Spec. No. : C329SE Issued Date : 2005.04.18 Revised Date : Page No. : 1/3 CYStech Electronics Corp. SURFACE MOUNT SWITCHING DIODE CDSN4148SE Description The CDSN4148SE is designed for high-speed switching application in hybrid thick-and thin-film circuits. Features •High speed switching •High mounting capability, strong surge withstand, high reliability Mechanical data •Case:1206(3216) standard package, molded plastic •Terminals: Solder plated, solderable per MIL-STD-750 method 2026 •Polarity: Indicated by cathode band •Mounting position: Any •Weight: 0.0085 gram(approximately) Absolute Maximum Ratings ( at TA=25°C unless otherwise specified ) Characteristics Reverse Voltage Repetitive Peak Reverse Voltage Average Forward Current Surge Forward Current @ tp=1 µs @ tp=1 s Power Dissipation Junction Temperature Storage Temperature Range Symbol VR VRRM IO Value 75 100 150 4 1 350 -55 to +175 -55 to +175 IFSM PD Tj Ts Unit V V mA A mW °C °C Characteristics (at TA=25°C unless otherwise specified) Characteristics Forward Voltage at IF=50mA Frverse Current VR=20V VR =75V Capacitance between terminals at f=1MHz and 0V reverse voltage Reverse Recovery Time From IF=-IR=10mA to IRR=-1mA, VR=6V, RL=50Ω CDSN4148SE Symbol VF CT Min - Typ - Max 1 25 2.5 3 Unit V nA µA pF trr - - 4 ns IR CYStek Product Specification Spec. No. : C329SE Issued Date : 2005.04.18 Revised Date : Page No. : 2/3 CYStech Electronics Corp. Characteristic Curves Forward Current vs Forward Voltage Forward Current Derating Curve 1000 M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 -25℃ 100 25℃ 75℃ 10 125℃ 20 0 1 0 25 50 75 100 125 150 0.2 0.6 0.8 1 1.2 Forward Voltage---VF(V) Ambient Temperature---TA(℃) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 100 5 f=1MHz Ta=25℃ 4 Reverse Leakage Current---IR(μA) Capacitance between terminals---C T(pF) 0.4 3 2 1 150℃ 10 1 12 5℃ 0.1 7 5℃ 0.01 25℃ 0.001 0 0 2 4 6 8 10 Reverse Voltage---VR (V) CDSN4148SE 12 14 0 10 20 30 Reverse Voltage---VR(V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C329SE Issued Date : 2005.04.18 Revised Date : Page No. : 3/3 1206 Dimension 1206 Plastic Surface Mounted Package CYStek Package Code: SE *:Typical Inches Min. Max. 0.118 0.126 0.020(typ) 0.063(typ) 0.055(typ) DIM A B C D Millimeters Min. Max. 3.00 3.20 0.50(typ) 1.6(typ) 1.4(typ) DIM E F R - Inches Min. Max. 0.043(typ) 0.035(typ) 0.010(typ) - Millimeters Min. Max. 1.1(typ) 0.9(typ) 0.25(typ) - Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CDSN4148SE CYStek Product Specification