Data Sheet CURRENT MODE PWM CONTROLLER AP384XC General Description Features The AP3842C/3C/4C/5C are high performance fixed frequency current-mode PWM controller series. · · These integrated circuits are optimized for off-line and DC-DC converter applications with minimum external components. They feature under-voltage lockout (UVLO) circuit with low start-up current, trimmed oscillator for precise duty cycle control, current sense comparator providing maximum current limiting and a totem pole output stage for increasing output current. In addition, these ICs also feature accurate protection against over-temperature, over-current and maximal output power. · · · · · The AP3842C and AP3844C have UVLO thresholds of 16V(on) and 10V(off); The corresponding thresholds for AP3843C and AP3845C are 8.4 V(on) and 7.6V(off). · The AP3842C and AP3843C can operate approaching 100% duty cycle; AP3844C and AP3845C can operate from zero to 50% duty cycle. · · · · · · Low Start-up Current: 50µA Robust VREF Line/Load Regulation Low Line Regulation : 4mV Low Load Regulation : 4mV High Stability of Reference Voltage over a Full Temperature Range: 0.2mV/ oC Operating Frequency up to 500KHz High PWM Frequency Stability over a Full Temperature Range: 2.5% High PWM Frequency Stability under a Full Supply Voltage Range: 0.2% Accurate Over-temperature Protection with Hysteresis UVLO with Hysteresis Applications These ICs are available in SOIC-8 and DIP-8 packages. Off-line Converter DC-DC Converter Voltage Adapter CRT Monitor Power Supply Desktop Power Supply DVD/STB Power Supply DIP-8 SOIC-8 Figure 1. Package Types of AP3842C/3C/4C/5C BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 1 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Pin Configuration P/M Package (DIP-8/SOIC-8) COMP 1 8 VREF VFB 2 7 VCC ISENSE 3 6 OUTPUT RT/CT 4 5 GND Figure 2. Pin Configuration of AP3842C/3C/4C/5C (Top View) Pin Description Pin Number Pin Name Function 1 COMP 2 VFB The inverting input of the Error Amplifier. It is normally connected to the switching power supply output through a resistor divider. 3 ISENSE A voltage proportional to inductor current is connected to this input. The PWM uses this information to terminate the output switch conduction. 4 RT/CT The Oscillator frequency and maximum output duty cycle are programmed by connecting resistor RT to VREF and capacitor CT to ground. Operation to 500 kHz is possible. 5 GND The combined control circuitry and power ground. 6 OUTPUT 7 VCC The positive supply of the control IC. 8 VREF This is the reference output. It provides charging current for capacitor CT through resistor RT. This pin is the Error Amplifier output and is made available for loop compensation. This output directly drives the gate of a power MOSFET. Peak currents up to 1.0 A are sourced and sunk by this pin. BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 2 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Functional Block Diagram VCC 7 34V GND UVLO S/R 5 5V REF 8 INTERNAL BIAS 2.50V VREF GOOD LOGIC RT/CT 4 OSC VFB COMP ISENSE 3 OUTPUT (Note) S 2R 2 1 6 T OVER TEMP PROTECT ERROR AMP VREF R R 1V CURRENT SENSE COMPARATOR PWN LATCH Note: Toggle flip-flop used for 3844C/45C only Figure 3. Functional Block Diagram of AP3842C/3C/4C/5C BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 3 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Ordering Information AP384XC - Circuit Type E1: Lead Free Blank: Tin Lead Package TR: Tape and Reel Blank: Tube M: SOIC-8 P: DIP-8 Package Temperature Range SOIC-8 -40 to 85oC DIP-8 Part Number Tin Lead Marking ID Lead Free Tin Lead Lead Free Packing Type AP3842/3/4/5CM AP3842/3/4/5CM-E1 3842/3/4/5CM 3842/3/4/5CM-E1 Tube AP3842/3/4/5CMTR AP3842/3/4/5CMTR-E1 3842/3/4/5CM 3842/3/4/5CM-E1 Tape & Reel AP3842/3/4/5CP-E1 AP3842/3/4/5CP AP3842/3/4/5CP-E1 -40 to 85oC AP3842/3/4/5CP Tube BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 4 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Absolute Maximum Ratings (Note 1, 2) Parameter Symbol Value Unit Supply Voltage VCC 30 V Output Current IO ±1 A Analog Inputs V(ANA) -0.3 to 6.3 V Error Amp Output Sink Current ISINK(E.A) 10 mA Power Dissipation at TA< 25 oC (DIP-8) PD (Note 3) 1000 mW Power Dissipation at TA<25 oC (SOIC-8) PD (Note 3) 460 mW TJ -40 to 150 oC 140 oC/W 160 oC/W TSTG -65 to 150 oC TLEAD +300 oC 250 V Junction Operating Temperature DIP-8 RθJA Thermal Resistance (Junction to Ambient) SOIC-8 Storage Temperature Range Lead Temperature (Soldering, 10sec) ESD (Machine Mode) Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: All voltages are with respect to pin 5 and all currents are positive into specified terminal. Note 3: Board thickness 1.6mm, board dimension 90mm x 90mm. Recommended Operating Conditions Parameter Oscillation Frequency Ambient Temperature Symbol Min f TA -40 Max Unit 500 KHz 85 o C BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 5 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Electrical Characteristics (VCC=15V, RT=10kΩ CT=3.3nF, TA= -40 to 85oC, unless otherwise specified.) Parameter Symbol Conditions Min Typ Max Unit TJ=25oC, IREF=1mA 4.90 5.00 5.10 V Line, Load, Temp. 4.82 REFERENCE SECTION Reference Output Voltage VREF Total Output Variation 5.18 V Line Regulation ∆VREF 12V ≤ VCC ≤25V 4 15 mV Load Regulation ∆VREF 1mA ≤ IREF ≤20mA 4 15 mV -100 -180 mA 0.2 0.4 mV/oC 52 57 KHz Short Circuit Output Current ISC TA=25oC Temperature Stability OSCILLATOR SECTION Oscillation Frequency f Oscillator Amplitude VOSC 47 TJ=25oC Pin 4, peak to peak (Note 6) 1.7 V Temperature Stability (Note 6) 2.5 % Voltage Stability 12V ≤ VCC ≤ 25V 0.2 1 % Discharge Current Vpin 4 =2V(Note 7) 8.5 9.5 10.5 mA VI Vpin 1=2.5V 2.45 2.50 2.55 V ISINK Vpin1=1.1V ERROR AMPLIFIER SECTION Input Voltage Output Sink Current Output Source Current ISOURCE Vpin1=5V High Output Voltage VOH RL=15kΩ to GND Low Output Voltage VOL RL=15kΩ to pin 8 8 mA -0.8 mA 5 7 V 0.7 1.1 V 2V ≤ VO ≤ 4V 65 90 dB PSRR 12V ≤ VCC ≤ 25V 60 70 dB VI(MAX) Vpin1=5V(Note 4) 0.9 1 1.1 V (Note 4, 5) 2.85 3 3.15 V/V Voltage Gain Power Supply Rejection Ratio 5 -0.5 CURRENT SENSE SECTION Maximum Input Signal Gain Power Supply Rejection Ratio GV PSRR Delay to Output Input Bias Current 12V ≤ VCC ≤ 25V (Note 4, 6) 70 Vpin3 = 0 to 2V (Note 6) 150 300 ns -3 -10 µA ISINK = 20mA 0.1 0.4 V ISINK = 200mA 1.4 2.2 V IBIAS dB OUTPUT SECTION Low Output Voltage High Output Voltage VOL VOH Rise Time tR Fall Time tF ISOURCE = 20mA 13 14 V ISOURCE = 200mA 12 13 V o TJ=25 C, CL=1nF (Note 6) TJ =25oC, CL=1nF (Note 6) 50 150 ns 50 150 ns BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 6 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Electrical Characteristics (Continued) Parameter Symbol Conditions Min Typ Max Unit AP3842C/AP3844C 15 16 17 V AP3843C/AP3845C 7.8 8.4 9.0 V VOPR (Min.) AP3842C/AP3844C 8.5 10.0 11.5 V AP3843C/AP3845C 7.0 7.6 8.2 V D(Max.) AP3842C/AP3843C 95 97 100 % D(Max.) AP3844C/AP3845C 46 48 50 % 0 % 50 80 µA 8 12 mA UNDER -VOLTAGE LOCKOUT SECTION Start Threshold VTH(ST) Min. Operation Voltage (After Turn On) PWM SECTION Max. Duty Cycle Min. Duty Cycle D(Min.) TOTAL STANDBY CURRENT SECTION Start-Up Current IST ICC(OPR) Operating Supply Current Zener Voltage Vpin3=Vpin2=0V ICC=25mA VZ 30 34 V OVER-TEMPERATURE PROTECT SECTION Shutdown Temperature TSHUT (Note 6) 155 oC Temperature Hysteresis THYS (Note 6) 25 oC Note 4: Parameters are tested at trip point of latch with Vpin2 = 0. Note 5: Here gain is defined as: ∆VPin 1 A= , 0 ≤ Vpin3 ≤ 0.8V ∆VPin 3 Note 6: These parameters, although guaranteed, are not 100% tested in production. Note 7: This parameter is measured with RT=10kΩ to VREF, it contributes 0.3mA of current to the measured value. So the total current flowing into the CT pin will be 0.3mA higher than the measured value approximately. VREF 4.7k 1k ERROR AMP ADJUST RT 1 COMP 2 VFB A VREF 8 VCC 7 VCC 100k 5k 4.7k AP384XC 2N2222 ISENSE ADJUST 0.1µF 3 ISENSE OUTPUT 6 4 RT/CT GND 5 1K 1W OUTPUT 0.1µF GND CT Figure 4. Basic Test Circuit BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 7 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC ELectrical Characteristics (Continued) Figure 4 is the basic test circuit for AP384XC. In testing, the high peak currents associated with capacitive loads necessitate careful grounding techniques. Timing and bypass capacitors should be connected close to pin 5 in a single point ground. The transistor and 5k potentiometer are used to sample the oscillator waveform and apply an adjustable ramp to pin 3. Typical Performance Characteristics Figure 5. Oscillator Dead Time vs. Timing Capacitor Figure 6. Timing Resistor vs. Frequency 5.015 4.0 VCC=15V, IO=1mA o 3.5 Saturation Voltage (V) Reference Voltage (V) 5.010 5.005 5.000 4.995 4.990 VCC=15V, TA=25 C 3.0 2.5 2.0 1.5 1.0 0.5 4.985 0.0 4.980 -40 -0.5 -20 0 20 40 60 80 100 120 0 50 100 150 200 250 300 350 400 450 500 550 600 o Ambient Temperature ( C) Output Sink Current (mA) Figure 7. Reference Voltage vs. Ambient Temperature Figure 8. Output Saturation Characteristics BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 8 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Typical Performance Characteristics (Continued) 60 90 80 o VCC=15V, TA=25 C 50 Start-up Current (µA) Voltage Gain (dB) 70 60 50 40 30 40 30 20 10 0 10 100 1k 10k 100k 20 -40 1M -20 0 20 40 60 80 100 120 o Frequency (Hz) Ambient Temperature ( C) Figure 9. Error Amplifier Open-Loop Frequency Response Figure 10. Start-up Current vs. Ambient Temperature BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 9 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Typical Application NTC Bridge Diode 1N4007*4 R19 10 C2 0.01µ 600V + R2 1M/ 0.25W J1 AC 90 to 265V C1 47µ C14 100µ/400V R3 39k 2W C15 2.2n L3 10µ T D1 Byv26e D3 8TQ100 R4 10 + C10 1000µ C11 1µ R20 2K Z2 SA12A + C9 2200µ + D2 1N4001 7 R12 100 Vcc V CC J2 12V/5A C3 0.1µ VREF 8 R5 10k 2 C5 220p VFB 1 COMP 5 GND RT/CT 4 OUTPUT 6 ISENSE 3 C15 100p R14 130k U1 AP3842C/3C/4C/5C R13 15k R11 820 C4 3.3n C8 0.22µ R6 20 R7 1k C6 2200p/600V R16 8.2k Q1 IRF830 U3 AZ431 C7 680p Z1 1N5819 R15 100 W1 1k R18 3.9k R10 0.51/1W R9 7.5k R17 2k U2 PC817 Figure 11. Typical Application of AP3842C/3C/4C/5C BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 10 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Mechanical Dimensions SOIC-8 Unit: mm(inch) 4.800(0.189) 5.000(0.197) 7° 0.320(0.013) 1.350(0.053) 1.750(0.069) 8° 8° 7° 0.675(0.027) 0.725(0.029) D 5.800(0.228) 1.270(0.050) 6.200(0.244) TYP D 20:1 0.300(0.012) R0.150(0.006) 0.100(0.004) φ 0.800(0.031) 0.200(0.008) 0° 8° 1.000(0.039) 3.800(0.150) 4.000(0.157) 1° 5° 0.330(0.013) 0.510(0.020) 0.900(0.035) R0.150(0.006) 0.190(0.007) 0.250(0.010) BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 11 Data Sheet CURRENT MODE PWM CONTROLLER AP384XC Mechanical Dimensions (Continued) DIP-8 Unit: mm(inch) 0.700(0.028) 7.620(0.300)TYP 1.524(0.060) TYP 6° 5° 6° 3.200(0.126) 3.600(0.142) 3.710(0.146) 4.310(0.170) 4° 4° 0.510(0.020)MIN 3.000(0.118) 3.600(0.142) 0.204(0.008) 0.360(0.014) 8.200(0.323) 9.400(0.370) 0.254(0.010)TYP 2.540(0.100) TYP 0.360(0.014) 0.560(0.022) 0.130(0.005)MIN 6.200(0.244) 6.600(0.260) R0.750(0.030) Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 9.000(0.354) 9.400(0.370) BCD Semiconductor Manufacturing Limited Sep. 2006 Rev. 1. 1 12 http://www.bcdsemi.com IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. MAIN SITE BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. 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