CYStech Electronics Corp. Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 1/6 PNP Epitaxial Planar Transistor BTB1198N3 Features • Low VCE(SAT), VCE(SAT)= -0.16V (Typ.) @ IC/IB=-500mA/-50mA • High breakdown voltage, BVCEO=-80V • Complementary to BTD1782N3 • Pb-free package Symbol Outline BTB1198N3 SOT-23 B：Base C：Collector E：Emitter Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation (TA=25°C) Power Dissipation (TC=25°C) Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC PD PD RθJA RθJC Tj Tstg Limits -80 -80 -5 -0.5 225 (Note) 560 556 (Note) 223 150 -55~+150 Unit V V V A mW mW °C/W °C/W °C °C Note : Free air condition BTB1198N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. -80 -80 -5 120 - Typ. -0.16 180 11 Max. -0.5 -0.5 -0.5 390 - Unit V V V µA µA V MHz pF Test Conditions IC=-50µA IC=-2mA IE=-50µA VCB=-50V VEB=-4V IC=-500mA, IB=-50mA VCE=-3V, IC=-0.1A VCE=-10V, IC=-50mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE Rank Q R Range 120~270 180~390 Ordering Information Device BTB1198N3 BTB1198N3 Package SOT-23 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel AK CYStek Product Specification CYStech Electronics Corp. Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 3/6 Characteristic Curves Output Characteristics Output Characteristics 0.1 0.45 IB=2.5mA 0.4 Collector Current---IC(A) Collector Current---IC(A) IB=500uA IB=400uA IB=300uA 0.05 IB=200uA IB=100uA 0.35 IB=2mA 0.3 IB=1.5mA 0.25 IB=1mA 0.2 0.15 IB=500uA 0.1 0.05 IB=0 IB=0 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 0 6 Output Characteristics 1.2 IB=10mA 0.8 IB=8mA 0.7 Collector Current---IC(A) Collector Current---IC(A) 6 Output Characteristics 0.9 IB=6mA 0.6 IB=4mA 0.5 0.4 IB=2mA 0.3 0.2 0.1 IB=25mA IB=20mA 1 IB=15mA 0.8 IB=10mA 0.6 IB=5mA 0.4 0.2 IB=0 IB=0 0 0 0 1 2 3 4 5 6 0 Collector-to-Emitter Voltage---VCE(V) 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 Saturation Voltage vs Collector Current Current Gain vs Collector Current 10000 Saturation Voltage---(mV) 1000 VCE=3V Current Gain---HFE 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 100 VCE=2V 10 VCE=1V VCE(SAT) 1000 IC=25IB 100 IC=20IB IC=10IB 10 1 1 BTB1198N3 10 100 1000 Collector Current---IC(mA) 10000 1 10 100 1000 Collector Current---IC(mA) 10000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 4/6 Characteristic Curves(Cont.) Saturation Voltage vs Collector Current Power Derating Curve 250 Power Dissipation---PD(mW) Saturation Voltage---(mV) 10000 VBE(SAT)@IC=10IB 1000 150 100 50 0 100 1 BTB1198N3 200 10 100 1000 Collector Current---IC(mA) 10000 0 50 100 150 200 Ambient Temperature---TA(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 5/6 Reel Dimension Carrier Tape Dimension BTB1198N3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 6/6 SOT-23 Dimension A L Marking: 3 B S AK TE 2 1 G V 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 C Style: Pin 1.Base 2.Emitter 3.Collector D K H J *: Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTB1198N3 CYStek Product Specification