G2997 Global Mixed-mode Technology DDR Termination Regulator Features General Description Support DDR I (1.25VTT), DDR II (0.9 VTT), DDR III (0.75 VTT), and DDR IIIL (0.675VTT) Requirements Input Voltage Range: 3V to 5.5V VLDOIN Voltage Range: 1.2V to 3.6V Requires Only 20µF Ceramic Output Capacitance Supports High-Z in S3 and Soft-Off in S5 Integrated Divider Tracks 1/2 VDDQSNS for Both VTT and VTTREF Remote Sensing (VTTSNS) ±20mV Accuracy for VTT and VTTREF 10mA Buffered Reference (VTTREF) Built-In Soft-Start Over Current Protection Thermal Shutdown Protection MSOP-8 (FD) , MSOP-10 (FD) & TDFN3X3-10 Package The G2997 is a 3A sink/source tracking termination regulator. It is specifically designed for low-cost/ low-external component count systems. The G2997 maintains a high speed operational amplifier that provides fast load transient response and only requires 20µF (2×10µF) of ceramic output capacitance. The G2997 supports remote sensing functions and all features required to power the DDR I / DDR II /DDR III /DDR IIIL VTT bus termination according to the JEDEC specification. In addition, the G2997 includes integrated sleep-state controls placing VTT in High-Z in S3 (suspend to RAM) and soft-off for VTT and VTTREF in S5 (Shutdown). The G2997 is available in the thermally efficient 8pin, 10pin MSOP (Thermal Pad) & 10pin TDFN. Applications DDR I/II/III/IIIL Memory Termination SSTL−2, SSTL−18 HSTL Termination Ordering Information ORDER NUMBER TEMP. RANGE MARKING PACKAGE (Green) G2997F51U G2997 -40°C~85°C MSOP-8 (FD) G2997F6U G2997RE1U G2997 2997 -40°C~85°C -40°C~85°C MSOP-10 (FD) TDFN3X3-10 Note: F5: MSOP-8(FD) F6: MSOP-10(FD) RE: TDF3X3-10 1: Bonding Code <only MSOP-8 (FD), TDFN3X3-10> U: Tape & Reel Pin Configuration G2997 VDDQSNS 1 VLDOIN 2 VTTSNS/VTT PGND G2997 8 7 GND 3 6 5 4 MSOP-8 (FD) VIN S5 S3 G2997 VDDQSNS 1 10 VIN VLDOIN 2 9 S5 VTT VTTREF PGND VTTSNS 3 Thermal Pad 4 8 7 5 6 MSOP-10 (FD) GND S3 VTTREF VDDQSNS 1 VLDOIN 2 VTT 3 PGND 4 VTTSNS 5 10 10 VIN Thermal Pad 9 S5 8 GND 7 S3 6 VTTREF TDFN3X3-10 Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 2.4 Sep 05, 2013 1 G2997B Global Mixed-mode Technology DDR Termination Regulator Features General Description Support DDR I (1.25VTT), DDR II (0.9 VTT), DDR III (0.75 VTT), and DDR IIIL (0.675VTT) Requirements Input Voltage Range: 3V to 5.5V VLDOIN Voltage Range: 1.2V to 3.6V Requires Only 20µF Ceramic Output Capacitance Supports High-Z in S3 and Soft-Off in S5 Integrated Divider Tracks 1/2 VDDQSNS for Both VTT and VTTREF Remote Sensing (VTTSNS) ±20mV Accuracy for VTT and VTTREF 10mA Buffered Reference (VTTREF) Built-In Soft-Start Over Current Protection Thermal Shutdown Protection MSOP-10 & MSOP-10 (FD) Package The G2997B is a 2A sink/source tracking termination regulator. It is specifically designed for low-cost/ low-external component count systems. The G2997B maintains a high speed operational amplifier that provides fast load transient response and only requires 20µF (2x10µF) of ceramic output capacitance. The G2997B supports remote sensing functions and all features required to power the DDR I / DDR II /DDRIII /DDR IIIL VTT bus termination according to the JEDEC specification. In addition, the G2997B includes integrated sleep-state controls placing VTT in High-Z in S3 (suspend to RAM) and soft-off for VTT and VTTREF in S5 (Shutdown). The G2997B is available in MSOP-10 and MSOP-10 (FD). Ordering Information ORDER NUMBER MARKING TEMP. RANGE PACKAGE (Green) G2997BP71U G2997BF61U G2997 G2997B -40°C~85°C -40°C~85°C MSOP-10 MSOP-10 (FD) Applications DDR I/II/III/IIIL Memory Termination SSTL−2, SSTL−18 HSTL Termination Note: P7: MSOP-10 F6: MSOP-10 (FD) 1: Bonding Code U: Tape & Reel Pin Configuration G2997B G2997B VDDQSNS 1 10 VIN VLDOIN 2 9 S5 VTT 3 8 GND PGND 4 7 S3 VTTSNS 5 6 VTTREF DDR II VDDQSNS 1 10 VIN VLDOIN 2 9 S5 VTT 3 8 GND PGND 4 7 S3 VTTSNS 5 6 VTTREF Thermal Pad 1.8V VDDQSNS VIN DDR II VLDOIN S5 VTT GND PGND S3 RS5 10kΩ RS3 S5 S3 10kΩ C1 2x10µF VTTSNS VTTREF C2 0.1µF Top View MSOP-10 (FD) MSOP-10 VIN=5V Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation. Typical Application Circuit DDR III* DDR I 2.5V VDDQSNS VLDOIN VTT PGND C1 2x10µF VIN S5 GND S3 RS5 10kΩ RS3 1.5V VIN=5V DDR II VLDOIN S5 VTT PGND S3 10kΩ VTTSNS VDDQSNS C1 2x10µF VTTREF VIN S5 GND S3 RS5 10kΩ RS3 VIN=3.3V S5 S3 10kΩ VTTSNS C2 0.1µF VTTREF C2 0.1µF * Recommended VIN =3.3V TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 1.0 Jun 18, 2012 1