• High brightness tri-color surface mount LED. • Capable for all video-standards. The RGB-LED chips can be controlled separately. • 120° viewing angle. • Small package outline (LxWxH) of 2.8 x 3.2 x 1.9 mm. • Qualified according to JEDEC moisture sensitivity Level 2. • Compatible to both IR reflow soldering and TTW soldering. 05/01/06 Multi DomiLED Multi DMRTB-CJ -v19 Page 1 of 9 Part Ordering Number Color ,λdom (nm) Chip#1 Chip#2 Luminous Intensity @ If = 20mA . Iv ( mcd ) Chip#3 Chip#1 Chip#2 1. Reel comes in a quantity of 1025 and 2050 units per reel. 2. Luminous intensity is measured with an accuracy of ±11%. 3. All electrical and optical data are measured at room temperature; Ta = 25°C. Half Group For Luminous Intensity Only one IV group is allowed for each chip within a reel. Groupings Min. (mcd) Max. (mcd) N3 35.5 50.5 P3 50.5 71.5 Q3 71.5 100.0 R3 100.0 140.0 S3 140.0 200.0 T3 200.0 285.0 Chip#3 Wavelength Grouping. If wavelength binning is required, only one wavelength group is allowed for each chip within a reel. Color Group Wavelength distribution (nm) Red Full 620 – 630 True Green Full 521 - 536 A 521 - 526 B 526 - 531 C 531 - 536 Full 465 - 475 A 465 - 470 B 470 - 475 Blue Dominant wavelength is measured with an accuracy of ±1 nm. Electrical Characteristics at Ta = 25 oC Vf at If=20mA; (V) Temperature coefficient of Vf (If =20mA; -10oC<T<100oC) Typ. ( mV/K ) Typ. Max Red 1.8 2.45 -2.0 True Green 3.7 4.25 -3.6 Blue 3.6 4.25 -3.1 Optical Characteristics at TA = 25 oC Temperature coefficient (If =20mA; -10oC<T<100oC, typ.) λpeak (nm/K) λdom. (nm/K) Red 0.15 0.05 True Green 0.04 0.03 Blue 0.04 0.02 05/01/06 Multi DomiLED Multi DMRTB-CJ -v19 View Angle (deg.) 120 Page 3 of 9 Absolute Maximum Ratings Maximum Value DC forward current. Peak pulse current. Red Green, Blue 30 20 Red (tp ≤ 10 µs, Duty cycle = 0.005) Reverse voltage. Green, Blue 1000 Green, Blue 12 5 Red Green, Blue 75 Thermal resistance junction/ambient, Rth JA mA V V 85 Red Green, Blue 1chip on 480 530 3 chips on 770 820 Thermal resistance junction/solder point, Rth JS mA 200 Red Power consumption. Unit Red Green, Blue 1chip on 260 290 3 chips on 420 470 K/W K/W 125 °C Operating temperature. -40 … +100 °C Storage temperature. -40 … +100 °C LED junction temperature. Recommended Solder Pad 05/01/06 Multi DomiLED Multi DMRTB-CJ -v19 Page 4 of 9 Luminous intensity vs. forward current. Wavelength vs. forward current. Intensity vs. DC Forward Current Wavelength vs. Forw ard Current Relative intensity. Normalized at 20 mA. 2.2 2 1.8 AlInGaP 470 535 469.5 533 1.4 525 523 467.5 0.8 0.6 521 467 0.4 0 10 20 30 40 50 517 466 60 515 10 Forward Current(mA) Wavelength Distribution. 519 Green 466.5 0.2 0 20 30 40 50 Forward current vs. forward voltage. Relative Spectral Emission Forward Current vs. Forward Voltage 35 1.0 0.9 30 0.8 True Green 0.7 Blue Forward Current (mA) Relative Intensity 527 Blue 468 1 Red 0.5 0.4 0.3 0.2 Red 25 20 15 Blue & Green InGaN 10 5 0.1 0.0 400 529 468.5 InGaN 1.2 0.6 531 469 1.6 450 500 550 600 650 Wavelength (nm) 700 750 800 0 1 1.5 2 2.5 3 3.5 4 Forward Voltage (V) Radiation pattern. 30° 20° 10° 0° 1.0 40° 0.8 50° 0.6 60° 0.4 70° 0.2 80° 0 90° 05/01/06 Multi DomiLED Multi DMRTB-CJ -v19 Page 5 of 9 4.5 Max forward current vs. temperature (1 chip on) Max forward current vs. temperature (3 chips on) 35 Red 30 25 Forward Current, If (mA) Forward Current, If (mA) 35 True Green 20 15 Blue 10 5 30 Red 25 True green 20 15 Blue 10 5 0 0 0 10 20 30 40 50 60 70 80 90 0 100 10 20 40 50 60 70 80 90 100 Ambient Temperature ( C) Ambient Temperature ( C) Max forward current vs. temperature (1 chip on) Max forward current vs. temperature (3 chips on) 35 35 Red 30 25 Forward Current, If (mA) Forward Current, If (mA) 30 o o True Green 20 15 10 Blue 5 Red 30 25 True Green 20 15 Blue 10 5 0 0 0 10 20 30 40 50 60 70 o Solder point temperature Ts ( C) 05/01/06 80 90 100 0 10 20 30 40 50 60 70 80 90 100 o Solder point temperature Ts ( C) Multi DomiLED Multi DMRTB-CJ -v19 Page 6 of 9 Taping And Orientation. Reels come in quantity of 1025 or 2050 units. Reel diameter is 180 mm. 05/01/06 Multi DomiLED Multi DMRTB-CJ -v19 Page 7 of 9 Recommended IR-reflow Soldering Profile. Classification Reflow Profile (JEDEC J-STD-020B) 275 250 235-240oC 10-30s Temperature ( C) 225 Ramp-up 3 oC/sec max. 200 o 183 oC 175 60-150s 150 125 Ramp-down 6 oC/sec max. 100 Preheat 60-120s 75 50 360s max 25 0 50 100 150 200 Time (sec) Recommended Pb Free IR-Reflow Soldering Profile. Classification Reflow Profile (JEDEC J-STD-020C) 300 275 o Temperature ( C) 250 Ramp-up 3 oC/sec 217 oC 225 255-260oC 10-30s 200 60-150s 175 150 125 Ramp-down 6 oC/sec max. 100 Preheat 60-180s 75 50 480s max 25 0 50 100 150 200 Time (sec) 05/01/06 Multi DomiLED Multi DMRTB-CJ -v19 Page 8 of 9