HLMP-NS31 and HLMP-NM31 T-1 (3mm) InGaN LED Lamps Data Sheet Description Features These InGaN lamps are designed in industry standard package with clear and non-diffused optics. These lamps are ideal for use as indicator and for general purpose lighting. • General purpose LED Package Dimensions 4.40 ± 0.30 3.10 ± 0.20 • Binned for color and intensity • Bright InGaN dice Applications • Status indicator • Small message panel • Running and decorative lights for commercial use 3.50 ± 0.30 5.85 ± 0.50 2.00 • Reliable and rugged • Back lighting • Consumer audio 0.65 MAX. 23.0 MIN. + 0.10 0.45 - 0.04 1.0 MIN. 2.54 ± 0.30 0.44 ± 0.20 CATHODE MARKS 3.40 ± 0.20 + 0.10 0.40 - 0 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040”) DOWN THE LEADS. Caution: Devices are class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application Note AN-1142 for additional details Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ. HLMP-NS31-J00xx HLMP-NM31-R00xx Luminous Intensity, Iv (mcd) at 20 mA Min. Typ. Viewing Angle, 2Θ½ (degree) Tinting Type Blue 470 240 600 30 Un-tinted; non-diffused Green 529 1500 2800 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package 2. The tolerance for intensity limit is ± 15% 3. The optical axis is closely aligned with the package mechanical axis 4. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. Absolute Maximum Ratings, TA =25°C Parameter Blue /Green Unit DC Forward Current [1] 30 mA Peak Forward Current 100 mA Reverse Voltage (IR = 10μA) 5 V LED Junction Temperature 115 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Notes: 1. Derate linearly as shown in Figure 5 Electrical/Optical Characteristics Parameter Symbol Min. Typ. Max. Units Test Condition Forward Voltage VF 3.0 3.3 4.0 V IF = 20 mA Reverse Voltage VR 5 V IR = 10 μA Dominant wavelength λd NS31 NM31 nm IF = 20 mA Peak wavelength λpeak NS31 NM31 464 519 nm Peak of wavelength of spectral distribution at IF = 20 mA Thermal Resistance RΘJ-PIN 290 °C/W 460 520 470 529 480 540 Notes: 1. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp. 2. Tolerance for each color bin limit is ± 0.5 nm 1.0 0.9 0.9 0.8 0.8 0.7 RELATIVE INTENSITY RELATIVE INTENSITY 1.0 0.6 0.5 0.4 0.3 0.6 0.5 0.4 0.3 0.2 0.2 0.1 0.1 0.0 380 430 480 530 0.0 400 580 WAVELENGTH - nm Figure 1. Relative Intensity vs wavelength for HLMP-NS31 30 1.4 25 1.2 20 15 10 5 0 0 1 2 450 500 550 WAVELENGTH - nm 600 650 Figure 2. Relative Intensity vs wavelength for HLMP-NM31 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA 0.7 3 1.0 0.8 0.6 0.4 0.2 0 4 0 5 10 15 20 25 DC FORWARD CURRENT - mA FORWARD VOLTAGE - V 30 35 Figure 4. Relative Intensity vs Forward Current Figure 3. Forward Current vs Forward Voltage 40 1 0.8 30 20 NORMALIZED INTENSITY IF - FORWARD CURRENT - mA 0.9 RJ-A=780°C/W 10 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 VF - FORWARD VOLTAGE - VOLTS 100 Figure 5. Maximum Forward current vs Ambient temperature based on TJ=110°C 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 6. Radiation pattern 60 90 Intensity Bin Limit Table Green Color Bin Limit Table Intensity (mcd) at 20 mA Bin Min Max Bin Min Max J 240 310 1 520 524 K 310 400 2 524 528 L 400 520 3 528 532 M 520 680 4 532 536 N 680 880 5 536 540 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 Tolerance for each bin limit is ± 15% Blue Color Bin Limit Table Intensity (mcd) at 20 mA Bin Min Max 1 460 464 2 464 468 3 468 472 4 472 476 5 476 480 Tolerance for each bin limit is ± 0.5nm Dominant Wavelength (nm) at 20 mA Tolerance for each bin limit is ± 0.5nm Precautions: Lead Forming: • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attached and wirebond. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 ºC before handling. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoffs. • Recommended PC board plated through hole size for LED component leads: • Recommended soldering condition: LED component lead size Diagonal Plated through hole diameter Wave Soldering Manual Solder Dipping 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm Pre-heat temperature 105 ºC Max. - (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) Pre-heat time 30 sec Max. - 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm Peak temperature 250 ºC Max. 260 ºC Max. (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Dwell time 3 sec Max. 5 sec Max. Note: Refer to application note AN1027 for more information on soldering LED components. LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 TEMPERATURE - °C 200 BOTTOM SIDE OF PC BOARD 150 TOP SIDE OF PC BOARD FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 ° SOLDER: SN63; FLUX: RMA 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 304 0 50 TIME - SECONDS 607 0 809 0 100 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0044EN - January 15, 2007