EVERLIGHT 61-136-REGHB7C-B01-ET

EVERLIGHT ELECTRONICS CO.,LTD.
Technical Data Sheet (Preliminary)
Luminosity Full Color LED
61-136/REGHB7C-B01/ET
Features
․Super-luminosity chip LED.
․White SMT package.
․Built in Red, Green, and Blue chips.
․Lead frame package with individual 6 pins.
․Wide viewing angle.
․Soldering methods: IR reflow soldering.
․Pb-free.
․The product itself will remain within RoHS
compliant version.
Descriptions
․ Due to the package design, 61-136 has wide
viewing angle , low power consumption and
adjusting each color is possible thanks to serial
connection by 6 terminal connection (Individual
driving by each terminal) in case of using several
number of LED. And makes it ideal for light pipe
application.
Applications
․Amusement equipment.
․Information boards.
․Flashlight for digital camera of cellular phone.
Device Selection Guide
Chip
Type
Material
Emitted Color
RE
AlGaInP
Brilliant Red
GH
InGaN
Brilliant Green
B7
InGaN
Blue
Lens Color
Water Clear
Everlight Electronics Co., Ltd.
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Device No.:
Prepared date: 18-Sep-2006
Prepared by: Forrest
EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Package Outline Dimensions
R+
-R
G-
+G
B +
-B
Polarity
Recommend solding pad design
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
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Device No.:
Prepared date: 18-Sep-2006
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EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
Peak Forward Current
(Duty 1/10 @ 1KHZ)
Power Dissipation
IF
IFP
Pd
Thermal resistance
(Junction-Air)
RthJ-A
Thermal resistance
(Junction-Lead)
RthJ-L
RE
30
GH
30
B7
30
RE
120
GH
110
B7
110
RE
80
GH
110
B7
110
RE
230
GH
240
B7
240
RE
150
GH
160
B7
160
mA
mA
mW
℃/W
℃/W
Electrostatic Discharge(HBM)
ESD
150
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40~ +90
℃
Soldering Temperature
Tsol
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
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Device No.:
Prepared date: 18-Sep-2006
Prepared by: Forrest
EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Electro-Optical Characteristics (Ta=25℃)
Parameter
Luminous Intensity
Luminous Flux
Symbol
Iv
ΦV
Dominant
Wavelength
Spectrum Radiation
Bandwidth
Forward Voltage
Reverse Current
Typ.
Max.
RE
500
-----
700
GH
700
-----
1300
B7
110
-----
210
RE
-----
1.75
-----
GH
-----
2.87
-----
B7
-----
0.58
-----
-----
120
-----
RE
-----
632
-----
GH
-----
518
-----
B7
-----
468
-----
RE
619.5
-----
631.5
GH
519.5
-----
530.5
B7
450.0
-----
460.5
RE
-----
20
-----
GH
-----
35
-----
B7
-----
35
-----
RE
1.8
-----
2.2
GH
3.0
-----
3.4
B7
3.0
-----
3.4
RE
-----
-----
10
GH
-----
-----
50
B7
-----
-----
50
2θ1/2
Viewing Angle
Peak Wavelength
Min.
λp
λd
△λ
VF
IR
Unit
Condition
IF=20mA
mcd
IF=20mA
IF=20mA
lm
IF=20mA
deg
IF=20mA
nm
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
μA
VR=5V
Notes:
1. Tolerance of Luminous Intensity ±10%
2.
Tolerance of Dominant Wavelength ±1 nm
3. Tolerance of Forward Voltage ±0.1V
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Device No.:
Prepared date: 18-Sep-2006
Prepared by: Forrest
EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Bin Range Of Luminous Intensity
Symbol
Bin Code
Min.
Max.
R1
500
600
R2
600
700
G0
700
1000
G1
1000
1300
B1
110
160
B2
160
210
Min.
Max.
619.5
625.5
519.5
525.5
450.0
455.0
625.5
RE
Iv
GH
B7
Bin Range Of Dominant Wavelength
Symbol
Bin Code
RE
R1
R2
λd
GH
G0
G1
B7
B0
B1
631.5
525.5
530.5
455.0
460.5
Unit
Condition
mcd
IF =20mA
Unit
Condition
nm
IF =20mA
Notes:
1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±1 nm
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Device No.:
Prepared date: 18-Sep-2006
Prepared by: Forrest
EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Bin Range of Forward Voltage
Symbol
RE
VF
GH
B7
Bin Code
Min.
Max.
VR0
1.80
2.00
VR1
2.00
2.20
VG0
3.00
3.20
VG1
3.20
3.40
VG2
3.40
3.60
VB1
3.00
3.20
VB2
3.20
3.40
Unit
Condition
V
IF =20mA
Notes:
1. Tolerance of Forward Voltage ±0.1V
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Device No.:
Prepared date: 18-Sep-2006
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EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Typical Electro-Optical Characteristics Curves
Typical curve of spectral distribution:
V(λ)=Standard eye response curve
100%
B7
Relative Intensity (%)
V(λ)
GH
RE
50%
0%
400
450
500
550
600
650
700
Peak Wavelength (nm)
Diagram characteristics of radiation:
20
30
View Angle
50
60
70
80
90
o
0
o
1.0
o
o
0.8
o
0.6
o
0.4
o
0.2
o
o
0
1.0
0.8
0.6
0.2
0.4
0
20
o
Relative Intensity
o
60
40
View Angle
o
80
o
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Device No.:
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Relative Intensity
40
10
o
EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Forward Current vs. Forward Voltage
Ta=25℃
Forward Current I F (mA)
100
RE
GH
B7
10
1
1.7
2
2.3
2.6
2.9
3.2
3.5
3.8
Forward Voltage V F (V)
Forward Current v.s. Ambient Temp.
50
IF (mA)
40
30
20
10
0
0
20
40
60
80
100
T (degree C)
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Device No.:
Prepared date: 18-Sep-2006
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EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Label explanation
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
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Device No.:
Prepared date: 18-Sep-2006
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EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Carrier Tape Dimensions;Loaded quantity per reel 800 PCS/reel
B
B
G
-
G
R
R
Polarity
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant
Label
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Device No.:
Prepared date: 18-Sep-2006
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EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
Test
Sample
Hours/Cycles
Size
No.
Items
Test Condition
1
Reflow Soldering
Temp. : 260℃±5℃
Min. 5sec.
6 Min.
22 PCS.
0/1
Temperature Cycle
H : +100℃ 15min
∫ 5 min
L : -40℃ 15min
300 Cycles
22 PCS.
0/1
Thermal Shock
H : +100℃ 5min
∫ 10 sec
L : -10℃ 5min
300 Cycles
22 PCS.
0/1
Temp. : 100℃
1000 Hrs.
22 PCS.
0/1
Temp. : -40℃
1000 Hrs.
22 PCS.
0/1
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
85℃/ 85%RH
1000 Hrs.
22 PCS.
0/1
2
3
4
5
6
High Temperature
Storage
Low Temperature
Storage
DC Operating Life
High Temperature /
High Humidity
* For each die
7
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Device No.:
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Ac/Re
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EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1
Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
1~5 °C / Sec.
260°C. Max.
10 Sec. Max.
1~5 °C / Sec.
Pre-heating
180~200°C
60 Sec. Max.
Above 220°C
120 Sec. Max.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and
do soldering of each terminal. Be careful because the damage of the product is often started at the
time of the hand solder.
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Device No.:
Prepared date: 18-Sep-2006
Prepared by: Forrest
EVERLIGHT ELECTRONICS CO.,LTD.
61-136/REGHB7C-B01/ET
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used (as below figure). It should be confirmed beforehand
whether the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936
Fax: 886-2267-6244, 2267-6189, 2267-6306
http://www.everlight.com
Everlight Electronics Co., Ltd.
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Rev. 1
Page: 13 of 13
Device No.:
Prepared date: 18-Sep-2006
Prepared by: Forrest