8609 XXX XX XX XXX XXXXX YY XX NOTES:- LINEAR ±0.1 ANGULAR ±1° 1. THE ''LF'' PRODUCTS MEET EUROPEAN UNION DIRECTIVES AND OTHER COUNTRY REGULATIONS AS DESCRIBED IN GS-22-008 2. THE HOUSING WILL WITHSTAND EXPOSURE TO 260°C PEAK TEMPERATURE FOR 3.5 SECONDS IN A WAVE SOLDER APPLICATION WITH A 1.6 MM MINIMUM THICK CIRCUIT BOARD 3. LEAD FREE OR RoHS DIRECTIVE LABELING TO BE PROVIDED AS PER GS-14-920 FOR LEAD FREE VERSION. b 19/05/2005 TECHNICAL SPECIFICATION MODIFIED AND LEAD FREE NOTE ADDED. a 22/09/2004 DRAWING NO. WAS C-8609-0107 REV.c Mini K Vandanath 22/09/2004 Rakhee George 22/09/2004 Rakhee George 19/05/2005 K Somasundaram 19/05/2005 8609 SEE TECH. SPEC. DIN STANDARD RECEPTACLE b I05-0042 MINI 19/05/2005 a I04-0100 MINI 09/11/2004 D\ENGG\EURO\8609 A3 (STRAIGHT SPILL DIN41612 STYLE-B) C-8609-2020 b 8609---61147-5XXXXX, 8609---61247-5XXXXX PDM: Rev:B STATUS:Released Printed: Sep 09, 2005.