[ /Title (CD74 HC4016 ) /Subject (HighSpeed CMOS Logic Quad Bilat- CD74HC4016 Data sheet acquired from Harris Semiconductor SCHS199C High-Speed CMOS Logic Quad Bilateral Switch February 1998 - Revised August 2004 Features Description • Wide Analog-Input-Voltage Range . . . . . . . . . 0V to 10V The CD74HC4016 contains four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits. • Low “ON” Resistance - 45Ω (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . .VCC = 4.5V - 35Ω (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC = 6V - 30Ω (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . .1fcVCC = 9V Each switch has two input/output terminals (nY, nZ) and an active high enable input (nE). Current through the switch will not cause additional VCC current provided the analog voltage is maintained between VCC and GND. • Fast Switching and Propagation Delay Times • Low “OFF” Leakage Current • Built-In “Break-Before-Make” Switching Ordering Information • Suitable for Sample and Hold Applications • Wide Operating Temperature Range . . . -55oC to 125oC PART NUMBER • HC Types - 2V to 10V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V TEMP. RANGE (oC) PACKAGE CD74HC4016E -55 to 125 14 Ld PDIP CD74HC4016M -55 to 125 14 Ld SOIC CD74HC4016MT -55 to 125 14 Ld SOIC CD74HC4016M96 -55 to 125 14 Ld SOIC CD74HC4016PW -55 to 125 14 Ld TSSOP CD74HC4016PWR -55 to 125 14 Ld TSSOP NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD74HC4016 (PDIP, SOIC, TSSOP) TOP VIEW 1Y 1 14 VCC 1Z 2 13 1E 2Z 3 12 4E 2Y 4 11 4Y 2E 5 10 4Z 3E 6 9 3Z GND 7 8 3Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2004, Texas Instruments Incorporated 1 CD74HC4016 Functional Diagram 13 1 1E 2 5 4 2E 3 6 8 3E 9 12 11 4E 10 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z VCC = 14 GND = 7 TRUTH TABLE INPUT nE SWITCH L OFF H ON H = High Level Voltage L = Low Level Voltage Logic Diagram nY VCC nZ nE GND 2 CD74HC4016 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 80 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 86 PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . 96 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 10V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) 9V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implie NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications 25oC TEST CONDITIONS PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) VIS (V) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS VIH - - 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V 4.5 - 45 180 - 225 - 270 Ω 6 - 35 160 - 200 - 240 Ω 9 - 30 135 - 170 - 205 Ω 4.5 - 85 320 - 400 - 480 Ω 6 - 55 240 - 300 - 360 Ω 9 - 35 170 - 215 - 255 Ω HC TYPES High Level Input Voltage Low Level Input Voltage “ON” Resistance IO = 1mA VIL RON Maximum “ON” Resistance Between Any Two Switches ∆RON Switch Off Leakage Current IIZ Logic Input Leakage Current II - VIH or VIL - VCC or GND VIL or VIH VCC or GND 4.5 - 10 - - - - - Ω 6 - 8.5 - - - - - Ω En = GND VCC or GND 6 - - ±0.1 - ±1 - ±1 µA 10 - - ±0.1 - ±1 - ±1 µA VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA 3 CD74HC4016 DC Electrical Specifications (Continued) 25oC TEST CONDITIONS PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) VIS (V) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS ICC VCC or GND VCC or GND 6 - - 2 - 20 - 40 µA 10 - - 16 - 160 - 320 µA Quiescent Device Current IO = 0mA Switching Specifications Input tr, tf = 6ns PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 60 - 75 - 90 ns 4.5 - - 12 - 15 - 18 ns CL = 15pF 5 - 4 - - - - - ns CL = 50pF 6 - - 10 - 13 - 15 ns 9 - - 8 - 10 - 12 ns 2 - - 190 - 240 - 285 ns 4.5 - - 38 - 48 - 57 ns CL = 15pF 5 - 16 - - - - - ns CL = 50pF 6 - - 32 - 41 - 48 ns 9 - - 28 - 35 - 42 ns 2 - - 145 - 180 - 220 ns 4.5 - - 29 - 36 - 44 ns CL = 15pF 5 - 12 - - - - - ns CL = 50pF 6 - - 25 - 31 - 38 ns 9 - - 22 - 28 - 33 ns HC TYPES Propagation Delay, Switch In to Switch Out Propagation Delay, Switch Turn-On En to Out Propagation Delay, Switch Turn-Off En to Out tPZH, tPZL tPHZ, tPLZ Input Capacitance Power Dissipation Capacitance (Notes 2, 3) CL = 50pF CL = 50pF CI - - - - 10 - 10 - 10 pF CPD - 5 - 12 - - - - - pF NOTES: 2. CPD is used to determine the dynamic power consumption, per package. 3. PD = CPD VCC2 fi + Σ (CL + CS) VCC2 fo where fi = input frequency, fo = output frequency, CL = output load capacitance, CS = switch capacitance, VCC = supply voltage. Analog Channel Specifications TA = 25oC PARAMETER TEST CONDITIONS VCC (V) CD74HC4016 UNITS Switch Frequency Response Bandwidth at -3dB Figure 3 Figure 6, Notes 4, 5 4.5 >200 MHz Crosstalk Between Any Two Switches, Figure 4 Figure 5, Notes 5, 6 4.5 TBE dB Total Harmonic Distortion 1kHz, VIS = 4VP-P Figure 7 4, 5 0.078 % 1kHz, VIS = 8VP-P Figure 7 9 0.018 % 4 CD74HC4016 Analog Channel Specifications TA = 25oC (Continued) PARAMETER TEST CONDITIONS Control to Switch Feedthrough Noise VCC (V) CD74HC4016 UNITS 4.5 TBE mV 9 TBE mV 4.5 -62 dB - 5 pF Figure 8 Switch “OFF” Signal Feedthrough, Figure 4 Figure 9, Notes 5, 6 Switch Input Capacitance, CS NOTES: 4. Adjust input level for 0dBm at output, f = 1MHz. 5. VIS is centered at VCC/2. 6. Adjust input for 0dBm at VIS. Typical Performance Curves 110 60 “ON” RESISTANCE, RON (Ω) “ON” RESISTANCE, RON (Ω) 100 90 VCC = 4.5V 80 70 60 50 VCC = 6V 40 30 20 50 45 VCC = 9V 40 35 30 25 20 15 10 5 10 0 0 0 1 2 3 4 4.5 INPUT SIGNAL VOLTAGE, VIS (V) 5 0 6 1 2 3 4 5 6 7 8 9 INPUT SIGNAL VOLTAGE, VIS (V) FIGURE 1. TYPICAL “ON” RESISTANCE vs INPUT SIGNAL VOLTAGE FIGURE 2. TYPICAL “ON” RESISTANCE vs INPUT SIGNAL VOLTAGE CROSSTALK, dB SWITCH OFF SIGNAL FEEDTHROUGH, dB 0 CHANNEL ON BANDWIDTH, dB 0 -1 CL = 10pF -2 VCC = 4.5V RL = 50Ω TA = 25oC PIN 4 TO 3 -3 CL = 10pF VCC = 9V RL = 50Ω TA = 25oC PIN 4 TO 3 -4 10K 100K 1M 10M FREQUENCY (f), Hz -40 -60 FIGURE 3. SWITCH FREQUENCY RESPONSE CL = 10pF VCC = 9V RL = 50Ω TA = 25oC PIN 4 TO 3 -80 -100 10K 100M CL = 10pF VCC = 4.5V RL = 50Ω TA = 25oC PIN 4 TO 3 -20 100K 1M 10M FREQUENCY (f), Hz 100M FIGURE 4. SWITCH-OFF SIGNAL FEEDTHROUGH AND CROSSTALK vs FREQUENCY 5 CD74HC4016 Analog Test Circuits VIS 0.1µF VCC VCC R SWITCH ON VIS VOS2 SWITCH ON VOS1 R R R VCC/2 C C dB METER VCC/2 VCC/2 fIS = 1MHz SINEWAVE R = 50Ω C = 10pF FIGURE 5. CROSSTALK BETWEEN TWO SWITCHES TEST CIRCUIT VCC VCC 0.1µF VIS SINE WAVE 10µF VIS VOS SWITCH ON 50Ω VIS VI = VIH SWITCH ON VOS 10kΩ 10pF dB METER VCC/2 50pF DISTORTION METER VCC/2 fIS = 1kHz TO 10kHz FIGURE 6. FREQUENCY RESPONSE TEST CIRCUIT E VCC 600Ω VCC/2 FIGURE 7. TOTAL HARMONIC DISTORTION TEST CIRCUIT SWITCH ALTERNATING ON AND OFF tr, tf ≤ 6ns fCONT = 1MHz 50% DUTY CYCLE VCC VP-P VOS 0.1µF 600Ω SCOPE VCC/2 FIGURE 8. CONTROL-TO-SWITCH FEEDTHROUGH NOISE TEST CIRCUIT VOS R R VCC/2 VCC/2 50pF fIS ≥ 1MHz SINEWAVE R = 50Ω C = 10pF SWITCH ON VIS VOS VC = VIL C dB METER FIGURE 9. SWITCH OFF SIGNAL FEEDTHROUGH Test Circuits and Waveforms 6ns tr = 6ns tf = 6ns VCC (HC) 3V (HCT) 90% 50% 10% INPUT 50% tTLH INVERTING OUTPUT 10% 50% 10% tPHZ OUTPUT HIGH TO OFF tPLH OUTPUTS ENABLED FIGURE 10. HC/HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPZH 90% 50% OUTPUTS DISABLED FIGURE 11. SWITCH TURN-ON AND TURN-OFF PROPAGATION DELAY TIMES 6 GND tPZL tPLZ OUTPUT LOW TO OFF 90% 50% 10% VCC (HC) 3V (HCT) 90% GND tTHL tPHL 6ns OUTPUT DISABLE OUTPUTS ENABLED IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HC4016E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4016EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4016M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4016PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC4016M96 D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 CD74HC4016PWR PW 14 MLA 330 12 7.0 5.6 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) CD74HC4016M96 D 14 MLA 342.9 336.6 28.58 CD74HC4016PWR PW 14 MLA 338.1 340.5 20.64 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated