leading to respectively ESW = 0 and ESW = 1. SPASS_T IÎ R State DriveHS SWI STOP Closed LOGIC SBOT 1 = R2GND 2 = R2VBAT Open DriveLS "R"-Comp 3 = OPEN IÎ R SPASS_B COMP Rth 32 µs Debouncer SWI_Cmp PC20060926.3 Figure 12: Simplified Schematic Diagram of the SWI Comparator As illustrated in Figure 14, a change in state is always synchronized with DriveHS or DriveLS. The same synchronization is valid for updating the internal position register. This means that after every current pulse (or closing of STOP or SBOT) the state of position switch together with the corresponding position is memorized. Using the GetActualPos commands reads back the ActPos register and the status of ESW. In this way the master node may get synchronous information about the state of the switch together with the position of the motor. See Figure 13. Byte Content Bit 7 0 1 2 3 4 5 6 7 8 Address Address Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 GetFullStatus1 Response Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 1 1 OTP3 1 1 Irun[3:0] Vmax[3:0] AccShape StepMode[1:0] VddReset StepLoss ElDef Motion[2:0] 1 1 1 AbsThr[3:0] OTP2 OTP3 OTP1 OTP2 Shaft UV2 ESW 1 TSD OVC1 1 Figure 13: GetFullStatus1 I2C Commando Important remark; Every 512µs this information is refreshed. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 22 Bit 2 Bit 1 Bit 0 OTP0 HW 1 OTP1 OTP0 HW Ihold[3:0] Vmin[3:0] Acc[3:0] TW Tinfo[1:0] OVC2 Stall CPFail 1 1 1 DelThr[3:0] AMIS-30624 I2C Microstepping Motordriver DriveHS Tsw =1024 µs Data Sheet 512 µs t Tsw_on = 128 µs DriveLS t "R"-Comp Rth t 120 µs SWI_Cmp t ESW 0 1 1 1 ActPos + 3 ActPos + 2 PC20060926.4 ActPos ActPos ActPos + 1 t t Figure 14: Timing Diagram Showing the Change in States for SWI Comparator 15.2 Main Control and Register, OTP Memory + ROM 15.2.1. Power-up Phase The power-up phase of the AMIS-30624 will not exceed 10ms. After this phase, the AMIS-30624 is in shutdown mode, ready to receive 2 I C messages and execute the associated commands. After power-up, the registers and flags are in the reset state; some of them being loaded with the OTP memory content (see Table 18). 15.2.2. Reset State After power-up, or after a reset occurrence (e.g. a micro cut on pin VBB has made Vdd go below VddReset level), the H-bridges will be in high impedance mode, and the registers and flags will be in a predetermined position. This is documented in Table 18 and Table 19. 15.2.3. Soft Stop A soft stop is an immediate interruption of a motion, but with a deceleration phase. At the end of this action, the register TagPos is loaded with the value contained in register ActPos to avoid an attempt of the circuit to achieve the motion (seeTable 18). The circuit is then ready to execute a new positioning command, provided thermal and electrical conditions allow for it. 15.2.4. Thermal Shutdown Mode When thermal shutdown occurs, the circuit performs a SoftStop command and goes to motor shutdown mode (see Figure 15). AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 23 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.2.5. Temperature Management The AMIS-30624 monitors temperature by means of two thresholds and one shutdown level, as illustrated in the Figure 15. The only condition necessary to reset flags <TW> and <TSD> (respectively thermal warning and thermal shutdown) is when the temperature is 2 lower than Ttw causing the occurrence of a GetFullStatus1 I C frame. <Tinfo> = '01' <TW> = '0' <TSD> = '0' T° < Tlow LOW TEMP NORMAL TEMP T° > Tlow <Tinfo> = '01' <TW> = '0' <TSD> = '0' T° < T tw & I2C frame <GetFullStatus1> <Tinfo> = '01' <TW> = '0' <TSD> = '0' T° > T tw T° < T tw & I2C frame <GetFullStatus1> POST THERMAL SHUTDOWN 2 PC20070219.1 <Tinfo> = '01' <TW> = '0' <TSD> = '0' POST THERMAL WARNING <Tinfo> = '01' <TW> = '0' <TSD> = '0' THERMAL WARNING T° < T tw T° > Ttw T° > T tsd T° > Ttw T° < Ttw T° > T tsd <Tinfo> = '01' <TW> = '0' <TSD> = '0' THERMAL SHUTDOWN POST THERMAL SHUTDOWN 1 T° < T tsd Figure 15: State Diagram Temperature Management AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 24 Tinfo> = '01' TW> = '0' TSD> = '0' AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.2.6. Battery Under-voltage Management The AMIS-30624 monitors the battery voltage by means of one threshold and one shutdown level, as illustrated in Figure 16. The only condition necessary to reset flags <UV2> and <StepLoss> is to recover a battery voltage higher than UV1 and to receive a GetFullStatus1 command. - <UV2> = '0' - <Steploss> = '0' NORMAL VOLTAGE Vbb > UV1 & I2C frame <GetFullStatus1> Vbb > UV1 & I2C frame <GetFullStatus1> Vbb < UV2 No Motion - <UV2> = '1' - <Steploss> = '0' - Motor Shutdown STOP MODE 2 Vbb < UV2 & Motion Ongoing - <UV2> = '1' - <Steploss> = '1' - HardStop - Motor Shutdown STOP MODE 1 PC20060926.5 Figure 16: State Diagram Battery Voltage Management 15.2.7. OTP Register 15.2.7.1. OTP Memory Structure Table 16 shows where the parameters to be stored in the OTP memory are located. Table 16: OTP Memory Structure Address Bit 7 0x00 OSC3 0x01 0x02 AbsThr3 0x03 Irun3 0x04 Vmax3 0x05 SecPos10 0x06 SecPos7 0x07 DelThr3 Bit 6 OSC2 TSD2 AbsThr2 Irun2 Vmax2 SecPos9 SecPos6 DelThr2 Bit 5 OSC1 TSD1 AbsThr1 Irun1 Vmax1 SecPos8 SecPos5 DelThr1 Bit 4 OSC0 TSD0 AbsThr0 Irun0 Vmax0 Shaft SecPos4 DelThr0 Bit 3 IREF3 BG3 PA3 Ihold3 Vmin3 Acc3 SecPos3 StepMode1 Bit 2 IREF2 BG2 PA2 Ihold2 Vmin2 Acc2 SecPos2 StepMode0 Bit 1 IREF1 BG1 PA1 Ihold1 Vmin1 Acc1 Bit 0 IREF0 BG0 PA0 Ihold0 Vmin0 Acc0 LOCKBT LOCKBG Parameters stored at address 0x00 and 0x01 and bit LOCKBT are already programmed in the OTP memory at circuit delivery. They correspond to the calibration of the circuit and are just documented here as an indication. Each OPT bit is at ‘0’ when not zapped. Zapping a bit will set it to ‘1’. Thus only bits having to be at ‘1’ must be zapped. Zapping of a bit already at ‘1’ is disabled. Each OTP byte will be programmed separately (see command SetOTPparam). Once OTP programming is completed, bit LOCKBG can be zapped, to disable future zapping, otherwise any OTP bit at ‘0’ could still be zapped by using a SetOTPparam command. Table 17: OTP Overwrite Protection Lock Bit LOCKBT (factory zapped before delivery) Protected Bytes 0x00 to 0x01 LOCKBG 0x00 to 0x07 Note: Zapped bits will really be “active” after a GetOTPparam or a ResetToDefault command or after a power-up. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 25 AMIS-30624 I2C Microstepping Motordriver Data Sheet The command used to load the application parameters via the I2C bus in the RAM prior to an OTP memory programming is SetMotorParam. This allows for a functional verification before using a SetOTPparam command to program and zap separately one OTP memory byte. A GetOTPparam command issued after each SetOTPparam command allows verification of the correct byte zapping. 15.2.7.2. Application Parameters Stored in OTP Memory Except for the physical address PA[3:0], these parameters, although programmed in a non-volatile memory, can still be overridden in 2 RAM by an I C writing operation. PA[3:0] In combination with hired wired (HW) address, it forms the physical address AD[6:0] of the stepper-motor. Up to 2 32 steppermotors can theoretically be connected to the same I C bus. AbsThr[3:0] Absolute threshold used for the motion detection Index 0 1 2 3 4 5 6 7 8 9 A B C D E F DelThr[3:0] 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 AbsThr 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 AbsThr level (V) Disable 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 Delta threshold used for the motion detection Index 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 DelThr 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 DelThr level (V) Disable 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 26 AMIS-30624 I2C Microstepping Motordriver Irun[3:0] Current amplitude value to be fed to each coil of the steppermotor. The table below provides the 16 possible values for IRUN. Index 0 1 2 3 4 5 6 7 8 9 A B C D E F Ihold[3:0] Irun 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Run Current (mA) 59 71 84 100 119 141 168 200 238 283 336 400 476 566 673 800 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Ihold 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Hold Current (mA) 59 71 84 100 119 141 168 200 238 283 336 400 476 566 673 0 Indicator of stepping mode to be used. StepMode 0 0 0 1 1 0 1 1 Shaft 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Hold current for each coil of the steppermotor. The table below provides the 16 possible values for IHOLD. Index 0 1 2 3 4 5 6 7 8 9 A B C D E F StepMode Data Sheet Step Mode 1/2 stepping 1/4 stepping 1/8 stepping 1/16 stepping Indicator of reference position. If Shaft = ‘0’, the reference position is the maximum inner position, whereas if Shaft = ‘1’, the reference position is the maximum outer position. SecPos[10:0] Secure position of the steppermotor. This is the position to which the motor is driven in case HW connection is lost. If SecPos[10:0] = “100 0000 0000”, this means that secure position is disabled, e.g. the steppermotor will be kept in the position occupied at the moment these events occur. The secure position is coded on 11 bits only, providing actually the most significant bits of the position, the non coded least significant bits being set to ‘0’. See also Table 10. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 27 AMIS-30624 I2C Microstepping Motordriver Vmax[3:0] Maximum velocity Index 0 1 2 3 4 5 6 7 8 9 A B C D E F Vmin[3:0] Vmax 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Vmin 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Vmax (full step/s) 99 136 167 197 213 228 243 273 303 334 364 395 456 546 729 973 B C D 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Vmax factor 1 1/32 2/32 3/32 4/32 5/32 6/32 7/32 8/32 9/32 10/32 11/32 12/32 13/32 14/32 15/32 Acceleration and deceleration between Vmax and Vmin. Index 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Acc 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Acceleration (full step/s²) 49 (*) 218 (*) 1004 . 3609 . 6228 . 8848 . 11409 . 13970 . 16531 . 19092 (*) 21886 (*) 24447 (*) 27008 (*) 29570 (*) 34925 (*) 40047 (*) (*) restriction on speed AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com Group A Minimum velocity Index 0 1 2 3 4 5 6 7 8 9 A B C D E F Acc[3:0] 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 28 Data Sheet AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.2.8. RAM Registers Table 18: RAM Registers Mnemonic Length (Bit) Actual position ActPos 16 Last programmed position Pos/ TagPos 16 AccShape 1 Coil peak current Irun 4 Coil hold current Ihold 4 Minimum velocity Vmin 4 Maximum velocity Vmax 4 Shaft 1 Acc 4 Secure position SecPos 11 Stepping mode StepMode 2 AbsThr 4 DelThr 4 Stall detection delay FS2StallEn 3 Stall detection sampling MinSamples 3 PWMJEn 1 DC100SDis 1 PWMFreq 1 Register Acceleration shape Shaft Acceleration/ deceleration Stall detection absolute threshold Stall detection delta threshold PWM jitter 100% duty cycle stall disable PWM frequency Related Commands GetFullStatus2 GotoSecurePos ResetPosition GetFullStatus2 GotoSecurePos ResetPosition SetPosition GetFullStatus1 1 ResetToDefault SetMotorParam GetFullStatus11 ResetToDefault SetMotorParam GetFullStatus11 ResetToDefault SetMotorParam GetFullStatus1 1 ResetToDefault SetMotorParam GetFullStatus11 ResetToDefault SetMotorParam GetFullStatus11 ResetToDefault SetMotorParam GetFullStatus1 1 ResetToDefault SetMotorParam GetFullStatus21 ResetToDefault SetMotorParam GetFullStatus1 SetStallParam GetFullStatus1 SetStallParam GetFullStatus1 SetStallParam GetFullStatus2 SetStallParam GetFullStatus2 SetStallParam GetFullStatus2 SetStallParam GetFullStatus2 SetStallParam SetMotorParam Comment 16-bit signed 16-bit signed (see Positioning) ‘0’ ⇒ normal acceleration from Vmin to Vmax ‘1’ ⇒ motion at Vmin without acceleration www.amis.com 29 Note 1 ‘0’ Operating current See look-up table Irun Standstill current See look-up table Ihold See Section 13.3 Minimum Velocity See look-up table Vmin See Section 13.2 Maximum Velocity See look-up table Vmax Direction of movement for positive velocity From OTP memory See Section 13.4 Acceleration See look-up table Acc Target position when LIN connection fails; 11 MSBs of 16-bit position (LSBs fixed to ‘0’) See Section 13.1 Stepping Modes See look-up table StepMode See Section 15.4 Motion detection See Section 15.4 Motion detection See Section 15.4 Motion detection ‘000’ See Section 15.4 Motion detection ‘000’ ‘1’ means jitter is added ‘0’ ‘1’ means stall detection is disabled in case PWM regulator runs at δ = 100% ‘1’ means 44 kHz is selected Note: A ResetToDefault command will act as a reset of the RAM content, except for ActPos and TagPos, which are registers that are not modified. Therefore, the application should not send a ResetToDefault during a motion, to avoid any unwanted change of parameter. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 Reset State ‘0’ ‘0’ AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.2.9. Flags Table Table 19: Flags Table Mnemonic Length (Bit) Related Commands CPFail 1 GetFullStatus1 ElDef 1 GetFullStatus1 ESW 1 GetFullStatus1 Motion 3 GetFullStatus1 Over current in coil X OVC1 1 GetFullStatus1 Over current in coil Y OVC2 1 GetFullStatus1 SecEn 1 Internal use StepLoss 1 GetFullStatus1 DelStallHi DelStallLo AbsStall Stall 1 1 1 1 GetFullStatus2 GetFullStatus2 GetFullStatus2 GetFullStatus1 Tinfo 2 GetFullStatus1 TSD 1 GetFullStatus1 TW 1 GetFullStatus1 UV2 1 GetFullStatus1 VddReset 1 GetFullStatus1 Flag Charge pump failure Electrical defect External switch status Motion status Secure position enabled Step loss Delta high stall Delta low stall Absolute stall Stall Temperature info Thermal shutdown Thermal warning Battery stop voltage Digital supply reset AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 30 Comment ‘0’ = charge pump OK ‘1’ = charge pump failure reset only after GetFullStatus <OVC1> or <OVC2> or <open circuit 1> or <open circuit 2> or <CPFail> resets only after GetFullStatus1 ‘0’ = open ‘1’ = close “x00” = Stop “001” = inner motion acceleration “010” = inner motion deceleration “011” = inner motion max. speed “101” = outer motion acceleration “110” = outer motion deceleration “111” = outer motion max. speed ‘1’ = over current reset only after GetFullStatus1 ‘1’ = over current reset only after GetFullStatus1 ‘0’ if SecPos = “100 0000 0000” ‘1’ otherwise ‘1’ = step loss due to under voltage, over current or open circuit ‘1’ = Vbemf > Average + DeltaThr ‘1’ = Vbemf < Average – DeltaThr ‘1’ = Vbemf > AbsThr Stall detected “00” = normal temperature range “01” = low temperature warning “10” = high temperature warning “11” = motor shutdown ‘1’ = shutdown (> 155°C typ.) reset only after GetFullStatus1 and if <Tinfo> = “00” ‘1’ = over temp (> 145°C) reset only after GetFullStatus1 and if <Tinfo> = “00” ‘0’ = Vbb > UV2 ‘1’ = Vbb ≤ UV2 reset only after GetFullStatus1 Set at ‘1’ after power-up of the circuit. If this was due to a supply micro-cut, it warns that the RAM contents may have been lost; can be reset to ‘0’ with a GetFullStatus1 command. Reset State ‘0’ ‘0’ ‘0’ “000” ‘0’ ‘0’ NA ‘1’ ‘0’ ‘0’ ‘0’ ‘0’ “00” ‘0’ ‘0’ ‘0’ ‘1’ AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.2.10. Priority Encoder The table below describes the state management performed by the main control block. Table 20: Priority Encoder State → Command ↓ GetOTPparam Stopped GotoPos DualPosition SoftStop Motor Stopped, Ihold in Coils Motor Motion Ongoing No Influence on RAM and TagPos Motor Decelerating OTP refresh; 2 I C slave response OTP refresh; 2 I C slave response OTP refresh; 2 I C slave response OTP refresh; 2 I C slave response HardStop ShutDown Motor Forced to Motor Stopped, Stop H-bridges in Hi-Z OTP refresh; 2 I C slave response OTP refresh; 2 I C slave response 2 GetFullStatus1 [attempt to clear all flags] (note 1) I C slave response GetFullStatus2 2 I C slave response 2 I C slave response 2 I C slave response I C slave response 2 I C slave response 2 I C slave response 2 ResetToDefault [ ActPos and TagPos are not altered ] OTP refresh; OTP to RAM; AccShape reset OTP refresh; OTP to RAM; AccShape reset SetMotorParam [ Master takes care about proper update ] RAM update SetStallParam RAM update ResetPosition TagPos and ActPos reset SetPosition RunVelocity 2 I C slave response I C slave response 2 I C slave response I C slave response OTP refresh; OTP to RAM; AccShape reset (note 2) OTP refresh; OTP to RAM; AccShape reset OTP refresh; OTP to RAM; AccShape reset OTP refresh; OTP to RAM; AccShape reset RAM update (note 5) RAM update RAM update RAM update RAM update RAM update RAM update RAM update RAM update 2 2 RAM update TagPos and ActPos reset TagPos updated; TagPos updated → GotoPos TagPos updated Continuous motion; → GotoPos GotoSecPosition If <SecEn> = ‘1’ then TagPos = SecPos; → GotoPos DualPosition → DualPosition If <SecEn> = ‘1’ then TagPos = SecPos If <SecEn> = ‘1’ then TagPos = SecPos → HardStop; → HardStop; → HardStop; <StepLoss> = ‘1’ <StepLoss> = ‘1’ <StepLoss> = ‘1’ HardStop → SoftStop SoftStop HardStop [ ⇔ (<CPFail> or <UV2> or <ElDef>) = ‘1’ ⇒ <HS> = ‘1’ ] → Shutdown → HardStop → HardStop Thermal shutdown [ <TSD> = ‘1’ ] → Shutdown → SoftStop → SoftStop Motion finished NA → Stopped → Stopped With the following color code: Command ignored Transition to another state Master is responsible for proper update (see Note 5) AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 2 I C slave response; if (<TSD> or <ElFlag> = ‘0’ then → Stopped 31 → HardStop → Stopped; → Stopped; TagPos =ActPos TagPos =ActPos NA AMIS-30624 I2C Microstepping Motordriver Data Sheet Notes: 1) <ElFlag> = <CPFail> or <UV2> or <ElDef> or <VDDreset> 2) After power-on-reset, the Shutdown state is entered. The shutdown state can only be left after GetFullStatus1 command (so that the master could read the <VddReset> flag). 3) A DualPosition sequence runs with a separate set of RAM registers. The parameters that are not specified in a DualPosition command are loaded with the values stored in RAM at the moment the DualPosition sequence starts. AccShape is forced to ‘1’ during second motion even if a ResetToDefault command is issued during a DualPosition sequence, in which case AccShape at ‘0’ will be taken into account after the DualPosition sequence. A GetFullStatus1 command will return the default parameters for Vmax and Vmin stored in RAM. 4) Shutdown state can be left only when <TSD> and <ElFlag> flags are reset. 5) Flags can be reset only after the master could read them via a GetFullStatus1 command, and provided the physical conditions allow for it (normal temperature, correct battery voltage and no electrical or charge pump defect). 6) A SetMotorParam command sent while a motion is ongoing (state GotoPos) should not attempt to modify Acc and Vmin values. This can be done during a DualPosition sequence since this motion uses its own parameters, the new parameters will be taken into account at the next SetPosition command. 7) <SecEn> = ‘1’ when register SecPos is loaded with a value different from the most negative value (i.e. different from 0x400 = “100 0000 0000”) 8) <Stop> flag allows user to distinguish whether state stopped was entered after HardStop/SoftStop or not. <Stop> is set to ‘1’ when leaving state HardStop or SoftStop and is reset during first clock edge occurring in state Stopped. 9) While in state stopped, if ActPos → TagPos there is a transition to state GotoPos. This transition has the lowest priority, meaning that <Stop>, <TSD>, etc. are first evaluated for possible transitions. 10) If <StepLoss> is active, then SetPosition and GotoSecurePosition commands are ignored (they will not modify TagPos register whatever the state). Other command like DualPosition or ResetPosition will be executed if allowed by current state. <StepLoss> can only be cleared by a GetFullStatus1 command. Thermal shutdown POWER ON DUALPOSITION SOFTSTOP HardStop HardStop DualPosition Motion Finished HARDSTOP Motion Finished HardStop GotoSecPos GetFullStatus1 SetPos STOPPED SHUTDOWN Thermal Shutdown SoftStop Thermal shutdown HardStop GOTOPOS Motion Finished Priorities 1 Motion Finished 2 3 PC20070323.1 Figure 17: State Diagram AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 32 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.3 Motordriver 15.3.1. Current Waveforms in the Coils Figure 18 illustrates the current fed to the motor coils by the motordriver in half step mode. Ix Iy Coil X t Coil Y PC20051205.1 Figure 18: Current Waveforms in Motorcoils X and Y in Halfstep Mode th Whereas Figure 19 below shows the current fed to one coil in 1/16 micro stepping (one electrical period). Ix Iy Coil X t Coil Y PC20051123.4 th Figure 19: Current Waveforms in Motorcoils X and Y in 1/16 Microstep mode AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 33 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.3.2. PWM Regulation In order to force a given current (determined by Irun or Ihold and the current position of the rotor) through the motor coil while ensuring high energy transfer efficiency, a regulation based on PWM principle is used. The regulation loop performs a comparison of the sensed output current to an internal reference, and features a digital regulation generating the PWM signal that drives the output switches. The zoom over one micro-step in Figure 19 shows how the PWM circuit performs this regulation. To reduce the current ripple, a higher PWM frequency should be selectable. The RAM register PWMfreq is used for this (Bit 6 in Data 7 of SetMotorParam). Table 21: PWM Frequency Selection PWMfreq 0 1 Applied PWM Frequency 22.8 kHz 45.6 kHz 15.3.3. PWM Jitter To lower the power spectrum for the fundamental and higher harmonics of the PWM frequency, jitter can be added to the PWM clock. The RAM register PWMJEn is used for this. (Bit 0 in Data 7 of SetMotorParam or SetStallParam). Readout with GetFullStatus1. Table 22: PWM Jitter Selection PWMJEn 0 1 Status Single PWM frequency Added jitter to PWM frequency 15.3.4. Motor Starting Phase At motion start, the currents in the coils are directly switched from Ihold to Irun with a new sine/cosine ratio corresponding to the first half (or micro) step of the motion. 15.3.5. Motor Stopping Phase At the end of the deceleration phase, the currents are maintained in the coils at their actual DC level (hence keeping the sine/cosine ratio between coils) during the stabilization time tstab (see Table 6). The currents are then set to the hold values, respectively, Ihold x sin(TagPos) and Ihold x cos(TagPos) as illustrated below. A new positioning order can then be executed. Figure 20: Motor Stopping Phase AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 34 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.3.6. Charge Pump Monitoring If the charge pump voltage is not sufficient for driving the high side transistors (due to a failure), an internal HardStop command is issued. This is acknowledged to the master by raising the flag <CPFail> (available with command GetFullStatus1). In case this failure occurs while a motion is ongoing, the flag <StepLoss> is also raised. 15.3.7. Electrical Defect on Coils, Detection and Confirmation The principle relies on the detection of a voltage drop on at least one transistor of the H-bridge. Then the decision is taken to open the transistors of the defective bridge. This allows the detection of the following short circuits: • External coil short circuit • Short between one terminal of the coil and Vbat or Gnd Open circuits are detected by a 100 percent PWM duty cycle value during a long time. Table 23: Electrical Defect Detection Pins Fault Mode Yi or Xi Short circuit to GND Yi or Xi Short circuit to Vbat Yi or Xi Open Y1 and Y2 Short circuited X1 and X2 Short circuited Xi and Yi Short circuited Remark: One cannot detect an internal short in the motor. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 35 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.3.8. Motor Shutdown Mode A motor shutdown occurs when: • The chip temperature rises above the thermal shutdown threshold Ttsd (see Thermal Shutdown Mode) • The battery voltage goes below UV2 (see Battery Voltage Management) • Flag <ElDef> = ‘1’, meaning an electrical problem is detected on one or both coils, e.g. a short circuit • Flag <CPFail> = ‘1’, meaning there is a charge pump failure A motor shutdown leads to the following: • H-bridges in high impedance mode • The TagPos register is loaded with the ActPos (to avoid any motion after leaving the motor shutdown mode) The I2C interface remains active, being able to receive orders or send status. The conditions to get out of a motor shutdown mode are: • Reception of a GetFullStatus1 command AND • The four causes above are no longer detected This leads to H-bridges in Ihold mode, hence the circuit is ready to execute any positioning command. This can be illustrated in the following sequence given as an application tip. The master can check whether there is a problem or not and decide which application strategy to adopt. Tj ≥ Tsd or Vbb ≤ UV2 or <ElDef> = ‘1’ or <CpFail> = ‘1’ SetPosition frame GetFullStatus1 frame GetFullStatus1 frame ↓ ↑ ↑ ↑… - The circuit is driven in motor shutdown mode - The application is not aware of this - The position set-point is updated by the 2 I C Master - Motor shutdown mode ⇒ no motion - The application is still unaware - The application is - Possible confirmation aware of a problem of the problem - Reset <TW> or <TSD> or <UV2> or <StepLoss> or <ElDef> or <CPFail> by the application - Possible new detection of over temperature or low voltage or electrical problem ⇒ Circuit sets <TW> or <TSD> or <UV2> or <StepLoss> or <ElDef> or <CPFail> again at ‘1’ Figure 21: Example of Possible Sequence Used to Detect and Determine Cause of Motor Shutdown Important: While in shutdown mode, since there is no hold current in the coils, the mechanical load can cause a step loss, which cannot be flagged by the AMIS-30624. Warning: The application should limit the number of consecutive GetFullStatus1 commands to try to get the AMIS-30624 out of shutdown mode. When this proves to be unsuccessful, for example if there is a permanent defect, the reliability of the circuit could be altered since GetFullStatus1 attempts to disable the protection of the H-bridges. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 36 AMIS-30624 I2C Microstepping Motordriver Data Sheet 15.4 Motion Detection Motion detection is based on the back emf generated internally in the running motor. When the motor is blocked, for example when it hits the end-position, the velocity and as a result also the generated back emf, is disturbed. The AMIS-30624 senses the back emf, calculates a moving average and compares the value with two independent threshold levels: Absolute threshold (AbsThr[3:0] ) and Delta threshold (DelThr[3:0] ). Instructions for the correct use of these two levels in combination with three additional parameters (MinSamples, FS2StallEn and DC100SDis) are outside the scope of this datasheet. Detailed information is available in a dedicated white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”, available on http://www.amis.com/. If the motor is accelerated by a pulling or propelling force and the resulting back emf increases above the Delta threshold (+ ∆THR), then <DelStallHi> is set. When the motor is slowing down and the resulting back emf decreases below the Delta threshold (- ∆THR), then <DelStallLo> is set. When the motor is blocked and the velocity is zero after the acceleration phase, the back emf is low or zero. When this value is below the Absolute threshold, <AbsStall> is set. The <Stall> flag is the OR function of <DelStallLo> OR <DelStallHi> OR <AbsStall>. Velocity Vbemf + ∆THR Vmax Motor speed Vmin Vbemf t Vbemf - ∆THR t Vbemf DeltaStallHi VABSTH Back emf t t DeltaStallLo AbsStall t t Figure 22:Triggering of the Stall Flags in Function of Measured Back emf and the Set Threshold Levels Table 24: Truth Table Condition Vbemf < Average - DelThr Vbemf > Average + DelThr Vbemf < AbsThr <DelStallLo> 1 0 0 <DelStallHi> 0 1 0 <AbsStall> 0 0 1 <Stall> 1 1 1 The motion will only be detected when the motor is running at the maximum velocity, not during acceleration or deceleration. If during positioning a mechanical obstacle is detected (stall), an (internal) hardstop is generated. The motor will stop immediately and as a consequence the <StepLoss> and <Stall> flags are set. The position in the internal counter will be copied to the ActPos register. All flags can be read out with the GetFullStatus1. If Stall appears during DualPosition then the first phase is cancelled (via internal Hardstop) and after timeout (26.6ms) the second phase at Vmin starts. Important Remark: Using GetFullStatus1 will read AND clear the following flags: <Steploss>, <Stall>, <AbsStall>, <DelStallLo>, and <DelStallHi>. New positioning is possible and the ActPos register will be further updated. Motion detection is disabled when the RAM registers AbsThr[3:0] and DelThr[3:0] are empty or zero. Both levels can be programmed 2 using the I C command SetStallParam in the registers AbsThr[3:0] and DelThr[3:0]. Also in the OTP register AbsThr[3:0] and DelThr[3:0] can be set using the I2C command SetOTPParam. These values are copied in the RAM registers during power on reset. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 37 AMIS-30624 I2C Microstepping Motordriver Data Sheet Value Table: Table 25: Absolute Threshold Settings AbsThr Index AbsThr Level (V) 0 1 2 3 4 5 6 7 8 9 A B C D E F Disable 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 Table 26: Delta Threshold Settings DelThr DelThr Level (V) Index 0 Disable 1 0.25 2 0.50 3 0.75 4 1.00 5 1.25 6 1.50 7 1.75 8 2.00 9 2.25 A 2.50 B 2.75 C 3.00 D 3.25 E 3.50 F 3.75 MinSamples MinSamples[2:0] is a Bemf sampling delay time expressed in number of PWM cycles, for more information please refer to the white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”. Table 27: Back emf Sample Delay Time Index MinSamples[2:0] 0 1 2 3 4 5 6 7 000 001 010 011 100 101 110 111 tDELAY (µs) PWMfreq = 0 87 130 174 217 261 304 348 391 PWMfreq = 1 43 65 87 109 130 152 174 196 FS2StallEn If AbsThr or DelThr <>0 (i.e. motion detection is enabled), then stall detection will be activated AFTER the acceleration ramp + an additional number of full-steps, according to the following table: Table 28: Activation Delay of Motion Detection Index 0 1 2 3 4 5 6 7 FS2StallEn[2:0] 000 001 010 011 100 101 110 111 Delay (Full Steps) 0 1 2 3 4 5 6 7 For more information please refer to the white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”. DC100StEn When a motor with large back – e.m.f. is operated at high velocity and low supply voltage, then the PWM duty cycle can be as high as 100 percent. This indicates that the supply is too low to generate the required torque and might also result in erroneously triggering the stall detection. The bit “DC100StEn” (Bit 1 in Data 7 of SetStallParam) enables the function where stall detection is switched off when PWM duty cycle equals 100 percent. For more information the white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”. Motion Qualification Mode This mode is useful to debug motion parameters and to verify the stability of stepper motor systems. The motion qualification mode is entered by means of the I2C command TestBemf. The SWI pin will be converted into an analog output on which the Bemf integrator output can be measured. Once activated, it can only be stopped after a POR. During the back emf observation, reading of the SWI state is internally forbidden. More information is available in the white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 38 AMIS-30624 I2C Microstepping Motordriver Data Sheet 16.0 I2C Bus Description 16.1 General Description AMIS-30624 uses a simple bi-directional 2-wire bus for efficient inter-ic control. This bus is called the Inter IC or I2C-bus. Features include: • Only two bus lines are required; a serial data line (SDA) and a serial clock line (SCK). • Each device connected to the bus is software addressable by a unique address and simple master/slave relationships exists at all times; master can operate as master-transmitter or as master receiver. • Serial, 8-bit oriented, bi-directional data transfers can be made up to 400 kbit/s. • On-chip filtering rejects spikes on the bus data line to preserve data integrity. 2 • No need to design bus interfaces because I C-bus interface is already integrated on-chip. • IC’s can be added to or removed from a system without affecting any other circuits on the bus. 16.2 Concept The I2C-bus consists of two wires, serial data (SDA) and serial clock (SCK), carrying information between the devices connected on the bus. Each device connected to the bus is recognized by a unique address and operates as either a transmitter or receiver, depending on the function of the device. AMIS-30624 can both receive and transmit data. In addition to transmitters and receivers, devices can also be considered as masters or slaves when performing data transfers. AMIS-30624 is a slave device. See Table 30. 2 Table 29: Definition of I C –bus Terminology Term Description Transmitter The device which sends data on the bus Receiver The device which receives data from the bus Master The device which initiates a transfer, generates clock signals and terminates a transfer Slave The devices addressed by a master Synchronization Procedure to synchronizer the clock signals of two or more devices Microcontroller Motordriver_2 Motordriver_4 AMIS-30624 AMIS-30624 SDA SCL Motordriver_1 Motordriver_3 AMIS-30624 AMIS-30624 PC20070217.1 Figure 23: Example of an I2C-bus Configuration Using One Microcontroller and Four Slaves 2 Figure 23 highlights the master-slave and receiver-transmitter relationships to be found on the I C-bus. It should be noted that these relationships are not permanent but only depend on the direction of data transfer at that time. The transfer of data would proceed as follows: 1) Suppose the microcontroller wants to send information to motordriver_1: • Microcontroller (master) addresses motordriver_1 (slave) • Microcontroller (master-transmitter) sends data to motordriver_1 (slave-receiver) • Microcontroller terminates the transfer AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 39 AMIS-30624 I2C Microstepping Motordriver Data Sheet 2) If the microcontroller wants to receive information from motordriver_2: • Microcontroller (master) addresses motordriver_2 (slave) • Microcontroller (master-receiver) receives data from motordriver_2 (slave-transmitter) • Microcontroller terminates the transfer Even in this case the master generates the timing and terminates the transfer. 2 Generation of the signals on the I C-bus is always the responsibility of the master device. It generates its own clock signal when transferring data on the bus. Bus clock signals from a master can only be altered when they are stretched by a slow slave device holding-down the clock line. 16.3 General Characteristics +5 V Rp Rp Serial Data Line Serial Clock Line SCK SDA 2 Clock IN Clock OUT SCL SDA 1 Data IN Clock IN Data OUT Data IN Clock OUT AMIS-30624 Data OUT MASTER PC20060925.7 Figure 24: Connection of a Device to the I2C-bus Both SDA and SCK are bi-directional lines connected to a positive supply voltage via a pull-up resistor (see Figure 24). When the bus is free both lines are HIGH. The output stages of the devices connected to the bus must have an open drain to perform the wired-AND 2 function. Data on the I C-bus can be transferred up to 400kbits/s in fast mode. The number of interfaces connected to the bus is dependent on the maximum bus capacitance limit (See CB in Table 6) and the available number of addresses. 16.4 Bit Transfer 2 The levels for logic ‘0’ (LOW) and ‘1’ (HIGH) are not fixed in the I C standard but dependent on the used VDD level. Using AMIS-30624, the levels are specified in Table 5. One clock pulse is generated for each data bit transferred. 16.4.1. Data Validity The data on the SDA line must be stable during the HIGH period of the clock. The HIGH or LOW state of the data line can only change when the clock signal on the SCL line is LOW (See Figure 25). SDA SCK Data line stable -> Data valid Change of data allowed 2 Figure 25: Bit Transfer on the I C-bus AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 40 PC20070217.2 AMIS-30624 I2C Microstepping Motordriver Data Sheet 16.4.2. START and STOP Conditions Within the procedure of the I2C-bus, unique situations arise, which are defined as START (S) and STOP (P) conditions (See Figure 26). A HIGH to LOW transition on the SDA line while SCK is HIGH is one such unique case. This situation indicates a START condition. LOW to HIGH transition on the SDA line while SCK is HIGH defines a STOP condition. START and STOP conditions are always generated by the master. The bus is considered to be busy after the START condition. The bus is considered to be free again a certain time after the STOP condition. The bus free situation is specified as tBUF in Table 6. The bus stays busy if a repeated START (Sr) is generated instead of a STOP condition. In this respect, the START (S) and repeated START (Sr) conditions are functionally identical (See Figure 27). The symbol S will be used to represent START and repeated START, unless otherwise noted. START STOP SDA SCK PC20070217.3 START condition STOP condition Figure 26: START and STOP Conditions 16.5 Transferring Data 16.5.1. Byte Format Every byte put on the SDA line must be 8-bits long. The number of bytes that can be transmitted per transfer to AMIS-30624 is restricted to eight. Each byte has to be followed by an acknowledge bit. Data is transferred with the most significant bit (MSB) first (See Figure 27). If a slave can’t receive or transmit another complete byte of data, it can hold the clock line SCK LOW to force the master into a wait state. Data transfer then continues when the slave is ready for another byte of data and releases clock line SCK. START STOP SDA MSB Acknowledgement signal from slave SCK 1 2 7 8 Clock line held low by slave 9 2 3-8 9 ACK START condition Aknowledge related clock puse from master Figure 27: Data Transfer on the I2C-bus AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 1 41 PC20070217.4 STOP condition AMIS-30624 I2C Microstepping Motordriver Data Sheet 16.5.2. Acknowledge Data transfer with acknowledge is obligatory. The acknowledge-related clock pulse is generated by the master. The transmitter releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver must pull down the SDA line during the acknowledge clock pulse so that it remains stable LOW during the HIGH period of this clock pulse (see Figure 28). Of course, set-up and hold times must also taken into account (see Table 6). When AMIS-30624 doesn’t acknowledge the slave address, the data line will be left HIGH. The master can than generate either a STOP condition to abort the transfer, or a repeated START condition to start a new transfer. If AMIS-30624 as slave-receiver does acknowledge the slave address but later in the transfer cannot receive any more data bytes, this is indicated by generating a not-acknowledge on the first byte to follow. The master generates than a STOP or a repeated START condition. If a master-receiver is involved in the transfer, it must signal the end of data to the slave-transmitter by not generating an acknowledge on the last byte that was clocked out of the slave. AMIS-30624 as slave-transmitter shall release the data line to allow the master to generate STOP or repeated START condition. START Master releases the Data line SDA by master transmitter MSB Not acknowledged SDA by slave receiver Acknowledged SCK from master 8 2 1 START condition Slave pulls data line low if Acknowledged 9 Aknowledge related clock puse from master PC20070217.5 Figure 28: Acknowledge on the I2C-bus 16.5.3. Clock Generation The master generates the clock on the SCK line to transfer messages on the I2C-bus. Data is only valid during the HIGH period of the clock. 16.6 Data Formats with 7-bit Addresses Data transfers follow the format shown in Figure 29. After the START condition (S), a slave address is sent. This address is 7-bit long followed by an eighth bit which is a data direction bit (R/W) – a ‘zero’ indicates a transmission (WRITE), a ‘one’ indicates a request for data (READ). A data transfer is always terminated by a STOP condition (P) generated by the master. START STOP PC20070217.6 SDA SCK START condition 1-7 8 9 ADDRESS R/W ACK 8 1-7 DATA 9 ACK 1-7 DATA 8 9 ACK STOP condition Figure 29: A Complete Data Transfer However, if a master still wishes to communicate on the bus, it can generate a repeated START (Sr) and address another slave without first generating a STOP condition. Various combinations of read/write formats are then possible within such a transfer. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 42 AMIS-30624 I2C Microstepping Motordriver Data Sheet 16.6.1. Data Transfer Formats 16.6.1.1. Writing Data to AMIS-30624 When writing to AMIS-30624, the master-transmitter transmits to slave-receiver and the transfer direction is not changed. A complete transmission consists of: • • • • • Start condition The slave address (7-bit) Read/Write bit (‘0’ = write) Acknowledge bit Any further data bytes are followed by an acknowledge bit. The acknowledge bit is used to signal a correct reception of the data to the transmitter. In this case the AMIS-30624 pulls the SDA line to ‘0’. The AMIS-30624 reads the incoming data at SDA on every rising edge of the SCK signal • Stop condition to finish the transmission S Slave Address R/W A Data Data S = Start condition P = Stop condition A = Acknowledge (SDA = LOW) A = No Acknowledge (SDA = HIGH) AMIS-30624 to Master A P N bytes + Acknowledge "0" = WRITE Master to AMIS-30624 A PC20070219.3 Figure 30: Master Writing Data to AMIS-30624 Some commands for the AMIS-30624 are supporting eight bytes of data, other commands are transmitting two bytes of data. See Table 30. 16.6.1.2. Reading Data from AMIS-30624 When reading data from AMIS-30624 two transmissions are needed: 1) The first transmission consists of two bytes of data: • The first byte contains the slave address and the write bit. • The second byte contains the address of an internal register in the AMIS-30624. This internal register address is stored in the circuit RAM. S Slave Address R/W A Internal Address "0" = WRITE A P PC20070219.5 Figure 31: Master Reading Data from AMIS-30624: First Transmission is Addressing 2) The second transmission consists of the slave address and the read bit. Then the master can read the data bits on the SDA line on every rising edge of signal SCK. After each byte of data the master has to acknowledge correct data reception by pulling SDA LOW. The last byte is not acknowledged by the master and therefore the slave knows the end of transmission. S Slave Address R/W A Data AMIS-30624 to Master Data A S = Start condition P = Stop condition A = Acknowledge (SDA = LOW) A = No Acknowledge (SDA = HIGH) PC20070219.3 Figure 32: Master Reading Data from AMIS-30624: Second Transmission is Reading Data Notes: (1) Each byte is followed by an acknowledgment bit as indicated by the A or Ā in the sequence. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com P N bytes + Acknowledge "0" = WRITE Master to AMIS-30624 A 43 AMIS-30624 I2C Microstepping Motordriver (2) (3) Data Sheet I2C-bus compatible devices must reset their bus logic on receipt of a START condition such that they all anticipate the sending of a slave address, even if these START conditions are not positioned according to the proper format. A START condition immediately followed by a STOP condition (void message) is an illegal format. 16.7 7-bit Addressing The addressing procedure for the I2C-bus is such that the first byte after the START condition usually determines which slave will be selected by the master. The exception is the general call address which can call all devices. When this address is used all devices should respond with an acknowledge. The second byte of the general call address then defines the action to be taken. 16.7.1. Definition of Bits in the First Byte The first seven bits of the first byte make up the slave address. The eighth bit is the least significant bit (LSB). It determines the direction of the message. If the LSB is a “zero” it means that the master will write information to a selected slave. A “one” in this position means that the master will read information from the slave. When an address is sent, each device in a system compares the first seven bits after the START condition with its address. If they match, the device considers itself addressed by the master as a slave-receiver or slave-transmitter, depending on the R/ W bit. LSB MSB R/W SLAVE ADDRESS PC20070219.2 Figure 33: First Byte after START Procedure AMIS-30624 is provided with a physical address in order to discriminate this circuit from other circuits on the I2C bus. This address is coded on seven bits (two bits being internally hardwired to ‘1’), yielding the theoretical possibility of 32 different circuits on the same bus. It is a combination of four OTP memory bits (OTP Memory Structure) and of the externally hardwired address bits (pin HW). HW must either be connected to ground or to Vbat. When HW is not connected and is left floating, correct functionality of the positioner is not guaranteed. The motor will be driven to the programmed secure position (See Hardwired Address – OPEN). LSB MSB 1 1 PA3 PA2 PA1 PA0 HW R/W OTP memory PC20070219.3 Hardwired Address Bit Figure 34: First Byte After START Procedure 16.7.2. General Call Address The AMIS-30624 supports also a “general call” address “000 0000”, which can address all devices. When this address is used all devices should respond with an acknowledge. The second byte of the general call address then defines the action to be taken. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 44 AMIS-30624 I2C Microstepping Motordriver Data Sheet 17.0 I2C Application Commands 17.1 Introduction Communications between the AMIS-30624 and a 2-wire serial bus interface master takes place via a large set of commands. Reading commands are used to: • Get actual status information, e.g. error flags • Get actual position of the steppermotor • Verify the right programming and configuration of the AMIS-30624 Writing commands are used to: • Program the OTP memory • Configure the positioner with motion parameters (max/min speed, acceleration, stepping mode, etc.) • Provide target positions to the Stepper motor The I2C-bus master will have to use commands to manage the different application tasks the AMIS-30624 can feature. The commands summary is given in Table 30. 17.2 Commands Table 2 Table 30: I C Commands with Corresponding ROM Pointer Command Mnemonic Command Byte Binary Hexadecimal “1000 0001” 0x81 “1111 1100” 0xFC “1000 0010” 0x82 “1000 0100” 0x84 “1000 0101” 0x85 “1000 0110” 0x86 “1000 0111” 0x87 “1000 1000” 0x88 “1000 1001” 0x89 “1001 0000” 0x90 “1000 1011” 0x8B “1001 0110” 0x96 “1000 1111” 0x8F “1001 0111” 0x97 “1001 1111” 0x9F Function Returns complete status of the chip Returns actual, target and secure position Returns OTP parameter Drives motor to secure position Immediate full stop Sets actual position to zero Overwrites the chip RAM with OTP contents Drives the motor to two different positions with different speed Sets motor parameter Zaps the OTP memory Programs a target and secure position Sets stall parameters Motor stopping with deceleration phase Drives motor continuously Outputs Bemf voltage on pin SWI GetFullStatus1 GetFullStatus2 GetOTPParam GotoSecurePosition HardStop ResetPosition ResetToDefault SetDualPosition SetMotorParam SetOTP SetPosition SetStallParam SoftStop Runvelocity TestBemf These commands are described hereafter, with their corresponding I2C frames. Refer to Data Transfer Formats for more details. A color coding is used to distinguish between master and slave parts within the frames. An example is shown below. Light Blue : Master data Byte Content 0 1 2 Address Address Data 1 Bit 7 1 1 GetFullStatus1 Response Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 1 1 Irun[3:0] OTP3 OTP2 Bit 2 OTP0 Bit 1 HW OTP1 OTP0 Ihold[3:0] Bit 0 0 HW White: Slave response 2 Figure 35: Color Code Used in the Definition of I C Frames AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 45 AMIS-30624 I2C Microstepping Motordriver Data Sheet 17.3 Application Commands GetFullStatus1 This command is provided to the circuit by the master to get a complete status of the circuit and of the steppermotor. Refer to Table 18 and Table 19 to see the meaning of the parameters sent back to the I2C master. Note: A GetFullStatus1 command will attempt to reset flags <TW>, <TSD>, <UV2>, <ElDef>, <StepLoss>, <CPFail>, <OVC1>, <OVC2>, and <VddReset>. GetFullStatus1 corresponds to the following I2C command frame: Byte Content 0 1 Address Command Byte Content 0 1 2 3 4 5 6 7 8 Address Address Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 Bit 7 1 1 GetFullStatus1 Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 0 Bit 2 OTP0 0 Bit 1 HW 0 Bit 0 0 1 Bit 7 1 GetFullStatus1 Response Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 Bit 2 OTP0 Bit 1 HW Bit 0 1 1 AccShape VddReset 1 1 1 Irun[3:0] Vmax[3:0] OTP3 OTP2 StepMode[1:0] Shaft UV2 ESW 1 TSD OVC1 1 StepLoss ElDef Motion[2:0] 1 1 AbsThr[3:0] Where: OTP(n) HW Irun[3:0] Ihold[3:0] Vmax[3:0] Vmin[3:0] AccShape StepMode[1:0] Shaft Acc[3:0] VddReset StepLoss ElDef UV2 TSD TW Tinfo[1:0] Motion[2:0] ESW OVC1 OVC2 Stall CPFail AbsThr[3:0] DelThr[3:0] OTP address bits PA[3:0] Hardwired address bit Operating current in the motor coil Standstill current in the motor coil Maximum velocity Minimum velocity Enables motion without acceleration Step mode definition Direction of movement Acceleration form minimum to maximum velocity Reset of digital supply Step loss occurred Electrical defect Battery under voltage detected Thermal shutdown Thermal warning Temperature Info Motion status External switch status Over current in X-coil detected Over current in Y-coil detected Stall detected Charge pump failure Stall detection absolute threshold Stall detection delta threshold AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 46 OTP1 OTP0 HW Ihold[3:0] Vmin[3:0] Acc[3:0] Tinfo[1:0] TW OVC2 Stall CPFail 1 1 1 DelThr[3:0] AMIS-30624 I2C Microstepping Motordriver Data Sheet GetFullStatus2 This command is provided to the circuit by the master to get the actual, target and secure position of the steppermotor. Both the actual and target position are returned in signed two’s complement 16-bit format. Secure position is coded in 10-bit format. According to the programmed stepping mode the LSBs of ActPos[15:0] and TagPos[15:0] may have no meaning and should be assumed to be ‘0’. This command also gives additional information concerning stall detection. Refer to Table 18 and Table 19 to see the meaning of the parameters sent back to the I2C master. GetFullStatus2 corresponds to the following I2C command frame: Byte Content 0 1 Address Command Byte Content 0 1 2 3 4 5 6 7 8 Address Address Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 Bit 7 1 1 GetFullStatus2 Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 1 1 1 1 Bit 2 OTP0 1 Bit 1 HW 0 GetFullStatus2 Response Frame Structure Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 1 OTP3 OTP2 OTP1 OTP0 HW 1 1 1 1 OTP3 OTP2 OTP1 OTP0 HW ActPos[15:8] ActPos[7:0] TagPos[15:8] TagPos[7:0] SecPos[7:0] FS2StallEn[2:0] 1 DC100 SecPos[10:8] DelStallLo DelStallHi DC100StEn AbsStall MinSamples[2:0] PWMJEn Where: OTP(n) HW ActPos[15:0] TagPos[15:0] SecPos[10:0] FS2StallEn[2:0] DC100 AbsStall DelStallLo DelStallHi: MinSamples[2:0] DC100StEn PWMJEn OTP address bits PA[3:0] Hardwired address bit Actual position Target position Secure position Number of full steps after stall detection is enabled Flag indicating PWM is at 100 percent duty cycle Stall detected because the absolute threshold is not reached Stall detected because the delta threshold is under crossed Stall detected because the delta threshold is crossed Back-emf sampling delay time Enables the switch off of stall detection when DC100 = 1 PWM jitter enable AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com Bit 0 0 0 47 AMIS-30624 I2C Microstepping Motordriver Data Sheet GetOTPParam This command is provided to the circuit by the I2C master to read the content of the OTP memory. More information can be found in OTP Memory Structure. GetOTPParam corresponds to the following I2C command frame: Byte Content 0 1 Address Command Byte Content 0 1 2 3 4 5 6 7 8 Address OTP byte 0 OTP byte 1 OTP byte 2 OTP byte 3 OTP byte 4 OTP byte 5 OTP byte 6 OTP byte 7 Bit 7 1 1 Bit 7 1 GetOTPParam Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 0 GetOTPParam Response Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 OTP byte @0x00 OTP byte @0x01 OTP byte @0x02 OTP byte @0x03 OTP byte @0x04 OTP byte @0x05 OTP byte @0x06 OTP byte @0x07 Bit 2 OTP0 0 Bit 1 HW 1 Bit 0 0 0 Bit 2 OTP0 Bit 1 HW Bit 0 1 GotoSecurePosition This command is provided by the I2C master to one or all the steppermotors to move to the secure position SecPos[10:0]. See the priority encoder description for more details. The priority encoder table also acknowledges the cases where a GotoSecurePosition command will be ignored. GotoSecurePosition corresponds to the following I2C command frame: Byte Content 0 1 Address Command Bit 7 1 1 GotoSecurePosition Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 0 Bit 2 OTP0 1 Bit 1 HW 0 Bit 0 0 0 HardStop This command will be internally triggered when an electrical problem is detected in one or both coils, leading to shutdown mode. If this occurs while the motor is moving, the <StepLoss> flag is raised to allow warning of the I2C master at the next GetStatus1 command that steps may have been lost. Once the motor is stopped, ActPos register is copied into TagPos register to ensure keeping the stop position. The I2C master for some safety reasons can also issue a HardStop command. HardStop corresponds to the following I2C command frame: Byte Content 0 1 Address Command Bit 7 1 1 HardStop Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 0 Bit 2 OTP0 1 Bit 1 HW 0 Bit 0 0 1 ResetPosition This command is provided to the circuit by the I2C master to reset ActPos and TagPos registers to zero. This can be helpful to prepare for instance a relative positioning. ResetPosition corresponds to the following I2C command frame: Byte Content 0 1 Address Command Bit 7 1 1 ResetPosition Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 0 AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 48 Bit 2 OTP0 1 Bit 1 HW 1 Bit 0 0 0 AMIS-30624 I2C Microstepping Motordriver Data Sheet ResetToDefault This command is provided to the circuit by the I2C master in order to reset the whole slave node into the initial state. ResetToDefault will, for instance, overwrite the RAM with the reset state of the registers parameters (see Table 18). This is another way for the I2C master to initialize a slave node in case of emergency, or simply to refresh the RAM content. Note: ActPos and TagPos are not modified by a ResetToDefault command. Important: Care should be taken not to send a ResetToDefault command while a motion is ongoing, since this could modify the motion parameters in a way forbidden by the position controller. ResetToDefault corresponds to the following I2C command frame: Byte Content 0 1 Address Command Bit 7 1 1 ResetToDefault Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 0 Bit 2 OTP0 1 Bit 1 HW 1 Bit 0 0 1 RunVelocity This command is provided to the circuit by the I2C master in order to put the motor in continuous motion state. RunVelocity corresponds to the following I2C command frame: Byte Content 0 1 Address Command RunVelocity Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 1 0 Bit 7 1 1 Bit 2 OTP0 1 Bit 1 HW 1 Bit 0 0 1 SetDualPosition This command is provided to the circuit by the I2C master in order to perform a positioning of the motor using two different velocities. See Section Dual Positioning. Note1: This sequence cannot be interrupted by another positioning command. Important: If for some reason ActPos equals Pos1[15:0] at the moment the SetDualPosition command is issued, the circuit will enter in deadlock state. Therefore, the application should check the actual position by a GetFullStatus2 command prior to starting a dual positioning. Another solution may consist of programming a value out of the steppermotor range for Pos1[15:0]. For the same reason Pos2[15:0] should not be equal to Pos1[15:0]. SetDualPosition corresponds to the following I2C command frame; Byte Content 0 1 2 3 4 5 6 7 8 Address Command Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 Bit 7 1 1 1 1 SetDualPosition Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 1 1 1 1 1 1 1 1 1 Vmax[3:0] Pos1[15:8] Pos1[7:0] Pos2[15:8] Pos2[7:0] Bit 2 Bit 1 OTP0 HW 0 0 1 1 1 1 Vmin[3:0] Where: Vmax[3:0] Vmin[3:0] Pos1[15:0] Pos2[15:0] Max. velocity for first motion Min. velocity for first motion and velocity for the second motion First position to be reached during the first motion Relative position of the second motion AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 49 Bit 0 0 0 1 1 AMIS-30624 I2C Microstepping Motordriver Data Sheet SetStallParam This command sets the motion detection parameters and the related steppermotor parameters, such as the minimum and maximum velocity, the run- and hold current, acceleration and step-mode. See Motion Detection for the meaning of these parameters. SetStallParam corresponds to the following I2C command frame: Byte Content 0 1 2 3 4 5 6 7 8 Address Command Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 SetStallParam Command Frame Structure Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 1 1 OTP3 OTP2 OTP1 OTP0 HW 1 0 0 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Irun[3:0] Ihold[3:0] Vmax[3:0] Vmin[3:0] MinSamples[2:0] Shaft Acc[3:0] AbsThr[3:0] DelThr[3:0] FS2StallEn[2:0] AccShape StepMode[1:0] DC100StEn Bit 0 0 0 1 1 PWMJEn SetMotorParam This command is provided to the circuit by the I2C master to set the values for the stepper motor parameters (listed below) in RAM. Refer to Table 18 to see the meaning of the parameters sent by the I2C master. Important: If a SetMotorParam occurs while a motion is ongoing, it will modify at once the motion parameters (see Position Controller). Therefore the application should not change parameters other than Vmax and Vmin while a motion is running, otherwise correct positioning cannot be guaranteed. SetMotorParam corresponds to the following I2C command frame: Byte Content 0 1 2 3 4 5 6 7 8 Address Command Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 Data 7 Bit 7 1 1 1 1 1 SetMotorParam Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 1 OTP3 OTP2 OTP1 OTP0 HW 0 0 0 1 0 0 1 1 1 1 1 1 1 1 1 1 1 1 Irun[3:0] Ihold[3:0] Vmax[3:0] Vmin[3:0] SecPos[10:8] Shaft Acc[3:0] SecPos[7:0] 1 AccShape PWMfreq 1 StepMode[1:0] Bit 0 0 1 1 1 PWMJEn SetOTPParam This command is provided to the circuit by the I2C master to program and zap the OTP data D[7:0] in OTP address OTPA[2:0]. Important: This command must be sent under a specific Vbb voltage value. See parameter VbbOTP in Table 5. This is a mandatory condition to ensure reliable zapping. SetOTPParam corresponds to the following I2C command frame: Byte Content 0 1 2 3 4 5 Address Command Data 1 Data 2 Data 3 Data 4 Bit 7 1 1 1 1 1 SetOTPParam Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 1 0 1 1 1 1 1 1 1 1 1 1 1 1 D[7:0] Where: OTPA[2:0]: OTP address D[7:0]: Corresponding OTP data AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 50 Bit 2 OTP0 0 1 1 Bit 1 HW 0 1 1 OTPA[2:0] Bit 0 0 0 1 1 AMIS-30624 I2C Microstepping Motordriver Data Sheet SetPosition This command is provided to the circuit by the I2C master to drive the motor to a given absolute position. See Positioning for more details. The priority encoder table (see Priority Encoder) acknowledges the cases where a SetPosition command will be ignored. SetPosition corresponds to the following I2C command frame: Byte Content 0 1 2 3 4 5 Address Command Data 1 Data 2 Data 3 Data 4 Bit 7 1 1 1 1 SetPosition Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 1 1 1 1 1 1 1 1 1 Pos[15:8] Pos[7:0] Bit 2 OTP0 0 1 1 Bit 1 HW 1 1 1 Bit 0 0 1 1 1 Where: Pos [15:0] Signed 16-bit position set-point for motor. SoftStop This command will be internally triggered when the chip temperature rises above the thermal shutdown threshold (see Table 5 and Section 15.2.5). It provokes an immediate deceleration to Vmin (see Minimum Velocity) followed by a stop, regardless of the position reached. Once the motor is stopped, TagPos register is overwritten with value in ActPos register to ensure keeping the stop position. The I2C Master for some safety reasons can also issue a SoftStop command. SoftStop corresponds to the following I2C command frame: Byte Content 0 1 Address Command Bit 7 1 1 SoftStop Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 0 1 Bit 2 OTP0 1 Bit 1 HW 1 Bit 0 0 1 TestBemf This command is provided to the circuit by the I2C master in order to output the Bemf integrator output to the SWI output of the chip. Once activated, it can be stopped only after POR. During the Bemf observation, reading of the SWI state is internally forbidden. TestBemf corresponds to the following I2C command frame: Byte Content 0 1 Address Command Bit 7 1 1 TestBemf Command Frame Structure Bit 6 Bit 5 Bit 4 Bit 3 1 OTP3 OTP2 OTP1 0 0 1 1 AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 51 Bit 2 OTP0 1 Bit 1 HW 1 Bit 0 0 1 AMIS-30624 I2C Microstepping Motordriver Data Sheet 18.0 Resistance to Electrical and Electromagnetic Disturbances 18.1 Electrostatic Discharges Table 31: Absolute Maximum Ratings Parameter Vesd Notes: (1) (1) Min. Max. Unit -2 +2 kV Electrostatic discharge voltage on all pins Human body model (100pF via 1.5 kΩ, according to JEDEC EIA-JESD22-A114-B.) 18.2 Electrical Transient Conduction Along Supply Lines Test pulses are applied to the power supply wires of the equipment implementing the AMIS-30624 (see application schematic), according to ISO 7637-1 document. Operating Classes are defined in ISO 7637-2. Table 32: Test Pulses and Test Levels According to ISO 7637-1 Pulse Amplitude Rise Time Pulse Duration Rs Operating Class #1 -100V ≤ 1µs 2ms 10Ω C #2a +100V ≤ 1µs 50µs 2Ω B #3a -150V (from +13.5V) 5ns 100ns (burst) 50Ω A #3b +100V (from +13.5V) 5ns 100ns (burst) 50Ω A #5b (load dump) +21.5V (from +13.5V) ≤ 10ms 400ms ≤ 1Ω C 18.3 EMC Bulk current injection (BCI), according to ISO 11452-4. Operating Classes are defined in ISO 7637-2. Table 33: Bulk Current Injection Operating Classes Current Operating Class 60mA envelope A 100mA envelope B 200mA envelope C 18.4 Power Supply Micro-interruptions According to ISO 16750-2 Table 34: Immunity to Power Supply Micro-interruptions Test Operating Class 10µs micro-interruptions B 5ms micro-interruptions B 50ms micro-interruptions C 300ms micro-interruptions C AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com A 100µs micro-interruptions 52 AMIS-30624 I2C Microstepping Motordriver 19.0 Package Outline Figure 36: SOIC-20: Plastic Small Outline; 20 leads; Body Width 300mil. AMIS reference: SOIC300 20 300G AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 53 Data Sheet AMIS-30624 I2C Microstepping Motordriver Dimensions: Dim Min A 0.8 A1 0 A2 0.576 A3 b 0.25 C 0.24 D D1 E E1 e J 5.37 K 5.37 L 0.35 P R 2.185 Nom 0.02 0.615 0.203 0.3 0.42 7 6.75 7 6.75 0.65 5.47 5.47 0.4 45 Max 0.9 0.05 0.654 0.35 0.6 5.57 5.57 0.45 2.385 Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm Degree mm Notes 2) Dimensions apply to plated terminal and are measured between 0.2 and 0.25 mm from terminal tip. 3) The pin #1 indication must be placed on the top surface of the package by using indentation mark or other feature of package body. 4) Exact shape and size of this feature is optional 5) Applied for exposed pad and terminals. Exclude embedding part of exposed pad from measuring. 6) Applied only to terminals 7) Exact shape of each corner is optional 7x7 NQFP Figure 37: NQFP-32: No lead Quad Flat Pack; 32 pins; body size 7 x 7 mm. AMIS reference: NQFP-32 AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com Data Sheet 54 AMIS-30624 I2C Microstepping Motordriver Data Sheet 20.0 Soldering 20.1 Introduction to Soldering Surface Mount Packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations re-flow soldering is often used. 20.2 Re-flow Soldering Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on the heating method. Typical reflow peak temperatures range from 215 to 260°C. The top-surface temperature of the packages should preferably be kept below 230°C. 20.3 Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems, the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the PCB; o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 20.4 Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C. Table 35: Soldering Process Soldering Method Package BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC (3) , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes: (1) (2) (3) (4) (5) Wave Re-flow(1) Not suitable (2) Not suitable Suitable (3)(4) Not recommended (5) Not recommended Suitable Suitable Suitable Suitable Suitable All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.” These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 55 AMIS-30624 I2C Microstepping Motordriver Data Sheet 21.0 Company or Product Inquiries For more information about AMI Semiconductor’s motordrivers, please send an email to [email protected]. For more information about AMI Semiconductor’s products or services visit our Web site at http://www.amis.com. 22.0 Document History Table 36: Document History Version Date of Version 1.0 July 16, 2002 th 2.1 December 5 , 2005 3.0 February 21, 2007 3.1 March 23, 2007 Modifications/Additions First non-preliminary issue Complete review Public release 2 UpdateI C commands, adding links Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc. AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003 www.amis.com 56