CYStech Electronics Corp. Spec. No. : C302C2-A Issued Date : 2004.02.11 Revised Date : Page No. : 1/3 Small Signal Schottky diode RB520S-30C2 Description These devices are designed for high speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand held and portable applications where space is limited. Features •Extremely small surface mounting type.(SC-79/SOD523) •Extremely fast switching speed •Low reverse current •Extremely low forward voltage.(VF=0.6V max. at 200mA) Symbol Outline Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg .................................................................................................... -55~+150°C Junction Temperature Tj .............................................................................................................. +150°C • Maximum Voltages and Currents (Ta=25°C) DC Reverse Voltage VR ...................................................................................................................... 30 V Mean Rectifying Current IF ......................................................................................................... 200 mA • Thermal Characteristics Total Device Dissipation @ TA=25°C (Note) Thermal Resistance, Junction to Ambient PD……………………………………………….200mW RθJA……………………………………………625°C/W Note: FR-5 board minimum pad. RB520S-30C2 CYStek Product Specification Spec. No. : C302C2-A Issued Date : 2004.02.11 Revised Date : Page No. : 2/3 CYStech Electronics Corp. Characteristics (Ta=25°C) Characteristic Symbol Condition Min. Max. Unit Forward Voltage VF IF=200mA - 600 mV Reverse Leakage Current IR VR=10V - 1 µA Characteristic Curves Forward Current vs Forward Voltage Forward Current Derating Curve 1000 125℃ M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 100 8 5℃ 10 25℃ 1 20 - 55℃ 0 0.1 0 25 50 75 100 125 150 175 200 0 0.1 Ambient Temperature---TA(℃) Reverse Leakage Current vs Reverse Voltage 0.3 0.4 0.5 0.6 Capacitance vs Reverse Voltage 20 Capacitance between terminals---C T(pF) 1000 Reverse Leakage Current---I R(μA) 0.2 Forward Voltage---VF(V) T a= 125℃ 100 10 T a= 8 5℃ 1 0.1 T a= 25℃ 0.01 18 f=1MHz Ta=25℃ 16 14 12 10 8 6 4 2 0 0.001 0 10 20 Reverse Voltage---VR(V) RB520S-30C2 30 0 5 10 15 20 25 30 Reverse Voltage---VR(V) CYStek Product Specification Spec. No. : C302C2-A Issued Date : 2004.02.11 Revised Date : Page No. : 3/3 CYStech Electronics Corp. SOD-523 Dimension Marking Code : 1 1 2 5J Style : Pin 1. Cathode 2. Anode 2 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical Millimeters DIM Min 0.5 0.25 0.1 1.1 A bp c D .Max. 0.7 0.35 0.2 1.3 DIM E HE V Millimeters Min. 0.7 1.5 Max. 0.9 1.7 0.15(typ) Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB520S-30C2 CYStek Product Specification