������������������������������� ���� �������������������������������������������������������������� � � � � � � � � � � � � � � � INTRODUCTION This easy-to-use kit provides a platform for the evaluation of power op amps using the PA04 pin-out configuration. It can be used to analyze a multitude of standard or proprietary circuit configurations, and is flexible enough to do most standard amplifier test configurations. The schematic of the PC board is shown in Figure 2. Note that all of the components shown on the schematic will probably not be used for any single circuit. The component locations on the PC board (See Figure 3) provide maximum flexibility for a variety of configurations. Also included are loops for current probes as well as connection pads on the edge of the PC board for easy interconnects. The hardware required to mount the PC board and the device under evaluation to the heatsink are included in the kit. Because of the limitless combination of configurations and component values that can be used, no other parts are included in this kit. However, generic formulas and guidelines are included in the APEX DATABOOK. ASSEMBLY HINTS The mating socket included with this kit has recessed nut sockets for mounting the device under evaluation. This allows assembly from one side of the heatsink, making it easy to swap devices under evaluation. The sizes of the stand-offs were selected to allow proper spacing of the board-to-heatsink and allow enough height for components when the assembly is inverted. PARTS LIST Part # HS11 EVAL04 MS05 HWRE01 TW05 Description Heatsink PC Board Mating Socket Hardware Kit Thermal Washer Quantity 1 1 1 1 1 HWRE01 contains the following: 4 #8 Panhead Screws 4 #6 x 1.25" Panhead Screws 4 #8 .375" Hex Spacers 4 #6 x 5/16" Hex Nuts 4 #8 1.00" Hex Stand Offs 2 #6 x 1/4" Hex Nuts • Initially set all power supplies to the minimum operating levels allowed in the device data sheet. • Check for oscillations. • Always use the heatsink included in this kit with thermal grease or TW05 and torque the part to the specified 8-10 in-lbs (.90-1.13 N•M). • Do not change connections while the circuit is under power. • Never exceed any of the absolute maximums listed in the device data sheet. • Always use adequate power supply bypassing. • Remember that internal power does not equal load power. • Do not count on internal diodes to protect the output against sustained, high frequency, high energy kickback pulses. ASSEMBLY 1. Insert a #6 x 1/4" hex nut in each of the nut socket recesses located on the bottom of the mating socket. 2. Insert the socket into the PC board until it is firmly pressed against the ground plane side of the PC board. 3. Solder the socket in place (Figure 1). Be sure the nuts are in the recesses prior to soldering. 4. Mount the PC board assembly to the heatsink using the stand-offs and spacers included. 5. Apply thermal grease or a TW05 to the bottom of the device under evaluation. Insert into the mating socket through the heatsink. 6. Use the #6 x 1.25" panhead screws to mount the amplifier to the heat sink. Do not overtorque. Recommended mounting torque is 8-10 in-lbs (.90-1.13 N•M). 7. On the ground plane side of the board, between terminations for –V and OUT, scrape off the green solder mask for a ground connection. Connect the power supply common in this area. If using the onboard Vboost generation circuits, connect J3 to this ground also. If desired, the green solder mask may be scrapped away on the other end of the board for low current input signal ground connections also. Mounting precautions, general operating considerations, and heatsinking information may be found in the APEX DATABOOK. BEFORE YOU GET STARTED NOTE: Refer to HS11 in Accessories Section. • All Apex amplifiers should be handled using proper ESD precautions! FIGURE 1. �������� �������� ������������ ������� �������� �������� ���������� ������������� ������������� ���������������� �������� ������������� �������� �������� ������������ APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL [email protected] 1 EK04 EVALUATION KIT FOR PA04 PIN-OUT FIGURE 2. �� �� ��� �� � � �� ��������������� ������� � � � ��� �� ������ � � �������� ��� �� � �� �� �� �� � �� �� �� �� �� �� �� � �� � �� ��� � ��� ��� ��� ��� ��� � ��� � �� � � ���� ��� � ��� � ������ � � � ��� ��� ��� ��� � � � ��� �� �� � �� ������ ��� � � �� �� � � ��� � ����� ����� �������� � �� ��� ��� ��� �� �� �������� ��� ���� ��� �� ��� �� �� �� ��� ��� ��� �� ����������������������� TYPICAL COMPONENT FUNCTIONS COMPONENT FUNCTION R1 Feedback resistor R2 Logic shutdown R4 Input resistor logic input R5 Current setting resistor R6 Input resistor logic input R7 Input resistor R8 Input bias current measurement (Note 4) R9 Current limit R10 Noise gain compensation (Note 1) R11 Resistor divider network for biasing inputs (Note 2) R12 Input bias current measurement (Note 4) R13 Resistor divider network for biasing inputs (Note 2) R14 Compensation resistor C1 AC gain or stability (Note 1) C4 Power supply bypass (Note 3) C5 Power supply bypass (Note 3) C7 Input coupling C8 AC gain set C9 Power supply bypass (Note 3) C10 Noise gain compensation (Note 1) C11 Power supply bypass (Note 3) C12 Bias node noise bypass (Note 2) C13 Bias node noise bypass (Note 2) C14 Compensation C16 Power supply bypass (Note 3) C17 Power supply bypass (Note 3) CR2 Flyback protection (Note 5) CR3-8 Input protection (Note 5) CR9 Flyback protection (Note 5) CR11 Zener reference for MAX636 OPTIONAL Vboost COMPONENT FUNCTIONS AND RECOMMENDED VALUES C2 100µF 25V Regulator Input Capacitor C3 100µF 100V Boost Output Filter Capacitor C6 10µF 200V Bias Filter Capacitor C15 100µF 100V Boost Output Filter Capacitor C18 100µF 25V Regulator Input Capacitor C19 1µF X7R 100V Boost Output Filter Capacitor C20 1µF X7R 100V Boost Output Filter Capacitor CR1 1N5242 Positive Input Boost Reference CR10 1N5819 Negative Boost Flyback Diode CR11 1N5242 Negative Input Boost Reference IC1 MAX632 Positive Boost Regulator IC2 MAX636 Negative Boost Regulator L1 330µH Positive Boost Output Inductor L2 330µH Negative Boost Output Inductor Q4 IRF9240 Positive Pass Element Q5 IRF240 Negative Pass Element R3 50KΩ 1Watt Reference Bias Resistor NOTE: Q4 and Q5 can optionally be attached to heatsinks, Apex part # HS01. This should be done when the total supply voltage to the PA04 exceeds 60 Vdc. NOTES: Please refer to the following sections of the APEX DATABOOK as noted. 1. See Stability section of “General Operating Considerations.” 2. See “General Operating Considerations.” 3. See Power Supplies section of “General Operating Considerations.” 4. See “Parameter Definitions and Test Methods.” 5. See Amplifier Protection section of “General Operating Considerations.” APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 2 EK04 EVALUATION KIT FOR PA04 PIN-OUT FIGURE 3. �� ��� �� �� ��� �� � ��� ��� �� �� � �� �� � �� �� �� � � �� ���� �� � � � �� �� � ��� ���� �� � ��� ��� ��� ��� ���� ��� ��� �� � � ��� ��� �� ��� �� ��� �� ��� ��� ��� ��� � � ���� �� ��� � ��� � ��� � � ��� ��� ��� ��� �������� �� �� �� � � �� �� ��� ��� � ��� �� � �� � ��� �� ������������ �������������� �� ���� ����������� APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL [email protected] 3 EK04 EVALUATION KIT FOR PA04 PIN-OUT TYPICAL APPLICATION ing configuration avoids any concern of common mode effects. Typical specs of such a circuit would read as follows: Po = 200W F = 10kHz RL = 4 Ohms THD = .0061 The PA04 is well suited for wideband, low distortion, high power applications. The circuit in Figure 4 displays the simplicity of use offered by the PA04. The circuit is in an inverting gain of 10. This relatively low gain allows the amplifier to have more than adequate loop gain available, resulting in extremely low distortion at the power levels delivered. The use of the invert- ��� FIGURE 4. ��� �� �� � �� � � � �� ��� ��� ��� ��� ��� ��� �� � �� ��� � ��� �� �� � �� �� ��� � � � � �� �� �� � � ��� ��� ��� �� ��� ��� ��� OPTIONAL V BOOST ��� extends the common mode range of the amplifier. The ground connection of J3 needs to be made when assembled. One of many inexpensive ways to acquire V boost for the PA04 has been included as an option on this evaluation kit. The addition of these parts not only increases swing, but also FIGURE 5. �� �� ��� �� � � �� ��������������� ������� � � � ��� �� ������ � � �������� ��� �� � �� �� �� �� �� �� �� � �� � �� ��� ��� ��� ��� ��� ��� � � � ��� �� � � �� �� � � � �� ��� ��� ��� ����� ����� �������� ��� �� �������� �� � � ��� �� �� � ������ � ���� �� �� � � ��� � ������ � � � ��� ���� ��� �� ��� ��� ��� �� ����������������������� HS11 HEATSINK NOTE The HS11 Heatsink is overkill for the average application. Once maximum power dissipation for the application is determined (refer to “General Operating Considerations” and Application Note 11 in the APEX DATABOOK), the final mechanical design will probably require substantially less heatsinking. APEX MICROTECHNOLOGY makes no representation that the use or interconnection of the circuits described herein will not infringe on existing or future patent rights, nor do the descriptions contained herein imply the granting of licenses to make, use, or sell equip– ment constructed in accordance therewith. APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 4 EK04 COMMON CONFIGURATIONS ����������������������������� �������������������������� �� � � � �� �� �� ����������������������������� ��������������������������� �� ��������� � ��� �� �� ���� �� �� ����� � ��� �� �� �� � � ���� �� ��� � �� � �� �������������������� �� �������������������������� �������������������������� �� �� �� �� �� �� �� ������� � �� �� � �� �� �� � �� ������ � �� ���� �� � �� ����������������������� ��������� � ������������� ����������� ��������������������������� ��� ���� �� �� �� ���� �� ����� � �� �� �� �� �� � � � �� � � � �������� ��� � �� �� �� �� � � �� �� �� �� ����������������������� �� �� �� � � �� �� �� �� ��� �� �� ��� �� �� � �� � �� �� �� � � �� �� �� � � � �������� �� ���� � ��� �� �� ������������ �� �� �� � ��� � � �������� �� ���� � � � � ��� � � ����� � ��� ��� ��� � � ��� ��� � � ���� � ���� �������� ��� ������������ �� �������� ��� �� �� ���� � �� �� �� �� �� ���� � �� ��� �� �������� �� � ����������������������� �� �� �� �� �� �� �� ����������������� �� �� �� �� � ����� � �� ��� ��� �� �� �� ����������������������������� ����������������������������� �� �� �� �� �� �� �� � �� �� �� � � ��� ����������������������������� �� �� � ��������� �� ������ ������������������ �� �� �� �� �� ��� � �� �� � �� � � �� �� � � ��� ������������ � �� �������� � � �� ��� � �������������� � �� � �������� � � �� � � � � �� �� �� � This data sheet has been carefullyCORPORATION checked and is believed to be reliable, however, no responsibility is assumed for possible• inaccuracies or omissions. All specifications subject to change without notice. APEX MICROTECHNOLOGY • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 ORDERS (520) 690-8601 • EMAILare [email protected] EK04U REV H JANUARY 2005 © 2005 Apex Microtechnology Corp. 5