LP62S1024B-I Series 128K X 8 BIT LOW VOLTAGE CMOS SRAM Document Title 128K X 8 BIT LOW VOLTAGE CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue May 30, 2002 Preliminary 0.1 Add 32L Pb-Free TSSOP package type October 2, 2002 1.0 Final version release July 18, 2003 1.1 Change ICCDR1, ICCDR2 (max.) from 3μA to 1μA June 29, 2004 1.2 Add Pb-Free package type for all parts August 9, 2004 Rev. No. (August, 2004, Version 1.2) Final AMIC Technology, Corp. LP62S1024B-I Series 128K X 8 BIT LOW VOLTAGE CMOS SRAM Features General Description Power supply range: 2.7V to 3.6V Access times: 55/70 ns (max.) Current: Very low power version: Operating: 30mA(max.) Standby: 5uA (max.) Full static operation, no clock or refreshing required All inputs and outputs are directly TTL-compatible Common I/O using three-state output Output enable and two chip enable inputs for easy application Data retention voltage: 2V (min.) Available in 32-pin SOP, TSOP, TSSOP (8 X 13.4mm) forward type and 36-pin CSP packages The LP62S1024B-I is a low operating current 1,048,576-bit static random access memory organized as 131,072 words by 8 bits and operates on a low power voltage: 2.7V to 3.6V. It is built using AMIC's high performance CMOS process. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Two chip enable inputs are provided for POWER-DOWN and device enable and an output enable input is included for easy interfacing. Data retention is guaranteed at a power supply voltage as low as 2V. Product Family Product Family Operating Temperature VCC Range Power Dissipation Speed Data Retention (ICCDR, Typ.) Standby (ISB1, Typ.) Operating (ICC2, Typ.) Package Type 32L SOP LP62S1024B -40°C ~ +85°C 2.7V~3.6V 55ns / 70ns 0.05µA 0.08µA 1.5mA 32L TSOP 32L TSSOP 36B µBGA 1. Typical values are measured at VCC = 3.0V, TA = 25°C and not 100% tested. 2. Data retention current VCC = 2.0V. (August, 2004, Version 1.2) 1 AMIC Technology, Corp. LP62S1024B-I Series Pin Configurations SOP TSOP/TSSOP CSP (Chip Size Package) 36-pin Top View 32 VCC 2 31 A15 A14 3 30 CE2 A12 4 29 WE A7 5 28 A13 A6 6 27 A8 A5 7 26 A9 A4 8 25 A11 A3 9 24 OE A2 10 A1 11 A0 23 A10 22 CE1 21 I/O8 13 20 I/O7 14 19 I/O6 I/O3 15 18 I/O5 GND 16 17 I/O4 I/O1 I/O2 12 16 1 LP62S1024BV-I (LP62S1024BX-I) 1 LP62S1024BM-I NC A16 1 2 3 4 5 6 A A0 A1 CE2 A3 A6 A8 A2 WE A4 A7 I/O1 NC A5 B I/O5 C I/O6 D GND E VCC F I/O7 I/O2 VCC GND NC NC I/O3 G I/O8 OE CE1 A16 A15 I/O4 H A9 A10 A11 A12 A13 A14 32 17 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name A11 A9 A8 A13 WE CE2 A15 VCC NC A16 A14 A12 A7 A6 A5 A4 Pin No. 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pin Name A3 A2 A1 A0 I/O 1 I/O 2 I/O 3 GND I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 CE1 A10 OE Block Diagram A0 VCC GND A14 ROW 512 X 2048 DECODER MEMORY ARRAY INPUT DATA CIRCUIT COLUMN I/O A15 A16 I/O1 I/O8 CE2 CE1 OE WE (August, 2004, Version 1.2) CONTROL CIRCUIT 2 AMIC Technology, Corp. LP62S1024B-I Series Pin Descriptions - SOP Pin No. Symbol 1 NC 2 - 12, 23, 25 - 28, 31 Pin Description – TSOP/TSSOP Description Pin No. Symbol Description No Connection 1 - 4, 7, 10 - 20, 31 A0 - A16 A0 - A16 Address Inputs 5 WE Write Enable 13 - 15, 17 - 21 I/O1 - I/O8 Data Input/Outputs 6 CE2 Chip Enable 16 GND Ground 8 VCC Power Supply 22 Chip Enable 9 NC No Connection CE1 24 OE Output Enable 21 - 23, 25 - 29 I/O1 - I/O8 29 WE Write Enable 24 GND Ground 30 CE2 Chip Enable 30 CE1 Chip Enable 32 VCC Power Supply 32 OE Output Enable Address Inputs Data Input/Outputs Pin Description - CSP Symbol A0 - A16 Description Address Inputs Symbol Description NC No Connection WE Write Enable OE Output Enable VCC Power Supply CE1 Chip Enable GND Ground CE2 Chip Enable -- (August, 2004, Version 1.2) I/O1 - I/O8 Data Input/Output -- 3 AMIC Technology, Corp. LP62S1024B-I Series Recommended DC Operating Conditions (TA = -40°C to +85°C) Symbol Parameter VCC Supply Voltage GND Ground Min. Typ. Max. Unit 2.7 3.0 3.6 V 0 0 0 V VIH Input High Voltage 2.2 - VCC + 0.3 V VIL Input Low Voltage -0.3 - +0.6 V CL Output Load - - 30 pF TTL Output Load - - 1 - Absolute Maximum Ratings* *Comments VCC to GND ...............................................-0.5V to +4.6V IN, IN/OUT Volt to GND..................... -0.5V to VCC +0.5V Operating Temperature, Topr ................... -40°C to +85°C Storage Temperature, Tstg..................... -55°C to +125°C Temperature Under Bias, Tbias................ -10°C to +85°C Power Dissipation, PT ............................................... 0.7W Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics Symbol (TA = -40°C to +85°C, VCC = 2.7V to 3.6V, GND = 0V) Parameter ⎜ILI⎥ Input Leakage Current ⎜ILO⎥ Output Leakage Current ICC Active Power Supply Current LP62S1024B-55LLI/70LLI Unit Conditions Min. Max. - 1 µA VIN = GND to VCC - 1 µA CE1 = VIH or CE2 = VIL or OE = VIH or WE = VIL VI/O = GND to VCC - 3 mA CE1 = VIL, CE2 = VIH II/O = 0mA - 30 mA Min. Cycle, Duty = 100% CE1 = VIL, CE2 = VIH II/O = 0mA ICC2 - 3 mA CE1 = VIL, CE2 = VIH VIH = VCC, VIL = 0V f = 1 MHZ, II/O = 0mA ISB - 0.5 mA - 5 µA VCC ≤ 3.3V, CE1 ≥ VCC - 0.2V or CE2 ≤ 0.2V, VIN ≥ 0V ICC1 Dynamic Operating Current ISB1 Standby Power Supply Current VCC ≤ 3.3V, CE1 = VIH or CE2 =VIL VOL Output Low Voltage - 0.4 V IOL = 2.1mA VOH Output High Voltage 2.2 - V IOH = -1.0mA (August, 2004, Version 1.2) 4 AMIC Technology, Corp. LP62S1024B-I Series Truth Table Mode CE1 CE2 OE WE I/O Operation H X X X High Z ISB, ISB1 X L X X High Z ISB, ISB1 Output Disable L H H H High Z ICC, ICC1, ICC2 Read L H L H DOUT ICC, ICC1, ICC2 Write L H X L DIN ICC, ICC1, ICC2 Min. Max. Unit Conditions Standby Supply Current Note: X = H or L Capacitance (TA = 25°C, f = 1.0MHz) Symbol Parameter CIN* Input Capacitance 6 pF VIN = 0V CI/O* Input/Output Capacitance 8 pF VI/O = 0V * These parameters are sampled and not 100% tested. (August, 2004, Version 1.2) 5 AMIC Technology, Corp. LP62S1024B-I Series AC Characteristics (TA = -40°C to +85°C, VCC = 2.7V to 3.6V) Symbol LP62S1024B-55LLI Parameter LP62S1024B-70LLI Unit Min. Max. Min. Max. 55 - 70 - ns - 55 - 70 ns CE1 - 55 - 70 ns CE2 - 55 - 70 ns - 30 - 35 ns CE1 10 - 10 - ns CE2 10 - 10 - ns 5 - 5 - ns CE1 0 20 0 25 ns CE2 0 20 0 25 ns Read Cycle tRC Read Cycle Time tAA Address Access Time tACE1 Chip Enable Access Time tACE2 tOE Output Enable to Output Valid tCLZ1 Chip Enable to Output in Low Z tCLZ2 tOLZ Output Enable to Output in Low Z tCHZ1 Chip Disable to Output in High Z tCHZ2 tOHZ Output Disable to Output in High Z 0 20 0 25 ns tOH Output Hold from Address Change 5 - 10 - ns tWC Write Cycle Time 55 - 70 - ns tCW Chip Enable to End of Write 50 - 60 - ns tAS Address Setup Time 0 - 0 - ns tAW Address Valid to End of Write 50 - 60 - ns tWP Write Pulse Width 40 - 50 - ns tWR Write Recovery Time 0 - 0 - ns tWHZ Write to Output in High Z 0 25 0 25 ns tDW Data to Write Time Overlap 25 - 30 - ns tDH Data Hold from Write Time 0 - 0 - ns tOW Output Active from End of Write 5 - 5 - ns Write Cycle Notes: tCHZ1, tCHZ2, tOHZ, and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. (August, 2004, Version 1.2) 6 AMIC Technology, Corp. LP62S1024B-I Series Timing Waveforms Read Cycle 1 (1, 2, 4) tRC Address tAA tOH tOH DOUT Read Cycle 2 (1, 3, 4, 6) CE1 tACE1 tCLZ15 tCHZ15 DOUT Read Cycle 3 (1, 4, 7, 8) CE2 tACE2 tCHZ25 tCLZ25 DOUT (August, 2004, Version 1.2) 7 AMIC Technology, Corp. LP62S1024B-I Series Timing Waveforms (continued) Read Cycle 4 (1) tRC Address tAA OE tOE tOH tOLZ 5 CE1 tACE1 tCHZ15 tCLZ15 CE2 tACE2 tOHZ5 tCHZ25 tCLZ25 DOUT Notes: 1. 2. 3. 4. 5. 6. 7. 8. WE is high for Read Cycle. Device is continuously enabled CE1 = VIL and CE2 = VIH. Address valid prior to or coincident with CE1 transition low. OE = VIL. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. CE2 is high. CE1 is low. Address valid prior to or coincident with CE2 transition high. Write Cycle 1 (6) (Write Enable Controlled) tWC Address tAW tWR3 tCW5 CE1 (4) CE2 (4) tAS1 tWP2 WE tDW tDH DIN tWHZ tOW DOUT (August, 2004, Version 1.2) 8 AMIC Technology, Corp. LP62S1024B-I Series Timing Waveforms (continued) Write Cycle 2 (Chip Enable Controlled) tWC Address tWR3 tAW tCW5 CE1 CE2 tAS1 (4) (4) tCW5 tWP2 WE tDW tDH DIN tWHZ7 DOUT tAS is measured from the address valid to the beginning of Write. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE . tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after the WE transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write. 6. OE is continuously low. ( OE = VIL) 7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. Notes: 1. 2. 3. 4. (August, 2004, Version 1.2) 9 AMIC Technology, Corp. LP62S1024B-I Series AC Test Conditions Input Pulse Levels 0.4V to 2.4V Input Rise and Fall Time 5 ns Input and Output Timing Reference Levels 1.5V Output Load See Figures 1 and 2 TTL TTL CL CL 30pF 5pF * Including scope and jig. * Including scope and jig. Figure 1. Output Load Figure 2. Output Load for tCLZ1, tCLZ2, tOHZ, tOLZ, tCHZ1, tCHZ2, tWHZ, and tOW Data Retention Characteristics (TA = -40°C to 85°C) Symbol Parameter Min. Max. Unit 2.0 3.6 V CE1 ≥ VCC - 0.2V VDR2 2.0 3.6 V CE2 ≤ 0.2V, ICCDR1 - 1* µA VCC = 2V, CE1 ≥ VCC - 0.2V, VIN ≥ 0V - 1* µA VCC = 2V, CE2 ≤ 0.2V, VIN ≥ 0V Chip Disable to Data Retention Time 0 - ns See Retention Waveform Operation Recovery Time 5 - ms VDR1 Conditions VCC for Data Retention Data Retention Current ICCDR2 tCDR tR * LP62S1024B-55LLI/70LLI (August, 2004, Version 1.2) ICCDR: max. 1µA at TA = 0°C to + 40°C 10 AMIC Technology, Corp. LP62S1024B-I Series Low VCC Data Retention Waveform (1) ( CE1 Controlled) DATA RETENTION MODE VCC 3.0V tCDR CE1 3.0V VDR ≥ 2V tR VIH VIH CE1 ≥ VDR - 0.2V Low VCC Data Retention Waveform (2) (CE2 Controlled) DATA RETENTION MODE VCC 3.0V tCDR CE2 3.0V VDR ≥ 2V VIL tR VIL CE2 ≤ 0.2V (August, 2004, Version 1.2) 11 AMIC Technology, Corp. LP62S1024B-I Series Ordering Information Part No. Access Time (ns) Operating Current Max. (mA) Standby Current Max. (µA) LP62S1024BM-55LLI Package 32L SOP LP62S1024BM-55LLIF 32L Pb-Free SOP LP62S1024BV-55LLI 32L TSOP LP62S1024BV-55LLIF 32L Pb-Free TSOP 55 30 5 LP62S1024BX-55LLI 32L TSSOP LP62S1024BX-55LLIF 32L Pb-Free TSSOP LP62S1024BU-55LLI 36L CSP LP62S1024BU-55LLIF 36L Pb-Free CSP LP62S1024BM-70LLI 32L SOP LP62S1024BM-70LLIF 32L Pb-Free SOP LP62S1024BV-70LLI 32L TSOP LP62S1024BV-70LLIF 32L Pb-Free TSOP 70 30 LP62S1024BX-70LLI 5 32L TSSOP LP62S1024BX-70LLIF 32L Pb-Free TSSOP LP62S1024BU-70LLI 36L CSP LP62S1024BU-70LLIF (August, 2004, Version 1.2) 36L Pb-Free CSP 12 AMIC Technology, Corp. LP62S1024B-I Series Package Information SOP (W.B.) 32L Outline Dimensions 32 unit: inches/mm 17 e1 HE E ~ L 1 b 16 Detail F e1 e Seating Plane D s A LE A1 A2 c D y See Detail F Symbol Dimensions in inches Dimensions in mm 3.00 Max. A 0.118 Max. A1 0.004 Min. 0.10 Min. A2 0.106±0.005 2.69±0.13 b 0.016 +0.004 0.41 +0.10 -0.002 -0.05 0.008 +0.004 0.20 +0.10 c -0.002 D -0.05 0.805 Typ. (0.820 Max.) 20.45 Typ. (20.83 Max.) E 0.445±0.010 11.30±0.25 e 0.050 ±0.006 1.27±0.15 e1 0.525 NOM. 13.34 NOM. HE 0.556±0.010 14.12±0.25 L 0.031±0.008 0.79±0.20 LE 0.055±0.008 1.40±0.20 S 0.044 Max. 1.12 Max. y 0.004 Max. 0.10 Max. θ 0° ~ 10° 0° ~ 10° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. (August, 2004, Version 1.2) 13 AMIC Technology, Corp. LP62S1024B-I Series Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm e D A c E A2 12.0° A1 GAUGE PLANE 0.25 BSC θ L LE HD Detail "A" D Detail "A" y S Symbol Dimensions in inches Dimensions in mm A 0.047 Max. 1.20 Max. A1 0.004±0.002 0.10±0.05 A2 0.039±0.002 1.00±0.05 b 0.008±0.001 0.20±0.03 c 0.006±0.001 0.15±0.02 D 0.724±0.004 18.40±0.10 E 0.315±0.004 8.00±0.10 e 0.020 TYP. 0.50 TYP. HD 0.787±0.007 20.00±0.20 L 0.020±0.004 0.50±0.10 LE 0.031 TYP. 0.80 TYP. S 0.0167 TYP. 0.425 TYP. Y 0.004 Max. 0.10 Max. θ 0° ~ 6° 0° ~ 6° b 0.10(0.004) M Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. (August, 2004, Version 1.2) 14 AMIC Technology, Corp. LP62S1024B-I Series Package Information TSSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions e unit: inches/mm A c E A2 12.0° A1 GAUGE PLANE 0.25 BSC θ L LE D1 D Detail "A" D Detail "A" 0.10MM S b SEATING PLANE Symbol Dimensions in inches Dimensions in mm A 0.049 Max. 1.25 Max. A1 0.002 Min. 0.05 Min. A2 0.039±0.002 1.00±0.05 b 0.008±0.001 0.20±0.03 c 0.006±0.0003 0.15±0.008 E 0.315±0.004 8.00±0.10 e 0.020 TYP. 0.50 TYP. D 0.528±0.008 13.40±0.20 D1 0.465±0.004 11.80±0.10 L 0.02±0.008 0.50±0.20 LE 0.0266 Min. 0.675 Min. S 0.0109 TYP. 0.278 TYP. y 0.004 Max. 0.10 Max. θ 0° ~ 6° 0° ~ 6° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. (August, 2004, Version 1.2) 15 AMIC Technology, Corp. LP62S1024B-I Series Package Information 36LD CSP (6 x 8 mm) Outline Dimensions unit: mm TOP VIEW BOTTOM VIEW Ball#A1 CORNER 0.10 S C 0.25 S C A B Ball*A1 CORNER b (36X) 6 5 4 3 2 1 1 2 3 4 5 6 A B C D E F G H A B E E1 e C D E F G H B A 0.10 C SIDE VIEW D 0.20(4X) A2 SEATING PLANE A1 (0.36) C Symbol A A1 A2 D E D1 E1 e b A // 0.25 C e D1 Dimensions in mm MIN. NOM. MAX. 1.00 0.16 0.48 5.80 7.80 ------0.25 1.10 0.21 0.53 6.00 8.00 3.75 5.25 0.75 0.30 1.20 0.26 0.58 6.20 8.20 ------0.35 Note: 1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY). 2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 3. DIMENSION b IS MEASURED AT THE MAXIMUM. 4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE SOLDER BALL AND THE BODY EDGE. (August, 2004, Version 1.2) 16 AMIC Technology, Corp.