FMM5709X K / Ka Band Low Noise Amplifier MMIC FEATURES ・Low Noise Figure : NF = 2.5dB ( Typ.) @ f=30GHz ・High Associated Gain : Gas = 23dB ( Typ.) @f=30GHz ・Broad Band : 17.5 ~ 32GHz ・High Output Power : P1dB = 12.5dBm ( Typ. ) @f=30GHz ・Impedance Matched Zin/Zout = 50Ω DESCRIPTION The FMM5709X is a LNA MMIC designed for applications in the 17.5 - 32 GHz frequency range. This product is well suited for satellite communications, radio link, and applications where low noise and high dynamic range are required. Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance. ABSOLUTE MAXIMUM RATING Item Drain Voltage Input Power Storage Temperature Symbol VDD Pin Tstg RECOMMENDED OPERATING CONDITIONS Item Symbol Drain Voltage VDD Operating Backside Temperature Top Rating 4 -3 -65 to +175 Unit V dBm o C Recommend <=3 -45 to +85 Unit V o C ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25o C) Item Noise Figure Associated Gain Output Power at 1dB G.C.P. Output 3rd order intercept point Drain Current at 1dB G.C.P. Input Return Loss Output Return Loss Symbol NF Gas P1dB OIP3 Iddrf RLin RLout Test Conditions VDD=3V f=30GHz ZL=ZS=50ohm Class 0 ESD Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kW) Edition 1.1 July 2004 1 Limits Min. 20 - Typ. 2.5 23 12.5 22.5 60 -10 -10 ~ 199V Unit Max. 3.0 26 75 - dB dB dBm dBm mA dB dB FMM5709X K / Ka Band Low Noise Amplifier MMIC NOISE FIGURE, ASSOCIATED GAIN vs. FREQUENCY P1dB, G1dB vs. FREQUENCY 26 30 12 11 10 9 8 7 24 25 Gas 20 15 10 5 NF P1dB [dBm], G1dB [dB] 6 5 4 3 2 1 0 VDD=3V Associated Gain [dB] Noise Figure [dB] VDD=3V 22 20 18 16 14 12 10 P1dB 8 0 6 16 18 20 22 24 26 28 30 32 34 36 38 40 16 18 20 22 24 26 28 30 32 34 36 Frequency [GHz] Frequency [GHz] GAIN vs. INPUT POWER OUTPUT POWER vs. INPUT POWER VDD=3V VDD=3V 16 26 14 24 12 Gain [dBm] Output Power [dBm] G1dB 10 8 18GHz 22GHz 6 22 20 18GHz 18 26GHz 26GHz 16 30GHz 4 22GHz 30GHz 32GHz 32GHz 2 14 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 -22 -20 -18 -16 -14 -12 -10 -8 Input Power [dBm] Input Power [dBm] 2 -6 -4 -2 FMM5709X K / Ka Band Low Noise Amplifier MMIC IMD PERFORMANCE vs. TOTAL OUTPUT POWER VDD=3V, ∆f=+10MHz Intermodulation Distortion [dBc] 0 18GHz 22GHz -10 IM3 26GHz -20 30GHz 32GHz -30 -40 -50 IM5 -60 -70 -2 0 2 4 6 8 10 12 14 16 2-Tone Total Output Power [dBm] INPUT/OUTPUT RETURN LOSS vs. FREQUENCY SMALL SIGNAL GAIN vs. FREQUENCY VDD=3V 10 5 Return Loss [dB] Small Signal Gain [dB] VDD=3V 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 0 -5 -10 -15 -20 Input -25 0 5 10 15 20 25 30 35 Output -30 40 0 Frequency [GHz] 5 10 15 20 25 30 Frequency [GHz] 3 35 40 FMM5709X K / Ka Band Low Noise Amplifier MMIC ■ S-Parameter VDD=3V FREQ. [MHz] mag. ang. mag. ang. mag. ang. mag. ang. 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 11000 12000 13000 14000 15000 16000 17000 18000 19000 20000 21000 22000 23000 24000 25000 26000 27000 28000 29000 30000 31000 32000 33000 34000 35000 36000 37000 38000 39000 40000 0.959 0.955 0.952 0.946 0.938 0.930 0.919 0.906 0.890 0.878 0.860 0.828 0.769 0.657 0.488 0.319 0.222 0.210 0.233 0.266 0.304 0.342 0.376 0.402 0.424 0.441 0.444 0.437 0.439 0.447 0.441 0.457 0.453 0.414 0.365 0.276 0.188 0.112 0.053 0.005 -25.9 -51.0 -75.9 -99.9 -123.2 -146.1 -168.5 169.2 146.8 123.8 98.9 71.7 40.9 6.8 -27.9 -54.0 -66.7 -73.7 -91.4 -112.2 -134.9 -155.9 -177.1 162.2 141.7 123.4 105.3 88.5 72.7 57.9 42.1 25.4 5.3 -17.9 -43.2 -67.3 -89.6 -107.1 -116.3 56.6 0.008 0.019 0.035 0.031 0.018 0.012 0.009 0.086 0.233 0.161 0.138 0.655 1.666 3.671 7.153 11.694 15.274 16.572 16.251 15.490 15.034 14.888 14.901 15.063 15.153 15.263 15.068 14.910 14.657 14.717 14.839 14.982 15.122 14.577 12.651 10.093 7.902 6.067 4.710 3.687 -156.9 154.9 65.7 -22.8 -92.8 -102.3 -106.0 -80.9 175.3 97.4 156.8 122.9 71.2 17.1 -44.3 -111.8 -179.8 117.2 61.8 13.4 -30.5 -71.8 -111.9 -151.4 169.5 130.8 92.7 55.4 18.6 -18.1 -54.9 -93.4 -133.5 -176.8 139.2 97.6 59.6 26.8 -3.9 -31.8 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.000 0.001 0.001 0.001 0.001 0.002 0.001 0.001 0.002 0.001 0.002 0.002 0.003 0.002 0.002 0.004 0.001 0.002 0.005 0.003 0.004 0.003 0.003 0.002 0.005 0.006 0.008 0.004 0.005 0.007 0.006 0.010 0.010 -10.3 -25.6 -171.1 173.6 -1.3 -133.3 147.2 131.7 161.3 136.4 89.5 149.3 13.5 -15.4 110.3 -133.8 -93.7 -103.6 83.2 159.7 101.3 122.4 118.6 -5.9 64.4 43.5 1.9 24.1 -31.2 -48.2 6.4 -11.1 -132.4 103.9 109.2 161.1 42.3 63.4 23.4 16.7 0.997 0.983 0.908 0.858 0.816 0.771 0.770 0.586 0.415 0.303 0.217 0.179 0.165 0.162 0.155 0.159 0.170 0.158 0.146 0.115 0.090 0.079 0.099 0.130 0.165 0.196 0.209 0.222 0.221 0.213 0.202 0.179 0.196 0.238 0.327 0.355 0.401 0.416 0.446 0.459 -19.1 -39.1 -59.1 -75.7 -94.7 -112.0 -137.7 -168.1 176.9 162.8 156.2 156.1 154.9 149.5 141.8 136.8 122.7 109.1 91.6 80.0 81.2 90.9 98.6 94.2 86.2 69.3 52.1 33.2 14.3 -1.9 -16.6 -22.8 -29.9 -43.6 -69.5 -98.2 -127.4 -152.8 179.1 160.2 S11 S21 4 S12 S22 FMM5709X K / Ka Band Low Noise Amplifier MMIC THERMAL INFORMATION (REFERENCE DATA) VDD=3V, IDD=60mA ∆ Tch 18 Unit o C MTTF vs Tch 1.E+09 Ea=1.02eV 1.E+08 MTTF (hrs) 1.E+07 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 60 80 100 120 140 160 180 200 220 Channel (deg-C) ChannelTemperature Temperature (OC) 5 240 260 280 FMM5709X K / Ka Band Low Noise Amplifier MMIC ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) 1440 RF-out 870 RF-in 680 140 0 0 140 670 1130 1470 1650 VDD Chip Size : 1650±30μm x 1440±30μm Chip Thickness : 85μm±20μm Bonding Pad Size : RF-Pad : 80μm x 160μm VDD-Pad : 80μm x 80μm 6 FMM5709X K / Ka Band Low Noise Amplifier MMIC ■ BONDING LAYOUT / EXTERNAL CIRCUIT 50Ω Line RF Input 50Ω Line 100pF 1μF VDD “Copper” is recommended material of the package or carrier. 7 RF Output FMM5709X K / Ka Band Low Noise Amplifier MMIC ■DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2)Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Perform Volume : per next Figure Volume of Au-Sn Perform (10 -3/mm 3) 500 400 300 FMM5709X 200 100 0 0 1 2 3 4 5 Area of Chip Back Surface (mm^2) ■ WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N +/- 0.0196 N Stage Temperature : 215 deg.C +/- 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond 8 FMM5709X K / Ka Band Low Noise Amplifier MMIC Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com CAUTION Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: ・Do not put these products into the mouth. ・Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 ・Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Rm.1101,Ocean Centre, 5 Canton Road Tsim Sha Tsui, Kowloon, Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others. © 2004 Eudyna Devices USA Inc. Printed in U.S.A. Eudyna Devices Inc. Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170 9