Cree® XLamp® XR-E LED Data Sheet Cree XLamp LEDs combine the brightness of power LED chips with a rugged package capable of operating up to four watts. Cree XLamp LEDs lead the solidstate lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. Cree XLamp LEDs bring lighting-class brightness and efficiency to a wide range of lighting and backlighting applications, including portable lighting and flashlights, outdoor and industrial, signaling, architectural, landscaping and entertainment/ advertising installations. FEATURES • Guaranteed minimum flux order codes up to • 100 lm in white and 23.5 lm in blue • Over 80 lm/W available in white • Available in white (2,600 K to 10,000 K CCT), Industry-leading JEDEC standard prequalification testing • Reflow solderable – JEDEC J-STD-020C compatible blue and royal blue • Electrically neutral thermal path • Drive currents: 350 to 1000 mA • RoHS-compliant • Industry’s lowest thermal resistance: 8°C/W • Lumen maintenance of greater than 70% after • Max junction temperature: 150°C 50,000 hours 6 CLD-DS05.00 Data Sheet: Table of Contents Flux Characteristics (TJ = 25°C)................................................................................2 Characteristics..........................................................................................................3 Relative Spectral Power............................................................................................4 Photometric Output vs. Junction Temperature (IF = 350 mA)...................................5 Electrical Characteristics (TJ = 25˚C)........................................................................6 Thermal Design.........................................................................................................6 Relative Intensity vs. Current (TJ = 25˚C).................................................................7 Typical Spatial Radiation Pattern...............................................................................7 Reflow Soldering Characteristics...............................................................................8 Notes.........................................................................................................................9 Mechanical Dimensions (TA = 25°C)........................................................................10 Tape and Reel..........................................................................................................11 Dry Packaging and Packaging.................................................................................12 Subject to change without notice. www.cree.com/xlamp Flux Characteristics (TJ = 25°C) The following tables describe the available colors and flux for XR-E LEDs by listing the correlated color temperature or dominant wavelength range for the entire family and by providing several base order codes. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XR-E & XR-C Binning and Labeling document. Base Order Codes Min Luminous Flux (lm) CCT Range Color Min. Cool White Max. 5,000 K Neutral White 3,700 K Warm White 2,600 K Group Flux (lm) N4 62.0 XREWHT-L1-0000-00601 P2 67.2 XREWHT-L1-0000-00701 P3 73.9 XREWHT-L1-0000-00801 P4 80.6 XREWHT-L1-0000-00901 Q2 87.4 XREWHT-L1-0000-00A01 Q3 93.9 XREWHT-L1-0000-00B01 Q4 100 XREWHT-L1-0000-00C01 N4 62.0 XREWHT-L1-0000-006E4 P2 67.2 XREWHT-L1-0000-007E4 P3 73.9 XREWHT-L1-0000-008E4 N3 56.8 XREWHT-L1-0000-005E7 N4 62.0 XREWHT-L1-0000-006E7 10,000 K 5,000 K 3,700 K Dominant Wavelength Range Min. Color Blue Order Code Max. Group DWL (nm) Group DWL (nm) B3 465 B6 485 Base Order Codes Min Luminous Flux (lm) Order Code Group Flux (lm) H0 18.1 XREBLU-L1-0000-00H01 J0 23.5 XREBLU-L1-0000-00J01 Dominant Wavelength Range Min. Color Royal Blue Max. Group DWL (nm) Group DWL (nm) D3 450 D5 465 Base Order Codes Min Radiant Flux (mW) Order Code Group Flux (mW) 12 250 XREROY-L1-0000-00701 13 300 XREROY-L1-0000-00801 Notes: • Cree maintains a tolerance of +/- 7% on flux and power measurements. • Typical CRI for Cool White & Neutral White (3,700 K – 10,000 K CCT) is 75. • Typical CRI for Warm White (2,600 K – 3,700 K CCT) is 80. Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Characteristics Characteristics Unit Thermal Resistance, junction to solder point °C/W 8 degrees 90 mV/°C -4.0 Viewing Angle (FWHM) Temperature coefficient of voltage (white, blue, royal blue) Minimum ESD Classification (HBM per Mil-Std-883D) Typical Maximum Class 2 DC Forward Current (white ≥ 5000 K) mA 1000 DC Forward Current (white < 5000 K, blue, royal blue) mA 700 DC Pulse Current (@ 1 kHz, 10% duty cycle) A 1.8 Reverse Voltage V 5 Forward Voltage (@ 350 mA) V 3.3 Forward Voltage (@ 700 mA) V 3.5 Forward Voltage (@ 1000 mA) (white ≥ 5000 K) V 3.7 LED Junction Temperature * °C 3.9 150 * Note: For lumen maintenance data, see the Cree XLamp LED Reliability document. Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Relative Spectral Power Relative Intensity (%) 100 80 60 5000KK- -10000K 5000 10000 CCT K CCT 3500K 5000K 3500 K - 5000 CCT K CCT 2600 3500 CCT K CCT 2600KK- -2500K 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) White Relative Intensity (%) 100 80 60 Royal Blue Blue 40 20 0 400 450 500 550 Wavelength (nm) Blue Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Photometric Output vs. Junction Temperature (IF = 350 mA) Relative Photmetric Output 100% 90% 80% 70% 60% White 50% Blue 40% 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (°C) Relative Radiometric Output 100% 90% 80% 70% 60% 50% Royal Blue 40% 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (°C) Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Electrical Characteristics (TJ = 25˚C) Max Current mA 1000 Tj max °C 150 Max Vf V 4.3 Max amb °C 150 1000 900 Forward Current (mA) 800 Rth,j-a Max mA 3488.4 1000.0 0.0 Ta °C 0 107 150 10 Derated mA 1000.0 1000.0 0.0 Ta °C 0 98.4 150 700 600 1200 400 300 200 100 0 0.0 1.0 2.0 Maximum Current (mA) 500 1000 800 600 Rj-a = 10°C/W Rj-a = 12°C/W Rj-a = 15°C/W Rj-a = 20°C/W 400 3.0 4.0 200 5.0 Forward Voltage (V) 0 0 25 50 75 100 125 150 100 125 150 Rth,j-a 10 Rth,j-a 12 Ambient Thermal Design Max Current mA 1000 Ta Max Derated Ta Max DeratedTemperature (°C) Tj max °C 150 °C mA mA °C mA mA Max Vf V 4.3 0 3488.4 1000.0 0 2907.0 1000.0 The maximum forward current is determined by the thermal resistance between the LED junction and ambient. Given Max 150 resistance 107 of 1000.0 1000.0the junction 98.4 and the1000.0 anamb existing°Cthermal 8°C/W between solder point,1000.0 it is crucial for the end product to 0.0 0.0 150 from the 0.0solder point0.0to ambient in order to optimize be designed in a manner 150 that minimizes the thermal resistance lamp life and optical characteristics. 800 700 1000 Maximum Current (mA) Maximum Current (mA) 1200 800 600 Rj-a = 10°C/W Rj-a = 12°C/W Rj-a = 15°C/W Rj-a = 20°C/W 400 200 600 500 400 Rj-a = 10°C/W Rj-a = 12°C/W Rj-a = 15°C/W Rj-a = 20°C/W 300 200 100 0 0 0 25 50 75 100 Ambient Temperature (°C) Cool White 125 150 0 25 50 75 Ambient Temperature (°C) Neutral White, Warm White, Blue and Royal Blue 800 Current (mA) 700 600 Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 500 400 CLD-DS05.006 Rj-a = 10°C/W Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Relative Intensity vs. Current (TJ = 25˚C) Relative Intensity (%) 250 200 150 100 50 0 0 100 200 300 400 500 600 700 800 900 1000 Forward Current (mA) Typical Spatial Radiation Pattern 120 Relative Intensity (%) 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle (°) Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Reflow Soldering Characteristics The following reflow soldering profiles are provided for reference. Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Cree XLamp LEDs are compatible with JEDEC J-STD-020C. Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Based Solder Lead-Free Solder 3°C/second max. 3°C/second max. Preheat: Temperature Min (Tsmin) 100°C 150°C Preheat: Temperature Max (Tsmax) 150°C 200°C 60-120 seconds 60-180 seconds 183°C 217°C 60-150 seconds 60-150 seconds 215°C 260°C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5°C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25°C to Peak Temperature 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Notes Lumen Maintenance Projections Based on internal long-term reliability testing and standardized forecasting methods, Cree projects XLamp LEDs to maintain an average of 70% lumen maintenance after 50,000 hours, provided the LED junction temperature is maintained at or below 80°C. Please read the XLamp Reliability application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity XLamp LEDs are shipped in sealed, moisture-barrier bags (MBB) designed for long shelf life. If XLamp LEDs are exposed to moist environments after opening the MBB packaging but before soldering, damage to the LED may occur during the soldering operation. The following derating table defines the maximum exposure time (in days) for an XLamp LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time specified below must be baked according to the baking conditions listed below. Temperature Maximum Percent Relative Humidity 30% 40% 50% 60% 70% 80% 90% 30ºC 9 5 4 3 1 1 1 25ºC 12 7 5 4 2 1 1 20ºC 17 9 7 6 2 2 1 Baking Conditions It is not necessary to bake all XLamp LEDs. Only the LEDs that meet all of the following criteria must be baked: 1. LEDs that have been removed from the original MBB packaging 2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above 3. LEDs that have not been soldered LEDs should be baked at 80ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking. Do not bake parts at temperatures higher than 80ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Storage Conditions XLamp LEDs that have been removed from original MBB packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ± 5ºC and no greater than 10% RH (relative humidity). For LEDs stored in these conditions, storage time does not add to exposure time as defined in the Moisture Sensitivity section above. RoHS Compliance The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (POP), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006. Vision Advisory Claim Users should be cautioned not to stare at the light of this LED product. The bright light can damage the eye. Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Mechanical Dimensions (TA = 25°C) All measurements are ±.1mm unless otherwise indicated. Lens Substrate Reflector Reflector Lens Substrate 6.8 mm 4.4 ± .2 mm Side View 9.0 mm 8.4 mm 5.6 mm 6.46 mm 0.7 mm 7.0 mm Bottom View Top View 9.4 mm 7.0 8.4mm mm 5.6 7.0mm mm 5.6 mm 1.2 mm 0.70 mm 7.4 mm 6.46 mm Recommended PC Board Solder Pad Recommended PC Board Solder Pad Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Tape and Reel All dimensions in mm. 330.2 mm Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 11 CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Dry Packaging and Packaging Desiccant (inside vacuum bag) Cree Bin Code and Barcode Label Cree Label with Customer P/N / Qty / Lot# Humidity Indicator (inside vacuum bag) Vacuum-Sealed Bag Bin Label Cautionary Labels Patent Label Taped Edge Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12 CLD-DS05.006 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp