Technical Data Sheet High Power Infrared LED HIR-A07/L183-P01 Features ․Small package with high efficiency ․Peak wavelength λp=850nm ․Soldering methods: SMT ․Thermal resistance (junction to lead): 35℃/W. ․Pb free ․The product itself will remain within RoHS compliant version. Descriptions ․HIR-A07/L183-P01 series is an infrared emitting diode in miniature SMD package which is molded in a water clear plastic with flat top view lens. ․The device is spectrally matched with silicon photodiode, Phototransistor. Applications ․CCD Camera ․Night Vision ․Infrared applied system Materials Items Description Housing Heat resistant polymer Encapsulating Resin Clear silicone resin Electrodes Ag plating copper alloy Die attach Silver paste Chip AlGaAs Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 1 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.25mm Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 2 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Forward Current IF 700 Units mA Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +85 ℃ Junction temperature Tj 125 ºC Power Dissipation @IF=700mA Pd 1 W Note: We suggest that customer should add the heat sink with HIR-A07/L183-P01 to exclude the heat. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition IF=350mA Min. Typ. 60 110 Max. -- Total Radiated Power Po IF=700mA 120 220 -- Radiant Intensity IE IF=350mA 10 35 -- IF=700mA 30 70 λp IF=20mA -- Δλ IF=20mA -- 850 50 --- Peak Wavelength Spectral Bandwidth IF=350mA 1.0 1.6 -2.5 IF=700mA 1.2 1.9 3.0 Units mW mW/sr nm nm Forward Voltage VF Reverse Current VR=5V -- -- 10 μA Optical Rise Time IR Tr IF=20mA -- 11 -- ns Optical Fall Time Tf IF=20mA -- 7 -- ns View Angle 2θ1/2 IF=20mA -- 125 -- deg Thermal resistance, junction to heat-sink Rth j-L IF=700mA -- 35 -- ℃/W Note. 1. Radiometric measurement tolerance : ±10% 2 .2θ1/2 is the off axis angle from lamp centerline where the radiant intensity peak value. 3. Forward Voltage measurement tolerance : ±0.1V Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 V is 1/2 of the Page: 3 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. Ambient Temperature Fig.2 Spectral Distribution 100 900 800 80 Rthj-L=35°/W 700 IF=20mA Ta=25° C 600 60 500 40 400 300 20 200 100 0 20 60 40 80 100 120 Fig.3 Peak Emission Wavelength Ambient Temperature 0 790 810 830 850 870 890 910 930 950 Fig.4 Forward Current vs. Forward Voltage 3.0 900 2.8 2.6 875 2.4 2.2 2.0 850 1.8 1.6 825 1.4 1.2 800 -25 1.0 0 25 Everlight Electronics Co., Ltd. Device No：DTH-A07-278 50 75 100 0 http:\\www.everlight.com Prepared date：03-29-2007 100 300 Rev 1 500 700 900 Page: 4 of 10 Prepared by：JAINE TSAI 1000 HIR-A07/L183-P01 Typical Electro-Optical Characteristics Curves Fig.5 Relative Radiant Intensity vs. Angular Displacement 0 1.0 10 20 30 0.9 40 R e la tiv e I n t e n s it y ( % ) 0.8 50 0.7 0.6 60 0.5 0.4 70 0.3 80 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 90 0 Angle (degree) Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 5 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Precautions For Use 1.Over-current-proof Though HIR-A07/L183-P01 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2.Thermal Management i. Because HIR-A07/L183-P01 is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance. ii. Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat. iii. A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum. iv. Sspecial thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. v. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 3.Soldering Condition 1.Lead reflow soldering temperature profile 2.Reflow soldering should not be done more than two times. 3.While soldering, do not put stress on the LEDs during heating. 4.After soldering, do not warp the circuit boa Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 6 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 4.Soldering Iron 1.For prototype builds or small series production runs it is possible to place and solder the LED by hand. 2.Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. 3.It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. 4.Be careful because the damage of the product is often started at the time of the hand solder. 5.Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 6.Repairing Repair should not be done after the LEDs have been soldered. If unfortunately, repair is unavoidable. In addition to double-head soldering iron, hot plane must be used under external heat sink plate to liquefy tin between device heat sink and outer heat sink, shown as figure below. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Hot plane with temperature controller Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 7 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Tube Packing Specifications 1.Reel Dimensions Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is ±0.1mm 2.Carrier Tape Dimensions: Loaded quantity 800 PCS per reel. Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is ±0.1mm Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 8 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Reliability Test Item And Condition The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% NO. Item Test Conditions Test Hours/ Sample Cycles Sizes 1 REFLOW Soldering TEMP.：260℃±5℃ 6Mins 10secs 15mins 300Cycles 2 Temperature Cycle H : +100℃ 5mins L : -40℃ 15mins 22pcs H :+100℃ 3 Thermal Shock 4 High Temperature Storage TEMP.：+100℃ 5 Low Temperature Storage TEMP.：-40℃ 6 DC Operating Life IF=700mA 7 High Temperature/ 85℃ / 85% R.H Ac/Re 0/1 22pcs IR≧U×2 Ie≦L×0.8 VF≧U×1.2 0/1 22pcs U：Upper 0/1 22pcs Specification Limit L：Lower 0/1 1000hrs 22pcs Specification Limit 0/1 1000hrs 22pcs 0/1 1000hrs 22pcs 0/1 5mins 300Cycles 10secs 5mins L :-10℃ Failure Judgement Criteria 1000hrs High Humidity Everlight Electronics Co., Ltd. Device No：DTH-A07-278 http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 9 of 10 Prepared by：JAINE TSAI HIR-A07/L183-P01 Moisture Resistant Packaging Label Aluminum moistue-proof bag Desiccant Label Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place RoHS HIR-A07/L183-P01 Notes 1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Everlight Electronics Co., Ltd. Device No：DTH-A07-278 Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\www.everlight.com http:\\www.everlight.com Prepared date：03-29-2007 Rev 1 Page: 10 of 10 Prepared by：JAINE TSAI