CSPEMI204 2 Channel Headset EMI Filter with ESD Protection Features Product Description • The CSPEMI204 is a low-pass filter array designed specifically to reduce EMI/RFI emissions and provide ESD protection for a headset port on a cellular and mobile devices. The CSPEMI204 integrates two high quality, pi-style filters (C-R-C) filters, one for a microphone and one for an earpiece or speaker, each providing more than 30dB attenuation relative to the pass band attenuation in the 800-2700 MHz range. These filters support bidirectional filtering, reducing EMI both to and from the headset port and support bipolar audio signals without distortion. • • • • • • • Two channels of EMI filtering, one for a microphone and one for an earpiece speaker Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Chip Scale Package features extremely low parasitic inductance for optimum filter performance Greater than 30dB relative attenuation in the 8002700MHz range ±8kV ESD protection on each channel (IEC 610004-2 Level 4, contact discharge) ±15kV ESD protection on each channel (HBM) 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • EMI filtering and ESD protection for headset microphone and earpiece speaker ports Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders In addition, the CSPEMI204 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CSPEMI204 can safely dissipate ESD strikes of ±8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15kV. The CSPEMI204 protects sensitive components such as CPU and DSPs that have much weaker internal ESD protection circuitry usually only intended for mechanical handling protection. The CSPEMI204 is particularly well-suited for portable electronics because of its small package format and low weight. The CSPEMI204 is available in a spacesaving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic 68 Ω Microphone A3 Input 47pF GND C3 Microphone Output 47pF C1 Earpiece Output 100pF 10 Ω 100pF Earpiece A1 Input B2 © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CSPEMI204 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 B AE A A3 A1 MIC_IN EAR_IN Orientation Marking A1 B2 GND C C3 C1 MIC_OUT EAR_OUT CSPEMI204 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 EAR_IN Earpiece Input (from audio circuitry) A3 MIC_IN Microphone Input (from microphone) B2 GND C1 EAR_OUT Device Ground Earpiece Output (to earpiece) C3 MIC_OUT Microphone Output (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 5 CSP CSPEMI204 Part Marking Ordering Part Number1 Part Marking AE CSPEMI204G AE Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05 CSPEMI204 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW RATING UNITS -40 to +85 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance 9 10 11 Ω R2 Resistance 54 68 75 Ω C1 Capacitance 80 100 120 pF C2 Capacitance 38 47 57 pF 1.0 μA 15 -5 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 fC1 Cut-off frequency 1; Note 5 fC2 Cut-off frequency 2; Note 5 VCL 5 -15 7 -10 ±15 kV ±8 kV +15 -19 V V R = 10Ω, C = 100pF 33 MHz R = 68Ω, C = 47pF 61 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: The parameters are guaranteed by design. Note 5: ZSOURCE=50Ω, ZLOAD=50Ω © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CSPEMI204 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05 CSPEMI204 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for EutecticDevices using Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CSPEMI204 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams The CSPEMI204 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s Chip Scale Package, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 Bumps 5 Millimeters Min Nom A 1 2 3 Inches Max Min Nom Max A1 0.885 0.930 0.975 0.0348 0.0366 0.0384 A2 1.365 1.410 1.455 0.0537 0.0555 0.0573 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.165 0.215 0.265 0.0065 0.0085 0.0104 C2 0.220 0.270 0.320 0.0087 0.0106 0.0126 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel C2 Dim B A2 Custom CSP B4 B3 C PACKAGE DIMENSIONS Package SIDE VIEW C1 B2 B1 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI204 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CSPEMI204 1.41 X 0.93 X 0.606 1.52 X 1.07 X 0.72 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches cumulative tolerance on tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center lines of cavity P1 User direction of feed Figure 6. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05