GMT G2997

G2997
Global Mixed-mode Technology Inc.
DDR Termination Regulator
Features
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General Description
Support Both DDR I (1.25VTT) and DDR II
(0.9 VTT) Requirements
Input Voltage Range: 3.3V to 5.5V
VLDOIN Voltage Range: 1.2V to 3.6V
Requires Only 20µF Ceramic Output Capacitance
Supports High-Z in S3 and Soft-Off in S5
Integrated Divider Tracks 1/2 VDDQSNS for
Both VTT and VTTREF
Remote Sensing (VTTSNS)
±20mV Accuracy for VTT and VTTREF
10mA Buffered Reference (VTTREF)
Built-In Soft-Start
Over Current Protection
Thermal Shutdown Protection
MSOP-10 and MSOP-10(Exposed Pad) Package
The G2997 is a 3A sink/source tracking termination
regulator. It is specifically designed for low-cost/
low-external component count systems. The G2997
maintains a high speed operational amplifier that provides fast load transient response and only requires
20µF (2x10µF) of ceramic output capacitance. The
G2997 supports remote sensing functions and all features required to power the DDR I / DDR II VTT bus
termination according to the JEDEC specification. In
addition, the G2997 includes integrated sleep-state
controls placing VTT in High-Z in S3 (suspend to RAM)
and soft-off for VTT and VTTREF in S5 (Shutdown).
The G2997 is available in the thermally efficient 10pin
MSOP and MSOP (Exposed PAD).
Ordering Information
Applications
DDR I/II Memory Termination
SSTL−2, SSTL−18
„ HSTL Termination
„
„
ORDER
NUMBER
MARKING
TEMP.
RANGE
PACKAGE
(Pb free)
G2997P7U
G2997F6U
G2997
G2997
-40°C~85°C
-40°C~85°C
MSOP-10
MSOP-10 (FD)
Note: P7: MSOP-10
F6: MSOP-10 (FD)
U: Tape & Reel
(FD): Thermal Pad
Pin Configuration
Typical Application Circuit
G2997
VDDQSNS
1
2.5V
10 VIN
VDDQSNS
VLDOIN
VLDOIN
VTT
2
9
3
8
S5
GND
PGND
4
7
S3
VTTSNS
5
6
VTTREF
Top View
MSOP-10
VTT
Thermal
Pad
C1
2*10µF
PGND
VTTSNS
VIN
S5
VIN=5V
S5
GND
S3
S3
VTTREF
C2
0.1µF
Bottom View
Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.1
Jul 06, 2006
1
G2997
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(1)
Recommend Operating Range (1) (2)
Supply Voltage Range
VIN, VLDOIN, VTTSNS, VDDQSNS, S3, S5..-0.3V to +6V
PGND . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 0.3V
Output Voltage Range
VTT, VTTREF . . . . . . . . . . . . . . . . . . . . . .-0.3V to 6V
Maximum Junction Temperature,TJ . . . . .. . . ..160°C
Storage Temperature Range, TSTG.-55°C to +160°C
Reflow Temperature (soldering, 10sec). . . . . 260°C
Thermal Resistance Junction to Ambient, (θJA)
MSOP-10 . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
MSOP-10 (FD) . . . . . . .. . . . . . . . . . . . . . . 60°C/W(3)
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3.3V to 5.5V
S3, S5 . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.1V to 5.5V
VDDQSNS. . . . . . . .. . . . . . . . . . . . . . . . .1.6V to 3.6V
VLDOIN . . . . . . . . . . . . . . . . . . . . . . . . . .1.2V to 3.6V
PGND . . . . . . . . . . . . . . . . . . . . . .-0.1V to 0.1V
Operating Ambient Temperature Range
TA . . . . . . . . . . . . . . . . . . . . . . . .. . . . .-40°C to 85°C
Note:
(1)
All voltage values are with respect to the network ground terminal unless otherwise noted.
(2)
VLDOIN, VTTSNS, VDDQSNS, S3, S5 must be lower than VIN on operation.
(3)
Please refer to PCB size described in EV2997-10.
Electrical Characteristics
Specifications with standard typeface are for TA=25°C, VIN=5V, VLDOIN=2.5V and VDDQSNS=2.5V. Unless
otherwise specified.
PARAMETER
Supply current, VIN
SYMBOL
MIN
TYP
VVIN=5V, no load, S5=5V, S3 =5V
VVIN=5V, no load, S5=5V, S3 =0V
VVIN=5V, no load, S5=0V, S3 =0V
0.5
-----
0.8
110
---
VVIN=5V, no load, S5=5V, S3 =5V
IVLDOINSTB VVIN=5V, no load, S5=5V, S3 =0V
IVLDOINSDN VVIN=5V, no load, S5=0V, S3 =0V
ZVDDQSNS VVIN=5V, S5=5V, S3 =5V
-------
IVIN
Standby current, VIN
IVINSTB
Shutdown current, VIN
Supply current, VLDOIN
IVINSDN
IVLDOIN
Standby current, VLDOIN
Shutdown current, VLDOIN
VDDQSNS input Impedance
VTTSNS input current
VTT output voltage
VTT Output Voltage Load Regulation (VTTREF-VTT)
IVTTSNS
VTT
VOSVTT
CONDITIONS
VVIN=5V, S5=5V, S3 =5V
(DDR I/DDR II)
IVTT=0
|IVTT|<1.5A
|IVTT|<3A
VTT Source Current limit
IVTTOCLSRC
VTT=VDDQSNS/2 *0.95, PGOOD=Hi
VTT=0
VTT Sink Current limit
IVTTOCLSNK
VTT=VDDQSNS/2 *1.05, PGOOD=Hi
VTT=VVDDQSNS
VTT leakage current in S3 mode
VTT Discharge Current
VTTREF output voltage
IVTTLK
S3=0V, S5=5V
IDISCHARGE S5=0V, VDDQSNS=0, VTT=0.5V
VTTREF
(DDR I/DDR II)
∆VTTREF |IVTTREF|<10mA
VIH
S3 and S5 pin
VIL
S3 and S5 pin
IILEAK
S3 and S5 pin
VTTREF Voltage Load Regulation
High Level Input Voltage
Low Level Input Voltage
Logic input leakage current
Thermal Shutdown
Thermal Shutdown Hystersis
TSD
MAX UNIT
2
200
1
mA
µA
µA
0.03
2
mA
0.1
0.1
10
1
-------
200
0.3
1.25/0.9
--1
---
µA
µA
KΩ
-20
-30
-40
3
1.5
------4
2
20
30
40
-----
µA
V
mV
A
3
4
---
1.5
--10
2
0.01
20
-------
µA
mA
---20
1.6
1.25/0.9
-----
--20
---
V
mV
V
---1
-----
----160
20
1
1
-----
V
µA
°C
°C
A
TEL: 886-3-5788833
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Ver: 1.1
Jul 06, 2006
2
G2997
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
CVLDOIN=10µF/MLCC/X5R, CVIN=1µF/MLCC/X5R, CVTTREF =0.1µF,CVTT=20µF/X5R/MLCC unless otherwise
noted.
VIN Supply Current vs Temperature
VIN Shutdown Current vs Temperature
1.1
0.14
1
0.12
V IN Shutdown Current (µA)
V IN supply current (mA)
0.9
0.8
0.7
0.6
0.5
V IN =5.0V
0.4
V DDQSNS=2.5V
0.3
V LDOIN =2.5V
0.2
0.1
0
-40 -20
0
20
40
60
80
0.1
0.08
0.06
V IN =5.0V
0.04
V DDQSNS=2.5V
0.02
V LDOIN =2.5V
0
-40 -20
100 120 140
0
Temperature( °C)
VLDOIN Supply Current vs Temperature
20 40 60 80
Temperature( °C)
100 120 140
VLDOIN Shutdown Current vs Temperature
32
0.6
V LDOIN Shutdown Current (µA)
V LDOIN Supply Current (µA)
31
30
29
28
27
V IN =5.0V
V DDQSNS=2.5V
V LDOIN =2.5V
26
25
24
23
22
-40 -20
0
20 40 60 80
Temperature ( °C)
0.5
0.4
0.3
0.1
0
-40 -20
100 120 140
VTT Discharge Current (mA)
V TTREF Discharge Current (mA)
100 120 140
26
0.41
V TTREF =0.5V
0.4
0.39
0.38
0.37
0.33
20 40 60 80
Temperature ( °C)
VTT Discharge Current vs Temperature
0.42
0.34
0
28
0.43
0.35
V LDOIN =2.5V
0.2
VTTREF Discharge Current vs Temperature
0.36
V IN =5.0V
V DDQSNS=2.5V
V IN =5.0V
V DDQSNS=2.5V
V LDOIN =2.5V
0.32
-40 -20
0
20
22
20
18
16
40
60
V TT=0.5V
24
V IN =5.0V
V DDQSNS=2.5V
V LDOIN =2.5V
14
-40 -20
80 100 120 140
Temperature ( °C)
0
20
40
60
80
100 120 140
Temperature ( °C)
TEL: 886-3-5788833
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Ver: 1.1
Jul 06, 2006
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G2997
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
VTT Voltage Regulation vs
VTT Voltage Regulation vs
VTT Load Current (DDR I )
VTT Load Current (DDR II )
1.27
0.918
1.26
V IN =5.0V
0.912
V DDQSNS=2.5V
0.906
V LDOIN =2.5V or 1.8V
V TT Volatge (V)
VTT Volatge (V)
1.265
1.255
1.25
0.9
1.24
0.876
-1
0
1
2
V DDQSNS=1.8V
0.888
0.882
-2
V IN =5.0V
0.894
1.245
-3
V LDOIN =1.8V
3
V LDOIN =1.5V
V LDOIN =1.2V
-3
-2
-1
0
1
V TT Load Current (A)
V TT Load Current (A)
1.268
0.918
1.264
0.914
1.26
1.256
1.252
1.248
V IN =5.0V
1.244
V DDQSNS=2.5V
V LDOIN =2.5V
1.24
1.236
-10 -8
-6
-4
-2
0
2
4
6
0.91
0.906
0.902
V IN =5.0V
0.898
V DDQSNS=1.8V
0.894
8
V LDOIN =1.8V
0.89
-10 -8
10
V TTREF Load Current (mA)
-4
-2
0
2
4
6
8
10
VIN Supply Current vs VTT Load Current
VDDQSNS Current vs Temperature
1.2
1.15
V IN =5.0V
13.5
V DDQSNS=2.5V
13
V IN Supply Current (mA)
V DDQSNS Current (µA)
-6
V TTREF Load Current (mA)
14
V LDOIN =2.5V
12.5
12
11.5
11
10.5
-40 -20
3
VTTREF Voltage Load Regulation vs
VTTREF Load Current (DDR II )
V TTREF Voltage (V)
V TTREF Voltage (V)
VTTREF Voltage Load Regulation vs
VTTREF Load Current (DDR I)
2
V IN =5.0V
1.1
V DDQSNS=1.8V
V LDOIN =1.8V
1.05
1
0.95
0.9
0.85
0.8
0
20
40
60
80
-2
100 120 140
Temperature ( °C)
-1.5
-1
-0.5
0
0.5
1
V TT Load Current (A)
1.5
2
TEL: 886-3-5788833
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Ver: 1.1
Jul 06, 2006
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G2997
Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Start Up Waveforms S5 Low to High
Start Up Waveforms S5 Low to High
Start Up Waveforms S3 Low to High
Shutdown Waveforms S3 High to Low
Shutdown Waveforms S3 and S5 High to Low
VTTREF Voltage Transient Response
ILoad=±10mA
TEL: 886-3-5788833
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Ver: 1.1
Jul 06, 2006
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Global Mixed-mode Technology Inc.
G2997
Typical Performance Characteristics (continued)
VTT Voltage Load Transient Response
Recommended Minimum Footprint
MSOP-10
MSOP-10 (FD)
TEL: 886-3-5788833
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Ver: 1.1
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G2997
Global Mixed-mode Technology Inc.
Pin Description
PIN
NAME
1
2
DESCRIPTIONS
VDDQSNS VDDQ sense input
VLDOIN Power supply for the VTT and VTTREF output stage
3
4
VTT
PGND
Output voltage for connection to termination resistors, equal to VDDQSNS/2
Power ground output for the VTT output
5
6
VTTSNS
VTTREF
7
8
9
S3
GND
S5
Active low suspend to RAM mode control pin, VTT is turned off and left Hi-Z
Ground
Active low shutdown control pin, both VTT and VTTREF are turned off and discharged to ground
10
Thermal Pad
VIN
Analog input pin
Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
Voltage sense input for the VTT LDO. Connect to plus terminal of the output capacitor
Buffered output that is a reference output ,equal to VDDQSNS/2
Block Diagram
VIN
VLDOIN
VDDQSNS
VTTSNS
S3
S5
SD/STB
VTT
VTTREF
PGOOD
GND
PGND
TEL: 886-3-5788833
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Ver: 1.1
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G2997
Global Mixed-mode Technology Inc.
Description
S3, S5 Control and Soft-Off
The S3 and S5 terminals should be connected to
SLP_S3 and SLP_S5 signals respectively. Both
VTTREF and VTT are turned on at normal state (S3 =
high, S5 = high). VTTREF is kept alive while VTT is
turned off and left high impedance in standby state (S3
= low, S5 = high). Both VTT and VTTREF outputs are
turned off and discharged to the ground through internal MOSFETs during shutdown state (S5 = low). The
control function is showed on the Table 1.
VTT SINK/SOURCE REGULATOR
The G2997 is a 3A sink/source tracking termination
regulator designed specially for low-cost, low external
components system where space is at premium such
as notebook PC applications. The G2997 integrates
high performance low-dropout linear regulator that is
capable of sourcing and sinking current up to 3 A. This
VTT linear regulator is implemented with ultimately
fast response feedback loop so that small ceramic
capacitors are enough to keep tracking to the VTTREF
within 40mV at all conditions including fast load transient. To achieve tight regulation with minimum effect
of trace resistance, a remote sensing terminal,
VTTSNS, should be connected to the positive node of
VTT output capacitor as a separate trace from the high
current line from VTT.
Table 1. S3 and S5 Control Table
VTTREF REGULATOR
The VTTREF block consists of an on-chip 1/2 divider,
LPF and buffer. This regulator can source/sink current
up to 10mA. Bypass VTTREF to GND using a 0.1µF
ceramic capacitor to ensure stable operation. To ensure better start-up and transient performance, the
larger 1µF ceramic capacitors are recommended.
STATE
S3
S5
VTT
VREF
Normal
Hi
Hi
1.25V/0.9V
1.25V/0.9V
Standby
Lo
Hi
12mV/6mV
(High-Z)
1.25V/0.9V
Shutdown
Lo
Lo
Shutdown
Hi
Lo
0V
(Discharge)
0V
(Discharge)
0V
(Discharge)
0V
(Discharge)
VTT Current Protection
The LDO has a constant overcurrent limit (OCL) at 4A.
This trip point is reduced to 2A before the outputvoltage comes within 5% of the target voltage or goes
outside of 10% of the target voltage.
Power on sequence
To operate safely, the G2997 must keep VIN voltage
larger than other Input-PIN voltage .This condition is
due to the internal parasitic diodes between VIN to
others PIN for ESD issue. If the VIN voltage is lower
than the other pins voltage, the G2997 will consume
extra current through the parasitic diodes during the
power-on period.
Input Capacitor
Adding a capacitance close to VLDOIN pin can improve
the VTT performance when fast load- transient. In general, 1/2 COUT is recommended for the VLDOIN capacitance. Separating the VDDQSNS and VLDOIN pins
will get better transient performance. The recommended
capacitor types are tabulated in the Table 2.
Soft-Start
The soft-start function of the VTT is achieved via a
current clamp, allowing the output capacitors to be
charged with low and constant current that gives linear
ramp up of the output voltage. The current limit
threshold is changed in two stages using an internal
powergood signal. When VTT is outside the powergood threshold, the current limit level is 2A. When VTT
rises above (VTTREF - 5%) or falls below (VTTREF +
5%) the current limit level switches to 4 A. The thresholds are typically VTTREF 5% (from outside regulation to inside) and 10% (when it falls outside). The
soft-start function is completely symmetrical and it
works not only from GND to VTTREF voltage, but also
from VDDQSNS to VTTREF voltage. Note that the
VTT output is in a high impedance state during the S3
state (S3 = low, S5 = high) and its voltage can be up
to VDDQSNS voltage depending on the external condition. Note that VTT does not start under a full load
condition.
Output Capacitor
For stable operation, total capacitance of the VTT
output terminal can be equal or greater than 20µF.
The output capacitor should be located near VTT output terminal as close as possible to minimize the effect
of ESR and ESL. The recommended capacitor types
are tabulated in the Table 2.
Table 2.
CAP
C1
C2
MANUF
TAYO
YUDEN
TAYO
YUDEN
PART NUMBER
EMK 325BJ106KD
UMK 212BJ104KG
TEL: 886-3-5788833
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Ver: 1.1
Jul 06, 2006
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G2997
Global Mixed-mode Technology Inc.
Package Information
A
10
A
e
E1
CL
E
b
1
DETAIL “A”
θ2
e
A2
0.076 C
0.25
R1
A
R
GAUGE PLANE
SEATING PLANE
b
A1
D
θ1
L
θ3
SECTION A-A
MSOP-10 Package
SYMBOL
A
A1
A2
b
b1
c
c1
D
E1
e
E
L
θ1
θ2
θ3
R
R1
JEDEC
MIN.
----0.05
0.81
0.15
0.15
0.13
0.13
2.90
2.90
0.445
0°
0.09
0.09
DIMENSION IN MM
NOM.
--------0.86
----0.20
----0.15
3.00
3.00
0.50 BSC
4.90 BSC
0.55
----12 REF
12 REF
---------
MAX.
MIN.
1.10
0.15
0.91
0.30
0.25
0.23
0.18
3.10
3.10
----0.002
0.032
0.006
0.006
0.005
0.005
0.114
0.114
0.648
6°
0.0175
0°
---------
0.004
0.004
DIMENSION IN INCH
NOM.
--------0.034
----0.008
0.006
0.118
0.118
0.020 BSC
0.193 BSC
0.0217
----12 REF
12 REF
---------
MAX.
0.043
0.006
0.036
0.012
0.010
0.009
0.007
0.122
0.122
0.0255
6°
---------
MO-187BA
TEL: 886-3-5788833
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Ver: 1.1
Jul 06, 2006
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G2997
Global Mixed-mode Technology Inc.
E2 E1 E
L
D1
D
θ
A2
c
0.05
e
b
A
A1
MSOP-10 (FD) Package
Note:1. JEDEC Outline: MO-187 BA/MO-187 BA-T (Thermally Enhanced Variations Only)
2. Dimension “D” does not include mold flash. Protrusions or gate burrs. Mold flash. Protrusions or gate burrs shall not exceed
0.15 per side.
3. Dimension “E1” does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side.
4. Dimension “0.22” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the
“0.22” dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum spac
between protrusion and adjacent lead is 0.07mm.
5. Dimensions “D” and “E1” to be determined at datum plane.
SYMBOL
A
A1
A2
b
c
D
D1
E
E1
E2
e
L
θ
MIN.
DIMENSION IN MM
NOM.
----0.00
0.75
0.17
0.08
0.40
0°
--------0.85
--------3.00 BSC
1.60 REF
4.90 BSC
3.00 BSC
1.715 REF
0.50 BSC
0.60
-----
MAX.
MIN.
1.10
0.15
0.95
0.27
0.23
----0.000
0.030
0.007
0.003
0.80
8°
0.016
0°
DIMENSION IN INCH
NOM.
--------0.033
--------0.118 BSC
0.063 REF
0.193 BSC
0.118 BSC
0.068 REF
0.002 BSC
0.024
-----
MAX.
0.043
0.006
0.037
0.011
0.009
0.031
8°
Taping Specification
PACKAGE
MSOP-10
MSOP-10 (FD)
Q’TY/BY REEL
2,500 ea
2,500 ea
F eed D irection
T ypical M S O P P ackag e O rientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.1
Jul 06, 2006
10