C26-SMD Model 32.768KHz Molded SMD Package Frequency: Calibration Tolerance: Turnover Temperature: Frequency vs Temp.: 32.768KHz ±20ppm 25°C ±5°C -0.034 ±0.006ppm/°C2 (See Chart 1) Operating Temp. Range: -40°C to 85°C Storage: -55°C to 125°C ESR: 50K ohm Max Load Capacitance: 12.5pF Typ. Motional Capacitance: 0.003pF Typ. Shunt Capacitance: 1.35pF Typ. Capacitance Ratio: 450 Typ. Drive Level: 1uW Max Insulation Resistance: 500M ohm Min, DC100V±15V Aging: Molded Crystal package to meet today's demand for pick and place processing. Available on tape and reel in quantities of 3K for SMT placement. <3ppm 1st/yr Max C26-SMD 0.075 (1.90) 4 0.051 (1.30) 0.216 (5.50) 3 1 2 3 0.150 (3.80) 0.075 (1.90) 0.165 (4.20) 0.051 (1.30) 4 1 0.051 (1.30) 0.315 (8.00) 0.098 (2.50) 2 0.019 (0.50) Dimensions inches (mm) All dimensions are Max unless otherwise specified. RECOMMENDED REFLOW SOLDERING PROFILE Critical Temperature Zone Chart 1 Ramp-Down 6°C/Sec. 217°C Typical Temperature Characteristic 0 200°C PPM TEMPERATURE Ramp-Up 3°C/Sec Max. 260°C 150°C -50 Preheat 180 Secs. Max. 8 Minutes Max. 90 Secs. Max. -10 0 25 Temperature °C 60 260°C for 10 Secs. Max. NOTE: Reflow Profile with 240°C peak also acceptable. Specifications subject to change without notice. TD-020902 Rev. C 37