CSPEMI307A 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB Features Product Description • The CSPEMI307A is a multichannel EMI/ESD array offering a combination of four low-pass filter + ESD channels to reduce EMI/RFI emissions on a data port and four dedicated ESD-only channels intended specifically for ESD protection on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a data port connector. • • • • • • • Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection EMI/ESD channels provide greater than 32dB attenuation at 1GHz +15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) + 30kV ESD protection on all channels (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • • EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs The CSPEMI307A provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CSPEMI307A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CSPEMI307A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic 100Ω FILTER+ESDn* FILTER+ESDn* 30pF ESDn* 30pF 30pF GND (Pins B1-B3) 1 of 4 EMI/RFI + ESD Channels. 1 of 4 ESD-only Channels * See Package/Pinout Diagram for expanded pin information © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CSPEMI307A PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER/ESD_2 ESD_3 A C1 C3 GND GND ESD_1 Orientation Marking C B1 A1 A1 FILTER/ESD_4 C4 B2 C6 A3 FILTER/ESD_1 ESD_4 GND FILTER/ESD_2 A2 C5 FILTER/ESD_3 FILTER/ESD_1 307A B C2 B3 FILTER/ESD_4 A4 FILTER/ESD_3 A5 A6 ESD_2 CSPEMI307A CSP Package Notes:. 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 ESD_1 ESD Channel 1 A2 FILTER+ESD_1 Filter + ESD Channel 1 A3 FILTER+ESD_2 Filter + ESD Channel 2 A4 FILTER+ESD_3 Filter + ESD Channel 3 A5 FILTER+ESD_4 A6 ESD_2 ESD Channel 2 B1-B3 GND Device Ground C1 ESD_3 ESD Channel 3 C2 FILTER+ESD_1 Filter + ESD Channel 1 C3 FILTER+ESD_2 Filter + ESD Channel 2 C4 FILTER+ESD_3 Filter + ESD Channel 3 C5 FILTER+ESD_4 Filter + ESD Channel 4 C6 ESD_4 Filter + ESD Channel 4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Lead-free Finish 2 Standard Finish Ordering Part Bumps Package Number1 15 CSP CSPEMI307A Ordering Part Part Marking Number1 Part Marking 307A CSPEMI307AG 307A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI307A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER R Resistance C Capacitance CONDITIONS At 2.5V DC Temperature Coefficient of Resistance TCC Temperature Coefficient of Capacitance At 2.5V DC Diode Voltage (reverse bias) IDIODE=10µA ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 30pF VESD VCL fC TYP MAX UNITS 80 100 120 Ω 30 36 24 TCR VDIODE MIN pF 1200 ppm/°C -300 ppm/°C 5.5 5.6 -0.4 V 6.8 -0.8 100 nA 9.0 -1.5 V V ±30 kV ±15 kV +10 -5 V V 64 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CSPEMI307A Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI307A Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2) © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CSPEMI307A Performance Information Typical Filter Performance (TA=25°C, 50 Ohm Environment) Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias © 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI307A Performance Information (cont’d) 1.6 1.5 Normalized Capacitance 1.4 1.3 1.2 T = -40C T = +25C 1.1 T = +70C 1.0 0.9 0.8 0.7 0 1 2 3 4 5 DC Input Voltage (V) Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) 1.100 1.080 Nornalized Resistance 1.060 1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C] Figure 7. Resistance vs. Temperature (normalized to resistance at 25°C) © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 CSPEMI307A Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI307A Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CSPEMI307A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 C1 SIDE VIEW B2 B4 B3 B1 C PACKAGE DIMENSIONS Custom CSP Bumps 15 Dim Millimeters A 1 Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 # per tape and reel Min A2 C2 B Package Nom 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Max DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI307A Chip Scale Package 0.0140 0.0150 0.0159 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CSPEMI307A 2.96 X 1.33 X 0.6 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 11. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 9