Tel : Fax : email : 0044 (0)118 979 1238 0044 (0)118 979 1283 [email protected] ACT2x6HRSMX The ACT2x6HRSMX is a miniature surface mount Watch Crystal in a cylindrical package offering high vibration and shock resistance together with high stability. This device is very suitable for many real time applications including portable equipment/hand held units and applications that require close packing density of components, it can also be re-flow soldered to 260°C. Specification Options Parameter Symbol Specification Nominal Frequency Frequency Tolerance @25°C Frequency v Temperature Temp Operating Range Turnover Temperature Temperature Coefficient Temp Storage Range Equivalent Series Resistance Quality Factor Load Capacitance Shunt Capacitance Capacitance Ratio Motional Capacitance Drive Level Insulation Resistance Aging Max Reflow temperature fo Δf/fo Δf/fo Topr Tm β Tstg ESR Q CL C0 C0/1 C1 DL IR Fa Tmax 32.768KHz ±10ppm ~ ±100ppm Please refer to plot on page 2 -40 ~ +85°C 25°C ±5°C 2 -0.037ppm / °C Typical -55 ~ +125°C 40KΩ max 60K Typical 12.5pF standard ( 6pF to 12.5pF available ) 1.4pf Typical 450 Typical 0.003pF Typical 1μ W max 500MΩ @ 100VDC min ±5ppm max First year, 25±3°C 260°C 10 seconds Please specify Please specify 3ppm max available Refer to page 2 Tape & Reel Dimensions Solder Footprint . Lead finish SnCu Please note that all parameters can not necessarily be specified in the same device Customer to specify : Frequency Tolerance, Load Capacitance In line with our ongoing policy of product evolvement and improvement, the above specification may subject to change without notice ISO9001:2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, UK http://www.actcrystals.com 1 of 2 Issue: 2 C1b Date: 10/10/06 Tel : Fax : email : #REF! 0044 (0)118 979 1238 0044 (0)118 979 1283 [email protected] ACT2x6HRSMX Soldering of the ACT2X6HRSMX Reflow oven should be set up to emulate the maximum reflow profiles temperatures and times shown in the diagram below. Note it is just as important to conform to the times specified l as the temperatures. Pre-heat should not exceed 217°C and rate of heating from 25°C to 217°C should be limited to 4deg C/sec Peak soldering temperature should not exceed 260°C. Time at peak temperature should not exceed 10 seconds. Total reflow time should not exceed 7 minutes. Should it be required to solder the can to the PCB, then the area and volume of solder should be kept to an absolute minimum, and trials should be conducted to determine if the re-flow process in use is satisfactory . Wash Processes for Watch Crystals Ultrasonic cleaning should be avoided. In line with our ongoing policy of product evolvement and improvement, the above specification may subject to change without notice ISO9001:2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, UK http://www.actcrystals.com Issue: 2 C1b Date: 10/10/06 2 of 2