BB REG1117FAKTTTG3

REG1117
REG1117A
SBVS001D − OCTOBER 1992 − REVISED JULY 2004
800mA and 1A Low Dropout Positive Regulator
1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable
FEATURES
D FIXED AND ADJUSTABLE VERSIONS
D 2.85V MODEL FOR SCSI-2 ACTIVE
D
D
D
D
D
D
TERMINATION
OUTPUT CURRENT:
REG1117: 800mA max
REG1117A: 1A max
OUTPUT TOLERANCE: +1% max
DROPOUT VOLTAGE:
REG1117: 1.2V max at IO = 800mA
REG1117A: 1.3V max at IO = 1A
INTERNAL CURRENT LIMIT
THERMAL OVERLOAD PROTECTION
SOT-223 AND DDPAK SURFACE-MOUNT
PACKAGES
DESCRIPTION
The REG1117 is a family of easy-to-use three-terminal
voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and
1A) and two package types (SOT-223 and DDPAK). See
the chart below for available options.
Output voltage of the adjustable versions is set with two
external resistors. The REG1117 low dropout voltage
allows its use with as little as 1V input-output voltage
differential.
Laser trimming assures excellent output voltage accuracy
without adjustment. An NPN output stage allows output
stage drive to contribute to the load current for maximum
efficiency.
800mA
VOLTAGE
APPLICATIONS
D
D
D
D
D
D
SOT-223
1A
DDPAK
1.8V
2.5V
SCSI-2 ACTIVE TERMINATION
HAND-HELD DATA COLLECTION DEVICES
HIGH EFFICIENCY LINEAR REGULATORS
BATTERY-POWERED INSTRUMENTATION
BATTERY MANAGEMENT CIRCUITS FOR
NOTEBOOK AND PALMTOP PCs
CORE VOLTAGE SUPPLY: FPGA, PLD, DSP,
CPU
2.85V
n
3.3V
n
5V
n
Adjustable
n
SOT-223
DDPAK
n
n
n
n
n
n
n
n
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright  1992−2004, Texas Instruments Incorporated
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
ABSOLUTE MAXIMUM RATINGS(1)
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V
Operating Junction Temperature Range . . . . . . . . −40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −65°C to +150°C
Lead Temperature (soldering, 10s)(2) . . . . . . . . . . . . . . . . . +300°C
(1) Stresses above these ratings may cause permanent damage.
(2) See Soldering Methods section.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
CONNECTION DIAGRAM
Front View
Plastic SOT−223
Plastic DDPAK
Tab is
VOUT
Tab is VOUT
Ground VOUT
(Adj.)(1)
VIN
Ground VOUT
(Adj.)(1)
NOTE: (1) Adjustable−Voltage Model.
2
VIN
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
VO/IO
PACKAGE-LEAD
PACKAGE
DESIGNATOR
OPERATING
TEMPERATURE
RANGE
PACKAGE
MARKING
REG1117-2.85
2.85/800mA
SOT223-3
DCY
−40°C to
+125°C
BB11172
REG1117-3.3
3.3/800mA
SOT223-3
DCY
−40°C to
+125°C
BB11174
KTT
−40 C to
−40°C
+125°C
REG1117F-3.3
3.3/800mA
DDPAK-3
REG1117-5
5V/800mA
SOT223-3
DCY
REG1117
Adj./800mA
SOT223-3
DCY
−40°C to
+125°C
BB1117
REG1117A-1.8
1.8V/1A
SOT223-3
DCY
−40°C to
+125°C
R111718
KTT
−40 C to
−40°C
+125°C
REG1117FA1.8
−40°C to
+125°C
R111725
REG1117A-2.5
REG1117FA-2.5
REG1117FA-5
REG1117A
REG1117FA
1.8/1A
2.5/1A
2.5/1A
5/1A
Adj./1A
Adj./1A
DDPAK-3
SOT223-3
DDPAK-3
DDPAK-3
SOT223-3
DDPAK-3
DCY
KTT
KTT
−40 C to
−40°C
+125°C
−40 C to
−40°C
+125°C
DCY
−40°C to
+125°C
KTT
−40 C to
−40°C
+125°C
BB11175
Rails, 80
REG1117-2.85
Tape and Reel,
2500
REG1117-3.3
Rails, 80
REG1117-3.3
Tape and Reel,
2500
REG1117F-3.3KTTT
Tape and Reel,
50
REG1117F-3.3/500
Tape and Reel,
500
REG1117-5
Rails, 80
REG1117-5
Tape and Reel,
2500
REG1117
Rails, 80
REG1117
Tape and Reel,
2500
REG1117A-1.8
Rails, 80
REG1117A-1.8
Tape and Reel,
2500
REG1117FA-1.8KTTT
Tape and Reel,
50
REG1117FA-1.8/500
Tape and Reel,
500
REG1117A-2.5
Rails, 80
REG1117A-2.5
Tape and Reel,
2500
REG1117FA-2.5KTTT
Tape and Reel,
50
REG1117FA-2.5/500
Tape and Reel,
500
REG1117FA-5/KTTT
Tape and Reel,
50
REG1117FA-5/500
Tape and Reel,
500
REG1117A
Rails, 80
REG1117A
Tape and Reel,
2500
REG1117FA/KTTT
Tape and Reel,
50
REG1117FA/500
Tape and Reel,
500
REG1117FA2.5
BB1117FA5.0
BB1117A
TRANSPORT
MEDIA,
QUANTITY
REG1117-2.85
BB1117F4
−40°C to
+125°C
REG1117FA-1.8
ORDERING
NUMBER
REG1117FA
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
3
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
ELECTRICAL CHARACTERISTICS
At TJ = +25°C, unless otherwise noted.
REG1117, REG1117A
PARAMETER
CONDITION
MIN
TYP
MAX
UNIT
REG1117-2.85
IO = 10mA, VIN = 4.85V
2.820
2.85
2.880
V
See Note 1
IO = 0 to 800mA, VIN = 4.05V to 10V
2.790
2.85
2.910
V
REG1117-3.3
IO = 10mA, VIN = 5.3V
3.270
3.30
3.330
V
See Note 1
IO = 0 to 800mA, VIN = 4.8V to 10V
3.240
3.30
3.360
V
IO = 10mA, VIN = 7V
4.950
5.00
5.050
V
See Note 1
IO = 0 to 800mA, VIN = 6.5V to 10V
4.900
5.00
5.100
V
REG1117A-1.8
IO = 10mA, VIN = 3.8V
1.782
1.8
1.818
V
OUTPUT VOLTAGE
REG1117-5
See Note 1
IO = 0 to 1A, VIN = 3.8V to 10V
1.764
1.8
1.836
V
REG1117A-2.5
IO = 10mA, VIN = 4.5V
2.475
2.5
2.525
V
See Note 1
IO = 0 to 1A, VIN = 4.5V to 10V
2.450
2.5
2.550
V
IO = 10mA, VIN = 7V
4.950
5.0
5.050
V
IO = 0 to 1A, VIN = 7V to 10V
4.900
5.0
5.100
V
IO = 10mA, VIN − VO = 2V
1.238
1.250
1.262
V
IO = 10 to 800mA, VIN − VO = 1.4 to 10V
1.225
1.250
1.280
V
IO = 10mA, VIN − VO = 2V
1.238
1.250
1.262
V
IO = 10mA to 1A, VIN − VO = 1.4 to 10V
1.225
1.250
1.280
V
IO = 0, VIN = 4.25 to 10V
1
7
mV
IO = 0, VIN = 4.8 to 10V
2
7
mV
IO = 0, VIN = 6.5 to 15V
3
10
mV
IO = 10mA, VIN − VO = 1.5 to 13.75V
0.1
0.4
%
REG1117A-5
See Note 1
REFERENCE VOLTAGE
REG1117 (Adjustable)
See Note 1
REG1117A (Adjustable)
See Note 1
LINE REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
REG1117-5(1)
REG1117 (Adjustable)(1)
REG1117A (Adjustable)(1)
IO = 10mA, VIN − VO = 1.5 to 13.75V
0.1
0.4
%
REG1117A-1.8(1)
REG1117A-2.5(1)
IO = 0, VIN = 3.8V to 10V
1
7
mV
IO = 0, VIN = 4.5V to 10V
1
7
mV
REG1117A-5.0(1)
IO = 0, VIN = 7V to 15V
3
10
mV
IO = 0 to 800mA, VIN = 4.25V
2
10
mV
IO = 0 to 800mA, VIN = 4.8V
3
12
mV
LOAD REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
REG1117-5(1)
IO = 0 to 800mA, VIN = 6.5V
3
15
mV
IO = 10 to 800mA, VIN − VO = 3V
0.1
0.4
%
IO = 10mA to 1A, VIN − VO = 3V
0.1
0.4
%
REG1117A-1.8(1)
IO = 0 to 1A, VIN = 3.8V
2
10
mV
REG1117A-2.5
IO = 0 to 1A, VIN = 4.5V
2
10
mV
REG1117A-5
IO = 0 to 1A, VIN = 7.0V
3
15
mV
IO = 100mA
1.00
1.10
V
IO = 500mA
1.05
1.15
V
IO = 800mA
1.10
1.20
V
IO = 1A
1.2
1.30
V
IO = 1A
1.2
1.55
V
REG1117 (Adjustable)(1)(2)
REG1117A (Adjustable)(1)(2)
DROPOUT VOLTAGE(3)
All Models(1)
See Note 1
REG1117 Models(1)
REG1117A
See Note 1
(1) Specification applies over the full specified junction temperature range, 0°C to +125°C.
(2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.
(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A),
VIN − VO = 1.4V (reading taken 10ms after pulse).
4
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
ELECTRICAL CHARACTERISTICS (continued)
At TJ = +25°C, unless otherwise noted.
REG1117, REG1117A
PARAMETER
CONDITION
MIN
TYP
MAX
UNIT
REG1117 Models
VIN − VO = 5V
800
950
1200
mA
REG1117A
VIN − VO = 5V
1000
1250
1600
mA
1.7
5
mA
CURRENT LIMIT
MINIMUM LOAD CURRENT
Adjustable Models(1)(2)
QUIESCENT CURRENT
Fixed-Voltage Models(1)
VIN − VO = 13.75V
VIN − VO = 5V
4
10
mA
IO = 10mA, VIN − VO = 1.4 to 10V
50
120
µA
IO = 10mA to 800mA, VIN − VO = 1.4 to 10V
0.5
5
µA
IO = 10mA to 1A, VIN − VO = 1.4 to 10V
0.5
5
µA
30ms Pulse
0.01
0.1
%/W
f = 120Hz, VIN − VOUT = 3V + 1VPP Ripple
62
dB
Fixed-Voltage Models
TJ = 0°C to +125°C
0.5
%
Adjustable Models
TJ = 0°C to +125°C
2
%
TA = 125°C, 1000Hr
0.3
%
f = 10Hz to 10kHz
0.003
%
15
°C/W
f > 50Hz
2
°C/W
dc
3
°C/W
65
°C/W
ADJUSTABLE PIN CURRENT(1)(2)
vs Load Current, REG1117(1)
vs Load Current, REG1117A(1)
THERMAL REGULATION
All Models(4)
RIPPLE REJECTION
All Models
TEMPERATURE DRIFT
LONG-TERM STABILITY
All Models
OUTPUT NOISE
rms Noise, All Models
THERMAL RESISTANCE
Thermal Resistance, qJC
(Junction-to-Case at Tab)
3-Lead SOT-223 Surface-Mount
3-Lead DDPAK Surface-Mount
Thermal Resistance, qJA
3-Lead DDPAK Surface-Mount
(Junction-to-Case at Tab)
No Heatsink
(1) Specification applies over the full specified junction temperature range, 0°C to +125°C.
(2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.
(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A),
VIN − VO = 1.4V (reading taken 10ms after pulse).
5
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
SIMPLIFIED SCHEMATIC
VIN
+
Current
Limit
Thermal
Limit
VOUT
10X
(Substrate)
Ground (Fixed−voltage Models)
Adj. (Adjustable−voltage Model)
6
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
TYPICAL CHARACTERISTICS
At TA = +25°C, all models, unless otherwise noted.
LOAD REGULATION
( ∆I LOAD = 800mA)
SHORT−CIRCUIT CURRENT vs TEMPERATURE
1
1300
REG1117A
1200
1100
REG1117 Models
1000
900
800
−50
−25
0
0
Output Voltage Deviation (mV)
Short−Circuit Current (mA)
1400
25
50
75
REG1117−2.85
1
REG1117A−1.8
−2
−3
−4
−5
REG1117−5
−6
−7
−50
100
−25
0
LINE REGULATION vs TEMPERATURE
VIN = 6.5V to 15V
REG1117−5
4
100
IOUT = 100mA
VRIPPLE = 1.0VPP
80
Ripple Rejection (dB)
Output Voltage Change (mV)
75
RIPPLE REJECTION vs FREQUENCY
90
5
3
2
1
REG1117A−1.8
VIN = 3.8V to 10V
0
70
60
50
40
30
20
−1
10
0
−25
0
25
50
75
100
10
100
1k
Temperature (_C)
10k
100k
Frequency (Hz)
QUIESCENT CURRENT vs TEMPERATURE
OUTPUT VOLTAGE vs TEMPERATURE
8
2.0
IO = 10mA
7
Fixed−Voltage Models
Quiescent Current (mA)
Output Voltage Change (%)
50
100
6
−2
−50
25
Temperature (_C)
Temperature (_ C)
1.0
0
−1.0
6
5
4
3
2
1
−2.0
−50
−25
0
25
50
Temperature (_ C)
75
100
0
−50
−25
0
25
50
75
100
Temperature (_C)
7
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, all models, unless otherwise noted.
LOAD TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
Output Voltage
Deviation (mV)
Output Voltage
Deviations (V)
60
0.1
0
−0.1
CIN = 1µF
COUT = 10µF Tantalum
IOUT = 0.1A
40
20
0
0
−0.5
0
20
40
60
80
100
Input Voltage (V)
Load Current (A)
−20
CIN = 10µF
COUT = 10µF
Tantalum
VIN = 4.25V
Preload = 0.1A
0.5
−40
5.25
4.25
3.25
0
20
40
60
Time (µs)
Time (µs)
Figure 2 shows a hookup diagram for the adjustable
voltage model. Resistor values are shown for some
commonly-used output voltages. Values for other voltages
can be calculated from the equation shown in Figure 2. For
best load regulation, connect R1 close to the output pin and
R2 close to the ground side of the load as shown.
APPLICATIONS INFORMATION
Figure 1 shows the basic hookup diagram for fixed-voltage
models. All models require an output capacitor for proper
operation, and for improving high-frequency load
regulation; a 10µF tantalum capacitor is recommended.
Aluminum electrolytic types of 50µF or greater can also be
used. A high-quality capacitor should be used to assure
that the ESR (Effective Series Resistance) is less than
0.5Ω.
VIN
THERMAL CONSIDERATIONS
The REG1117 has current limit and thermal shutdown
circuits that protect it from overload. The thermal shutdown
activates at approximately TJ = 165°C. For continuous
operation, however, the junction temperature should not
be allowed to exceed 125°C. Any tendency to activate the
thermal shutdown in normal use is an indication of an
inadequate heat sink or excessive power dissipation. The
power dissipation is equal to:
VO
REG1117
+
10µF
Tantalum
80 100 120 140 160 180 200
+ 10µF
Tantalum
PD = (VIN – VOUT) IOUT
The junction temperature can be calculated by:
TJ = TA + PD (qJA)
where TA is the ambient temperature, and qJA is the
junction-to-ambient thermal resistance.
Figure 1. Fixed-Voltage Model—Basic
Connections
VIN
C1 +
10µF
3
REG1117
(Adj)
1
C3(1) +
10µF
VO
2
R1
+ C2
10µF
Load
R2
VO =
R1 + R2
R1
x (1.25V) + (50µA) (R2)
This term is negligible with
proper choice of values−see
table at right.
VOUT
(V )
R1
(Ω)(2)
R2
(Ω)(2)
1.25
1.5
2.1
2.85
3
3.3
5
10
Open
750
158
169
137
115
113
113
Short
147
107
215
191
187
340
787
NOTES: (1) C3 optional. Improves high−frequency line rejection. (2) Resistors are standard 1% values.
Figure 2. Adjustable-Voltage Model—Basic Connections
8
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
A simple experiment will determine whether the maximum
recommended junction temperature is exceeded in an
actual circuit board and mounting configuration: Increase
the ambient temperature above that expected in normal
operation until the device’s thermal shutdown is activated.
If this occurs at more than 40°C above the maximum
expected ambient temperature, then TJ will be less than
125°C during normal operation.
The internal protection circuitry of the REG1117 was
designed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously
running the REG1117 into thermal shutdown will degrade
reliability.
LAYOUT CONSIDERATIONS
The DDPAK (REG1117F-3.3 and REG1117FA) is a
surface-mount power package that has excellent thermal
characteristics. For best thermal performance, the
mounting tab should be soldered directly to a circuit board
copper area, as shown in Figure 3. Increasing the copper
area improves heat dissipation. Figure 4 shows typical
thermal resistance from junction-to-ambient as a function
of the copper area.
3−Lead DDPAK(1)
0.2
0.085
0.45
0.51
All measurements
in inches.
0.155
0.05
0.10
NOTE: (1) For improved thermal performance increase
footprint area. See Figure 4 (Thermal Resistance vs
Circuit Board Copper Area).
Figure 3. DDPAK Footprint
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
Circuit Board Copper Area
Thermal Resistance, qJA (°C/W)
60
REG1117F
DDPAK Surface Mount Package
1oz copper
50
40
30
20
REG1117F
DDPAK Surface−Mount Package
10
0
1
2
3
4
5
Copper Area (inches2)
Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area
9
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SBVS001D − OCTOBER 1992 − REVISED JULY 2004
The SOT-223 package derives heat sinking from
conduction through its copper leads, especially the large
mounting tab. These must be soldered to a circuit board
with a substantial amount of copper remaining, as shown
in Figure 5. Circuit board traces connecting the tab and the
leads should be made as large as practical. The mounting
tab of both packages is electrically connected to VOUT.
Total Area: 50 x 50mm
35 x 17 mm
16 x 10 mm
16 x 10 mm
Without backside copper: q
With solid backside copper: q
≈ 59_ C/W
JA ≈ 49_C/W
Table 1. SOT-223 qJA for Various Board
Configurations
TOTAL PC
BOARD
AREA
TOPSIDE(1)
COPPER
AREA
BACKSIDE
COPPER
AREA
SOT-223
THERMAL
RESISTANCE
JUNCTIONTO-AMBIENT
2500mm2
2500mm2
2500mm2
46°C/W
2500mm2
1250mm2
2500mm2
47°C/W
2500mm2
950mm2
2500mm2
49°C/W
2500mm2
2500mm2
0
51°C/W
2500mm2
1800mm2
0
53°C/W
1600mm2
600mm2
1600mm2
55°C/W
2500mm2
1250mm2
0
58°C/W
2500mm2
915mm2
0
59°C/W
1600mm2
600mm2
0
67°C/W
900mm2
340mm2
900mm2
72°C/W
900mm2
340mm2
0
85°C/W
JA
(1) Tab is attached to the topside copper.
Figure 5. SOT-223 Circuit Board Layout Example
SOLDERING METHODS
Other nearby circuit traces, including those on the back
side of the circuit board, help conduct heat away from the
device, even though they may not be electrically
connected. Make all nearby copper traces as wide as
possible and leave only narrow gaps between traces.
Both REG1117 packages are suitable for infrared reflow
and vapor-phase reflow soldering techniques. The high
rate of temperature change that occurs with wave
soldering or hand soldering can damage the REG1117.
Table 1 shows approximate values of qJA for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting
conditions, and ventilation can dramatically affect the
actual qJA. Proper heat sinking significantly increases the
maximum power dissipation at a given ambient
temperature, as shown in Figure 6.
INSPEC Abstract Number: B91007604, C91012627.
Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω
Packages.” The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive
Surface Mount Technology, April 3−6, 1990, Atlantic City,
NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago,
IL, USA.
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
Power Dissipation (Watts)
6
q JA = 27_ C/W
(4in2 one oz copper
mounting pad)
5
PD = (TJ (max) − TA) / q JA
TJ (max) = 150_ C
qJA = 46_ C/W
(2500mm2 topside and
backside copper)
4
DDPAK
SOT−223
3
qJA = 65_ C/W
(no heat sink)
2
qJA = 85_ C/W
(340mm2 topside copper,
no backside copper)
1
0
0
25
50
75
100
125
Ambient Temperature (_ C)
Figure 6. Maximum Power Dissipation versus Ambient Temperature
10
"#$$$%
"#$$$%
www.ti.com
SBVS001D − OCTOBER 1992 − REVISED JULY 2004
TERMPWR
5V
TERMPWR
110Ω
2.85V
1N5817
110Ω
2.85V
REG1117−2.85
10µF
5V
1N5817
REG1117−2.85
10µF
10µF
(Up to 27 Lines)
110Ω
10µF
110Ω
Figure 7. SCSI Active Termination Configuration
REG1117−5
In
VIN > 12V
10µF
REG1117−5
Out
+
5V to 10V
+
GND
In
VIN > 9.0V
100µF
10µF
+
Out
7.5V
+
GND
100µF
2.5VOUT
10µF
+
1kΩ
REF1004−2.5
Figure 8. Adjusting Output of Fixed Voltage Models
Figure 9. Regulator with Reference
REG1117−5
VIN
In
10µF
5.2V Line
5.0V Battery
Out
GND
+
50Ω
1kΩ
REG1117−5
In
6.5V
10µF
Out
GND
+
+
100µF
Figure 10. Battery Backed-Up Regulated Supply
REG1117−5
In
VIN
10µF
+
Out
GND
+
100µF
Floating Input
VOUT = −5V
Figure 11. Low Dropout Negative Supply
11
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
REG1117
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3
ACTIVE
SOT-223
DCY
4
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5G4
ACTIVE
SOT-223
DCY
4
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5G4
ACTIVE
SOT-223
DCY
4
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117AG4
ACTIVE
SOT-223
DCY
4
CU NIPDAU
Level-1-260C-UNLIM
80
80
80
80
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
REG1117F-3.3
OBSOLETE
DDPAK/
TO-263
KTT
3
REG1117F-3.3/500
ACTIVE
DDPAK/
TO-263
KTT
3
REG1117F-3.3/500G3
ACTIVE
DDPAK/
TO-263
KTT
REG1117F-3.3KTTT
ACTIVE
DDPAK/
TO-263
REG1117F33KTTTG3
ACTIVE
REG1117FA
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Call TI
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-1.8
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-1.8/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-1.8KTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-18/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-2.5
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-2.5/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-2.5KTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-25/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-5.0
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-5.0/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-5.0KTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-5.0KTTTG
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA1.8KTTTG3
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA2.5KTTTG3
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA5.0/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FAKTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FAKTTTG3
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jan-2007
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Mailing Address:
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
REG1117
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-2.85G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-3.3G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117-5G4
ACTIVE
SOT-223
DCY
4
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-1.8G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5/2K5G4
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A-2.5G4
ACTIVE
SOT-223
DCY
4
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
REG1117A/2K5
ACTIVE
SOT-223
DCY
4
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
80
80
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
REG1117A/2K5G4
ACTIVE
SOT-223
DCY
4
REG1117AG4
ACTIVE
SOT-223
DCY
4
REG1117F-3.3
OBSOLETE
DDPAK/
TO-263
KTT
3
REG1117F-3.3/500
ACTIVE
DDPAK/
TO-263
KTT
3
REG1117F-3.3/500G3
ACTIVE
DDPAK/
TO-263
KTT
REG1117F-3.3KTTT
ACTIVE
DDPAK/
TO-263
REG1117F33KTTTG3
ACTIVE
REG1117FA
2500 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Call TI
Call TI
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-1.8
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-1.8/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-1.8KTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-18/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-2.5
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-2.5/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-2.5KTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-25/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-5.0
OBSOLETE
DDPAK/
TO-263
KTT
3
TBD
Call TI
Call TI
REG1117FA-5.0/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-5.0KTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA-5.0KTTTG
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA/500
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA1.8KTTTG3
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA2.5KTTTG3
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FA5.0/500G3
ACTIVE
DDPAK/
TO-263
KTT
3
500
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117FAKTTT
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
80
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
REG1117FAKTTTG3
ACTIVE
DDPAK/
TO-263
KTT
3
50
Green (RoHS &
no Sb/Br)
CU SN
Level-2-260C-1 YEAR
REG1117G4
ACTIVE
SOT-223
DCY
4
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
REG1117F-3.3/500
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117F-3.3KTTT
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA-1.8/500
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA-1.8KTTT
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA-2.5/500
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA-2.5KTTT
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA-5.0/500
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA-5.0KTTT
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FA/500
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
REG1117FAKTTT
KTT
3
SITE 41
330
24
10.6
15.6
4.9
16
24
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
REG1117F-3.3/500
KTT
3
SITE 41
346.0
346.0
41.0
REG1117F-3.3KTTT
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA-1.8/500
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA-1.8KTTT
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA-2.5/500
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA-2.5KTTT
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA-5.0/500
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA-5.0KTTT
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FA/500
KTT
3
SITE 41
346.0
346.0
41.0
REG1117FAKTTT
KTT
3
SITE 41
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
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