Formosa MS Chip Schottky Barrier Diodes FM723-NS Surface mount small signal type SOD-323S Features Extremely thin package 0.106(2.70) 0.091(2.30) 0.008(0.20)Typ. Low stored charge 0.014(0.35) 0.010(0.25) Majority carrier conduction 0.057(1.45) 0.041(1.05) 0.083(2.10) 0.067(1.70) 0.005(0.12) 0.003(0.08) Mechanical data 0.031(0.80) 0.024(0.60) Case : Molded plastic, SOD-323-S Terminals : Solder plated, solderable per MIL_STD_750, Method 2026 Dimensions in inches and (millimeters) Polarity : Indicated by cathode band Marking Code : 4 Mounting Position : Any Weight : 0.0001482 ounce, 0.0042 gram o MAXIMUM RATINGS (AT T A =25 C unless otherwise noted) PARAMETER CONDITIONS Repetitive peak reverse voltage Mean rectifying current Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Capacitance between terminals f=1MHz and applied 10VDC reverse voltage Storage temperature Operating temperature Symbol MIN. TYP. MAX. UNIT V RM 30 V IO 200 mA I FSM 1500 mA CT 20 pF TJ -40 +125 o T STG -40 +125 o C C o ELECTRICAL CHARACTERISTICS (AT T A =25 C unless otherwise noted) PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Forward voltage I F = 200 mA DC VF 0.60 V Reverse current V R = 30 V IR 15 uA RATING AND CHARACTERISTIC CURVES (FM723-NS) Fig. 1 Forward characteristics Fig. 2 Reverse characteristics 10m 1000 O REVERSE CURRENT : (A) 100 1 0 0.1 C C O 25 75 O C O 1m O 75 C 100 10 O 25 C 1 25 5C 10 O 12 FORWARD CURRENT : (mA) 125 C 0.2 0.3 0.4 0.5 0.1 0 0.6 10 20 30 40 REVERSE VOLTAGE : (V) FORWARD VOLTAGE : (V) Fig. 4 Derating curve FIG.3-TYPICAL TERMINALS CAPACITANCE 100 100 Io CURRENT (%) CAPACITANCE BETWEEN TERMINALS : (pF) (mounting on glass epoxy PCBs) 10 1 0 5 10 15 20 25 30 35 80 60 40 20 REVERSE VOLTAGE : V 0 0 25 50 75 100 125 AMBIENT TEMPERATURE : Ta 150