CALMIRCO CSPEMI204

CSPEMI204
2 Channel Headset EMI Filter with ESD Protection
Features
Product Description
•
The CSPEMI204 is a low-pass filter array designed
specifically to reduce EMI/RFI emissions and provide
ESD protection for a headset port on a cellular and
mobile devices. The CSPEMI204 integrates two high
quality, pi-style filters (C-R-C) filters, one for a microphone and one for an earpiece or speaker, each providing more than 30dB attenuation relative to the pass
band attenuation in the 800-2700 MHz range. These
filters support bidirectional filtering, reducing EMI both
to and from the headset port and support bipolar audio
signals without distortion.
•
•
•
•
•
•
•
Two channels of EMI filtering, one for a microphone and one for an earpiece speaker
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
Chip Scale Package features extremely low parasitic inductance for optimum filter performance
Greater than 30dB relative attenuation in the 8002700MHz range
±8kV ESD protection on each channel (IEC 610004-2 Level 4, contact discharge)
±15kV ESD protection on each channel (HBM)
5-bump, 0.930mm X 1.410mm footprint
Chip Scale Package (CSP)
Lead-free version available
Applications
•
•
•
•
•
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EMI filtering and ESD protection for headset microphone and earpiece speaker ports
Cellular / Mobile Phones
Notebooks and Personal Computers
Handheld PCs / PDAs / Tablets
Wireless Handsets
Digital Camcorders
In addition, the CSPEMI204 provides a very high level
of protection for sensitive electronic components that
may be subject to electrostatic discharge (ESD). The
CSPEMI204 can safely dissipate ESD strikes of ±8kV,
the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the device provides protection for contact discharges to greater than ±15kV. The CSPEMI204 protects sensitive components such as CPU and DSPs
that have much weaker internal ESD protection circuitry usually only intended for mechanical handling
protection.
The CSPEMI204 is particularly well-suited for portable
electronics because of its small package format and
low weight. The CSPEMI204 is available in a spacesaving, low-profile Chip Scale Package with optional
lead-free finishing.
Electrical Schematic
68 Ω
Microphone A3
Input
47pF
GND
C3 Microphone
Output
47pF
C1 Earpiece
Output
100pF
10 Ω
100pF
Earpiece A1
Input
B2
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CSPEMI204
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1 2 3
B
AE
A
A3
A1
MIC_IN
EAR_IN
Orientation
Marking
A1
B2
GND
C
C3
C1
MIC_OUT
EAR_OUT
CSPEMI204
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
EAR_IN
Earpiece Input (from audio circuitry)
A3
MIC_IN
Microphone Input (from microphone)
B2
GND
C1
EAR_OUT
Device Ground
Earpiece Output (to earpiece)
C3
MIC_OUT
Microphone Output (to audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
5
CSP
CSPEMI204
Part Marking
Ordering Part
Number1
Part Marking
AE
CSPEMI204G
AE
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05
CSPEMI204
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
RATING
UNITS
-40 to +85
°C
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
Resistance
9
10
11
Ω
R2
Resistance
54
68
75
Ω
C1
Capacitance
80
100
120
pF
C2
Capacitance
38
47
57
pF
1.0
μA
15
-5
V
V
ILEAK
Diode Leakage Current
VIN=5.0V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3 and 4
fC1
Cut-off frequency 1; Note 5
fC2
Cut-off frequency 2; Note 5
VCL
5
-15
7
-10
±15
kV
±8
kV
+15
-19
V
V
R = 10Ω, C = 100pF
33
MHz
R = 68Ω, C = 47pF
61
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: The parameters are guaranteed by design.
Note 5: ZSOURCE=50Ω, ZLOAD=50Ω
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CSPEMI204
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05
CSPEMI204
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for EutecticDevices using Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
09/28/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
CSPEMI204
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
The CSPEMI204 is supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CMD’s Chip Scale Package,
see the California Micro Devices CSP Package Information document.
BOTTOM VIEW
A1
Bumps
5
Millimeters
Min
Nom
A
1 2 3
Inches
Max
Min
Nom
Max
A1
0.885 0.930 0.975 0.0348 0.0366 0.0384
A2
1.365 1.410 1.455 0.0537 0.0555 0.0573
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.165 0.215 0.265 0.0065 0.0085 0.0104
C2
0.220 0.270 0.320 0.0087 0.0106 0.0126
D1
0.562 0.606 0.650 0.0221 0.0239 0.0256
D2
0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
C2
Dim
B
A2
Custom CSP
B4
B3
C
PACKAGE DIMENSIONS
Package
SIDE
VIEW
C1
B2
B1
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI204
Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CSPEMI204
1.41 X 0.93 X 0.606
1.52 X 1.07 X 0.72
8mm
178mm (7")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches cumulative
tolerance on tape
±0.2 mm
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center lines
of cavity
P1
User direction of feed
Figure 6. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
09/28/05