GMT G1117TD3B

G1117
Global Mixed-mode Technology Inc.
1A Adjustable Low-Dropout Linear Regulator
Features
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General Description
The G1117 is a low dropout linear regulator with a
dropout of 1.2V at 800mA of load current and 1.3V at
1A of load current. It is available in an adjustable
version, which can set the output from 1.25V to 5V
with only two external resistors.
Available in adjust version
Space saving TO-252, SOT-223 and TO-92
package
Internal short circuit current limiting
Internal over temperature protection
Output current in excess of 1A
Output current in excess of 100mA with
TO-92 package
The G1117 provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions.
The G1117 is available in TO-252, SOT-223 and
TO-92 packages. A minimum of 10μF tantalum electrolytic capacitor is required at the output to improve
the transient response and stability.
Applications
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Post regulation for switching DC/DC converter
High efficiency linear regulator
Battery charger
Battery powered instrumentation
Motherboard
Ordering Information
ORDER
NUMBER
ORDER NUMBER
G1117T43U
G1117T63U
G1117T43Uf
G1117T63Uf
G1117
G1117
-40°C~85°C
-40°C~85°C
-----
G1117TD3B
G1117
-40°C~85°C
(Pb free)
TEMP.
MARKING
RANGE
1
PIN OPTION
2
3
TO-252
SOT-223
GND/ADJ
GND/ADJ
VOUT
VOUT
VIN
VIN
TO-92
GND/ADJ
VOUT
VIN
PACKAGE
* For other package types and pin options, please contact us at [email protected]
Order Number Identification
GXXXX
XX
X
X
Packing Type
Pin Option
Package Type
Part Number
PACKAGE TYPE
PIN OPTION
T4:TO-252
T6: SOT-223
TD: TO-92
1
3: GND/ADJ
2
VOUT
PACKING
U: Tape & Reel
B: Bag
3
VIN
Package Type
Typical Application
[Note 4]: Type of COUT
IO
Top View
VIN
VIN
Top
View
Top View
2
3
TO-252
1
2
3
SOT-223
1
2
VOUT
GND/ADJ
C1
1µF
1
G1117 VOUT
R1
R2
COUT
10µF
3
TO-92
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
1
G1117
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . . .150°C
Reflow Temperature (soldering, 10sec) . . . . . . 260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . .116°C/W
Thermal Resistance Junction to Case, (θJc)
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21°C/W
Operating Conditions
(Note 1)
(VIN-VADJ) Voltage. . . . . . . . . . . . . . . . . . . . . .2.5V~6.5V
Temperature Range. . . . . . . . . . . . . .-40°C ≤ TA ≤85°C
Note (1): See Recommended Minimum Footprint
Electrical Characteristics
Operating Conditions: VIN ≤ 6.5V, TJ = 25°C unless otherwise specified. [Note3]
PARAMETER
CONDITIONS
Reference Voltage
VIN - VOUT = 2V, IOUT = 10mA
Line Regulation
Load Regulation
(VOUT + 1.5V) < VIN < 6.5V, IOUT = 10mA
(VIN - VOUT) = 2V, 10mA < IOUT < 1A
ΔVOUT = 2%, IOUT = 800mA
ΔVOUT = 2%, IOUT = 1A
Dropout Voltage
MIN
TYP
MAX
1.225
1.250
1.275
UNITS
V
---------
1.32
0.04
1.2
1.3
----1.3
1.4
%
%
V
Current Limit
(VIN - VOUT) = 2V
1000
1200
---
mA
Adjust Pin Current Change
Minimum Load Current
VIN - VOUT = 2V, 10mA < IOUT < 1A
1.5V < (VIN - VOUT) < 5.25V
--10
0.15
---
-----
µA
mA
Quiescent Current
VIN - VOUT = 2V
30
80
150
µA
---
50
---
dB
Thermal Regulation
f = 120Hz, COUT = 10μF Tantalum,
(VIN - VOUT) = 3V, IOUT = 800mA
TA = 25°C, 30ms pulse
---
0.004
0.02
%/W
Temperature Stability
RMS Output Noise (% of VOUT)
VIN = 4V, IO =10mA
TA = 25°C, 10Hz < f < 10kHz, ILOAD = 10mA
-----
0.3
0.007
-----
%
%
---
116
---
°C/W
---
150
---
°C
---
10
---
°C
Ripple Rejection
Thermal Resistor Junction-to-Ambient
SOT-223; Recommended Minimum Footprint
(No heat sink; No air flow)
Thermal Shutdown
Junction Temperature
Thermal Shutdown Hysteresis
Note1:
Note2:
Note3:
Note4:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G1117 in SOT-223 package; θJA is 116°C/W (See recommend minimum footprint).
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
2
Global Mixed-mode Technology Inc.
G1117
Definitions
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly affected.
Output Voltage
The G1117 provides an adjustable output voltage from
1.25V to 5V. With two external resistors. It can be formulated as:
VOUT = 1.25V x (1+
R2
R1
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measurement is made under conditions of low dissipation or by
using pulse techniques such that average chip temperature is not significantly affected.
) + IADJ x R2
IADJ = 80µA (TYP.)
Dropout Voltage
The input/output Voltage differential at which the
regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 2% below its nominal value. Dropout
voltage is affected by junction temperature, load current and minimum input supply requirements.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Line Regulation
The change in output voltage for a change in input
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
3
G1117
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
VIN= 4V, CIN= 10µF, COUT=10µF, TA=25°C, unless otherwise noted.
Line transient
Load Transient
Dropout Voltage vs. Load Current
IADJ Current vs. Load Current
1.06
94
85°C
91
85°C
1.02
1
IADJ Current (µA)
Dropout Voutput (V)
1.04
25°C
0.98
0.96
0.94
25°C
85
82
79
-45°C
76
-45°C
0.92
88
73
0.9
70
0
200
400
600
Output Current (mA)
800
1000
0
100
300
400
500
600
700
800
Load Current (mA)
Temperature Stability
Ripple Rejection
1
60
Output Voltage Change (%)
IOUT = 100mA
50
Ripple Rejection (dB)
200
(V IN - V OUT ) > 3V
40
IOUT = 800mA
30
20
COUT = 10μF
IOUT = 0.1A~0.8A
10
0.5
0
-0.5
-1
-40
0
10
100
1000
10000
Frequency (Hz)
100000
-20
0
20
40
60
80
100
Temperature (°C)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
4
G1117
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Output Noise
Short-Circuit Current
1.60
1.50
Short-Circuit current (A)
V IN = 4.5V
IOUT = 10mA
115oC
1.40
1.30
25oC
1.20
1.10
-45oC
1.00
0.90
0.80
1.25 1.75 2.25 2.75 3.25 3.75 4.25 4.75 5.25
(V IN-V OUT ) Diffrential (V)
Load Regulation
Overcurrent Protection Characteristics
Output Voltage Deviation (%)
0.15
0.1
0.05
0
-0.05
-0.1
-40 -25 -10
5
20
35
50
65
80
95 110
Temperature( °C)
SOT-223 Max. Power
Dissipation vs. TAMB
3
3
2.5
2.5
Max. Dissipation Power (W)
Max. Dissipation Power (W)
SOT-223 Max. Power Dissipation
vs. PCB Top Copper Area
2
1.5
1
0.5
Unite:in2
A=0.5
A=1.0
A=1.5
2
A=2.0
A=2.5
1.5
A=3.0
1
A=3.5
A=4.0
0.5
A=4.5
A=5.0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
PCB Top Copper Area (in2)
4.5
5
25
45
65
85
TAMB ( oC)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
5
Global Mixed-mode Technology Inc.
G1117
Recommended Minimum Footprint
SOT-223
TO-252
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
6
G1117
Global Mixed-mode Technology Inc.
Package Information
D
A
D1
C1
B
V
E
A1
L
b1
L3
L1
L2
b
e
e1
C
TO-252 (T4) Package
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
A1
2.190
0.000
2.400
0.127
0.086
0.000
0.094
0.005
B
b
0.880
0.500
1.650
0.880
0.035
0.020
0.065
0.035
b1
C
0.700
0.430
0.900
0.580
0.028
0.017
0.035
0.023
C1
D
D1
E
e
e1
0.430
6.350
5.200
5.400
0.580
6.730
5.460
6.220
0.017
0.250
0.205
0.213
0.023
0.265
0.215
0.245
4.500
4.700
0.177
L
8.830
10.77
0.348
0.424
L1
L2
2.550
1.400
2.900
1.780
0.100
0.055
0.114
0.070
L3
V
0.350
3.800
1.020
4.320
0.014
0.150
0.040
0.170
2.300 TYP
0.091 TYP
0.185
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
7
G1117
Global Mixed-mode Technology Inc.
A
D
α
B1
C
13°(4X)
H
E
L
L2
e
e1
13°(4X)
A1
B
SOT-223 (T6) Package
SYMBOLS
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
1.55
1.80
0.061
0.071
A1
0.02
0.12
0.0008
0.0047
B
B1
0.60
2.90
0.80
3.10
0.024
0.114
0.031
0.122
C
D
0.24
6.30
0.32
6.70
0.009
0.248
0.013
0.264
E
e
3.30
3.70
0.130
e1
H
2.30 BSC
4.60 BSC
6.70
0.146
0.090 BSC
0.181 BSC
7.30
0.264
0.287
L
0.90 MIN
0.036 MIN
L2
α
0.06 BSC
0.0024 BSC
0°
10°
0°
10°
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
8
G1117
Global Mixed-mode Technology Inc.
L
b
E
e
D
A
C
A1
D1
G
TO-92 (TD) Package
MILLIMETER
SYMBOL
INCH
MIN
MAX
MIN
MAX
A
3.35
3.86
0.132
0.152
A1
b
1.0414
0.254
1.55
0.508
0.041
0.010
0.061
0.020
E
C
4.34
0.254
4.85
0.508
0.171
0.010
0.191
0.020
L
e
G
D
D1
14.53
1.143
3.683
4.29
4.34
15.04
1.397
4.191
4.80
4.85
0.572
0.045
0.145
0.169
0.171
0.592
0.055
0.165
0.189
0.191
Package Specification
Feed Direction
TO-252 Package Orientation
Feed Direction
SOT-223 Package Orientation
PACKAGE
Q’TY/REEL
Q’TY/BY BAG
TO-252
SOT-223
TO-92
2,500 ea
2,500 ea
-----
--------2,000 ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.9
Mar 07, 2007
9