EUDYNA FMM5007VF

FMM5007VF
Ku Band Power Amplifier MMIC
FEATURES
・High Output Power: 31.0dBm(typ.)
・High Linear Gain: 20.0dB(typ.)
・Low Input VSWR
・Impedance Matched Zin/Zout = 50Ω
・Small Hermetic Metal-Ceramic SMT Package(VF-pkg)
DESCRIPTION
The FMM5007VF is a MMIC amplifier that contains a three-stage amplifier,
internally matched, for standard communications in the 14.0 to 14.5GHz
frequency range. This product is well suited for VSAT applications as a driver
or output stage.
Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance.
ABSOLUTE MAXIMUM RATING
Item
Symbol
Rating
Unit
12
-7
20
-55 to +125
V
V
dBm
o
C
RECOMMENDED OPERATING CONDITION
Item
Symbol
Condition
Unit
DC Input Voltage
DC Input Voltage
Operating Case Temperature
10
-5
-40 to +85
V
V
o
C
DC Input Voltage
DC Input Voltage
Input Power
Storage Temperature
VDD
VGG
Pin
Tstg
VDD
VGG
Tc
o
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C)
Item
Symbol
Frequency
Output Power at 1dB G.C.P.
Linear Gain
Gain Flatness
Input VSWR
Output VSWR
Power Monitor ( Rmon=10Kohm )
DC Input Current
DC Input Current
f
P1dB
G
∆G
VSWRi
VSWRo
Vmon
IDD
IGG
Condition
VDD=10V
VGG=-5V
f =14.0-14.5GHz
Pout=30dBm
VDD=10V
VGG=-5V
Limit
Min. Typ. Max.
Unit
14.0
30.0
18.0
-
GHz
dBm
dB
dB
V
mA
mA
31.0
20.0
1.0
2:1
2.3:1
3.5
1000
15
G.C.P.:Gain Compresstion Point
ESD
Class 0
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5k Ω)
CASE STYLE
Edition 2.0
September 2004
VF
1
~ 199V
15
1.5
2.3:1
3:1
1200
20
FMM5007VF
Ku band Power Amplifier MMIC
2
FMM5007VF
Ku Band Power Amplifier MMIC
■ S-PARAMETER
INPUT/OUTPUT RETURN LOSS vs. FREQUENCY
Vdd=10V, Vgg=-5V
SMALL SIGNAL GAIN vs. FREQUENCY
Vdd=10V, Vgg=-5V
30
-
-5
Input Return Loss
25
Output Return Loss
Small Signal Gain [dB]
Input/Output Return Loss [dB]
0
-10
-15
-20
-25
-30
13.6
20
15
10
5
13.8
14.0
14.2
14.4
14.6
0
13.6
14.8
13.8
Frequency [GHz]
14.0
14.2
14.4
14.6
14.8
Frequency [GHz]
VDD=10V, VGG=-5V
Frequency
[ MHz ]
13800
13900
14000
14100
14200
14300
14400
14500
14600
14700
S11
S21
S12
S22
MAG
ANG
MAG
ANG
MAG
ANG
MAG
ANG
0.081
0.066
0.053
0.052
0.052
0.069
0.090
0.119
0.161
0.201
150.5
144.4
141.5
152.1
163.7
177.3
178.7
-178.1
178.0
173.7
10.412
10.869
10.443
10.511
10.387
10.078
9.953
9.496
9.486
8.887
78.2
55.9
46.5
26.7
14.9
-2.6
-15.6
-30.3
-45.6
-59.6
0.004
0.004
0.009
0.008
0.005
0.005
0.004
0.006
0.001
0.001
-109.4
-165.3
-163.0
-128.8
171.8
-123.7
-90.4
-160.1
-164.1
-104.3
0.400
0.377
0.359
0.328
0.316
0.299
0.281
0.259
0.232
0.213
-45.0
-44.4
-44.8
-43.6
-45.2
-43.5
-43.6
-42.8
-42.5
-37.6
3
FMM5007VF
Ku band Power Amplifier MMIC
■ Package Outline
PIN ASSIGMENT
1 : VDD
2 : RF in
3 : VGG
4 : Pmon
5 : RF out
6 : VDD
4
FMM5007VF
Ku Band Power Amplifier MMIC
■ Mounting Instructions for VF Package
1. Screw Mounting
(1) The flange of package may be attached using screws. Torque conditions are
shown in table 1.
Table 1. Recommended and Maximum Torque for Screw Mounting
Package
Recommended
Recommended
screw
Torque
M2.0
10 N-cm (0.9 lb-in)
VF
Maximum Torque
15 N-cm (1.3 lb-in)
(2) First, tighten the screws with a torque driver set to 5 N-cm.
(3) The surface finish of the heat sink should be better than 0.8 µm, and the surface
flatness must be better than 10 µm.
(4) Silicon based heat sink compounds should not be used for the thermal
conductive grease. They cause poor grounding of the source flange,
contamination and long term degradation of thermal resistance between the FET
package and heat sink.
2. Solder Mounting
(1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder (Sn3.0Ag-0.5Cu)*1 or equivalent.
(2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder (Sn-3.0Ag0.5Cu)*1 shall be used. (*1: The figure displays with weight %. A predominantly
tin-rich alloy with 3.0% silver and 0.5% copper.)
(3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low
halogen content. After soldering, the flux residue should be removed by
appropriate cleaning methods.
(4) The recommended soldering conditions are as follows:
Partial heating method (soldering iron, spot laser/air)
Product terminal temperature: 260 deg-C, max. 10 s./terminal or
400 deg-C, max. 3 s./terminal
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FMM5007VF
Ku band Power Amplifier MMIC
■ Recommended Bias Circuit and Internal Block Diagram
PIN ASSIGMENT
1 : VDD
2 : RF in
3 : VGG
4 : Pmon
5 : RF out
6 : VDD
Note 1: The capacitors are recommended on the bias supply line, close to the package,
in order to prevent video oscillations which could damage the module.
Note 2: Two pins of VDD are internally connected respectively.
Note 3: The external resistor ( 10Kohm ) on the board is necessary to monitor the output
power.
6
FMM5007VF
Ku Band Power Amplifier MMIC
For further information please contact :
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
Eudyna Devices Inc. products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
・Do not put these products into the mouth.
・Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or
swallowed.
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
・Observe government laws and company regulations when
discarding this product. This product must be discarded in
accordance with methods specified by applicable hazardous waste
procedures.
Eudyna Devices Asia Pte. Ltd.
Hong Kong Branch
Rm.1101,Ocean Centre, 5 Canton Road
Tsim Sha Tsui, Kowloon, Hong kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc.
JAPANESE SALES OFFICE(Head Office)
1, Kanai-cho, Sakae-ku, Yokohama,
244-0845, Japan
Tel: +81-45-853-8150
Fax: +81-45-853-8170
www.eudyna.com
Eudyna Devices Incorporated reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Eudyna Devices Incorporated or others.
© 2004 Eudyna Devices USA Inc.
Printed in U.S.A.
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