ASMT-Mx20 3W Power LED Light Source Data Sheet Description Features 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. • • • • • • • • • • The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer. Available in white color Energy efficient Exposed pad for excellent heat transfer Suitable for reflow soldering process High current operation up to 700 mA Long operation life Wide viewing angle Silicone encapsulation ESD of 2 kV MSL 2A Specifications • InGaN technology • 4.0 V, 700 mA (max.) • 110 viewing angle Applications • • • • • • • Portable (flash light, bicycle headlight) Reading light Architectural lighting Garden lighting Decorative lighting Backlighting General lighting Package Dimensions 10.00 1 ANODE 2 CATHODE 3 ANODE 3.30 1.27 8.50 METAL SLUG 3 ∅ 5.26 10.60 8.50 ∅ 8.00 1.30 1 5.25 2.00 2 0.81 LED 5.08 + – NOTES: 1. ALL DIMENSIONS IN MILLIMETERS. 2. TOLERANCE IS ± 0.1 mm UNLESS OTHERWISE SPECIFIED. Device Selection Guide at Junction Temperature Tj = 25°C Color Part Number White ASMT-MW20 Luminous Flux, Φv[1][2] (lm) Min. Typ. 95 140 Test Current (mA) 700 Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at 25 ms mono pulse condition. 2. Flux tolerance is ±10%. Dice Technology InGaN Part Numbering System A S M T- M x 2 0 – N x 1 x 2 x 3 0 Color Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color W – White Absolute Maximum Ratings at TA = 25°C Parameter ASMT-Mx20 Units 700 mA Peak Pulsing Current 1000 mA LED Junction Temperature 120 °C Operating Ambient Temperature Range -30 to +85 °C Storage Temperature Range -40 to +120 °C DC Forward Current [1] Soldering Temperature Refer to Figure 5 Note: 1. Pulse condition duty factor = 10%, Frequency = 1 kHz. Optical Characteristics (TA = 25 °C) Part Number Color Typical Chromaticity Coordinates x y Viewing Angle 2θ1/2[1] (Degrees) Typ. Luminous Efficiency (lm/W) Typ. ASMT-MW20 0.33 110 57 White 0.33 Notes: 1. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic (TA = 25°C) Dice Type InGaN Forward Voltage VF (Volts) Reverse Voltage Min. Max. VR[1] 3.03 4.00 Not recommended Notes: 1. Not designed for reverse bias operation. 2. RΘj-ms is Thermal Resistance from LED junction to metal slug. Thermal Resistance RΘj-ms (°C/W)[2] Typ. 8 1.0 700 0.9 WHITE 600 FORWARD CURRENT – mA RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 300 200 0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 0.9 0.8 0.8 0.7 0.7 RELATIVE INTENSITY 1.0 0.9 0.6 0.5 0.4 0.3 FORWARD VOLTAGE – V 0.5 0.4 0.3 0.2 0.1 0.1 100 200 300 400 500 600 0 -90 700 WHITE 0.6 0.2 0 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 Figure 2. Forward current vs. forward voltage 1.0 0 0 780 Figure 1. Relative intensity vs. wavelength RELATIVE LUMINOUS FLUX (Φv) – lm 400 100 0.1 0.0 500 -70 -50 MONO PULSE CURRENT – mA -30 -10 10 30 50 OFF-AXIS ANGLE (°) Figure 3. Relative luminous flux vs. mono pulse current Figure 4. Radiation pattern 10.70 ± 0.10 10 - 30 SEC. 8.40 ± 0.10 TEMPERATURE 255 - 260 °C 217 °C 200 °C 3 °C/SEC. MAX. -6 °C/SEC. MAX. 150 °C 1.00 ± 0.10 3 °C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. TIME Figure 5. Recommended reflow soldering 17.00 ± 0.20 (Acc. to J-STD-020C) 3.1 ± 0.10 5.08 ± 0.10 Figure 6. Recommended soldering land pattern 70 90 100 COOL WHITE RELATIVE INTENSITY (%) 90 80 70 60 50 40 30 20 10 0 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 JUNCTION TEMPERATURE (°C) Figure 7. Relative LOP vs. junction temperature Flux Bin Limit (for Reference Only) [X1 X2] Bin A B C D E F G H J K L M N Flux (lm) at 700 mA Min. 5.5 7.0 9.0 11.5 15.0 19.5 25.5 33.0 43.0 56.0 73.0 95.0 124.0 Tolerance for each bin limits is ±10% Max. 7.0 9.0 11.5 15.0 19.5 25.5 33.0 43.0 56.0 73.0 95.0 124.0 161.0 Color Bin Selections [ X3 ] Individual reel will contain parts from one full bin only. 0 A B C D E F Z Y W V U T S Q P N M L K J 1 2 3 4 5 6 Full Distribution A only B only C only D only E only F only A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B and C only B, C and D only C, D and E only D, E and F only E, F and G only F, G and H only Special Color Bin A, B, C and D only E, F, G and H only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only White Bin A Bin B Bin C Bin D Bin E Bin F Bin G Bin H Color Limits (Chromaticity Coordinates) X 0.367 0.362 0.329 0.329 Y 0.400 0.372 0.345 0.369 X 0.362 0.356 0.329 0.329 Y 0.372 0.330 0.302 0.345 X 0.329 0.329 0.305 0.301 Y 0.369 0.345 0.322 0.342 X 0.329 0.329 0.311 0.305 Y 0.345 0.302 0.285 0.322 X 0.303 0.307 0.283 0.274 Y 0.333 0.311 0.284 0.301 X 0.307 0.311 0.290 0.283 Y 0.311 0.285 0.265 0.284 X 0.388 0.379 0.362 0.367 Y 0.417 0.383 0.372 0.400 X 0.379 0.369 0.356 0.362 Y 0.383 0.343 0.330 0.372 Tolerances ± 0.01 0.44 0.42 0.40 G 0.38 A Y - COORDINATE 0.36 4.0 k 4.5 k C 0.34 B H 5.6 k 0.32 7k E BLACK BODY CURVE D 0.30 10 k 0.28 F 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 X-COORDINATE 0.36 0.38 0.40 0.42 0.44 Package Tube Dimensions 535 10.5 6.6 10.5 36.5 Handling Precaution This product is classified as moisture sensitive level 2A The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body (white epoxy). When the bag is opened, parts required to mount within 672 hours of factory conditions ≤30°C/60%, and stored at <10% RH. Devices required bake, before mounting if: a) The humidity indicator card is >10% when read at 23 ± 5°C b) The pack has been opened for more than 672 hours. Baking recommended condition: 60 ± 5°C for 20 hours. DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0153EN - August 3, 2007