G930/G931 Global Mixed-mode Technology Inc. 3.5V 400mA Low Dropout Regulator Features General Description The G930/G931 positive 3.5V voltage regulator features the ability to source 400mA of output current with a dropout voltage of typically 0.8V over the entire operating temperature range. A low quiescent current is provided over the entire output current range. The typical quiescent current is 0.6mA. Furthermore, the quiescent current is smaller when the regulator is in the dropout mode (VIN < 3.5V). Dropout voltage typically 0.8V @ IO = 400mA Output current in excess of 400mA Output voltage accuracy +3%/-2% Quiescent current, typically 600µA Internal short circuit current limit Internal over temperature protection Familiar regulator features such as over temperature and over current protection circuits are provided to prevent it from being damaged by abnormal operating conditions. Ordering Information ORDER NUMBER ORDER NUMBER (Pb free) PACKAGE TYPE G930T21U G930T21Uf SOT-89 VOUT G931T24U G931T24Uf SOT-89 GND 1 PIN OPTION 2 3 GND VIN VIN VOUT * For other package types, pin options and package, please contact us at sales @gmt.com.tw Order Number Identification GXXX XX X X Packing Type Pin Option Package Type Part Number PACKAGE TYPE T2 : SOT 89 PIN OPTION 1 1 : VOUT 2 : VOUT 3 : GND 4 : GND 5 : VIN 6 : VIN Typical Application 2 GND VIN VOUT VIN GND VOUT PACKING U : Tape & Reel 3 VIN GND VIN VOUT VOUT GND Package Type [Note 4] : Type of COUT IO VIN Top TopView View 1 2 VOUT G930 C1 0.47µF IQ COUT 10µF 3 SOT-89 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 4.6 Jan 08, 2007 1 G930/G931 Global Mixed-mode Technology Inc. Absolute Maximum Ratings Operating Conditions (Note 1) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .4V~6V Temperature Range . . . . . . . . . . . . . . 0°C ≤ TJ ≤125°C (Note 1) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature . . . . . . . . . . . . . . 150°C Storage Temperature Range . . . .-65°C ≤ TJ ≤+150°C Reflow Temperature (soldering, 10sec) . . . . . .260°C Thermal Resistance Junction to Ambient, (θJA) SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . 173°C/W(1) Thermal Resistance Junction to Case, (θJc) SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25°C/W Note (1) :See P.4 Recommended Minimum Footprint. Electrical Characteristics VIN =5V, IO = 400mA, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] MIN TYP MAX UNITS Output Voltage Line Regulation PARAMETER 5mA < IO <400mA 4V < VIN < 6V, IO = 10mA 3.43 --- 3.5 3 3.605 30 V mV Load Regulation Quiescent Current 50mA < IO < 400mA VIN = 5V --0.3 35 0.6 50 1.5 mV mA Ripple Rejection fi = 120Hz, 1VP-P, Io = 100mA IO = 400mA ----- 50 0.8 --0.9 dB V IO = 100mA ------- 125 1.6 150 ------- mV A °C Dropout Voltage CONDITIONS Short Circuit Current Over Temperature Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G930/G931 in SOT-89 package, θJA is 173°C/W. (See Recommended Minimum Footprint). The safe operation in SOT -89, it can see “Typical Performance Characteristics”. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 4.6 Jan 08, 2007 2 G930/G931 Global Mixed-mode Technology Inc. Typical Performance Characteristics (VIN=5V, CIN=1µF, COUT =10µF, TA=25°C, unless otherwise noted.) Line Transient Load Transient Ch1: Iout (400mA/div) Ch2: Vout (offset=3.50V) Ch1: Vout (offset=3.50V) Ch2: Vin (offset=5.0V) Iout=100mA Output Voltage vs. Load Current Dropout Voltage vs. Load Current 800 3.55 700 Dropout Voltage (mV) 3.56 Output Voltage (V) 3.54 3.53 3.52 3.51 3.50 600 500 400 300 200 100 3.49 0 0 100 200 300 400 500 Load Current (mA) 600 0 100 200 Load Current (mA) 300 400 Ground Current vs. Load Current 1.60 1.50 Ground Current (mA) 1.40 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 0 100 200 Load Current (mA) 300 400 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 4.6 Jan 08, 2007 3 G930/G931 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) SOT-89 Max. Power Dissipation vs. TAMB (still air) ( Different PCB Top Copper Area ) SOT-89 Max.Power Dissipation vs. PCB Top Copper Area TAMB = 25°C ; Still Air 2 Unit : in 3 3 A=0.1 A=0.2 A=0.3 2.5 Max. Dissipation Power (W) Max. Dissipation Power (W) 2.5 2 1.5 1 A=0.4 A=0.5 2 A=1.0 A=1.5 A=2.0 1.5 A=2.5 A=3.0 A=3.5 1 0.5 A=4.0 A=4.5 A=5.0 0.5 0 0 1 2 3 4 25 5 35 45 55 65 75 85 TAMB (°C) PCB Top Copper Area (in2) Recommended Minimum Footprint SOT-89 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 4.6 Jan 08, 2007 4 G930/G931 Global Mixed-mode Technology Inc. Package Information D D1 POLISH E HE A1 e C MATTE FINISH A b b1 b POLISH SOT- 89 (T2) Package SYMBOLS A A1 DIMENSIONS IN MILLIMETERS MIN NOM MAX MIN 1.40 0.80 0.055 0.031 1.50 1.04 1.60 ----- DIMENSIONS IN INCHES NOM MAX 0.059 0.041 0.063 ----- b 0.36 0.42 0.48 0.014 0.016 0.018 b1 C D D1 HE E e 0.41 038 4.40 1.40 ----2.40 2.90 0.47 0.40 4.50 1.60 ----2.50 3.00 0.53 0.43 4.60 1.75 4.25 2.60 3.10 0.016 0.014 0.173 0.055 ----0.094 0.114 0.018 0.015 0.177 0.062 ----0.098 0.118 0.020 0.017 0.181 0.069 0.167 0.102 0.122 Package Specification PACKAGE Q’TY/REEL SOT-89 1,000 ea Feed Direction SOT-89 Package Orientation GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 4.6 Jan 08, 2007 5