Agilent HFCT-5903E MT-RJ Duplex Single Mode Transceiver Data Sheet Description The HFCT-5903E transceiver is a high performance, cost effective module for serial optical data communications applications specified for a signal rate of 125 MBd. It is designed to provide an FDDI SMF-PMD1 link for FDDI or Fast Ethernet applications and is also compatible with ATM/ SONET/SDH transceivers. The HFCT-5903 does not include a nose shield and is not recommended due to the potential degradation of EMI performance in a complete system. The HFCT-5903 is available on the rare occasion that a system mechanical design may not allow for a nose shield. This module is designed for single mode fiber and operates at a nominal wavelength of 1300 nm. It incorporates Agilent’s high performance, reliable, long wavelength optical devices and proven circuit technology to give long life and consistent service. The transmitter section uses an advanced SMQW Fabry Perot laser with full IEC 825 and CDRH Class I eye safety. The receiver section uses a MOVPE grown planar PIN photodetector for low dark current and excellent responsivity. A pseudo-ECL logic interface simplifies interface to external circuitry. Features • MT-RJ duplex single mode transceiver • Power compliant to ANSI X3.184- 1993 standard for FDDI SMF-PMD category 1 optoelectronic performance • Single +3.3 V power supply • Multisourced 2 x 5 pin configuration • Interchangeable with LED multisourced 2 x 5 transceivers • Unconditionally eye safe laser IEC 825/CDRH Class 1 compliant • Temperature range: 0°C to +70°C Applications • FDDI SMF-PMD1 • Fast ethernet • ATM compatible Connection Diagram RX TX Mounting Studs/ Solder Posts Package Grounding Tabs Top View RECEIVER SIGNAL GROUND RECEIVER POWER SUPPLY SIGNAL DETECT RECEIVER DATA OUT BAR RECEIVER DATA OUT f f f f f 1 2 3 4 5 10 9 8 7 6 f f f f f TRANSMITTER DATA IN BAR TRANSMITTER DATA IN TRANSMITTER DISABLE TRANSMITTER SIGNAL GROUND TRANSMITTER POWER SUPPLY Pin Descriptions: Pin 1 Receiver Signal Ground VEE RX:1 Directly connect this pin to the receiver ground plane. Pin 4 Receiver Data Out Bar RD-: No internal terminations are provided. See recommended circuit schematic. Pin 2 Receiver Power Supply VCC RX: Provide +3.3 V dc via the recommended receiver power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC RX pin. Pin 5 Receiver Data Out RD+: No internal terminations are provided. See recommended circuit schematic. Pin 3 Signal Detect SD: Normal optical input levels to the receiver result in a logic “1” output. Low optical input levels to the receiver result in a fault condition indicated by a logic “0” output. This Signal Detect output can be used to drive a PECL input on an upstream circuit, such as Signal Detect input or Loss of Signal-bar. Pin 6 Transmitter Power Supply VCC TX: Provide +3.3 V dc via the recommended transmitter power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC TX pin. Pin 7 Transmitter Signal Ground VEE TX: Directly connect this pin to the transmitter ground plane. Note: 1. The Transmitter and Receiver VEE connections are commoned within the module. 2 Pin 8 Transmitter Disable TDIS: Optional feature for laser based products only. For laser based products connect this pin to +3.3 V TTL logic high “1” to disable module. To enable module connect to TTL logic low “0”. Pin 9 Transmitter Data In TD+: No internal terminations are provided. See recommended circuit schematic. Pin 10 Transmitter Data In Bar TD-: No internal terminations are provided. See recommended circuit schematic. Mounting Studs/Solder Posts The two mounting studs are provided for transceiver mechanical attachment to the circuit board. It is recommended that the holes in the circuit board be connected to chassis ground. Package Grounding Tabs Connect four package grounding tabs to signal ground. Functional Description Receiver Section Design The receiver section contains an InGaAs/InP photo detector and a preamplifier mounted in an optical subassembly. This optical subassembly is coupled to a postamp/decision circuit on a separate circuit board. The postamplifier is ac coupled to the preamplifier as illustrated in Figure 1. The coupling capacitor is large enough to pass the FDDI test pattern at 125 MBd and the SONET/SDH test pattern at 155 MBd without significant distortion or performance penalty If a lower signal rate, or a code which has significantly more low frequency content is used, sensitivity, jitter and pulse distortion could be degraded. Figure 1 also shows a filter network which limits the bandwidth of the preamp output signal. The filter is designed to bandlimit the preamp output noise and thus improve the receiver sensitivity. These components will also reduce the sensitivity of the receiver as the signal bit rate is increased above 155 MBd. Noise Immunity The receiver includes internal circuit components to filter power supply noise. Under some conditions of EMI and power supply noise, external power supply filtering may be necessary. If receiver sensitivity is found to be degraded by power supply noise, the filter network illustrated in Figure 3 may be used to improve performance. The values of the filter components are general recommendations and may be changed to suit a particular system environment. Shielded inductors are recommended. Terminating the Outputs The PECL Data outputs of the receiver may be terminated with the standard Thevenin-equivalent 50 ohm to VCC - 2 V termination. Other standard PECL terminating techniques may be used. The Signal Detect Circuit The signal detect circuit works by sensing the peak level of the received signal and comparing this level to a reference. DATA OUT FILTER TRANSIMPEDANCE PREAMPLIFIER PECL OUTPUT BUFFER AMPLIFIER GND SIGNAL DETECT CIRCUIT Figure 1. Receiver Block Diagram 3 The two outputs of the receiver should be terminated with identical load circuits to avoid unnecessarily large ac current in VCC. If the outputs are loaded identically the ac current is largely nulled. The SD output of the receiver is PECL logic and must be loaded if it is to be used. The signal detect circuit is much slower that the data path, so the ac noise generated by an asymmetrical load is negligible. Power consumption may be reduced by using a higher than normal load impedance for the SD output. Transmission line effects are not generally a problem as the switching rate is slow. PECL OUTPUT BUFFER DATA OUT SD Functional Description Transmitter Section Design The transmitter section uses a buried heterostructure Fabry Perot laser as its optical source. The package of this laser is designed to allow repeatable coupling into single mode fiber. In addition, this package has been designed to be compliant with IEC 825 Class 1 and CDRH Class I eye safety requirements. The optical output is controlled by a custom IC which detects the laser output via the monitor photodiode. This IC provides both dc and ac current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature, supply voltage and life. Solder and Wash Process Compatibility The transceivers are delivered with protective process plugs inserted into the MT-RJ connector receptacle. This process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. These transceivers are compatible with either industry standard wave or hand solder processes. Each process plug can only be used once during processing, although with subsequent use, it can be used as a dust cover. LASER DATA LASER MODULATOR DATA PECL INPUT LASER BIAS DRIVER LASER BIAS CONTROL Figure 2. Simplified Transmitter Schematic 4 PHOTODIODE (rear facet monitor) Interface and Termination Recommendations Figure 3 shows a +3.3 V coupling scheme. Also present are power supply filtering arrangements which comply with the recommendations of the small form factor multisource agreement. Such a compliance ensures noise rejection compatibility between transceivers from various vendors. PHY DEVICE VCC (+3.3 V) TERMINATE AT TRANSCEIVER INPUTS 100 f 1 2 3 TD- Z = 50 W TD+ LVPECL 130 f VCC TX f SD VCC RX RX VEE RX TX W 6 f RD+ 7 f N/C TD+ TD- 8 f VEE TX 9 f RD- 10 W Z = 50 f f 4 5 1 µH C2 C3 W 130 10 µF VCC (+3.3 V) RD+ C1 130 W W Z = 50 W Z = 50 W 100 Note: C1 = C2 = C3 = 10 nF or 100 nF Figure 3. +3.3 V Transceiver Interface with +3.3 V LVPECL Device W LVPECL RD- VCC (+3.3 V) 130 W SD 82 5 W 1 µH f Z = 50 130 W VCC (+3.3 V) W TERMINATE AT DEVICE INPUTS Regulatory Compliance Feature Test Method Targeted Performance Electrostatic Discharge (ESD) to the Electrical Pins MIL-STD-883C Method 3015.4 Meets Class 1 (2000 Volts). Electrostatic Discharge (ESD) to the Duplex MT-RJ Receptacle Variation of IEC 801-2 Products of this type, typically, withstand at least 25 kV without damage when the Duplex MT-RJ Connector Receptacle is contacted by a Human Body Model probe. Electromagnetic Interference (EMI) FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class 1 Transceivers typically provide 12 dB margin to the noted standard limits when tested at a certified test range with the transceiver mounted to a circuit card without a chassis enclosure. Three transceivers typically provide 20 dB of margin in a ’perfect’ closed box with the recommended port openings. Immunity Variation of IEC 801-3 Typically show no measurable effect from a 10 V/m field swept from 10 to 450 MHz applied to the transceiver when mounted to a circuit card without a chassis enclosure. Eye Safety FDA CDRH 21-CFR 1040 Class 1 Compliant per Agilent testing under normal operating conditions. Accession Number: 9521220-20. IEC 825 Issue 1 1993:11 Class 1 CENELEC EN60825 Class 1 Compliant per Agilent testing under single fault conditions. TUV Certification: 933/510817/05. 6 Performance Specifications Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Storage Temperature Lead Soldering Temperature/Time Output Current Data Input Voltage Power Supply Voltage Symbol TS TSOLD /tSOLD IO VI VCC Minimum -40 Symbol TA VCC VIL - VCC VIH - VCC RL Minimum 0 3.1 -1.810 -1.165 Typical Maximum +85 +260/10 30 VCC 3.6 Units °C °C/s mA V V Notes Typical Maximum +70 3.5 -1.475 -0.880 Units °C V V V Notes 1 0 GND 0 Operating Environment Parameter Ambient Operating Temperature Power Supply Voltage Data Input Voltage - Low Data Input Voltage - High Data and Signal Detect Output Load 50 W 2 Transmitter Section (Ambient Operating Temperature VCC = 3.1 V to 3.5 V) Parameter Supply Current Power Dissipation Optical Output Power Center Wavelength Spectral Width Extinction Ratio Output Optical Eye Optical Rise Time Optical Fall Time Data Input Current - Low Data Input Current - High Data Input Voltage - Low Data Input Voltage - High Symbol ICC PDISS PO Minimum Typical 50 0.175 Maximum 120 0.42 -14 1360 7.7 Units mA W -20 dBm avg. 1261 nm lC nm Dl ER 8.2 dB Compliant with Eye Mask Bellcore TR-NWT-000253 and ITU recommendation G.957 2 ns tR tF 2 ns IIL -200 µA IIH 200 µA VIL - VCC -1.810 -1.475 V VIH - VCC -1.165 -0.880 V Notes 3 4 5 5 6 6 Notes: 1. 2 ms-1 air flow required. 2. Outputs terminated with 50 W to VCC – 2V are the Thevenin equivalent. 3. The power supply current varies with temperature. Maximum current is specified at VCC = Maximum @ maximum temperature (not including terminations) and end of life. 4. Output power is power coupled into a single mode fiber. 5. 10% - 90% Values 6. These inputs are compatible with 10 K, 10 KH, and 100 K ECL and LVPECL inputs. 7 Receiver Section (Ambient Operating Temperature VCC = 3.1 V to 3.5 V) Parameter Supply Current Power Dissipation Receiver Sensitivity at Eye Center Receiver Sensitivity at Window Edge Maximum Input Optical Power Operating Wavelength Data Output Voltage - Low Data Output Voltage - High Signal Detect Output Voltage - Low Signal Detect Output Voltage - High Signal Detect - Asserted Signal Detect - Deasserted Signal Detect - Hysteresis Signal Detect Assert time (off to on) Signal Detect Deassert time (on to off) Power Supply Noise Rejection Symbol Minimum Typical 75 ICC 0.263 PDISS PIN Min. (C) PIN Min. (W) -8.0 PIN Max. 1261 l VOL - VCC -1.840 VOH - VCC -1.045 -1.840 VOL - VCC VOH - VCC -1.045 PD + 1.5 dB PA -45 PD 0.5 PA - PD AS_Max 0 4.0 100 Units mA W dBm avg. dBm avg. dBm avg. nm V V V V dBm avg. dBm avg. dB µs ANS_Max 350 µs 50 mV p-p PSNR 0 Maximum 100 0.35 -31.8 -31 1360 -1.620 -0.880 -1.620 -0.880 -34 Notes 7 8 9 9 9 10 10 10 10 11 Notes: 7. This does not include the output load current. 8. This does not include the output load power. 9. Minimum sensitivity and saturation levels for a 2 23-1 PRBS with 72 ones and 72 zeros inserted. (CCITT recommendation G.958) 10. These outputs are compatible with 10 K, 10 KH and 100 K ECL and PECL outputs. 11. Between 20 Hz and 2000 KHz with the recommended power supply filter. No degradation above the maximum ‘receiver sensitivity at eye center’specification of –31.8 dBm. 8 13.97 (0.55) MIN. 5.15 (0.20) (PCB to OVERALL RECEPTACLE CENTER LINE) 4.5 ±0.2 (0.177 ±0.008) (PCB to OPTICS CENTER LINE) FRONT VIEW 7.11 (0.28) 13.59 10.0 (0.535) (0.394) MAX. MAX. 10.16 (0.4) TOP VIEW 4.57 (0.18) Pin 1 1.778 (0.07) 7.59 (0.299) 17.778 (0.7) 12.4 (0.488) 7.112 (0.28) +0 Ø 0.61 –0.2 (+000) (0.024) (–008) 49.56 (1.951) 37.56 (1.479) MAX. 9.3 9.8 (0.386) (0.366) MAX. MAX. SIDE VIEW 0.25 (0.01) Ø 1.07 (0.042) 3.3 (0.13) Full Radius 1 (0.039) DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1. THIS PAGE DESCRIBES THE MAXIMUM PACKAGE OUTLINE, MOUNTING STUDS, PINS AND THEIR RELATIONSHIPS TO EACH OTHER. 2. TOLERANCED TO ACCOMMODATE ROUND OR RECTANGULAR LEADS. 3. THE 10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS ARE TO BE TREATED AS A SINGLE PATTERN. (SEE FIGURE 6 PCB LAYOUT). 4. THE MT-RJ HAS A 750 µm FIBER SPACING. 5. THE MT-RJ ALIGNMENT PINS ARE IN THE MODULE. 6. SEE MT-RJ TRANSCEIVER PIN OUT DIAGRAM FOR DETAILS. Figure 4. HFCT-5903E Package Outline Drawing 9 13.97 (0.55) MIN. 5.15 (0.20) (PCB to OVERALL RECEPTACLE CENTER LINE) 4.5 ±0.2 (0.177 ±0.008) (PCB to OPTICS CENTER LINE) FRONT VIEW 7.11 (0.28) 13.59 9.6 (0.535) (0.378) MAX. MAX. 10.16 (0.4) TOP VIEW 4.57 (0.18) Pin 1 1.778 (0.07) 7.59 (0.299) 17.778 (0.7) 12 (0.472) +0 –0.2 (+000) (0.024) (–008) Ø 0.61 7.112 (0.28) 49.56 (1.951) 37.56 (1.479) MAX. 9.3 9.8 (0.386) (0.366) MAX. MAX. SIDE VIEW 0.25 (0.01) Ø 1.07 (0.042) 3.3 (0.13) Full Radius 1 (0.039) DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1. THIS PAGE DESCRIBES THE MAXIMUM PACKAGE OUTLINE, MOUNTING STUDS, PINS AND THEIR RELATIONSHIPS TO EACH OTHER. 2. TOLERANCED TO ACCOMMODATE ROUND OR RECTANGULAR LEADS. 3. THE 10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS ARE TO BE TREATED AS A SINGLE PATTERN. (SEE FIGURE 6 PCB LAYOUT). 4. THE MT-RJ HAS A 750 µm FIBER SPACING. 5. THE MT-RJ ALIGNMENT PINS ARE IN THE MODULE. 6. SEE MT-RJ TRANSCEIVER PIN OUT DIAGRAM FOR DETAILS. Figure 5. HFCT-5903 Package Outline Drawing 10 Board Layout - Decoupling Circuit and Ground Planes It is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. Figure 3 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. It is further recommended that a continuous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices. Spacing Of Front Housing Leads Holes KEEP OUT AREA FOR PORT PLUG 7 (0.276) Ø 1.4 ±0.1 (0.055 ±0.004) Board Layout - Hole Pattern The Agilent transceiver complies with the circuit board “Common Transceiver Footprint” hole pattern defined in the original multisource announcement which defined the 2 x 5 package style. This drawing is reproduced in Figure 6 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Figure 7 shows the front panel dimensions associated with such a layout. 7.11 (0.28) Ø 1.4 ±0.1 (0.055 ±0.004) 3.56 (0.14) Holes For Housing Leads Ø 1.4 ±0.1 (0.055 ±0.004) 10.16 (0.4) 10.8 (0.425) 3.08 (0.121) 13.34 7.59 (0.525) (0.299) 3 (0.118) 3 (0.118) 27 (1.063) 6 (0.236) 4.57 (0.18) 17.78 (0.7) 9.59 (0.378) 1.778 (0.07) 13.97 (0.55) MIN. 2 (0.079) Ø 2.29 (0.09) 7.112 (0.28) 3.08 (0.121) Ø 0.81 ±0.1 (0.032 ±0.004) DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE MT-RJ TRANSCEIVER PLACED AT .550 SPACING. 2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR GROUND CONNECTION IN KEEP-OUT AREAS. 3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS). PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND. 4. THE SOLDER POSTS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS. Figure 6. Recommended Board Layout Hole Pattern 11 Design Support Materials Further technical details and supporting information regarding small form factor transceivers are contained in an application note aimed at providing useful information to the fiber-optic system designer. This document describes PC board layout techniques, power supply filtering, EMI considerations and interfacing options. Agilent has created a number of reference designs with major PHY IC vendors in order to establish full functionality and interoperability. Such design information and results can be made available to the designer as a technical aid. Please contact your Agilent representative for further information if required. 3.8 (0.15) 10.8 ±0.1 (0.425 ±0.004) 1 (0.039) 9.8 ±0.1 (0.386 ±0.004) 0.25 ±0.1 (0.01 ±0.004) (TOP OF PCB TO BOTTOM OF OPENING) 13.97 (0.55) MIN. 14.79 (0.589) DIMENSIONS IN MILLIMETERS (INCHES) NOTE: NOSE SHIELD SHOULD BE CONNECTED TO CHASSIS GROUND. Figure 7. Recommended Panel Mounting Ordering Information HFCT-5903E Model Name: HFCT-5903E - Preferred option with nose shield fitted HFCT-5903E - Non-preferred option without nose shield Class 1 Laser Product: This product conforms to the applicable requirements of 21 CFR 1040 at the date of manufacture Date of Manufacture: Agilent Technolgies Ltd., Depot Road, Singapore Handling Precautions 1. The HFCT-5903E can be damaged by current surges or overvoltage. Power supply transient precautions should be taken. 2. Normal handling precautions for electrostatic sensitive devices should be taken. www.semiconductor.agilent.com Data subject to change. Copyright © 2000 Agilent Technologies, Inc. Obsoletes: 5968-5828E 5988-0698EN (10/00)