Crystal unit THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT MC-146 • • • • High-density mounting-type SMD of 1.4mm thickness. Small packaging area and light weight. Excellent shock resistance and environmental capability. Most suitable for small communications devices. Actual size Specifications (characteristics) Item Symbol Nominal frequency Remarks Specifications f 32.768kHz Storage temperature TSTG -55˚C to +125˚C Operating temperature TOPR -40˚C to +85˚C Maximum drive level GL 1.0µW max. Soldering condition TSOL Twice at under 260˚C within 10 sec. Temperature range please contact us for inquiries 75.000kHz about usable frequencies Operating drive level 0.5µW max. or under 230˚C within 3 min. Frequency tolerance(standard) ∆f/f Peak temperature(frequency) θT 25˚C ±5˚C Temperature coefficient(frequency) a -0.04ppm/ ˚C2 max. Load capacitance CL Series resistance R1 Motional capacitance C1 1.9fF typ. Shunt capacitance C0 0.8pF typ. Insulation resistance IR 500 MΩ min. Aging fa ±3ppm/year max. Ta=25˚C ±3˚C, first year S.R. ±5ppm max. Three drops on a hard board from 75 cm or excitation Shock resistance ±20ppm, ±50ppm Ta=25˚C, DL=0.1µW 6pF to ∞ Please specify 65 kΩ max. 30kΩ max. test with 3000G x 0.3ms x 1/2 sine wave x 3 directions Metal may be exposed on the top of this product. This won't affect any quality, reliability or electrical spec. (Unit: mm) #1 #2 0.15 0.3 0.1 ±0.05 1.2 0.4 0.2 5.1 1.2 0.2 #2 0.25 #1 #4 #3 0.6 #2 6.9 ±0.1 0.4 #4 0.6 6.7 0.1 (Unit: mm) 1.4 ±0.1 EA99 #1 Recommended soldering pattern Internal connection #3 #4 1.3 ±0.1 0.3 0.55 0.3 External dimensions #3 0.2 Do not connect #2 and #3 to external device. 16 THE CRYSTALMASTER ENERGY SAVING EPSON EPSON offers effective savings to its customers through a wide range of electronic devices, such as semiconductors, liquid crystal display (LCD) modules, and crystal devices. These savings are achieved through a sophisticated melding of three different efficiency technologies. Power saving technology provides low power consumption at low voltages. Energy Saving Space saving technology provides further reductions in product size and weight Power Saving through super-precise processing and high-density assembly technology. Space Saving Time saving technology shortens the time required for design and development Time Saving on the customer side and shortens delivery times. Our concept of Energy Saving technology conserves resources by blending the essence of these three efficiency technologies. The essence of these technologies is represented in each of the products that we provide to our customers. In the industrial sector, leading priorities include measures to counter the greenhouse effect by reducing CO2, measures to preserve the global environment, and the development of energyefficient products. Environmental problems are of global concern, and although the contribution of energyResource saving technology developed by Saving EPSON may appear insignificant, we seek to contribute to the development of energy-saving products by our customers through the utilization of our electronic devices. EPSON is committed to the conservation of energy, both for the sake of people and of the planet on which we live. SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification by B.V.Q. I. (Bureau Veritas Quality International) . ISO9001 in October, 1992. ISO14001 in November,1997. NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material of portions there may contain technology or the subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade Control Law of Japan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency.