Spec. No. : C848M3-A Issued Date : 2002.08.18 Revised Date : 2005.10.04 Page No. : 1/5 CYStech Electronics Corp. Low Vcesat NPN Epitaxial Planar Transistor BTD2150AM3 Features • Low VCE(sat), VCE(sat)=0.1 V (typical), at IC / IB = 1A / 50mA • Excellent current gain characteristics • Complementary to BTB1424AM3 • Pb-free package Symbol Outline BTD2150AM3 SOT-89 B：Base C：Collector E：Emitter B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Symbol Limits Unit VCBO VCEO VEBO IC 80 50 6 3 0.6 1 2 150 -55~+150 V V V A Pd Tj Tstg *1 *2 W °C °C Note : *1 Printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm. *2 When mounted on a 40*40*0.7mm ceramic board. BTD2150AM3 CYStek Product Specification Spec. No. : C848M3-A Issued Date : 2002.08.18 Revised Date : 2005.10.04 Page No. : 2/5 CYStech Electronics Corp. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. 80 50 6 120 120 100 - Typ. 0.1 0.25 90 45 Max. 0.1 0.1 0.25 0.5 2 820 - Unit V V V µA µA V V V MHz pF Test Conditions IC=50µA, IE=0 IC=1mA, IB=0 IE=50µA, IC=0 VCB=60V, IE=0 VEB=5V, IC=0 IC=1A, IB=50mA IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=0.1A VCE=2V, IC=0.5A VCE=2V, IC=1A VCE=5V, IC=0.1A, f =100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE 2 Rank Q Range 120~270 R 180~390 S T 270~560 390~820 Ordering Information Device Package SOT-89 (Pb-free) BTD2210AM3 Shipping Marking 1000 pcs / Tape & Reel CF Characteristic Curves Grounded Emitter Output Characteristics Grounded Emitter Output Characteristics 700 500uA 120 Collector Current---IC(mA) Collector Current---IC(mA) 140 400uA 100 80 300uA 60 200uA 40 100uA 20 IB=0uA 0 0 1 2 3 4 5 Collector To Emitter Voltage---VCE(V) BTD2150AM3 2.5mA 600 500 2mA 400 1.5mA 300 1mA 200 500uA 100 IB=0uA 0 6 0 1 2 3 4 5 6 Collector To Emitter Voltage---VCE(V) CYStek Product Specification Spec. No. : C848M3-A Issued Date : 2002.08.18 Revised Date : 2005.10.04 Page No. : 3/5 CYStech Electronics Corp. Characteristic Curves(Cont.) Grounded Emitter Output Characteristics Grounded Emitter Output Characteristics 3500 Collector Current---IC(mA) Collector Current---IC(mA) 2500 10mA 2000 8mA 1500 6mA 1000 4mA 500 2mA 25mA 3000 20mA 2500 15mA 2000 10mA 1500 5mA 1000 500 IB=0mA IB=0mA 0 0 0 1 2 3 4 5 Collector To Emitter Voltage---VCE(V) 0 6 1 2 3 4 5 6 Collector To Emitter Voltage---VCE(V) Current gain vs Collector current Saturation voltage vs Collector current 1000 1000 Saturation voltage---(mV) Current gain---HFE VCE(sat) VCE=5V 100 VCE=2V VCE=1V 10 100 IC=40IB 10 IC=10IB 1 1 10 100 1000 10000 1 Collector current---IC(mA) 10 100 1000 10000 Collector current---IC(mA) Saturation votlage vs Collector current Power Derating Curves 10000 2.5 Power Dissipation---PD(W) Saturation voltage---(mV) IC=20IB VBE(sat)@IC=10IB 1000 100 2 See Note 2 on Page 1 1.5 See Note 1 on Page 1 1 0.5 0 1 10 100 1000 Collector current---IC(mA) BTD2150AM3 10000 0 50 100 150 200 Ambient Temperature---TA(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C848M3-A Issued Date : 2002.08.18 Revised Date : 2005.10.04 Page No. : 4/5 Reel Dimension Carrier Tape Dimension BTD2150AM3 CYStek Product Specification Spec. No. : C848M3-A Issued Date : 2002.08.18 Revised Date : 2005.10.04 Page No. : 5/5 CYStech Electronics Corp. SOT-89 Dimension A 2 1 Marking: 3 H C CF* D B E Style: Pin 1. Base 2. Collector 3. Emitter I F G 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 *: Typical Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.01417 0.0201 DIM A B C D E Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.527 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD2150AM3 CYStek Product Specification